JP5025907B2 - Method for manufacturing plasma display panel - Google Patents

Description

The present invention relates to a plasma display panel used for a wall-mounted television or a large monitor, and more particularly, to a plasma display panel with improved display quality at a display edge.

  Plasma displays (hereinafter abbreviated as PDPs) are attracting attention as displays that can be used in thin and large televisions. In the PDP, a plurality of paired sustain electrodes are formed of a material such as silver, chromium, aluminum, or nickel on a glass substrate on the front plate side serving as a display surface. Further, a dielectric layer mainly composed of glass is formed with a thickness of 20 to 50 μm by covering the sustain electrode, and an MgO layer is formed by covering the dielectric layer. On the other hand, on the glass substrate on the back plate side, a plurality of address electrodes are formed in stripes, and a dielectric layer mainly composed of glass is formed by covering the address electrodes. A barrier rib for partitioning the discharge cells is formed on the dielectric layer, and a phosphor layer is formed in a discharge space formed by the barrier rib and the dielectric layer. In a PDP capable of full color display, the phosphor layer is configured to emit light for each of RGB colors. The front plate and the back plate are sealed so that the sustain electrode of the glass substrate on the front plate side and the address electrode on the back plate side are orthogonal to each other, and helium, neon, xenon, etc. are formed in the gap between the substrates. A rare gas is enclosed to form a PDP. Since the pixel cell is formed around the intersection of the scan electrode and the address electrode, the PDP has a plurality of pixel cells and can display an image.

  When performing display in the PDP, in a selected pixel cell, if a voltage higher than the discharge start voltage of the sealed gas is applied between the sustain electrode and the address electrode from a state in which no light is emitted, cations and electrons generated by ionization are Because the pixel cell has a capacitive load, it moves toward the opposite polarity electrode in the discharge space and charges the inner wall of the MgO layer on both sides, and the inner wall charge is attenuated due to the high resistance of the MgO layer. It remains without. Due to this wall charge, an electric field having a reverse polarity to the externally applied voltage is formed in the discharge space, so that the electric field in the cell is weakened and the discharge immediately stops.

  Next, the discharge is maintained by applying a discharge sustain voltage between the scan electrodes. Discharge at a voltage lower than the discharge start voltage is continued by the wall charge. Xenon gas in the discharge space is excited by the discharge, and ultraviolet light having a wavelength of 147 nm is generated. The ultraviolet light excites the phosphor, thereby enabling light emission display.

In recent years, in order to improve the performance of PDPs, in addition to the conventional stripe-shaped partition wall shape, a partition wall shape having a trident or intersection such as a lattice shape or a honeycomb shape has been proposed. One of the reasons why the barrier rib structure is complicated in this way is that, in the case of a striped barrier rib structure, interference of discharge between pixels tends to occur. In particular, when the resolution is increased, the interference of discharge becomes significant, and it is necessary to narrow the discharge gap of the front plate. However, in that case, the discharge space of the pixel is narrowed, so that the luminance is greatly reduced. Problems arise. In order to solve this problem, it has been proposed to provide an auxiliary partition that partitions pixels that intersect with the striped partition (see, for example, Patent Document 1). However, the provision of the auxiliary barrier ribs causes a problem that the barrier ribs at the end portions are pulled inward due to contraction of the barrier ribs during firing and are inclined. Since the end partition wall is inclined inward, the height of the end partition wall becomes higher than the other parts. Therefore, when the back plate is bonded to the front plate to form a panel, the back plate and the front plate A gap was generated between the two, and an erroneous discharge occurred in this portion, which was a problem.
JP-A-10-32148

  SUMMARY OF THE INVENTION In view of the above prior art, an object of the present invention is to provide a display with improved display quality at the end of a display area.

That is, the present invention is a method for manufacturing a plasma display panel, wherein a photosensitive paste is applied onto the substrate, and the coating film of the photosensitive paste is exposed to form an auxiliary partition, a non-display area formed in a display area. Forming a latent image of a portion corresponding to the dummy partition wall formed on the outermost edge of the substrate and the dummy auxiliary partition wall formed in the non-display area, and further applying a photosensitive paste thereon to form the photosensitive paste Of the coating film, at least a portion corresponding to the partition wall formed in the display region is exposed, developed, and baked.

ADVANTAGE OF THE INVENTION According to this invention, the plasma display panel which eliminated the erroneous discharge of the display area edge part and improved display quality can be provided.

  Hereinafter, the present invention will be described in detail together with preferred embodiments.

