JP2007265853A - Manufacturing method of display panel member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method to manufacture a rear plate of a large PDP efficiently and without causing color difference in each region exposed. <P>SOLUTION: The manufacturing method of a display member comprises (A) a process in which a photosensitive paste is coated and dried on a substrate and a coating film is obtained, (B) a process in which an operation to expose a part of the exposed part of the coating film is exposed a plurality of times through a photo mask and the whole exposed part is exposed, (C) a process in which the exposed coating film is heat treated, (D) a process in which a pattern is formed by developing the coated film heat-treated, and (E) a process in which a barrier rib is formed by calcining the coated film with the pattern formed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display member. Specifically, the present invention relates to a manufacturing method suitable for manufacturing a display member such as a back plate substrate of a plasma display panel (hereinafter referred to as PDP) including a step of forming a pattern using a photomask.

  PDPs, which are attracting attention as next-generation large-scale displays, generate discharge by applying voltage to electrode pairs in a sealed space filled with a rare gas composed of helium, neon, xenon, etc., and visualize the discharge phenomenon. This is a display device that displays information. Among the members constituting such a PDP, a back plate can be cited as a member that occupies a large cost.

The back plate is composed of at least an electrode formed on the substrate, a dielectric layer, barrier ribs, and RGB phosphor layers. In recent years, auxiliary partition walls are often provided perpendicular to the stripe-shaped main partition walls. In any shape of the back plate having the partition walls, a high-definition back plate can be stably produced by using the photosensitive paste method (photolithography method) for forming the electrode pattern and the partition pattern. However, in recent PDPs, further increase in size and increase in the number of pixels are desired.
Normally, when forming a pattern on the back plate, a photomask having a size substantially the same as that of the back plate is used, and the entire back plate is exposed at once to form the pattern. For this reason, when manufacturing a large PDP (for example, 100-inch scale), a photomask of a considerable size must be used, which results in a very high cost and is difficult to handle. Has occurred. In such a photolithography process, a method of dividing and exposing a pattern is well known in the field of semiconductors and the like. However, these are not related to a method for manufacturing a display member, and a slight shift based on a mechanical accuracy error of a jointed portion when two or more areas are divided and exposed, or a slight mask displacement. Due to the large difference in aperture ratio, it was visible to the human eye when it was made into a panel, and the display quality was greatly reduced. (For example, see Patent Documents 1 and 2)
Japanese Patent Publication No. 5-127186 Patent Publication 2001-77000

  The present invention has been proposed as a method for solving the above-mentioned problems, and a display that efficiently and does not cause a color difference in each area where a large display member is exposed and does not recognize the boundary between the areas. An object of the present invention is to provide a method for manufacturing a member for use.

For the purpose of solving the above problems, the present invention provides:
(A) A step of applying a photosensitive paste on a substrate and drying to obtain a coating film,
(B) A step of exposing the entire exposed portion by performing an operation of exposing a part of the exposed portion of the coating film through a photomask a plurality of times,
(C) heat-treating the exposed coating film,
(D) A method for producing a display member, comprising: a step of developing the heat-treated coating film to form a pattern; and (E) a step of baking the patterned coating film to form a partition wall.

  According to the present invention, the photosensitive paste coating film is divided into a plurality of portions by using a photomask, and the entire surface is exposed, so that it is less expensive than the case where exposure is performed at once using a large photomask. A PDP can be manufactured. Further, when the PDP is driven, it is possible to manufacture a PDP in which the boundary portion of each exposure process is not conspicuous and no color difference is generated in each exposed region.

The present invention
(A) A step of applying a photosensitive paste on a substrate and drying to obtain a coating film,
(B) A step of exposing the entire exposed portion by performing an operation of exposing a part of the exposed portion of the coating film through a photomask a plurality of times,
(C) heat-treating the exposed coating film,
The present invention relates to a method for producing a display member, which includes (D) a step of developing the heat-treated coating film to form a pattern, and (E) a step of forming partition walls by firing the patterned coating film.

