JP4540968B2 - Plasma display panel manufacturing method and plasma display - Google Patents

Description

  The present invention relates to a method of manufacturing a member for a plasma display used for a wall-mounted television or a large monitor, and more particularly, a method for manufacturing a member for a plasma display with improved brightness and improved display quality of the plasma display panel, and a plasma display It is about.

  A plasma display panel (hereinafter abbreviated as PDP) has attracted attention as a display that can be used for thin and large televisions. In the PDP, for example, a plurality of paired sustain electrodes are formed of a material such as silver, chromium, aluminum, and nickel on a glass substrate on a front plate side that serves as a display surface.

  In addition, a black stripe pattern is formed in a portion corresponding to the light emitting pixels of the PDP for the purpose of improving display quality such as contrast.

  Further, a dielectric layer mainly composed of glass is formed with a thickness of 20 to 50 μm by covering the sustain electrode and the black stripe pattern, and an MgO layer is formed by covering the dielectric layer. On the other hand, on the glass substrate on the back plate side, a plurality of address electrodes are formed in stripes, and a dielectric layer mainly composed of glass is formed by covering the address electrodes. A partition for partitioning the discharge cells is formed on the dielectric layer, and a phosphor layer is formed in a discharge space formed by the partition and the dielectric layer. In a PDP capable of full color display, the phosphor layer is configured to emit light in red, green, and blue (RGB) colors. The front plate and the back plate are sealed so that the sustain electrode of the glass substrate on the front plate side and the address electrode on the back plate side are orthogonal to each other, and helium, neon, xenon, etc. are formed in the gap between the substrates. A rare gas is enclosed to form a PDP. Since the pixel cell is formed around the intersection of the scan electrode and the address electrode, the PDP has a plurality of pixel cells and can display an image.

  When a display is performed in the PDP, when a voltage higher than the discharge start voltage is applied between the sustain electrode and the address electrode from the non-lighted state in the selected pixel cell, positive ions and electrons generated by ionization are Is a capacitive load and moves toward the opposite polarity electrode in the discharge space and charges the inner wall of the MgO layer. The inner wall charge is not attenuated due to the high resistance of the MgO layer, and becomes a wall charge. Remains.

  Next, a sustaining voltage is applied between the scan electrode and the sustain electrode. Where there is a wall charge, it can be discharged even at a voltage lower than the discharge start voltage. The xenon gas in the discharge space is excited by the discharge, and ultraviolet light having a wavelength of 147 nm is generated. The ultraviolet light excites the phosphor, thereby enabling light emission display.

  In such a PDP, it is important to increase the luminance when the phosphor screen emits light. As means for increasing the brightness, wall-like projections that are parallel to the partition walls and lower than the partition walls and wall-like projections that are lower than the partition walls are formed in the direction intersecting the partition walls. It has been proposed to increase the luminance by increasing the light emitting area of the phosphor screen by forming the phosphor screen and allowing the ultraviolet rays to efficiently act on the phosphor screen (see Patent Document 1).

  As a method for forming the partition walls and the wall-shaped protrusions, Patent Document 1 discloses a method of applying twice / exposing twice, for example, forming a first photosensitive partition material layer on a substrate, and forming a wall shape thereon. A photomask having a pattern of protrusions is placed for exposure, and the second photosensitive barrier rib material layer is formed on the first photosensitive barrier rib material layer without developing as it is, and the barrier rib pattern is formed thereon. There has been proposed a method of forming a wall-shaped protrusion and a partition wall by arranging a photomask having a mask and developing it after exposure.

  However, in this method, when the application width of the first photosensitive barrier rib material layer and the second photosensitive barrier rib material layer are the same, or when the application width of the first photosensitive barrier rib layer is wider, After firing, the barrier rib pattern peels off at the interface between the first photosensitive barrier rib material layer and the second photosensitive barrier rib material layer, or when the pattern edge jumps up and forms a panel, color crosstalk occurs in this portion. There was a problem that a high-quality plasma display panel could not be made.

In addition, because of scratches on the photomask and foreign matter adhering to the photomask, defects in the barrier rib pattern occur, causing interference of discharge and color crosstalk when paneled, reducing the panel yield, and plasma display It was also a cause of increasing the manufacturing cost of the panel.
JP 2000-77002 A (pages 3 to 14)

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a plasma plasma display panel manufacturing method and a plasma display at low cost by forming a barrier rib pattern free from jumping and pattern defects and having excellent display quality.