  As the glass substrate used for the display member of the present invention, “PD200” manufactured by Asahi Glass Co., Ltd., “PP8” manufactured by Nippon Electric Glass Co., Ltd., which is a heat resistant glass for PDP, can be used in addition to soda glass.

  Address electrodes are formed of a metal such as silver, aluminum, chromium, or nickel on a glass substrate. As a forming method, a metal paste mainly composed of these metal powders and an organic binder is subjected to pattern printing by screen printing, or a photosensitive metal paste using a photosensitive organic component as an organic binder is applied, and a photo paste is applied. It is also possible to use a photosensitive paste method in which pattern exposure is performed using a mask, unnecessary portions are dissolved and removed in a development step, and further, heated and baked at 400 to 600 ° C. to form a metal pattern. Further, an etching method in which a metal such as chromium or aluminum is sputtered on a glass substrate, a resist is applied, the resist is subjected to pattern exposure / development, and then an unnecessary portion of the metal is removed by etching can be used. The electrode thickness is preferably 1 to 10 μm, and more preferably 2 to 5 μm. If the electrode is too thin, the resistance value tends to increase and accurate driving cannot be performed. If the electrode is too thick, a large amount of material is required, which tends to be disadvantageous in cost. The width of the address electrode is preferably 20 to 200 μm, more preferably 30 to 100 μm. If the address electrode is too thin, the resistance value tends to be high and accurate driving tends to be difficult. If the address electrode is too thick, the distance between adjacent electrodes tends to be small, so that a short defect tends to occur. Further, the address electrodes are formed at a pitch corresponding to the display cell (region where each RGB of the pixel is formed). The pitch is preferably 100 to 500 μm for a normal PDP and 100 to 250 μm for a high definition PDP.

  A dielectric layer can be formed by applying a glass paste obtained by kneading glass powder and an organic binder as main components onto a substrate on which an electrode is formed, and then baking at 400 to 600 ° C. As the glass paste used for the dielectric layer, glass powder containing at least one of lead oxide, bismuth oxide, zinc oxide, and phosphorus oxide and containing 10 to 80% by weight in total is preferably used. By setting it as 10 weight% or more, baking at 600 degrees C or less becomes easy, and setting it as 80 weight% or less prevents crystallization and the fall of the transmittance | permeability. As the organic binder, cellulose compounds typified by ethyl cellulose, methyl cellulose and the like, acrylic compounds such as methyl methacrylate, ethyl methacrylate, isobutyl methacrylate, methyl acrylate, ethyl acrylate and isobutyl acrylate, and the like can be used. Moreover, you may add additives, such as a solvent and a plasticizer, in glass paste. As the solvent, general-purpose solvents such as terpineol, butyrolactone, toluene and methyl cellosolve can be used. As the plasticizer, dibutyl phthalate, diethyl phthalate, or the like can be used.

  By adding a filler component in addition to the glass powder, it is possible to obtain a PDP having high dielectric layer reflectance and high luminance. As the filler, titanium oxide, aluminum oxide, and zirconium oxide are preferable, and it is particularly preferable to use titanium oxide having a particle diameter of 0.05 to 3 μm. The filler content is a glass powder: filler ratio, and 10: 1 to 1: 1 is preferable for obtaining a sufficient effect of addition.

  Further, by containing conductive fine particles, a display with high reliability during driving can be created. The conductive fine particles are preferably metal powders such as nickel and chromium, and the particle diameter is preferably 1 to 10 μm. By setting the thickness to 1 μm or more, a sufficient effect can be exhibited, and by setting the thickness to 10 μm or less, the unevenness on the dielectric can be suppressed and the partition can be easily formed. The content of these conductive fine particles contained in the dielectric layer is preferably 0.1 to 10% by weight. When the content is 0.1% by weight or more, the effect of addition can be obtained, and when the content is 10% by weight or less, a short circuit between adjacent address electrodes can be prevented. The thickness of the dielectric layer is preferably 3 to 30 μm, more preferably 3 to 15 μm. If the dielectric layer is too thin, pinholes tend to occur, and if it is too thick, the discharge voltage tends to increase and the power consumption tends to increase.

A partition for partitioning the discharge cell is formed on the dielectric layer.
Here, the partition refers to a stripe pattern formed in the display region. The auxiliary barrier rib is a stripe pattern formed in the display area in a direction perpendicular to the barrier rib. The dummy barrier rib refers to a stripe pattern formed outside the display area in a direction parallel to the barrier rib. The dummy auxiliary barrier rib is a stripe pattern formed outside the display area in a direction perpendicular to the dummy barrier rib. The outermost partition wall means one of the partition walls existing on the outermost side in the display area. The outermost dummy partition wall means one of the dummy partition walls existing on the outermost side far from the display area.