  As the substrate used for the back plate as a member for PDP in the present invention, soda glass, heat-resistant glass for PDP, etc. can be used. Specifically, PD200 manufactured by Asahi Glass Co., Ltd. or Nippon Electric Glass Co., Ltd. PP8 and the like.

  The photosensitive paste used in the step (A) contains inorganic fine particles. As the inorganic fine particles contained in the photosensitive paste, glass, ceramic (alumina, cordierite, etc.) and the like can be used. In particular, glass or ceramics containing silicon oxide, boron oxide, or aluminum oxide as an essential component is preferable.

The particle diameter of the inorganic fine particles is selected in consideration of the shape of the pattern to be produced, but the volume average particle diameter (D50) is preferably 1 to 10 μm, and more preferably 1 to 5 μm. By setting D50 to 10 μm or less, it is possible to prevent surface irregularities from occurring. Moreover, the viscosity adjustment of a paste can be made easy by setting it as 1 micrometer or more. Furthermore, it is particularly preferable in the pattern formation to use glass fine particles having a specific surface area of 0.2 to ³ m ² / g.

When the partition is formed by the method for manufacturing a display member of the present invention, the partition is preferably patterned on a glass substrate having a low thermal softening point, so that the glass having a thermal softening temperature of 350 to 600 ° C. is used as inorganic fine particles. It is preferable to use inorganic fine particles containing 60% by weight or more of fine particles. Further, by adding glass fine particles or ceramic fine particles having a heat softening temperature of 600 ° C. or higher, the shrinkage ratio during firing can be suppressed, but the amount is preferably 40% by weight or less. As the glass fine particles to be used, the linear expansion coefficient is 50 × 10 ^{−7 to} 90 × 10 ⁻⁷ (/ ° C.), and further 60 × 10 ^{−7 to} 90 × 10 in order to prevent warping of the glass substrate during firing. It is preferable to use glass fine particles of ⁻⁷ (/ ° C.).

  As the glass fine particles, glass containing an oxide of silicon and / or boron is preferably used.

  It is preferable that silicon oxide is blended in the range of 3 to 60% by weight. When the content is 3% by weight or more, the denseness, strength, and stability of the glass layer are improved, and the thermal expansion coefficient is within a desired range, thereby preventing mismatch with the glass substrate. Moreover, by setting it as 60 weight% or less, there exists an advantage that a thermal softening point becomes low and baking to a glass substrate is attained.

  Boron oxide can improve electrical, mechanical and thermal characteristics such as electrical insulation, strength, thermal expansion coefficient, and denseness of the insulating layer by blending in the range of 5 to 50% by weight. The stability of glass can be maintained by setting it as 50 weight% or less.

  Furthermore, by containing at least one of bismuth oxide, lead oxide, and zinc oxide in a total amount of 5 to 50% by weight, a glass paste having temperature characteristics suitable for patterning on a glass substrate can be obtained. it can. In particular, when glass fine particles containing 5 to 50% by weight of bismuth oxide are used, advantages such as a long pot life of the paste can be obtained. As the bismuth-based glass fine particles, glass powder containing the following composition is preferably used.

Bismuth oxide: 10-40 parts by weight Silicon oxide: 3-50 parts by weight Boron oxide: 10-40 parts by weight Barium oxide: 8-20 parts by weight Aluminum oxide: 10-30 parts by weight In addition, lithium oxide, sodium oxide, potassium oxide Among them, glass fine particles containing 3 to 20% by weight of at least one kind may be used. By adding the alkali metal oxide in an amount of 20% by weight or less, preferably 15% by weight or less, the stability of the paste can be improved. Of the above three types of alkali metal oxides, lithium oxide is particularly preferred from the viewpoint of paste stability. As the lithium glass fine particles, for example, glass powder containing the following composition is preferably used.

Lithium oxide: 2 to 15 parts by weight Silicon oxide: 15 to 50 parts by weight Boron oxide: 15 to 40 parts by weight Barium oxide: 2 to 15 parts by weight Aluminum oxide: 6 to 25 parts by weight In addition, lead oxide, bismuth oxide, zinc oxide Glass particles containing both metal oxides such as lithium oxides, alkali metal oxides such as lithium oxide, sodium oxide, and potassium oxide, the thermal softening temperature and the linear expansion coefficient can be easily achieved with a lower alkali content. Can be controlled.