That is, the present invention is a method for manufacturing a plasma display panel including a step of forming a barrier rib , wherein the step of forming the pattern of the barrier ribs includes the following steps (A) to (F) in order. It is a manufacturing method of a plasma display panel .
(A) a step of forming a first-layer pattern-forming photosensitive coating film that becomes a part of the partition ;
(B) exposing the first layer pattern forming photosensitive coating film through a first photomask;
(C) forming a second layer pattern forming photosensitive coating film, which is a part of the partition wall, wider than the first layer pattern forming photosensitive coating film;
(D) exposing the second layer pattern-forming photosensitive coating film through a second photomask;
(E) developing step,
(F) A step of firing.

Moreover, the manufacturing method of the plasma display panel of this invention has the following preferable aspects.
(a) The line width of the second photomask is wider than the line width of the first photomask.
(b) The photosensitive coating film is formed of a photosensitive partition paste.
(c) The photosensitive coating film is formed by a die coater.

The plasma plasma display of the present invention, characterized by using a plasma display panel obtained by the above-described manufacturing method.

ADVANTAGE OF THE INVENTION According to this invention, the plasma display panel which can form the partition without a jump and a pattern defect, and can provide the plasma display excellent in the display quality can be obtained.

  Hereinafter, the member for a plasma display and the plasma display of the present invention will be described in accordance with a procedure for producing a PDP.

  As the substrate used in the present invention, a glass substrate such as “PD200” manufactured by Asahi Glass Co., Ltd. or “PP8” manufactured by Nippon Electric Glass Co., Ltd., which is a heat-resistant glass plate for PDP, can be used in addition to the soda glass plate.

  An address electrode is formed on a glass substrate with a metal such as silver, aluminum, chromium and nickel. As a method of forming the address electrode, a metal paste mainly composed of these metal powders and an organic binder is printed by screen printing, or a photosensitive metal paste using a photosensitive organic component as an organic binder is applied. After that, a photosensitive paste method is used in which pattern exposure is performed using a photomask, unnecessary portions are dissolved and removed in a development step, and further, a metal pattern is formed by heating and baking to a temperature of 400 to 600 ° C. it can. Further, after sputtering a metal such as chromium or aluminum on a glass substrate, a resist is applied, and after the resist is subjected to pattern exposure / development, an etching method in which unnecessary portions of metal are removed by etching can be used.

  The thickness of the electrode is preferably 1 to 10 μm, more preferably 2 to 5 μm. If the electrode thickness is too thin, the resistance value tends to increase and accurate driving tends to be difficult. The width of the address electrode is preferably 20 to 200 μm, more preferably 30 to 100 μm. If the width of the address electrode is too thin, the resistance value tends to be high and accurate driving tends to be difficult. If it is too thick, the distance between adjacent electrodes tends to be small, so that a short defect tends to occur. Further, the address electrodes are formed at a pitch corresponding to the display cell (region where each RGB of the pixel is formed). A normal PDP is preferably formed at a pitch of 100 to 500 μm, and a high-definition PDP is preferably formed at a pitch of 100 to 400 μm.

  Next, a dielectric layer is preferably formed. The dielectric layer can be formed by applying a glass paste containing glass powder and an organic binder as main components so as to cover the address electrodes, and then baking at a temperature of 400 to 600 ° C. For the glass paste used for the dielectric layer, glass powder containing at least one kind of lead oxide, bismuth oxide, zinc oxide and phosphorus oxide and containing 10 to 80% by weight in total can be preferably used. . By making the amount of the glass powder 10% by weight or more, firing at a temperature of 600 ° C. or less is facilitated, and by making it 80% by weight or less, crystallization is prevented and a decrease in transmittance is prevented. A paste can be prepared by kneading these glass powder and an organic binder. Examples of organic binders that can be used include cellulose compounds such as ethyl cellulose and methyl cellulose, and acrylic compounds such as methyl methacrylate, ethyl methacrylate, isobutyl methacrylate, methyl acrylate, ethyl acrylate, and isobutyl acrylate.