  The height of the partition wall is suitably 80 μm to 200 μm. By setting the thickness to 80 μm or more, the phosphor and the scan electrode can be prevented from being too close to each other, and the phosphor can be prevented from being deteriorated by discharge. Further, by setting the thickness to 200 μm or less, the distance between the discharge at the scan electrode and the phosphor can be reduced, and sufficient luminance can be obtained. The partition pitch (P) is often 100 μm ≦ P ≦ 500 μm. In the high-definition plasma display, the partition pitch (P) is 100 μm ≦ P ≦ 350 μm. By setting the thickness to 100 μm or more, the discharge space can be widened and sufficient luminance can be obtained, and by setting the thickness to 500 μm or less, a fine image with fine pixels can be displayed. By setting the thickness to 350 μm or less, it is possible to display a beautiful video of HDTV (high definition) level. The line width (L) is preferably 10 μm ≦ L ≦ 50 μm in half width. By setting the thickness to 10 μm or more, strength can be maintained, and damage can be prevented from occurring when the front plate and the back plate are sealed. Further, when the thickness is 50 μm or less, the formation area of the phosphor can be increased and high luminance can be obtained.

  The simplest shape of the barrier ribs is a stripe barrier rib structure parallel to the data electrodes, and the manufacturing process is simple. However, in the case of striped barrier ribs, discharge interference between pixels tends to occur. In particular, when the definition is increased, the interference of discharge becomes remarkable, and it is necessary to narrow the discharge gap of the front plate. In this case, however, there arises a problem that the luminance is greatly reduced. In order to solve this problem, it has been proposed to provide an auxiliary partition wall for partitioning pixels that intersect the stripe-shaped partition wall.

  Such high-definition partition walls, auxiliary partition walls, dummy partition walls, and dummy auxiliary partition walls are formed by patterning a glass paste made of inorganic fine particles and an organic binder into the shape of the partition walls, and then baking them at 400 to 600 ° C. It can generally be obtained by a method.

  As the inorganic fine particles, glass, ceramics (alumina, cordierite, etc.) can be used. In particular, glass or ceramics containing silicon oxide, boron oxide, or aluminum oxide as an essential component is preferable.

The particle diameter of the inorganic fine particles is selected in consideration of the shape of the pattern to be produced, but the volume average particle diameter (D50) is preferably 1 to 10 μm, and more preferably 1 to 5 μm. By setting D50 to 10 μm or less, it is possible to prevent surface irregularities from occurring during pattern formation. Moreover, the viscosity adjustment of a paste can be easily performed by setting it as 1 micrometer or more. Furthermore, it is particularly preferable in the pattern formation to use inorganic fine particles having a specific surface area of 0.2 to ³ m ² / g.

  The partition walls, the auxiliary partition walls, the dummy partition walls, and the dummy auxiliary partition walls are patterned on a glass substrate having a low thermal softening point, and therefore include 60% by weight or more of glass particles having a thermal softening temperature of 350 ° C. to 600 ° C. as inorganic particles. It is preferable to use one. On the other hand, by adding glass fine particles or ceramic fine particles having a heat softening temperature of 600 ° C. or higher, the shrinkage rate during firing can be suppressed, but the amount is preferably 40% by weight or less.

As the glass powder to be used, it is preferable to use glass fine particles having a linear expansion coefficient of 50 to 90 × 10 ⁻⁷ , and more preferably 60 to 90 × 10 ⁻⁷ so as not to cause warpage of the glass substrate during firing.

  As the composition of the glass fine particles forming the partition walls, those containing silicon and / or boron oxide as essential components are preferably used.

  It is preferable that silicon oxide is blended in the range of 3 to 60% by weight. When the content is 3% by weight or more, the denseness, strength, and stability of the glass layer are improved, and the thermal expansion coefficient is within a desired range, thereby preventing mismatch with the glass substrate. Moreover, by setting it as 60 weight% or less, there exists an advantage that a thermal softening point becomes low and baking to a glass substrate is attained.

  Boron oxide can improve electrical, mechanical and thermal characteristics such as electrical insulation, strength, thermal expansion coefficient, and denseness of the insulating layer by blending in the range of 5 to 50% by weight. The stability of glass can be maintained by setting it as 50 weight%.

