JP2007281021A - 電子部品装置 - Google Patents

電子部品装置 Download PDF

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Publication number
JP2007281021A
JP2007281021A JP2006102213A JP2006102213A JP2007281021A JP 2007281021 A JP2007281021 A JP 2007281021A JP 2006102213 A JP2006102213 A JP 2006102213A JP 2006102213 A JP2006102213 A JP 2006102213A JP 2007281021 A JP2007281021 A JP 2007281021A
Authority
JP
Japan
Prior art keywords
electronic component
light
package
light transmission
transmission window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006102213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007281021A5 (enExample
Inventor
Naoyuki Koizumi
直幸 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006102213A priority Critical patent/JP2007281021A/ja
Publication of JP2007281021A publication Critical patent/JP2007281021A/ja
Publication of JP2007281021A5 publication Critical patent/JP2007281021A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Light Receiving Elements (AREA)
JP2006102213A 2006-04-03 2006-04-03 電子部品装置 Pending JP2007281021A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006102213A JP2007281021A (ja) 2006-04-03 2006-04-03 電子部品装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006102213A JP2007281021A (ja) 2006-04-03 2006-04-03 電子部品装置

Publications (2)

Publication Number Publication Date
JP2007281021A true JP2007281021A (ja) 2007-10-25
JP2007281021A5 JP2007281021A5 (enExample) 2009-03-26

Family

ID=38682196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006102213A Pending JP2007281021A (ja) 2006-04-03 2006-04-03 電子部品装置

Country Status (1)

Country Link
JP (1) JP2007281021A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009057602A1 (ja) 2007-10-29 2009-05-07 Ntt Docomo, Inc. 移動通信システム、ホーム基地局及び移動局
JP2016184069A (ja) * 2015-03-26 2016-10-20 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
JP2018064081A (ja) * 2016-10-07 2018-04-19 日本電気硝子株式会社 気密パッケージ及びその製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63149553A (ja) * 1986-12-12 1988-06-22 Nippon Mining Co Ltd 電子湿度計
JPH0338884A (ja) * 1989-07-06 1991-02-19 Fuji Electric Co Ltd 半導体装置の遮光構造
JPH03188680A (ja) * 1989-12-18 1991-08-16 Toshiba Corp 固体撮像装置
JP2001345391A (ja) * 2000-03-28 2001-12-14 Canon Inc 電子部品及びその製造方法
JP2004505267A (ja) * 2000-07-28 2004-02-19 大塚電子株式会社 スペクトル光検出装置
JP2004134721A (ja) * 2002-10-09 2004-04-30 Optware:Kk 光検出器および該光検出器を備えた光情報再生装置、光情報記録再生装置
JP2005518673A (ja) * 2002-02-25 2005-06-23 シリコン バンドウィドス インコーポレイテッド モジュール型半導体ダイパッケージ及びその製造方法
JP2007165464A (ja) * 2005-12-12 2007-06-28 Stanley Electric Co Ltd 半導体光学装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63149553A (ja) * 1986-12-12 1988-06-22 Nippon Mining Co Ltd 電子湿度計
JPH0338884A (ja) * 1989-07-06 1991-02-19 Fuji Electric Co Ltd 半導体装置の遮光構造
JPH03188680A (ja) * 1989-12-18 1991-08-16 Toshiba Corp 固体撮像装置
JP2001345391A (ja) * 2000-03-28 2001-12-14 Canon Inc 電子部品及びその製造方法
JP2004505267A (ja) * 2000-07-28 2004-02-19 大塚電子株式会社 スペクトル光検出装置
JP2005518673A (ja) * 2002-02-25 2005-06-23 シリコン バンドウィドス インコーポレイテッド モジュール型半導体ダイパッケージ及びその製造方法
JP2004134721A (ja) * 2002-10-09 2004-04-30 Optware:Kk 光検出器および該光検出器を備えた光情報再生装置、光情報記録再生装置
JP2007165464A (ja) * 2005-12-12 2007-06-28 Stanley Electric Co Ltd 半導体光学装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009057602A1 (ja) 2007-10-29 2009-05-07 Ntt Docomo, Inc. 移動通信システム、ホーム基地局及び移動局
JP2016184069A (ja) * 2015-03-26 2016-10-20 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
US10739554B2 (en) 2015-03-26 2020-08-11 Seiko Epson Corporation Electro-optical device, manufacturing method of electro-optical device, and electronic apparatus
JP2018064081A (ja) * 2016-10-07 2018-04-19 日本電気硝子株式会社 気密パッケージ及びその製造方法

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