  Moreover, you may add additives, such as a solvent and a plasticizer, in glass paste. As the solvent, general-purpose solvents such as terpineol, butyrolactone, toluene and methyl cellosolve can be used. As the plasticizer, dibutyl phthalate, diethyl phthalate, or the like can be used. By adding a filler component in addition to the glass powder, a PDP having a high reflectance and a high luminance can be obtained. As the filler, titanium oxide, aluminum oxide, zirconium oxide and the like are preferable, and it is particularly preferable to use titanium oxide having a particle diameter of 0.05 to 3 μm. The filler content is preferably in the range of 1: 1 to 10: 1 in the ratio of glass powder: filler. The brightness improvement effect can be obtained by setting the filler content to 1/10 or more of the glass powder. Moreover, sinterability can be maintained by setting it as below equal amount of glass powder. Further, by adding conductive fine particles, a PDP with high reliability during driving can be created. The conductive fine particles are preferably metal powders such as nickel and chromium, and those having a particle diameter in the range of 1 to 10 μm are preferable. By setting the particle diameter to 1 μm or more, a sufficient effect can be exhibited, and by setting the particle diameter to 10 μm or less, unevenness on the dielectric can be suppressed and partition formation can be facilitated. The content of these conductive fine particles contained in the dielectric layer is preferably 0.1 to 10% by weight. Effectiveness can be obtained by setting the content to 0.1% by weight or more, and shorting between adjacent address electrodes can be prevented by setting the content to 10% by weight or less. The thickness of the dielectric layer is preferably 3 to 30 μm, more preferably 3 to 15 μm. If the thickness of the dielectric layer is too thin, pinholes tend to occur frequently, and if it is too thick, the discharge voltage tends to increase and the power consumption tends to increase.

  On the dielectric layer, partition walls for partitioning the discharge cells and wall-shaped protrusions for improving luminance are formed. The cross-sectional shape of the partition wall can be formed as a trapezoid or a rectangle. The height of the partition wall is suitably 80 μm to 200 μm. By setting the height of the partition wall to 80 μm or more, it is possible to prevent the phosphor and the scan electrode from being too close to each other and to prevent the phosphor from being deteriorated due to discharge. In addition, by setting the height of the partition wall to 200 μm or less, it is possible to reduce the distance between the discharge at the scan electrode and the phosphor and obtain sufficient luminance.

  The partition pitch (P) is often 100 μm ≦ P ≦ 500 μm. The pitch (P) of the partition walls of the high-definition plasma display is preferably 100 μm ≦ P ≦ 250 μm. By setting the partition pitch (P) to 100 μm or more, the discharge space can be widened and sufficient luminance can be obtained, and by setting the pitch to 500 μm or less, a fine image with fine pixels can be displayed. By setting the pitch (P) of the partition walls to 250 μm or less, it is possible to display a beautiful video of HDTV (high vision) level.

  The line width (L) is preferably 10 μm ≦ L ≦ 50 μm in half width. By maintaining the line width (L) to 10 μm or more, the strength can be maintained, and it is possible to prevent breakage when sealing the front plate and the back plate. Can be made large, and high luminance can be obtained.

  In the present invention, there is no need for the wall-shaped protrusion, but it is preferable to form the wall-shaped protrusion because the luminance can be improved by forming the wall-shaped protrusion. By forming the wall-shaped protrusions, the phosphor layer can be formed also on the wall-shaped protrusions, and the light emission area can be increased. Accordingly, it is possible to increase the luminance because the ultraviolet rays efficiently act on the phosphor screen. Further, the presence of the auxiliary partition wall increases the bonding area of the entire partition wall, and the structural strength of the member can be obtained. As a result, the width of the barrier ribs and auxiliary barrier ribs can be reduced, the discharge volume in the display cell portion can be increased, and the discharge efficiency can be further improved.

  The wall-shaped protrusions may be provided in a direction parallel to or intersecting the partition walls, but are preferably formed lower than the partition walls. By forming the wall-shaped protrusions lower than the partition walls, there are advantages that the phosphor layer can be easily formed in the manufacturing process and that sealing and exhausting after sealing with the front plate is facilitated.

  Such partition walls and wall-shaped protrusions can be formed by baking after forming a pattern using a photosensitive paste comprising inorganic fine particles and a photosensitive organic component.

  As the inorganic fine particles of the photosensitive paste, glass, ceramic (alumina, cordierite, etc.) and the like can be used. In particular, glass or ceramics containing silicon oxide, boron oxide or aluminum oxide as an essential component is preferable.

The particle diameter of the inorganic fine particles is selected in consideration of the shape of the pattern to be produced, but the volume average particle diameter (D50) is preferably 1 to 10 μm, more preferably 1 to 5 μm. By setting D50 to 10 μm or less, it is possible to prevent surface irregularities from occurring. Moreover, the viscosity adjustment of a paste can be made easy by D50 being 1 micrometer or more. Furthermore, in pattern formation, it is particularly preferable to use glass fine particles having a specific surface area of 0.2 to ³ m ² / g.