Furthermore, by containing at least one of bismuth oxide, lead oxide, and zinc oxide in a total amount of 5 to 50% by weight, a glass paste having temperature characteristics suitable for patterning on a glass substrate can be obtained. it can. In particular, when glass fine particles containing 5 to 50% by weight of bismuth oxide are used, advantages such as a long pot life of the paste can be obtained. As the bismuth-based glass fine particles, for example, glass powder having the following composition is preferably used.
Bismuth oxide: 10-40 parts by weight Silicon oxide: 3-50 parts by weight Boron oxide: 10-40 parts by weight Barium oxide: 8-20 parts by weight Aluminum oxide: 10-30 parts by weight

Moreover, you may use the glass microparticles | fine-particles which contain 3-20 weight% of at least 1 type in total among lithium oxide, sodium oxide, and potassium oxide. By adding the alkali metal oxide in an amount of 20% by weight or less, preferably 15% by weight or less, the stability of the paste can be improved. Of the above three types of alkali metal oxides, lithium oxide is particularly preferred from the viewpoint of paste stability. As the lithium glass fine particles, for example, glass powder containing the following composition is preferably used.
Lithium oxide: 2-15 parts by weight Silicon oxide: 15-50 parts by weight Boron oxide: 15-40 parts by weight Barium oxide: 2-15 parts by weight Aluminum oxide: 6-25 parts by weight

  In addition, if glass fine particles containing both metal oxides such as lead oxide, bismuth oxide and zinc oxide and alkali metal oxides such as lithium oxide, sodium oxide and potassium oxide are used, with a lower alkali content, The thermal softening temperature and linear expansion coefficient can be easily controlled.

  In addition, the workability can be improved by adding aluminum oxide, barium oxide, calcium oxide, magnesium oxide, titanium oxide, zirconium oxide, etc., especially aluminum oxide and barium oxide, to the glass fine particles. In view of the softening point and thermal expansion coefficient, the content is preferably 40% by weight or less, more preferably 25% by weight or less.

  Examples of the organic binder include polyvinyl alcohol, polyvinyl butyral, methacrylic acid ester polymer, acrylic acid ester polymer, acrylic acid ester-methacrylic acid ester copolymer, α-methylstyrene polymer, butyl methacrylate resin, ethyl cellulose and methyl cellulose. Cellulose compounds can be used. Furthermore, additives such as plasticizers, thickeners, organic solvents, antioxidants, dispersants, organic or inorganic suspending agents and leveling agents are also added.

  Furthermore, when adjusting the viscosity of the solution, an organic solvent may be added. The organic solvents used at this time are methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyl lactone, bromobenzene. , Chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid and the like, and organic solvent mixtures containing one or more of these.

  In addition, when the barrier rib and auxiliary barrier rib, dummy barrier rib, and dummy auxiliary barrier rib of the display member of the present invention are formed by the photosensitive paste method described later, the glass paste includes a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer. It is good to contain the photosensitive component chosen from at least 1 type of these, and also add a photoinitiator, a light absorber, a sensitizer, a sensitizer, and a polymerization inhibitor as needed.

  The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include monofunctional and polyfunctional (meth) acrylates, vinyl compounds, allyl compounds, and the like. be able to. These can be used alone or in combination of two or more.

  The photosensitive glass paste preferably uses a photosensitive polymer and / or a photosensitive oligomer as an organic binder. The oligomer or polymer is obtained by polymerization or copolymerization of components selected from compounds having a carbon-carbon double bond. By copolymerizing an unsaturated acid such as an unsaturated carboxylic acid with a polymer or oligomer, the developability in an alkaline aqueous solution after exposure can be improved. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof. The acid value (AV) of the polymer or oligomer having an acidic group such as a carboxyl group in the side chain thus obtained is preferably in the range of 50 to 180, and more preferably in the range of 70 to 140. By adding a photoreactive group to the side chain or molecular end to the polymer or oligomer shown above, it can be used as a photosensitive polymer or photosensitive oligomer having photosensitivity. Preferred photoreactive groups are those having an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acrylic group, and a methacryl group.

  Specific examples of the photopolymerization initiator include benzophenone, methyl O-benzoylbenzoate, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4- Examples include benzoyl-4-methylphenyl ketone, dibenzyl ketone, fluorenone, 2,3-diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, and the like. One or more of these can be used. The photopolymerization initiator is preferably added in the range of 0.05 to 10% by weight, more preferably 0.1 to 5% by weight, based on the photosensitive component. If the amount of the polymerization initiator is too small, the photosensitivity tends to decrease, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion tends to be too small.

