JP2005518673A - モジュール型半導体ダイパッケージ及びその製造方法 - Google Patents
モジュール型半導体ダイパッケージ及びその製造方法 Download PDFInfo
- Publication number
- JP2005518673A JP2005518673A JP2003572072A JP2003572072A JP2005518673A JP 2005518673 A JP2005518673 A JP 2005518673A JP 2003572072 A JP2003572072 A JP 2003572072A JP 2003572072 A JP2003572072 A JP 2003572072A JP 2005518673 A JP2005518673 A JP 2005518673A
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor die
- cap
- light
- die package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
Abstract
Description
200 ベース
230 ペデスタル
300 導電ピン
400 キャップ
410 光学窓
500 接着部材
600 延長レッグ
610 導電リード
700 縦横配列延長レッグ層
710 縦横配列ベース層
720 縦横配列接着部材層
730 縦横配列キャップ層
800 半導体ダイ
Claims (4)
- 半導体ダイパッケージにおいて、
下側表面及び上側表面を有し、前記上側表面が少なくとも1つの半導体ダイをマウントするための表面である高分子材ベース、
前記ベースの前記上側表面の少なくとも一部に被せて作用的に固定されて空洞を形成し、光透過部材を有し、前記光透過部材が、前記ベースの前記上側表面の少なくとも一部と前記光透過部材の間のあらかじめ定められた波長の光の通過を可能にするように作用的に配置されている高分子材キャップ、及び
前記ベースの前記下側表面から前記ベースを貫通して前記空洞まで延びている複数本の導電リード、
を備えることを特徴とする半導体ダイパッケージ。 - 縦横配列半導体ダイパッケージにおいて、
複数の高分子材ベースを有し、前記複数のベースのそれぞれが少なくとも1つの半導体ダイをマウントするための表面を有する縦横配列ベース、
前記縦横配列ベースに被せて作用的に固定される複数の高分子材キャップを有し、前記ベースと前記キャップの組合せのそれぞれが空洞を形成し、前記複数のキャップのそれぞれが光透過部材を有し、前記光透過部材が、対応するベースの少なくとも1つの半導体ダイをマウントするための前記表面と前記光透過部材の間のあらかじめ定められた波長の光の通過を可能にするように作用的に配置されている縦横配列キャップ、及び
前記複数のベースのそれぞれの外部表面から前記それぞれのベースを貫通して、対応する、前記キャップと前記ベースの組合せのそれぞれにより形成される前記空洞まで延びている複数本の導電リード、
を備えることを特徴とする縦横配列半導体ダイパッケージ。 - 半導体ダイパッケージの作成方法において、
下側表面及び上側表面を有し、前記上側表面が少なくとも1つの半導体ダイをマウントするための表面である高分子材ベースを形成する工程、
前記ベースの前記上側表面の少なくとも一部に被せて作用的に固定され、光透過部材を有し、前記光透過部材が、前記ベースの前記上側表面の少なくとも一部と前記光透過部材の間のあらかじめ定められた波長の光の通過を可能にするように作用的に配置されている高分子材キャップを形成する工程、及び
前記ベースの前記下側表面から前記ベースを貫通して前記空洞まで延びている複数本の導電リードを形成する工程、
を含むことを特徴とする方法。 - 縦横配列半導体ダイパッケージの作成方法において、
複数の高分子材ベースを有し、前記複数のベースのそれぞれが少なくとも1つの半導体ダイをマウントするための表面を有する縦横配列ベースを形成する工程、
前記縦横配列ベースに被せて作用的に固定される複数の高分子材キャップを有し、前記ベースと前記キャップの組合せのそれぞれが空洞を形成し、前記複数のキャップのそれぞれが光透過部材を有し、前記光透過部材が、対応するベースの少なくとも1つの半導体ダイをマウントするための前記表面と前記光透過部材の間のあらかじめ定められた波長の光の通過を可能にするように作用的に配置されている縦横配列キャップを形成する工程、及び
前記複数のベースのそれぞれの外部表面から前記それぞれのベースを貫通して、対応する、前記キャップと前記ベースの組合せのそれぞれにより形成される前記空洞まで延びている複数本の導電リードを配置する工程、
を含むことを特徴とする方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/081,146 US6700138B2 (en) | 2002-02-25 | 2002-02-25 | Modular semiconductor die package and method of manufacturing thereof |
PCT/US2003/005534 WO2003073474A2 (en) | 2002-02-25 | 2003-02-25 | Modular semiconductor die package and method of manufacturing thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005518673A true JP2005518673A (ja) | 2005-06-23 |
Family
ID=27752916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003572072A Pending JP2005518673A (ja) | 2002-02-25 | 2003-02-25 | モジュール型半導体ダイパッケージ及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US6700138B2 (ja) |
JP (1) | JP2005518673A (ja) |
AU (1) | AU2003219865A1 (ja) |