Since the partition walls and the wall-shaped protrusions are preferably patterned on a glass substrate having a low thermal softening point, the inorganic fine particles include 60% by weight or more of glass fine particles having a thermal softening temperature of 350 ° C. to 600 ° C. as inorganic fine particles. Is preferably used. Further, by adding glass fine particles or ceramic fine particles having a heat softening temperature of 600 ° C. or higher, the shrinkage rate during firing can be suppressed, but the amount is preferably 40% by weight or less. The glass powder used has a linear expansion coefficient of 50 × 10 ^{−7 to} 90 × 10 ⁻⁷ , and further 60 × 10 ^{−7 to} 90 × 10 ⁻⁷ so as not to cause warpage of the glass substrate during firing. It is preferable to use glass fine particles.

  A glass material containing an oxide of silicon and / or boron is preferably used as a material for forming the partition walls and the wall-like protrusions.

  It is preferable that silicon oxide is blended in the range of 3 to 60% by weight. By making the compounding amount of silicon oxide 3% by weight or more, the denseness, strength and stability of the glass layer can be improved, and the thermal expansion coefficient can be kept within a desired range to prevent mismatch with the glass substrate. . Further, by making the blending amount 60% by weight or less, there is an advantage that the thermal softening point is lowered and baking onto a glass substrate becomes possible.

  Boron oxide can improve electrical, mechanical, and thermal characteristics such as electrical insulation, strength, thermal expansion coefficient, and denseness of the insulating layer by blending, for example, in the range of 5 to 50% by weight. The stability of glass can be maintained by setting it as 50 weight% or less.

Furthermore, it is possible to obtain a glass paste having temperature characteristics suitable for patterning on a glass substrate by containing at least one of bismuth oxide, lead oxide and zinc oxide in a total amount of 5 to 50% by weight. it can. In particular, when glass fine particles containing, for example, 5 to 50% by weight of bismuth oxide are used, advantages such as a long pot life of the paste can be obtained. As the bismuth-based glass fine particles, glass powder containing the following composition is preferably used.
Bismuth oxide: 10-40 parts by weight Silicon oxide: 3-50 parts by weight Boron oxide: 10-40 parts by weight Barium oxide: 8-20 parts by weight Aluminum oxide: 10-30 parts by weight

Moreover, you may use the glass fine particle which contains 3-20 weight% of at least 1 sort (s) among lithium oxide, sodium oxide, and potassium oxide. By making the addition amount of the alkali metal oxide 20% by weight or less, preferably 15% by weight or less, the stability of the paste can be improved. Of the above three types of alkali metal oxides, lithium oxide is particularly preferred from the viewpoint of paste stability. As the lithium glass fine particles, for example, glass powder containing the following composition is preferably used.
Lithium oxide: 2-15 parts by weight Silicon oxide: 15-50 parts by weight Boron oxide: 15-40 parts by weight Barium oxide: 2-15 parts by weight Aluminum oxide: 6-25 parts by weight

  In addition, by using glass fine particles containing both metal oxides such as lead oxide, bismuth oxide and zinc oxide and alkali metal oxides such as lithium oxide, sodium oxide and potassium oxide, a lower alkali content can be obtained. In addition, the heat softening temperature and the linear expansion coefficient can be easily controlled.

  Also, workability is improved by adding aluminum oxide, barium oxide, calcium oxide, magnesium oxide, titanium oxide, zinc oxide, zirconium oxide, etc., especially aluminum oxide, barium oxide, zinc oxide, to the glass fine particles. However, from the viewpoint of the thermal softening point and the thermal expansion coefficient, the content is preferably 40% by weight or less, more preferably 25% by weight or less.

  As the photosensitive organic component, it is preferable to contain a photosensitive component selected from at least one of a photosensitive monomer, a photosensitive oligomer and a photosensitive polymer, and, if necessary, a photopolymerization initiator, A light absorber, a sensitizer, an organic solvent, a sensitization aid and a polymerization inhibitor are added.

  The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include monofunctional and polyfunctional (meth) acrylates, vinyl compounds and allyl compounds. be able to. These can be used alone or in combination of two or more.