  As the light absorber, those composed of organic dyes are preferably used. Specifically, azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, anthraquinone dyes, benzophenone dyes, diphenylcyanoacrylate dyes are used. Dyes, triazine dyes, p-aminobenzoic acid dyes, and the like can be used. Since organic dye does not remain in the insulating film after baking, it is preferable because the deterioration of the insulating film characteristics due to the light absorber can be reduced. Among these, azo dyes and benzophenone dyes are preferable. The addition amount of the organic dye is preferably 0.05 to 5% by weight, and more preferably 0.05 to 1% by weight. When the addition amount is too small, the effect of adding the light absorber tends to decrease, and when it is too large, the insulating film characteristics after firing tend to decrease.

  A sensitizer is added in order to improve sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-dimethylaminobenzal) cyclohexanone, and the like. Is mentioned. One or more of these can be used. When adding a sensitizer to a photosensitive paste, the addition amount is 0.05 to 10 weight% normally with respect to the photosensitive component, More preferably, it is 0.1 to 10 weight%. If the amount of the sensitizer is too small, the effect of improving the photosensitivity tends not to be exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion tends to be small.

  As a method of patterning partition walls, auxiliary partition walls, dummy partition walls, and dummy auxiliary partition walls using glass paste, they can be formed by methods such as screen printing, sand blasting, photosensitive paste method, photo embedding method, and mold transfer method. is there.

  The screen printing method is a method in which a paste is spread on a screen plate in which an emulsion layer is formed in a portion other than a pattern to be formed and transferred onto a substrate using a squeegee. Since the transferable thickness is about 10 to 30 μm, the partition wall, the auxiliary partition wall, the dummy partition wall, and the dummy auxiliary partition wall are formed by firing 5 to 15 times repeatedly to ensure the necessary height.

  The sandblasting method is a method in which after applying a glass paste on a substrate, a dry film resist is laminated thereon, the dry film resist is patterned by a photolithography method, and then unnecessary portions are removed by spraying polishing sand. is there. After removing the unnecessary portion, the resist portion is removed and further baked to form a partition, an auxiliary partition, a dummy partition, and a dummy auxiliary partition.

  In the photo embedding method, a dry film resist is laminated on a substrate, and a pattern for removing a resist in a portion for forming a partition wall, an auxiliary partition wall, a dummy partition wall, and a dummy auxiliary partition wall is formed. A photolithography method is used for the pattern. Next, after the glass paste is embedded in the portion where the resist has been removed, the entire resist portion is removed. As a removing method, there are a method of dissolving with an alkali and a method of removing by incineration by baking. Next, the partition wall, the auxiliary partition wall, the dummy partition wall, and the dummy auxiliary partition wall can be formed by firing.

  Among various types of partition walls, auxiliary partition walls, dummy partition walls, and dummy auxiliary partition wall formation methods, the photosensitive paste method is excellent in terms of high definition and process simplicity. Next, an example of a procedure for forming barrier ribs, auxiliary barrier ribs, dummy barrier ribs, and dummy auxiliary barrier ribs using a photosensitive paste is shown below.

  A photosensitive paste is applied to a glass substrate. As a coating method, a general method such as a screen printing method, a bar coater, a roll coater, a die coater, or a blade coater can be used. The coating thickness can be adjusted by selecting the number of coatings, screen mesh, and paste viscosity. Alternatively, a method may be used in which a photosensitive sheet is formed by applying a photosensitive paste on a film such as a polyester film, and the photosensitive paste is transferred onto a substrate using an apparatus such as a laminator.

After applying the photosensitive paste, exposure is performed using an exposure apparatus. As for exposure, a mask exposure method using a photomask is generally used, as in normal photolithography. As the mask to be used, either a negative type or a positive type is selected depending on the type of the photosensitive organic component. Alternatively, a method of directly drawing with a laser beam or the like without using a photomask may be used. Examples of the active light used for exposure include visible light, near ultraviolet light, ultraviolet light, electron beam, X-ray, and laser light. Among these, ultraviolet rays are most preferable, and as the light source, for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a halogen lamp, or a germicidal lamp can be used. Among these, an ultrahigh pressure mercury lamp is suitable. Exposure conditions vary depending on the coating thickness, but exposure is performed for 0.1 to 10 minutes using an ultrahigh pressure mercury lamp with an output of 1 to 100 mW / cm ² .

  After the exposure, development is performed using the difference in solubility between the exposed portion and the non-exposed portion in the developer. In this case, an immersion method, a spray method, a brush method, or the like is used.

