JP2007273756A - 半導体装置の製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 60
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 60
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 37
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 31
- 239000010703 silicon Substances 0.000 claims abstract description 31
- 239000011229 interlayer Substances 0.000 claims abstract description 30
- 238000002955 isolation Methods 0.000 claims description 52
- 239000010410 layer Substances 0.000 claims description 49
- 230000015572 biosynthetic process Effects 0.000 claims description 15
- 238000009792 diffusion process Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 238000005468 ion implantation Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 25
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 20
- 239000010936 titanium Substances 0.000 description 20
- 229910052719 titanium Inorganic materials 0.000 description 20
- 229910021341 titanium silicide Inorganic materials 0.000 description 12
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- 239000005380 borophosphosilicate glass Substances 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
- H01L21/76832—Multiple layers
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
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Abstract
【解決手段】先ず、下地20を用意する。次に、下地上にシリコン酸化膜30を形成する。次に、シリコン酸化膜30上にシリコン窒化膜50を形成する。次に、シリコン窒化膜上に層間絶縁膜60を形成する。次に、シリコン酸化膜、シリコン窒化膜及び層間絶縁膜の積層体65を貫通するコンタクトホール70を設ける。ここで、シリコン酸化膜の厚みを、32〜48nmの範囲内の値とする。
【選択図】図4
Description
図1〜4を参照して、第1実施形態の半導体装置の製造方法について説明する。図1〜4は、第1実施形態の半導体装置の製造方法を説明するための工程図であって、断面の切り口で示している。
図5(A)及び(B)を参照して、第2実施形態の半導体装置の製造方法について説明する。図5(A)及び(B)は、第2実施形態の半導体装置の製造方法を説明するための工程図であって、断面の切り口で示している。
21、121 MOSトランジスタ形成領域
22、122 シリコン基板
23、123 素子分離領域
24、124 素子分離膜
26、126 ゲート酸化膜
28、128 ゲート電極
29、129 拡散層
30、130 シリコン酸化膜
32、132 マスク酸化膜
34、134 抵抗体分離酸化膜
40、140 抵抗体
42 抵抗体材料層
50、51、150 シリコン窒化膜
55 開口部
60、61、160 層間絶縁膜
65、67、165 積層体
70、71、170 コンタクトホール
80、180 チタン伝導層
82、182 チタンシリサイド
85、185 コンタクトプラグ
Claims (5)
- 下地を用意する工程と、
該下地上にシリコン酸化膜を形成する工程と、
該シリコン酸化膜上にシリコン窒化膜を形成する工程と、
該シリコン窒化膜上に層間絶縁膜を形成する工程と、
前記シリコン酸化膜、シリコン窒化膜及び層間絶縁膜の積層体を貫通するコンタクトホールを設ける工程と
を備え、
前記コンタクトホールが形成される領域のシリコン酸化膜の厚みを、32〜48nmの範囲内の値とすることを特徴とする半導体装置の製造方法。 - シリコン基板に、素子分離領域と、該素子分離領域で画成されていて、かつゲート酸化膜及びゲート電極が形成されているMOSトランジスタ形成領域とが設定されている下地を用意する工程と、
該下地上にマスク酸化膜を形成する工程と、
前記シリコン基板の、MOSトランジスタのソース又はドレインとして機能する領域にイオン注入を行って拡散層を形成する工程と、
前記マスク酸化膜上に抵抗体分離酸化膜を形成する工程と、
前記抵抗体分離酸化膜上に、所定の抵抗値を有する抵抗体材料層を形成する工程と、
前記抵抗体材料層を加工して、前記素子分離領域に対応する領域内の前記抵抗体分離酸化膜上に抵抗体を形成する工程と、
前記抵抗体分離酸化膜及び抵抗体上にシリコン窒化膜を形成する工程と、
該シリコン窒化膜上に層間絶縁膜を形成する工程と、
前記マスク酸化膜、抵抗体分離酸化膜、シリコン窒化膜及び層間絶縁膜の積層体を貫通するコンタクトホールを設ける工程と
を備え、
前記マスク酸化膜及び抵抗体分離酸化膜が積層されて構成されたシリコン酸化膜の厚みを、32〜48nmの範囲内の値とすることを特徴とする半導体装置の製造方法。 - 前記シリコン酸化膜の厚みを、前記積層体の厚みの2.8〜5.1%の範囲内の値とする
ことを特徴とする請求項1又は2に記載の半導体装置の製造方法。 - 下地を用意する工程と、
該下地上にシリコン酸化膜を形成する工程と、
該シリコン酸化膜上にシリコン窒化膜を形成する工程と、
該シリコン窒化膜に、前記シリコン酸化膜を露出させる開口部を形成する工程と、
該シリコン窒化膜、及び前記開口部内に露出した前記シリコン酸化膜上に層間絶縁膜を形成する工程と、
前記シリコン酸化膜、シリコン窒化膜及び層間絶縁膜の積層体を貫通するコンタクトホールを設ける工程と