  As the photosensitive oligomer and the photosensitive polymer, an oligomer or a polymer obtained by polymerizing at least one of compounds having a carbon-carbon double bond can be used. In the polymerization, it can be copolymerized with other photosensitive monomers so that the content of these monomers is 10% by weight or more, more preferably 35% by weight or more. By copolymerizing an unsaturated acid such as an unsaturated carboxylic acid with a polymer or oligomer, the developability after exposure can be improved. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof. The acid value (AV) of the polymer or oligomer having an acidic group such as a carboxyl group in the side chain thus obtained is preferably in the range of 50 to 180, more preferably in the range of 70 to 140. By adding a photoreactive group to the side chain or molecular end to the polymer or oligomer shown above, it can be used as a photosensitive polymer or photosensitive oligomer having photosensitivity. Preferred photoreactive groups are those having an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acrylic group, and a methacryl group.

  Specific examples of the photopolymerization initiator include benzophenone, methyl O-benzoylbenzoate, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4- Examples include benzoyl-4-methylphenyl ketone, dibenzyl ketone, fluorenone, 2,3-diethoxyacetophenone and 2,2-dimethoxy-2-phenyl-2-phenylacetophenone. One or more of these can be used. The photopolymerization initiator is preferably added in the range of 0.05 to 10% by weight, more preferably 0.1 to 5% by weight, based on the photosensitive component. If the amount of the polymerization initiator is too small, the photosensitivity tends to decrease, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion tends to be too small.

  It is also effective to add a light absorber. By adding a compound having a high absorption effect of ultraviolet light or visible light, a high aspect ratio, high definition and high resolution can be obtained. As the light absorber, a light absorber composed of an organic dye is preferably used. Specifically, an azo dye, an aminoketone dye, a xanthene dye, a quinoline dye, an anthraquinone dye, a benzophenone dye, diphenylcyano, and the like. Acrylate dyes, triazine dyes, p-aminobenzoic acid dyes, and the like can be used. Since the organic dye does not remain in the insulating film after firing, the deterioration of the insulating film characteristics due to the light absorber can be reduced. Among these, azo dyes and benzophenone dyes are preferable. The addition amount of the organic dye is preferably 0.05 to 5% by weight, and more preferably 0.05 to 1% by weight. When the addition amount is too small, the effect of adding the light absorber tends to decrease, and when it is too large, the insulating film characteristics after firing tend to decrease.

  A sensitizer is added in order to improve sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone and 2,6-bis (4-dimethylaminobenzal) cyclohexanone. Is mentioned. One or more of these can be used. When adding a sensitizer to a photosensitive paste, the addition amount is 0.05 to 10 weight% normally with respect to the photosensitive component, More preferably, it is 0.1 to 10 weight%. If the amount of the sensitizer is too small, the effect of improving the photosensitivity tends not to be exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion tends to be small.

Examples of the organic solvent include methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether acetate, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, and γ-butyllactone. N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, and the like, and one or more of these An organic solvent mixture is used.
The photosensitive paste is usually prepared by mixing the inorganic fine particles and organic components so as to have a predetermined composition, and then uniformly mixing and dispersing them with a three-roller or a kneader.

  Next, a method for forming the partition wall and the wall-like protrusion in the present invention will be described. First, a first photosensitive paste is applied on a substrate on which an electrode is formed or a dielectric layer. As a coating method, a screen printing method, a bar coater, a roll coater, a die coater, a blade coater, or the like can be used. It is preferable to apply with a die coater from the viewpoints of thickness control of the coating film, uniformity of the coating film and workability. After the photosensitive paste is applied, it is dried using a ventilating oven, a hot plate, an IR furnace or the like to form a first photosensitive coating film.

Subsequently, exposure is performed using an exposure apparatus. The exposure is performed by mask exposure using a first photomask, as is performed by a normal photolithography method. At this time, in the case of forming a wall-shaped protrusion, a first photomask having a wall-shaped protrusion pattern is used. Examples of the active light source used at this time include visible light, near ultraviolet light, ultraviolet light, electron beam, X-ray, and laser light. Among these, ultraviolet rays are most preferable, and for example, a low pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a halogen lamp, and a germicidal lamp can be used as the light source. Among these, an ultrahigh pressure mercury lamp is suitable. Although exposure conditions differ depending on the coating thickness, exposure can be performed for 0.1 to 10 minutes using an ultrahigh pressure mercury lamp with an output of 1 to 100 mW / cm ² .