  As the developer, a solution in which an organic component to be dissolved in the photosensitive paste can be dissolved is used. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, it can be developed with an alkaline aqueous solution. As the alkaline aqueous solution, sodium hydroxide, sodium carbonate, sodium carbonate aqueous solution, calcium hydroxide aqueous solution or the like can be used. However, it is preferable to use an organic alkaline aqueous solution because an alkaline component can be easily removed during firing. As the organic alkali, a general amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, and diethanolamine. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the soluble portion tends to be difficult to remove, and if the alkali concentration is too high, the pattern portion is peeled off and the non-soluble portion tends to be corroded. The development temperature during development is preferably 20 to 50 ° C. in terms of process control.

  Next, baking is performed in a baking furnace. The firing atmosphere and temperature vary depending on the type of paste and substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a roller hearth-type continuous firing furnace can be used. The firing temperature is 400 to 800 ° C. When the substrate is glass, the substrate is baked while being held at a temperature of 450 to 620 ° C. for 10 to 60 minutes.

  Generally, a pattern forming method using a photosensitive paste is performed through the above-described steps. In the present invention, the partition wall, auxiliary partition wall, dummy partition wall, and dummy auxiliary partition pattern formation method can be accurately and efficiently formed by repeating the coating, drying, and exposure steps in addition to the above general pattern formation method, for example. It becomes possible to do.

That is, first, the dried photosensitive paste coating film is exposed through the photomask only to the auxiliary partition wall portion, the dummy auxiliary partition wall portion, and the outermost dummy partition wall portion in the final partition wall pattern. On the exposed coating film, various photosensitive pastes are applied again, and after drying, the portions other than the outermost edge of the partition walls and the dummy partition walls are exposed through a photomask, and then developed and baked. It is possible to manufacture a display member in which the height of the dummy partition walls is lower than the height of the partition walls.
Yes.

  In addition, by applying a sandblasting paste to the second layer, it is possible to form a partition wall pattern having a height difference even if resist formation, sandblasting, resist stripping and a normal sandblasting method are used.

By making the height of the dummy partition located at least at the outermost edge of the non-display area out of the dummy partitions in the non-display area lower than the partition height of the display area, the dummy partition located at the outermost edge of the non-display area becomes a dummy assist. Even if the partition wall is tilted toward the display area due to firing shrinkage stress, the height of the dummy partition wall does not exceed the partition wall height, and when the panel is formed, a gap is opened between the back plate and the front plate at the panel edge. It is possible to prevent erroneous discharge caused by the above.

  The difference between the height of the partition in the display area and the height of the dummy partition formed lower than the partition is preferably 10 to 60 μm. By setting the height difference to be 10 μm or more, even if the dummy partition located at the outermost edge of the non-display area is tilted toward the display area, the height of the dummy partition does not exceed the partition height and is set to 60 μm or less. It is possible to prevent the partition wall adjacent to the dummy partition wall formed low or the dummy partition wall from being inclined.

The difference between the height of the dummy partition wall formed lower than the partition wall and the height of the dummy auxiliary partition wall is preferably 0 to 10 μm. By setting the thickness to 0 to 10 μm, the dummy partition wall can sufficiently withstand the firing stress of the dummy auxiliary partition wall , and does not have an influence such as peeling or tilting of the adjacent partition wall.

  It is also one of the preferred embodiments of the present invention that the second layer of photosensitive paste is baked to exhibit a black color. Contrast can be improved by using a second layer of photosensitive paste that is baked and exhibits a black color. In order to make the photosensitive paste baked to exhibit a black color, using glass containing Ru, Mn, Ni, Cr, Fe, Co, Cu metals or their oxides in a total amount of 1 to 15% by weight. good. Moreover, you may make black metal or a metal oxide adhere to glass powder, or you may make it wear. Alternatively, the first layer of the photosensitive paste coating film may be exposed and developed to form a part of the partition pattern, and then the second layer of photosensitive paste may be applied, exposed and developed to form the partition. .

  Furthermore, although it has been described that the previous electrode and dielectric formation are each performed as a firing step, by changing each electrode paste and dielectric paste, electrodes / dielectrics, dielectrics / partitions, electrodes / dielectrics / It is also possible to fire the partition walls at once. Even in this case, the effect of the present invention is not impaired.

  After the barrier ribs are formed, phosphor layers that emit light of RGB colors are formed. A phosphor layer can be formed by applying a phosphor paste mainly composed of phosphor powder, an organic binder, and an organic solvent between predetermined partitions. The methods include screen printing using a screen printing plate for pattern printing, dispenser method for discharging phosphor paste in a pattern from the tip of a discharge nozzle, and photosensitive phosphor using a photosensitive organic component as an organic binder. A photosensitive paste method using a paste or the like can be employed.