  Also, workability is improved by adding aluminum oxide, barium oxide, calcium oxide, magnesium oxide, titanium oxide, zinc oxide, zirconium oxide, etc., especially aluminum oxide, barium oxide, zinc oxide, etc. to the glass fine particles. However, the content is preferably 40% by weight or less, more preferably 25% by weight or less from the viewpoint of the thermal softening point and the thermal expansion coefficient.

  The photosensitive paste used in the method for producing a display member of the present invention contains an organic component containing a photosensitive organic component and an organic solvent in addition to the above-described inorganic fine particles.

  As the photosensitive organic component, it is preferable to contain a photosensitive component selected from at least one of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer. Further, if necessary, a photopolymerization initiator, Contains a light absorber, a sensitizer, an organic solvent, a sensitization aid, and a polymerization inhibitor.

  The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include monofunctional and polyfunctional (meth) acrylates, vinyl compounds, allyl compounds, and the like. be able to. These can be used alone or in combination of two or more.

  As the photosensitive oligomer and photosensitive polymer, an oligomer or polymer obtained by polymerizing at least one of compounds having a carbon-carbon double bond can be used. In the polymerization, it can be copolymerized with other photosensitive monomers so that the content of these monomers is 10% by weight or more, more preferably 35% by weight or more. By copolymerizing an unsaturated acid such as an unsaturated carboxylic acid with a polymer or oligomer, the developability after exposure can be improved. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof. The acid value (AV) of the polymer or oligomer having an acidic group such as a carboxyl group in the side chain thus obtained is preferably in the range of 50 to 180, and more preferably in the range of 70 to 140. By adding a photoreactive group to the side chain or molecular end of the polymer or oligomer shown above, it can be used as a photosensitive polymer or photosensitive oligomer having photosensitivity. Preferred photoreactive groups are those having an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acrylic group, and a methacryl group.

  Specific examples of the photopolymerization initiator include benzophenone, methyl O-benzoylbenzoate, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4- Examples include benzoyl-4-methylphenyl ketone, dibenzyl ketone, fluorenone, 2,3-diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, and the like. One or more of these can be used. The photopolymerization initiator is preferably added in the range of 0.05 to 10% by weight, more preferably 0.1 to 5% by weight, based on the photosensitive component. If the amount of the polymerization initiator is too small, the photosensitivity tends to decrease, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion tends to be too small.

  It is also effective to add a light absorber. By adding a compound having a high absorption effect of ultraviolet light or visible light, a high aspect ratio, high definition, and high resolution can be obtained. As the light absorber, an organic dye is preferably used. Specifically, an azo dye, an aminoketone dye, a xanthene dye, a quinoline dye, an anthraquinone dye, a benzophenone dye, a diphenylcyanoacrylate dye. Dyes, triazine dyes, p-aminobenzoic acid dyes, and the like can be used. Since organic dye does not remain in the insulating film after baking, it is preferable because the deterioration of the insulating film characteristics due to the light absorber can be reduced. Among these, azo dyes and benzophenone dyes are preferable. The addition amount of the organic dye is preferably 0.05 to 5% by weight, and more preferably 0.05 to 1% by weight. When the addition amount is too small, the effect of adding the light absorber tends to decrease, and when it is too large, the insulating film characteristics after firing tend to decrease.

  A sensitizer is added in order to improve sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-dimethylaminobenzal) cyclohexanone, and the like. Can be given. One or more of these can be used. When adding a sensitizer to a photosensitive paste, the addition amount is 0.05 to 10 weight% normally with respect to the photosensitive component, More preferably, it is 0.1 to 10 weight%. If the amount of the sensitizer is too small, the effect of improving the photosensitivity tends not to be exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion tends to be small.

