JP2007287820A5 - - Google Patents

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Publication number
JP2007287820A5
JP2007287820A5 JP2006111661A JP2006111661A JP2007287820A5 JP 2007287820 A5 JP2007287820 A5 JP 2007287820A5 JP 2006111661 A JP2006111661 A JP 2006111661A JP 2006111661 A JP2006111661 A JP 2006111661A JP 2007287820 A5 JP2007287820 A5 JP 2007287820A5
Authority
JP
Japan
Prior art keywords
electronic device
main surface
substrate
external connection
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006111661A
Other languages
English (en)
Japanese (ja)
Other versions
JP4889359B2 (ja
JP2007287820A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006111661A priority Critical patent/JP4889359B2/ja
Priority claimed from JP2006111661A external-priority patent/JP4889359B2/ja
Publication of JP2007287820A publication Critical patent/JP2007287820A/ja
Publication of JP2007287820A5 publication Critical patent/JP2007287820A5/ja
Application granted granted Critical
Publication of JP4889359B2 publication Critical patent/JP4889359B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006111661A 2006-04-14 2006-04-14 電子装置 Expired - Fee Related JP4889359B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006111661A JP4889359B2 (ja) 2006-04-14 2006-04-14 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006111661A JP4889359B2 (ja) 2006-04-14 2006-04-14 電子装置

Publications (3)

Publication Number Publication Date
JP2007287820A JP2007287820A (ja) 2007-11-01
JP2007287820A5 true JP2007287820A5 (enExample) 2009-04-23
JP4889359B2 JP4889359B2 (ja) 2012-03-07

Family

ID=38759327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006111661A Expired - Fee Related JP4889359B2 (ja) 2006-04-14 2006-04-14 電子装置

Country Status (1)

Country Link
JP (1) JP4889359B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987872B2 (en) * 2013-03-11 2015-03-24 Qualcomm Incorporated Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
JP6375517B2 (ja) * 2013-06-25 2018-08-22 パナソニックＩｐマネジメント株式会社 マイクロ波回路
CN106783805A (zh) * 2017-03-13 2017-05-31 中国科学院微电子研究所 射频多芯片封装及屏蔽电路
JP2025119873A (ja) 2024-02-02 2025-08-15 キヤノン株式会社 電子モジュール及び電子機器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63128736A (ja) * 1986-11-19 1988-06-01 Olympus Optical Co Ltd 半導体素子
EP1198005A4 (en) * 1999-03-26 2004-11-24 Hitachi Ltd SEMICONDUCTOR MODULE AND ITS ASSEMBLY
JP2001111232A (ja) * 1999-10-06 2001-04-20 Sony Corp 電子部品実装多層基板及びその製造方法
JP2002043507A (ja) * 2000-07-31 2002-02-08 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP4045083B2 (ja) * 2000-12-25 2008-02-13 株式会社ルネサステクノロジ 半導体モジュールおよび実装構造体
KR100521279B1 (ko) * 2003-06-11 2005-10-14 삼성전자주식회사 적층 칩 패키지
JP2005005092A (ja) * 2003-06-11 2005-01-06 Sony Corp 電子回路装置及び接続部材
JP3842272B2 (ja) * 2004-06-02 2006-11-08 株式会社Ｇｅｎｕｓｉｏｎ インターポーザー、半導体チップマウントサブ基板および半導体パッケージ

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