KR20040043839A - 더미 와이어를 이용한 열방출형 적층 칩 패키지 - Google Patents
더미 와이어를 이용한 열방출형 적층 칩 패키지 Download PDFInfo
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- KR20040043839A KR20040043839A KR1020020072256A KR20020072256A KR20040043839A KR 20040043839 A KR20040043839 A KR 20040043839A KR 1020020072256 A KR1020020072256 A KR 1020020072256A KR 20020072256 A KR20020072256 A KR 20020072256A KR 20040043839 A KR20040043839 A KR 20040043839A
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- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Abstract
Description
Claims (9)
- 기판과;상기 기판의 상부면에 부착되며, 활성면의 가장자리에 전극 범프들이 형성된 제 1 칩과;상기 제 1 칩의 전극 범프와 상기 기판을 전기적으로 연결하는 제 1 본딩 와이어와;상기 제 1 칩의 상부면에 부착되며, 활성면에 전극 범프들이 형성되어 있고 배면에 비전도성 접착층이 형성된 제 2 칩과;상기 제 2 칩의 전극 범프와 상기 기판을 전기적으로 연결하는 제 2 본딩 와이어와;상기 기판 상부면에 적층된 제 1 칩과 제 2 칩, 제 1 본딩 와이어와 제 2 본딩 와이어를 봉합하여 형성된 수지 봉합부; 및상기 기판 하부면에 형성되며, 상기 제 1 및 제 2 칩과 전기적으로 연결된 복수개의 솔더 볼;을 포함하며,상기 제 1 칩과 제 2 칩 사이를 경유하고, 양단이 상기 기판에 본딩된 복수개의 열방출용 더미 와이어;를 더 포함하는 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
- 제 1 항에 있어서, 상기 제 1 칩의 전극 범프는 활성면의 마주보는 양쪽의변에 근접하게 형성되며, 상기 더미 와이어는 상기 제 1 칩의 전극 범프가 형성되는 양변과 이웃하는 양변을 가로지르는 방향으로 형성된 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
- 제 2항에 있어서, 상기 기판의 상부면에는 상기 더미 와이어가 본딩되는 더미 패드가 형성된 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
- 제 3항에 있어서, 상기 기판의 하부면에 형성된 솔더 볼 중에는, 상기 더미 패드와 전기적으로 연결된 열방출용 더미 솔더 볼을 포함하는 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
- 제 4항에 있어서, 상기 더미 솔더 볼 중에는, 적어도 하나 이상의 접지용 더미 솔더 볼을 포함하는 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
- 제 3항에 있어서, 상기 제 1 칩은 활성면에 상기 전극 범프가 형성된 방향에 수직된 방향으로 형성된 복수개의 더미 전극 범프를 더 포함하며,상기 더미 와이어는 상기 더미 전극 범프와 상기 더미 패드 사이에 본딩된 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
- 제 6항에 있어서, 상기 더미 전극 범프는 상기 제 1 칩의 활성면의 중심 부분에 형성된 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
- 제 6항에 있어서, 상기 더미 전극 범프는 상기 제 1 칩의 활성면의 가장자리에 근접하게 형성되며, 상기 더미 와이어는 상기 더미 전극 범프가 형성된 변과 마주보는 변쪽의 상기 기판의 더미 패드에 본딩되는 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
- 제 1항 내지 8항의 어느 한 항에 있어서, 상기 제 2 칩의 전극 범프는 활성면의 마주보는 양쪽의 변에 근접하게 형성되며, 상기 제 1 칩의 전극 범프가 형성된 양변과 이웃하는 양변을 가로지르는 방향으로 형성된 더미 와이어를 더 포함하는 것을 특징으로 하는 더미 와이어를 이용한 열방출형 적층 칩 패키지.
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US10/719,670 US6857470B2 (en) | 2002-11-20 | 2003-11-20 | Stacked chip package with heat transfer wires |
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KR20190082544A (ko) * | 2018-01-02 | 2019-07-10 | 삼성전자주식회사 | 반도체 메모리 패키지 |
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2002
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2003
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KR101034054B1 (ko) * | 2009-10-22 | 2011-05-12 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
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US20040196635A1 (en) | 2004-10-07 |
KR100508682B1 (ko) | 2005-08-17 |
US6857470B2 (en) | 2005-02-22 |
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