  Examples of the organic solvent include methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether acetate, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, and γ-butyllactone. , N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid and the like, and one or more of these An organic solvent mixture is used.

  The photosensitive paste is usually produced by mixing the above-mentioned inorganic fine particles and organic components so as to have a predetermined composition and then uniformly mixing and dispersing them with a three-roller or a kneader.

  In addition, a drying oven, a hot plate, an IR furnace, or the like can be used for drying after application.

Examples of the active light source used in the exposure in the step (B) include visible light, near ultraviolet light, ultraviolet light, electron beam, X-ray, and laser light. Among these, ultraviolet rays are most preferable, and as the light source, for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a halogen lamp, or a germicidal lamp can be used. Among these, an ultrahigh pressure mercury lamp is suitable. Although the exposure conditions vary depending on the coating thickness, it is preferable to use an ultrahigh pressure mercury lamp with an output of 1 to 100 mW / cm ² .

  In the present invention, it is preferable to perform the step (B) using two or more kinds of photomasks. Specifically, the entire surface of the coating film is divided into a plurality of regions, and each region is sequentially exposed through a photomask corresponding to each size, so that the entire surface of the coating film is finally exposed. This eliminates the need to handle a large mask as compared to the case where exposure is performed at once using a large photomask, which is preferable from the viewpoint of cost and handling.

In the step (B), the distance (gap setting value) between the photomask and the coating film surface of the photosensitive paste is preferably adjusted to 50 to 500 μm, more preferably 70 to 400 μm. By setting the gap set value to 50 μm or more, contact between the photosensitive paste coating film and the photomask can be prevented, and destruction or contamination of both can be prevented. Moreover, moderately sharp patterning is attained by setting it as 500 micrometers or less. In the case of performing exposure of n times in total, k-1 th and k th gap set value in the exposure and h _k-1 and h _k, respectively, when the slit width of the photomask and p, k-1 th It is preferable to vary h _k-1 and h _k so that the partition pattern shape difference formed at the k-th time is within 20% × p (k is an integer satisfying 2 ≦ k ≦ n). Even when the line widths of the masks used at the (k-1) th time and the kth time are the same, even if _hk-1 and _hk are the same due to the mask lot and the position accuracy limit of the exposure machine, the partition pattern This is because there are many differences in shape. When the partition pattern shape difference is 20% × p or more, the joint can be confirmed by this shape difference, and there is a tendency that a color difference occurs in each exposed region when the PDP is driven.

  By the way, in the step (B), a difference is likely to occur between the interval between the partition walls formed at the boundary portion of each exposure region and the interval between the other partition walls. As a result, when the PDP is driven, the boundary portion Tend to stand out. Therefore, in order to solve such a problem, in the present invention, it is preferable to perform the exposure step in step (B) as follows.

  FIG. 1 shows the procedure for carrying out the step (B). First, the (k−1) th exposure is performed on the substrate 1 with the light emitted from the light source through the photomask 2a. After the exposure, a partition wall pattern is formed on the substrate 1 by slits of the photomask 2a. Next, the k-th exposure is similarly performed on the substrate 1 through the photomask 2b. This is repeated a predetermined number of times to form a pattern on the substrate.

  In the first embodiment, for example, photomasks 5a and 5b having patterns as shown in FIG. 3A and FIG. 3B are used, and the k-1th photomask 5a is formed at the end of the photomask 5a. The distance between the slit I located and the slit II located at the end of the k-th photomask 5b adjacent to the slit I through the boundary portion between the (k-1) th and k-th exposure regions is d, the photomask When the slit interval at is set to 1, the difference between d and l is made as small as possible to adjust the interval between the partition walls formed at the boundary portion. The difference between d and l is preferably within 20% × p. If the difference between d and l is larger than 20% × p, the difference between the distance between the partition walls formed at the boundary of the exposure area on the substrate 1 and the distance between the other partition walls becomes large. There is a tendency that the boundary portion of the exposure region is conspicuous.

  In the step (B), it is preferable to perform alignment at two points on the pattern central axis as shown in FIG. 2 during the (k−1) th and kth exposures. By taking alignment at two points on the pattern central axis, the difference between d and l can be suppressed.