  A photosensitive paste is further applied on the exposed first photosensitive coating film and dried to form a second photosensitive coating film. The photosensitive paste of the second layer may be the same as or different from the photosensitive paste of the first layer, but the photosensitive coating film of the second layer is the width of the photosensitive coating film of the first layer. It is necessary to form wider than. The width of the second photosensitive coating film is preferably 1 mm or more, and more preferably 1.5 mm or more wider than the width of the first photosensitive coating film. Thus, by making the width of the coating film of the second layer wider than that of the first layer, it is possible to prevent pattern peeling or jumping up of the pattern edge at the interface between the first layer and the second layer after baking. In addition, the application end portion can have a positive taper angle to further prevent the pattern end portion from jumping up.

  In addition, the width of the photosensitive coating film of the first layer is shorter than the length of the partition wall, and a positive taper angle is formed on the end cross section, so that the photosensitive coating film of the second layer forms a positive taper angle after coating and drying. It becomes easy to do. Specifically, the width of the first photosensitive coating film is preferably 1 mm or more shorter than the length of the partition wall, and more preferably 2 mm or more. Furthermore, it is preferable that the range of 0.5-5 mm from the edge part of the photosensitive coating film becomes a taper shape.

  After forming the second photosensitive paste film, exposure is performed using an exposure apparatus. At this time, a second photomask is used as the photomask. By changing the photomask used when the first layer is exposed and the photomask used when the second layer is exposed, pattern defects caused by foreign matters adhering to the mask and pattern defects when the mask is damaged are suppressed. be able to.

  Further, the line width of the second photomask is preferably wider than the line width of the first photomask. By increasing the line width of the second photomask, it is not necessary to increase the alignment accuracy of the first layer and the second layer, and productivity can be improved. In this case, the line width of the second photomask needs to be a finally required line width.

  The ratio (W1 / W2) of the line width W1 of the first photomask and the line width W2 of the second photomask is preferably in the range of 9/10 to 1/10, more preferably 8/10 to 10. The range is 2/10, more preferably 7/10 to 3/10.

  After the second photosensitive coating film is exposed, development is performed using the difference in solubility between the exposed portion and the unexposed portion in the developer. Development can be performed by a dipping method, a spray method, a brush method, or the like.

  As the developer, a solution in which an organic component to be dissolved in the photosensitive paste can be dissolved is used. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, it can be developed with an alkaline aqueous solution. As the alkaline aqueous solution, sodium hydroxide, sodium carbonate, sodium carbonate aqueous solution, calcium hydroxide aqueous solution, or the like can be used. However, the use of the organic alkaline aqueous solution makes it easier to remove the alkaline component during firing. As the organic alkali, a general amine compound can be used. Specific examples of the organic alkali include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine and diethanolamine. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the soluble portion tends not to be removed. If the alkali concentration is too high, the pattern portion tends to be peeled off or the non-soluble portion tends to be corroded. Moreover, it is preferable to perform image development at the temperature of 20-50 degreeC on process control.

  Next, the partition / auxiliary partition pattern obtained by development is fired in a firing furnace. The firing atmosphere and temperature vary depending on the type of paste and substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a roller hearth-type continuous firing furnace can be used. Firing is preferably performed at a temperature of 400 to 800 ° C. In the case where the partition wall is directly formed on the glass substrate, it is preferable to perform baking while maintaining the temperature at 450 to 620 ° C. for 10 to 60 minutes.

  Next, in the present invention, phosphor layers that emit light of R (red), G (green), and B (blue) colors are formed between the barrier ribs formed in a direction parallel to the predetermined address electrodes. The phosphor layer can be formed by applying a phosphor paste containing phosphor powder, an organic binder, and an organic solvent as main components between predetermined partitions, drying, and firing as necessary.

  As a method of applying the phosphor paste between predetermined partition walls, a screen printing method in which a pattern is printed using a screen printing plate, a dispenser method in which the phosphor paste is discharged from the tip of a discharge nozzle, or a phosphor paste The phosphor paste of each color can be applied to a predetermined place by the above-described photosensitive paste method using the organic component having photosensitivity as the organic binder, but the screen printing method and the dispenser method are the present invention for cost reasons. Then, it is preferably applied.