  The thickness of each color phosphor layer is preferably 10 to 50 μm. Sufficient luminance can be obtained by setting the thickness to 10 μm or more. Further, by setting the thickness to 50 μm or less, a discharge space is secured and the phosphor can emit light effectively. The thickness of the phosphor layer in this case is measured as the formation thickness at the midpoint between adjacent barrier ribs, that is, the thickness of the phosphor layer formed at the bottom of the discharge space (in the cell).

  It is also effective to improve the luminance of blue by forming a phosphor layer that emits blue light in two or more adjacent grooves formed by the partition walls, such as RGBBRGBB..., RGBBBRGGBB.

As phosphor powder to be used, red is Y ₂ O ₃ : Eu, YVO ₄ : Eu, (Y, Gd) BO ₃ : Eu, Y ₂ 0 ₃ S: Eu, γ-Zn ₃ (PO ₄ ) _2. : Mn, (ZnCd) S: Ag + In ₂ O _3, etc., green is Zn ₂ GeO ₂ : Mn, BaAl ₁₂ O ₁₉ : Mn, Zn ₂ SiO ₄ , LaPO ₄ : Tb, ZnS: Cu, Al, ZnS: Au , Cu, Al, (ZnCd) S: Cu, Al, Zn 2 SiO 4: Mn, As, Y 3 A1 5 O 12: Ce, CeMgAl 11 O 19: Tb, Gd 2 O 2 S: Tb, Y 3 A1 ₅ O ₁₂ : Tb, ZnO: Zn, etc. The blue color is Sr ₅ (PO ₄ ) ₃ Cl: Eu, BaMgAl ₁₄ O ₂₃ : Eu, BaMgAl ₁₆ O ₂₇ : Eu, BaMg ₂ Al ₁₄ O ₂₄ : Eu, ZnS: Ag + red pigment, Y ₂ SiO ₃ : Ce, and the like.

  The display member of the present invention can be produced by firing the substrate on which the phosphor layer is formed at 400 to 550 ° C. as necessary.

  Using the above display member as a back plate, after sealing with the front plate, after enclosing a discharge gas composed of helium, neon, xenon, etc. in the space formed between the front and back substrates, the drive circuit is The plasma display of the present invention can be manufactured by mounting. The front plate is a substrate in which a transparent electrode, bus electrode, dielectric, and protective film (MgO) are formed in a predetermined pattern on the substrate, and the color corresponding to the RGB color phosphor layers formed on the back substrate is colored. A filter layer may be formed. Further, a black stripe may be formed in order to improve contrast.

Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to this.
A 42-inch AC (alternating current) type plasma display panel back plate was formed and evaluated. The forming method will be described in order.

Example 1
As a glass substrate, PD-200 (manufactured by Asahi Glass Co., Ltd.) having a size of 590 × 964 × 2.8 mm and 42 inches was used. On this substrate, as a writing electrode, a composition of 70 parts by weight of silver powder having an average particle diameter of 2.0 μm, 69% by weight of bismuth oxide, 24% by weight of silicon oxide, 4% by weight of aluminum oxide, and 3% by weight of boron oxide. 2 parts by weight of glass powder having an average particle size of 2.2 μm, 8 parts by weight of a copolymer of acrylic acid, methyl methacrylate and styrene, 7 parts by weight of trimethylolpropane triacrylate, 3 parts by weight of benzophenone, 7 parts by weight of butyl carbitol acrylate A striped electrode having a pitch of 240 μm, a line width of 100 μm, and a thickness of 3 μm after firing was formed by photolithography using a photosensitive silver paste comprising 3 parts by weight of benzyl alcohol.

  On this substrate, 60% by weight of low melting point glass powder containing 78% by weight of bismuth oxide, 14% by weight of silicon oxide, 3% by weight of aluminum oxide, 3% by weight of zinc oxide and 2% by weight of boron oxide, average particle diameter A dielectric paste having a thickness of 10 μm was formed by applying 0.3% of titanium oxide powder 10% by weight, 15% by weight of ethyl cellulose and 15% by weight of terpineol and then baking at 580 ° C.