WO (1) | WO2003073474A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007281021A (ja) * | 2006-04-03 | 2007-10-25 | Shinko Electric Ind Co Ltd | 電子部品装置 |
JP2015148808A (ja) * | 2015-03-10 | 2015-08-20 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
Families Citing this family (44)
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JP4074419B2 (ja) * | 2000-03-14 | 2008-04-09 | シャープ株式会社 | 半導体レーザ装置のワイヤボンディング方法 |
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JP4194918B2 (ja) * | 2003-10-31 | 2008-12-10 | シャープ株式会社 | 受光装置の製造方法 |
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DE102004051379A1 (de) * | 2004-08-23 | 2006-03-23 | Osram Opto Semiconductors Gmbh | Vorrichtung für ein optoelektronisches Bauteil und Bauelement mit einem optoelektronischen Bauteil und einer Vorrichtung |
US7843410B2 (en) | 2004-09-27 | 2010-11-30 | Qualcomm Mems Technologies, Inc. | Method and device for electrically programmable display |
US8310441B2 (en) | 2004-09-27 | 2012-11-13 | Qualcomm Mems Technologies, Inc. | Method and system for writing data to MEMS display elements |
US7170376B2 (en) * | 2004-12-09 | 2007-01-30 | Eaton Corporation | Electrical switching apparatus including a housing and a trip circuit forming a composite structure |
US20060246615A1 (en) * | 2005-04-27 | 2006-11-02 | Unity Opto Technology Co., Ltd. | Method of manufacturing vertical cavity surface emitting laser |
KR20080027236A (ko) | 2005-05-05 | 2008-03-26 | 콸콤 인코포레이티드 | 다이나믹 드라이버 ic 및 디스플레이 패널 구성 |
EP1999800A1 (en) * | 2006-03-21 | 2008-12-10 | Koninklijke Philips Electronics N.V. | Light emitting diode module and method for the manufacturing of such an led module |
US7358836B2 (en) * | 2006-03-29 | 2008-04-15 | Eaton Corporation | Shield, and printed circuit board and electrical apparatus employing the same |
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2002
- 2002-02-25 US US10/081,146 patent/US6700138B2/en not_active Expired - Fee Related
-
2003
- 2003-02-25 WO PCT/US2003/005534 patent/WO2003073474A2/en active Application Filing
- 2003-02-25 AU AU2003219865A patent/AU2003219865A1/en not_active Abandoned
- 2003-02-25 JP JP2003572072A patent/JP2005518673A/ja active Pending
- 2003-08-08 US US10/636,754 patent/US20040026757A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007281021A (ja) * | 2006-04-03 | 2007-10-25 | Shinko Electric Ind Co Ltd | 電子部品装置 |
JP2015148808A (ja) * | 2015-03-10 | 2015-08-20 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
Also Published As
Publication number | Publication date |
---|---|
US20030160314A1 (en) | 2003-08-28 |
AU2003219865A1 (en) | 2003-09-09 |
WO2003073474A3 (en) | 2004-06-03 |
WO2003073474A8 (en) | 2004-10-14 |
US20040026757A1 (en) | 2004-02-12 |
US6700138B2 (en) | 2004-03-02 |
AU2003219865A8 (en) | 2003-09-09 |
WO2003073474A2 (en) | 2003-09-04 |
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