When the thickness of the R phosphor layer is Tr, the thickness of the G phosphor layer is Tg, and the thickness of the B phosphor layer is Tb, preferably,
10 μm ≦ Tr ≦ Tb ≦ 50 μm
10 μm ≦ Tg ≦ Tb ≦ 50 μm
By having such a relationship, the effect of the present invention can be exhibited more. In other words, a plasma display having a better color balance (high color temperature) can be manufactured by making the thickness of the blue light emitting luminance lower than that of green and red. A sufficient luminance can be obtained by setting the thickness of the phosphor layer to 10 μm or more. Further, by setting the thickness of the phosphor layer to 50 μm or less, it is possible to widen the discharge space and obtain high luminance. The thickness of the phosphor layer in this case is measured as the formation thickness at the midpoint between adjacent barrier ribs. That is, it is measured as the thickness of the phosphor layer formed at the bottom of the discharge space (inside the cell).
The member for a plasma display of the present invention can be produced by firing the phosphor layer applied as described above at a temperature of 400 to 550 ° C. as necessary.

  Using this plasma display member as a back plate, after sealing with the front plate, after enclosing a discharge gas composed of helium, neon, xenon, etc. in the space formed between the front and back substrates, the drive circuit is A plasma display can be manufactured by mounting. The front plate is a member in which a transparent electrode, a bus electrode, a dielectric, and a protective film (MgO) are formed on a substrate in a predetermined pattern. A color filter layer may be formed in a portion corresponding to the RGB color phosphor layers formed on the back plate. Further, a black stripe may be formed in order to improve contrast.

  Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to this. In addition, the density | concentration (%) in an Example and a comparative example is weight%.

Example 1
First, a front plate was produced. A scan electrode having a pitch of 375 μm and a line width of 150 μm was formed on a glass substrate PD200 manufactured by Asahi Glass Co., Ltd. using ITO. In addition, after applying a photosensitive silver paste on the glass substrate, a mask exposure through a photomask, development using a 0.3% aqueous sodium carbonate solution, and a baking process at 580 ° C. for 15 minutes, a line width of 50 μm A bus electrode having a thickness of 3 μm was formed. Next, the bus electrode of the display portion is covered by screen printing with a glass paste obtained by kneading 70% of low melting point glass powder containing 75% by weight of lead oxide, 20% of ethyl cellulose and 10% of terpineol. After coating with a thickness of 50 μm, a front dielectric was formed by firing at a temperature of 570 ° C. for 15 minutes. A front plate was prepared by forming a 0.5 μm thick magnesium oxide layer as a protective film by electron beam evaporation on the substrate on which the dielectric was formed.

  Next, a back plate was produced. Address electrodes were prepared on a glass substrate PD200 manufactured by Asahi Glass Co., Ltd. using a photosensitive silver paste. The photosensitive silver paste was applied, dried, exposed, developed, and baked to form address electrodes having a line width of 50 μm, a thickness of 3 μm, and a pitch of 250 μm. Next, 60% of low melting point glass powder containing 75% by weight of bismuth oxide, 10% by weight of titanium oxide powder having an average particle diameter of 0.3 μm, 15% of ethyl cellulose, and 15% of terpineol were obtained. A glass paste was applied by screen printing to a thickness of 50 μm so as to cover the bus electrode of the display portion, and then baked at a temperature of 570 ° C. for 15 minutes to form a front dielectric layer.

  A first layer of photosensitive paste was applied on the dielectric. The photosensitive paste is composed of glass powder and an organic component containing a photosensitive component. The glass powder includes 10% by weight of lithium oxide, 25% by weight of silicon oxide, 30% by weight of boron oxide, 15% by weight of zinc oxide, and aluminum oxide. A glass powder having an average particle diameter of 2 μm, obtained by pulverizing a glass composed of 5% by weight and 15% by weight of calcium oxide, was used. The organic component including the photosensitive component includes 30% by weight of an acrylic polymer containing a carboxyl group, 30% by weight of trimethylolpropane triacrylate, “Irgacure (registered trademark) 651” (manufactured by Ciba Geigy) 10 A composition consisting of 30% by weight and 30% by weight of diethylene glycol monobutyl ether acetate was used. The photosensitive paste was prepared by mixing the glass powder and the organic component containing the photosensitive component in a weight ratio of 70:30, and then kneading them with a roll mill. Next, this photosensitive paste was applied by using a die coater so as to have a thickness of 180 μm and a coating width of 520 mm after drying. Drying was performed in an IR drying furnace (manufactured by NGK). After drying, exposure was performed in a direction parallel to the address electrodes using a photomask A (FIG. 1) having a stripe pattern with a pitch 1 of 250 μm and a line width 2 of 20 μm. At this time, pseudo defect portions 3 and 4 were formed on a part of the photomask A. After the exposure, the photosensitive paste was further applied and dried. After drying, a photosensitive coating film having a thickness of 70 μm and a coating film width of 522 mm was obtained.