  Next, a second embodiment of the step (B) will be shown. In the present embodiment, the (k−1) th and kth exposure regions have overlapping portions, and the partition walls in the overlapping portions are exposed through the slits of the (k−1) th and kth photomasks. It is formed by alternately arranging the portions. This will be specifically described below.

  Examples of the slit shape of the photomask include those shown in FIGS. 4A and 4B, but the present invention is not limited to these. In FIG. 4A, the photomask 6a has slits whose slit intervals are the same as those of the partition walls finally formed on the substrate, and slits corresponding to overlapping portions are finally formed on the substrate. It is constituted by slits wider than the interval of the partition walls. In the present embodiment, the interval between the slits at the joint overlapping portion is twice the interval between the partition walls finally formed on the substrate.

  Next, the procedure for forming the partition pattern will be described. First, the (k−1) th exposure is performed on the substrate with the light emitted from the light source through the photomask 6a. After the exposure, a barrier rib pattern included in the photomask 6a is formed on the substrate. Next, the position of the photomask 6b at the time of performing the k-th exposure is on the partition pattern in which the width between the partitions is doubled at the joint overlapping portion formed by the k-1th exposure. The slits at the joint overlapping portions of the photomask 6b are made to alternate with the partition wall pattern generated by the k-th exposure, and the slit 6b is aligned and exposed so as to overlap the unexposed portions. After the exposure, the barrier rib pattern formed by each exposure process is alternately formed on the substrate in the overlapping portion of the (k-1) th exposure and the kth exposure, and as a whole, the barrier rib pattern is equally spaced.

  Next, a third embodiment of the step (B) will be shown. In the present embodiment, the (k-1) th and kth exposure areas have overlapping portions, and the partition walls in the overlapping portions are exposed portions through the slits of the (k-1) th and kth photomasks. Are formed by adjacent integration. This will be specifically described below.

  Examples of the pattern shape of the photomask include those shown in FIGS. 5A and 5B, but the present invention is not limited to these. In FIG. 5A and FIG. 5B, the slit shape of the photomask 7a and the photomask 7b is a ratio in which the slit that is the same as the finally formed partition and the slit width corresponding to the joint overlap portion is constant. It is comprised by the slit which becomes small.

  Next, the procedure for forming the partition pattern will be described. First, the (k−1) th exposure is performed on the substrate with the light emitted from the light source through the photomask 7a. After the exposure, a partition wall pattern is formed on the substrate by the slits of the photomask 7a. Here, the slits at the joint overlapping portions forming the partition wall pattern 7a are denoted by A, B, and C, respectively. Next, the position of the photomask 7b when performing the k-th exposure is aligned so that the slit 7b overlaps the partition wall pattern 7a, and the exposed portions A ′, B ′, and C ′ by the slit 7b are the slits 7a. Exposure is performed so as to be adjacent to and integrated with the exposed portions A, B, and C. As a result, in the overlapping portion of the (k-1) th and kth exposures on the substrate, barrier ribs having the same width are formed by the barrier rib patterns 7a and 7b, and a barrier rib pattern having the same width as a whole is formed.

  Note that, as in the present embodiment, it is preferable to reduce the slit width of the photomask at a certain rate in the overlapping portions of the (k−1) th and kth exposure regions. By reducing the width of each slit at a certain rate and superimposing the slits, it is possible to prevent the boundary between the exposed areas from being known during PDP driving.

  As temperature which heat-processes the coating film exposed in the process (C), 50-300 degreeC is preferable and 80-200 degreeC is more preferable. When the temperature is lower than 50 ° C., the effect of the heat treatment is small, and the rate of disconnection of the barrier rib pattern tends to increase. On the other hand, if the temperature is higher than 300 ° C., the effect of heat treatment becomes too strong, and there is a tendency that patterning defects and shape variations are likely to occur.

  The development of the exposed coating film in the step (D) is performed by utilizing the difference in solubility between the exposed portion and the unexposed portion in the developer. Development can be performed by a dipping method, a spray method, a brush method, or the like.