を備え、
前記開口部の直径を、前記コンタクトホールの直径の1.05〜1.3倍の範囲内の値とすることを特徴とする半導体装置の製造方法。 - シリコン基板に、素子分離領域と、該素子分離領域で画成されていて、かつゲート酸化膜及びゲート電極が形成されているMOSトランジスタ形成領域とが設定されている下地を用意する工程と、
該下地上にマスク酸化膜を形成する工程と、
前記シリコン基板の、MOSトランジスタのソース又はドレインとして機能する領域にイオン注入を行って拡散層を形成する工程と、
前記マスク酸化膜上に抵抗体分離酸化膜を形成する工程と、
前記抵抗体分離酸化膜上に、所定の抵抗値を有する抵抗体材料層を形成する工程と、
前記抵抗体材料層を加工して、前記素子分離領域に対応する領域内の前記抵抗体分離酸化膜上に抵抗体を形成する工程と、
前記抵抗体分離酸化膜及び前記抵抗体上にシリコン窒化膜を形成する工程と、
該シリコン窒化膜に、前記抵抗体分離酸化膜を露出する開口部を形成する工程と、
該シリコン窒化膜、及び前記開口部内に露出した前記抵抗体分離酸化膜上に層間絶縁膜を形成する工程と、
前記マスク酸化膜、抵抗体分離酸化膜、シリコン窒化膜及び層間絶縁膜の積層体を貫通するコンタクトホールを設ける工程と
を備え、
前記開口部の直径を、前記コンタクトホールの直径の1.05〜1.3倍の範囲内の値とすることを特徴とする半導体装置の製造方法。
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JP2006098100A JP2007273756A (ja) | 2006-03-31 | 2006-03-31 | 半導体装置の製造方法 |
US11/715,340 US7465663B2 (en) | 2006-03-31 | 2007-03-08 | Semiconductor device fabrication method |
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JP2006098100A JP2007273756A (ja) | 2006-03-31 | 2006-03-31 | 半導体装置の製造方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11387185B2 (en) | 2014-04-18 | 2022-07-12 | Sony Group Corporation | Field-effect transistor, method of manufacturing the same, and radio-frequency device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0464220A (ja) * | 1990-07-03 | 1992-02-28 | Sharp Corp | 半導体装置の製造方法 |
JPH0897370A (ja) * | 1994-09-29 | 1996-04-12 | Sony Corp | 拡散層抵抗の形成方法 |
JPH08102505A (ja) * | 1994-09-30 | 1996-04-16 | Sony Corp | 半導体装置の製造方法 |
JPH10270549A (ja) * | 1997-03-24 | 1998-10-09 | Nec Corp | 半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5592415A (en) * | 1992-07-06 | 1997-01-07 | Hitachi, Ltd. | Non-volatile semiconductor memory |
JPH11307633A (ja) * | 1997-11-17 | 1999-11-05 | Sony Corp | 低誘電率膜を有する半導体装置、およびその製造方法 |
JP2002217292A (ja) * | 2001-01-23 | 2002-08-02 | Hitachi Ltd | 半導体集積回路装置および半導体集積回路装置の製造方法 |
JP3743513B2 (ja) | 2002-09-26 | 2006-02-08 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
-
2006
- 2006-03-31 JP JP2006098100A patent/JP2007273756A/ja active Pending
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- 2007-03-08 US US11/715,340 patent/US7465663B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0464220A (ja) * | 1990-07-03 | 1992-02-28 | Sharp Corp | 半導体装置の製造方法 |
JPH0897370A (ja) * | 1994-09-29 | 1996-04-12 | Sony Corp | 拡散層抵抗の形成方法 |
JPH08102505A (ja) * | 1994-09-30 | 1996-04-16 | Sony Corp | 半導体装置の製造方法 |
JPH10270549A (ja) * | 1997-03-24 | 1998-10-09 | Nec Corp | 半導体装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11387185B2 (en) | 2014-04-18 | 2022-07-12 | Sony Group Corporation | Field-effect transistor, method of manufacturing the same, and radio-frequency device |
US11810861B2 (en) | 2014-04-18 | 2023-11-07 | Sony Group Corporation | Field-effect transistor, method of manufacturing the same, and radio-frequency device |
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US7465663B2 (en) | 2008-12-16 |
US20070275524A1 (en) | 2007-11-29 |
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