  Next, using a photomask B (FIG. 2) having a stripe pattern with a pitch of 250 μm and a line width of 40 μm, exposure was performed in a direction parallel to the address electrodes. After the exposure, development was carried out in a 0.5% by weight ethanolamine aqueous solution, followed by baking at a temperature of 560 ° C. for 15 minutes to form partition walls. In the obtained partition wall, no defect due to the mask and no jumping up of the end of the partition wall were observed.

  Next, a phosphor was applied between adjacent barrier ribs. The phosphor was applied by a dispenser method in which the phosphor paste was discharged from the tip of a nozzle in which 256 holes (caliber: 130 μm) were formed. The phosphor was fired at 500 ° C. for 10 minutes after being applied on the side walls of the barrier ribs so that the thickness was 25 μm after firing and on the dielectric so that the thickness was 25 μm after firing. Thus, a back plate was produced as a member for PDP.

Further, the produced front substrate and back substrate were sealed using sealing glass, and Ne gas containing Xe 5% was sealed so as to have an internal gas pressure of 66500 Pa. Further, a driving circuit was mounted to produce a PDP. A voltage was applied to the scan electrode of the PDP to emit light. When the luminance was measured using the luminance meter, it was 220 cd / m ² , and the display characteristics were good. Moreover, display unevenness was not seen in the plane.

Example 2
The partition pattern was formed in the same manner as Example 1 except that the photomask C shown in FIG. The photomask C has a pattern with a pitch of 250 μm in the direction parallel to the address electrodes, a line width of 20 μm, and a line width of 60 μm in the direction perpendicular to the address direction. Pseudo defects 5 and 6 are formed in part of the pattern. did. After the pattern formation, the wall-shaped protrusion is formed lower than the partition in the direction intersecting the partition. In the obtained pattern of partition walls and wall-shaped protrusions, no chipping or jumping up of the end portions of the partition walls was observed. Furthermore, voltage was applied to the scan electrode of the obtained PDP to emit light. When the luminance was measured using the luminance meter, it was 260 cd / m ² , and a high luminance display characteristic could be obtained. Moreover, display unevenness was not seen in the plane.

Comparative Example 1
In the partition wall pattern formation, the coating width of the second layer was set to the same width (520 mm) as that of the first layer, and the photomask A was used in the same manner as the first layer in the exposure of the second layer. 1 was performed. In the obtained partition wall pattern, chipping and edge jumping due to mask defects were observed. Furthermore, when a voltage was applied to the scan electrode of the obtained PDP to emit light, display unevenness appeared at the notched portion of the partition wall pattern and the jumped-up portion of the end portion, and the display characteristics were poor.

  The member for a plasma display of the present invention is used for a wall-mounted television or a large monitor, and is particularly suitable for manufacturing a plasma display plasma display in which the brightness of the plasma display panel is improved and the display quality of the panel is improved.

It is an external view of the photomask A used by this invention. It is an external view of the photomask B used by this invention. It is an external view of the photomask C used in the present invention.

Explanation of symbols

1 Pitch 2 Line width 3 Pseudo defect 4 Pseudo defect 5 Pseudo defect 6 Pseudo defect

Claims (5)

A method of manufacturing a plasma display panel comprising a step of forming the partition wall, the production of plasma display panel to form a pattern of the partition wall is equal to or going through successively the steps below (A) ~ (F) Method.
(A) a step of forming a first-layer pattern-forming photosensitive coating film that becomes a part of the partition ;
(B) exposing the first layer pattern forming photosensitive coating film through a first photomask;
(C) forming a second layer pattern forming photosensitive coating film, which is a part of the partition wall, wider than the first layer pattern forming photosensitive coating film;
(D) exposing the second layer pattern-forming photosensitive coating film through a second photomask;
(E) developing step,
(F) A step of firing. 2. The method of manufacturing a plasma display panel according to claim 1, wherein a line width of the second photomask is wider than a line width of the first photomask. 3. The method of manufacturing a plasma display panel according to claim 1, wherein the pattern-forming photosensitive coating film is formed of a photosensitive partition paste. The method for manufacturing a plasma display panel according to claim 1, wherein the photosensitive coating film is formed by a die coater. The plasma display which uses the plasma display panel obtained by the manufacturing method in any one of Claims 1-4.

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