JP2007266410A5 - - Google Patents

Download PDF

Info

Publication number
JP2007266410A5
JP2007266410A5 JP2006091102A JP2006091102A JP2007266410A5 JP 2007266410 A5 JP2007266410 A5 JP 2007266410A5 JP 2006091102 A JP2006091102 A JP 2006091102A JP 2006091102 A JP2006091102 A JP 2006091102A JP 2007266410 A5 JP2007266410 A5 JP 2007266410A5
Authority
JP
Japan
Prior art keywords
processing
substrate
temperature
determination
lot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006091102A
Other languages
English (en)
Japanese (ja)
Other versions
JP5128080B2 (ja
JP2007266410A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2006091102A external-priority patent/JP5128080B2/ja
Priority to JP2006091102A priority Critical patent/JP5128080B2/ja
Priority to US11/692,426 priority patent/US20070227658A1/en
Priority to TW096110861A priority patent/TWI409850B/zh
Priority to CN2007100913221A priority patent/CN101046691B/zh
Priority to KR1020070031063A priority patent/KR100882221B1/ko
Publication of JP2007266410A publication Critical patent/JP2007266410A/ja
Publication of JP2007266410A5 publication Critical patent/JP2007266410A5/ja
Priority to US12/958,997 priority patent/US20110190924A1/en
Publication of JP5128080B2 publication Critical patent/JP5128080B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2006091102A 2006-03-29 2006-03-29 基板処理装置の制御装置およびその制御方法 Expired - Lifetime JP5128080B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006091102A JP5128080B2 (ja) 2006-03-29 2006-03-29 基板処理装置の制御装置およびその制御方法
US11/692,426 US20070227658A1 (en) 2006-03-29 2007-03-28 Control device for controlling substrate processing apparatus and method therefor
TW096110861A TWI409850B (zh) 2006-03-29 2007-03-28 A control device for a substrate processing apparatus, and a control method thereof
KR1020070031063A KR100882221B1 (ko) 2006-03-29 2007-03-29 기판 처리 장치의 제어 장치, 기판 처리 장치의 제어 방법및 기판 처리 장치의 제어 프로그램을 기억한 기록 매체
CN2007100913221A CN101046691B (zh) 2006-03-29 2007-03-29 基板处理装置的控制装置、方法
US12/958,997 US20110190924A1 (en) 2006-03-29 2010-12-02 Control device for controlling substrate processing apparatus and method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006091102A JP5128080B2 (ja) 2006-03-29 2006-03-29 基板処理装置の制御装置およびその制御方法

Publications (3)

Publication Number Publication Date
JP2007266410A JP2007266410A (ja) 2007-10-11
JP2007266410A5 true JP2007266410A5 (https=) 2009-03-26
JP5128080B2 JP5128080B2 (ja) 2013-01-23

Family

ID=38639090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006091102A Expired - Lifetime JP5128080B2 (ja) 2006-03-29 2006-03-29 基板処理装置の制御装置およびその制御方法

Country Status (4)

Country Link
JP (1) JP5128080B2 (https=)
KR (1) KR100882221B1 (https=)
CN (1) CN101046691B (https=)
TW (1) TWI409850B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288282A (ja) * 2007-05-15 2008-11-27 Hitachi Kokusai Electric Inc 基板処理装置
JP5463066B2 (ja) 2009-04-30 2014-04-09 東京エレクトロン株式会社 ロット処理開始判定方法及び制御装置
TWI524388B (zh) * 2013-12-27 2016-03-01 日立國際電氣股份有限公司 A substrate processing apparatus, a manufacturing method of a semiconductor device, and a recording medium
JP6501601B2 (ja) 2014-05-20 2019-04-17 東京エレクトロン株式会社 基板処理装置、基板処理方法及び基板処理プログラム
US12074044B2 (en) * 2018-11-14 2024-08-27 Cyberoptics Corporation Wafer-like sensor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2511288B2 (ja) * 1988-03-14 1996-06-26 富士通株式会社 半導体装置の熱処理方法
US5925212A (en) * 1995-09-05 1999-07-20 Applied Materials, Inc. Apparatus and method for attaining repeatable temperature versus time profiles for plasma heated interactive parts used in mass production plasma processing
JP3568749B2 (ja) 1996-12-17 2004-09-22 株式会社デンソー 半導体のドライエッチング方法
KR19980068383A (ko) * 1997-02-19 1998-10-15 김광호 더미 로트 플로우 제어방법
JPH11288990A (ja) * 1998-04-01 1999-10-19 Hitachi Ltd プロセス処理方法およびその装置並びに半導体製造ラインおよびそれにおける被処理基板の搬送方法
JP3660582B2 (ja) * 2000-12-04 2005-06-15 株式会社日立製作所 プラズマエッチング処理装置
JP4334817B2 (ja) * 2002-05-15 2009-09-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR100476931B1 (ko) * 2002-09-19 2005-03-16 삼성전자주식회사 시즈닝 레서피의 최적화 방법
JP4673548B2 (ja) * 2003-11-12 2011-04-20 東京エレクトロン株式会社 基板処理装置及びその制御方法
US20050233477A1 (en) * 2004-03-05 2005-10-20 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and program for implementing the method
CN100373545C (zh) * 2004-03-05 2008-03-05 东京毅力科创株式会社 基板处理装置、基板处理方法及程序

Similar Documents

Publication Publication Date Title
JP5890477B2 (ja) ロボットプログラム修正システム
US9782898B2 (en) Robot controller for avoiding problem regarding robot at the time of emergency stop
JP2018114607A5 (ja) 制御装置、ロボットシステム、制御方法、プログラム、記録媒体及び物品の製造方法
JP2019136860A5 (ja) 制御装置、制御方法、ロボットシステム、物品の製造方法、表示装置、プログラム及び記録媒体
CN101932982A (zh) 电动机控制特性评价装置及电动机控制特性的提示方法
JP2009506424A5 (https=)
JP2011146663A5 (https=)
JP2012155533A5 (ja) データ処理装置、その制御方法およびプログラム、並びに記憶媒体
JP2012235087A5 (https=)
JP2011221821A5 (https=)
JP2009123209A5 (https=)
JP2012190215A5 (https=)
JP2005258661A5 (https=)
JP2010181636A5 (https=)
JP2008529121A5 (https=)
CN100474192C (zh) 数字控制器
JP2007266410A5 (https=)
JP2012155686A5 (https=)
JP2018024040A5 (https=)
JP2013014082A5 (https=)
JP2007221721A5 (https=)
JP2019093243A5 (https=)
JP2016153023A5 (https=)
JPWO2023166573A5 (ja) 学習装置、制御装置、学習方法及びプログラム
JP2011164949A5 (ja) 情報処理装置及びその制御方法