  As the developer, a solution in which an organic component to be dissolved in the photosensitive paste can be dissolved is used. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, it can be developed with an alkaline aqueous solution. As the alkaline aqueous solution, organic alkali such as tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, diethanolamine, etc. can be used, but inorganic such as sodium hydroxide, sodium carbonate, sodium carbonate aqueous solution, calcium hydroxide aqueous solution, etc. It is preferable to use an alkali.

  In the present invention, an inorganic alkaline aqueous solution is preferably used as the developer in the step (D). When an inorganic alkali is used, the remaining components of the developer remaining in the patterned partition walls are not easily discolored during firing, and the boundary between the exposed surfaces can suppress the color difference.

  When the developing solution is an organic alkali aqueous solution, it is preferable that the first exposure start to the last exposure end be performed within 5 minutes. When the exposure time difference is 5 minutes or more, there is a difference in the permeability of the developing solution to the exposed portion, and the boundary portion becomes conspicuous due to the remaining components remaining in the partition wall, and each region exposed when the PDP is driven There is a tendency for color differences to occur.

  The density | concentration of the organic alkali or inorganic alkali in a developing solution is 0.01 to 10 weight% normally, More preferably, it is 0.1 to 5 weight%. If the alkali concentration is too low, the soluble portion tends not to be removed. If the alkali concentration is too high, the pattern portion tends to be peeled off or the insoluble portion tends to be corroded. The development temperature during development is preferably 20 to 50 ° C. in terms of process control.

  Firing of the patterned coating film in the step (E) is performed in a firing furnace. The firing atmosphere and temperature vary depending on the type of paste and substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a roller hearth-type continuous firing furnace can be used. The firing temperature is preferably 400 to 800 ° C. In the case where the partition walls are directly formed on the glass substrate, it is preferable to perform firing by holding at a temperature of 450 to 620 ° C. for 10 to 60 minutes.

In the present invention, after the step (B), (A ′) a step of applying a photosensitive paste on the exposed coating film and drying to obtain a second coating film;
(B ′) a step of exposing a part of the exposed portion of the second coating film through a photomask a plurality of times to expose the entire exposed portion, and then the steps (C) and ( It is also useful when performing D) and step (E). Thus, by performing the coating and drying step and the exposure step multiple times, a large display member can be efficiently manufactured even when a pattern with different heights is formed depending on the position, and A display member that does not have a color difference depending on the position can be easily manufactured.

  The pitch of the formed barrier rib pattern is defined by the substrate size and the number of pixels. For example, in the high vision type (HD or XGA), the number of pixels in the horizontal direction of the panel is 1024 to 1366 and 3072 to 4098 cells in three colors of RGB. Therefore, when the substrate size is 42 inches, the horizontal dimension is about 900 nm, and when the substrate size is 50 inches, it is 1100 mm, so that the pitch is about 0.3 to 0.35 mm. In addition, standard definition (SD or VGA) has 852 pixels, and full-spec high-definition (FHD) has 1920 pixels, and the pitch may be set according to the number of pixels.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited by these Examples.

Address electrodes were formed on the glass substrate PD200 using a photosensitive silver paste. An address electrode having a line width of 50 μm, a thickness of 3 μm, and a pitch of 250 μm was formed by applying a photosensitive silver paste, drying, exposing, developing, and baking processes.
Next, a glass paste obtained by kneading the low melting glass powder, titanium oxide powder, ethyl cellulose, and terpineol was applied by screen printing to a thickness of 50 μm so as to cover the bus electrode of the display portion, and then 570 ° C. 15 A dielectric layer was formed by baking for a minute.
A photosensitive barrier rib paste was applied on the dielectric multilayer and dried to form a dry coating film. The composition of the photosensitive partition paste used was as follows: 52% by weight of glass powder having an average particle diameter of 2 μm mainly composed of lead oxide, boron oxide, silicon oxide and barium oxide, methyl methacrylate / methacrylic acid copolymer (weight composition ratio) 60/40, weight average molecular weight 32000) 12% by weight, dipentaerythritol hexaacrylate 12% by weight, benzophenone 1.94% by weight, 1,6-hexanediol-[(3,5-di-t-butyl-4- Hydroxyphenyl)] 0.05 wt%, Basic Blue 7 0.01 wt%, and propylene glycol monomethyl ether acetate 22 wt%. A die coater was used for coating so that the thickness after drying was 180 μm. The barrier rib paste was dried using an IR furnace for 30 minutes while maintaining the substrate temperature at 100 ° C.
Photomask with half the pattern without overlapping at the center joint of the substrate, or photomask with overlapping parts at the center and alternating exposed parts of the overlapping parts, or overlapping parts at the center Each exposure was performed using a photomask in which the exposed portions of overlapping portions were adjacently integrated. Table 1 shows the slit width, slit interval l, slit interval difference | dl |, exposure time difference, partition wall shape difference, heat treatment temperature after exposure, and the like of the photomask of each example.

  The exposed substrate formed as described above was developed with an alkaline aqueous solution shown in Table 2 to form a partition pattern. Next, the pattern-formed substrate was baked at 560 ° C. for 15 minutes. A phosphor was applied between the partition walls thus obtained by a dispenser method so that the thickness after firing was 25 μm, and firing was performed at 500 ° C. for 10 minutes. A plasma display panel was prepared by combining the back plate thus obtained and a separately prepared front plate, and the display quality was evaluated. The evaluation results are shown in Table 2.

  In the PDP using the back plate obtained in Examples 1 to 8, there was no color difference in the joint portion and good display characteristics were shown. In Comparative Example 1, ethanolamine was used, and the difference in exposure time was 5 minutes or more, so a color difference occurred in the joint portion, and good display quality could not be obtained. In Comparative Example 2, the color difference was confirmed due to the difference in shape of the partition walls and the pitch shift at the joint, and good display quality was not obtained.

It is a schematic diagram which shows the exposure method in the process (B) of this invention. It is a schematic diagram which shows arrangement | positioning of the alignment mark and pattern in the process (B) of this invention. The pattern of the photomask used in the 1st example of the process (B) of this invention is shown. The pattern of the photomask used in the 2nd example of the process (B) of this invention is shown. The pattern of the photomask used in the 3rd example of the process (B) of this invention is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2a Photomask 2b used in k-1th exposure Photomask 3a used in kth exposure, b Divided exposure surface 4 Alignment marks 5a, 5b Photomask pattern 6a used in the first embodiment of the present invention 6b Photomask pattern 7a, 7b used in the second embodiment of the present invention Photomask pattern used in the third embodiment of the present invention

Claims (6)

(A) A step of applying a photosensitive paste on a substrate and drying to obtain a coating film,
(B) A step of exposing the entire exposed portion by performing an operation of exposing a part of the exposed portion of the coating film through a photomask a plurality of times,
(C) heat-treating the exposed coating film,
(D) The manufacturing method of the member for a display which has the process of developing this heat-processed coating film, and forming a pattern, and (E) baking the pattern-formed coating film and forming a partition. The method for manufacturing a display member according to claim 1, wherein in the step (B), exposure is performed using two or more kinds of photomasks. 3. The method for producing a display member according to claim 1, wherein the development is performed with an inorganic alkaline aqueous solution in the step (D). The production of a display member according to claim 1 or 2, wherein the first exposure start to the last exposure end are performed within 5 minutes in the step (B), and the development is performed with an organic alkaline aqueous solution in the step (D). Method. After the step (B), further (A ′) a step of applying a photosensitive paste on the exposed coating film and drying to obtain a second coating film;
(B ′) An operation of exposing a part of the exposed portion of the second coating film through a photomask is performed a plurality of times to perform a step of exposing the entire exposed portion, and then the step (C), The manufacturing method of the member for a display in any one of Claims 1-4 which perform the said process (D) and the said process (E).   The back plate for plasma displays manufactured by the manufacturing method of the member for displays in any one of Claims 1-5.

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