The photosensitive paste for partition formation used the following composition.
Glass powder: Bi ₂ O ₃ / SiO ₂ / Al ₂ O ₃ / ZnO / B ₂ O ₃ = 82/5/3/5/3/2 glass: glass powder with an average particle diameter of 2 μm: 67 parts by weight filler : Titanium oxide having an average particle size of 0.2 μm: 3 parts by weight Polymer: “Cyclomer” P (ACA250, manufactured by Daicel Chemical Industries): 10 parts by weight organic solvent (1): benzyl alcohol: 4 parts by weight organic solvent (2 ): Butyl carbitol acetate: 3 parts by weight Monomer: Dipentaerythritol hexaacrylate: 8 parts by weight Photopolymerization initiator: Benzophenone: 3 parts by weight Antioxidant: 1,6-hexanediol-bis [(3,5-di -T-butyl-4-hydroxyphenyl) propionate]: 1 part by weight Organic dye: Basic Blue 26: 0.01 part by weight thixotropic agent: N, '12-hydroxystearic acid butylene diamine: 0.5 parts by weight Surfactant: Polyoxyethylene cetyl ether: 0.49 parts by weight.

    The paste was applied to a thickness of 280 μm using a die coater, and then dried in a clean oven at 100 ° C. for 40 minutes to form a coating film. The formed coating film was exposed to the outermost dummy partition wall, auxiliary partition wall, and dummy auxiliary partition wall with a gap of 150 μm from a predetermined photomask. Further, the paste was applied to a thickness of 50 μm using a die coater, and then dried at 100 ° C. for 30 minutes in a clean oven to form a coating film. A gap between the formed coating film and a predetermined photomask was set to 150 μm, and exposure of dummy partition walls and partition walls other than the outermost dummy partition walls was performed.

Example 2
The paste used in Example 1 was applied to a thickness of 170 μm using a die coater, and then dried in a clean oven at 100 ° C. for 40 minutes to form a coating film. A gap with a predetermined photomask was set to 150 μm with respect to the formed coating film, and the outermost one of the dummy partitions far from the display area, the auxiliary partition, and the dummy auxiliary partition were exposed. Further, the paste was applied to a thickness of 170 μm using a die coater, and then dried in a clean oven at 100 ° C. for 30 minutes to form a coating film. A gap with a predetermined photomask was set to 150 μm on the formed coating film, and the partition walls were exposed to the dummy partition walls other than the outermost one far from the display area.

Comparative Example 1
The paste was applied to a thickness of 330 μm using a die coater, and then dried at 100 ° C. for 40 minutes in a clean oven to form a coating film. The formed coating film was exposed to a partition, a dummy partition, an auxiliary partition, and a dummy auxiliary partition with a gap of 150 μm from a predetermined photomask.

  The exposed substrate formed as described above was developed with a 0.5 wt% ethanolamine aqueous solution to form a partition pattern. The substrate on which pattern formation was completed was baked at 560 ° C. for 15 minutes.

The height of the formed partition was measured using a laser displacement meter (LT8010 manufactured by KEYENCE). When the intersection of the partition wall and the auxiliary partition wall is defined as the partition wall intersection point, the height of the center point of the partition wall sandwiched between the two partition wall intersection points is the height of the partition wall, and the height of the center point of the auxiliary partition wall sandwiched between the two partition wall intersection points Is the height of the auxiliary partition wall. Similarly, when the portion where the dummy bulkhead and the dummy auxiliary bulkhead intersect is the dummy bulkhead intersection, the height of the center of the dummy bulkhead sandwiched between the two dummy bulkhead intersections is sandwiched between the dummy bulkhead height and the two dummy bulkhead intersections. The height of the center point of the dummy auxiliary bulkhead was defined as the dummy auxiliary bulkhead height.

  Each color phosphor paste was applied to the formed barrier ribs using a screen printing method and baked (500 ° C., 30 minutes) to form phosphor layers on the side and bottom portions of the barrier ribs.

  Next, the front plate was produced by the following steps. First, ITO was formed on the same glass substrate as the back plate by sputtering, and then a resist was applied thereon, and a transparent electrode having a thickness of 0.1 μm and a line width of 200 μm was formed by exposure / development processing and etching processing. Further, a bus electrode having a thickness of 5 μm after firing was formed by photolithography using a photosensitive silver paste made of black silver powder. Electrodes with a pitch of 375 μm and a line width of 100 μm were produced.

  Next, a glass paste obtained by kneading 70% by weight of a low melting glass powder containing 75% by weight of lead oxide, 20% by weight of ethyl cellulose, and 10% by weight of terpineol is screen-printed to form a bus electrode in the display portion. After coating with a thickness of 50 μm so as to be covered, firing was performed at 570 ° C. for 15 minutes to form a front dielectric.

  A front plate was produced by forming a 0.5 μm thick magnesium oxide layer as a protective film by electron beam evaporation on the substrate on which the dielectric was formed.

  The obtained front glass substrate was bonded and sealed to the rear glass substrate, and then a discharge gas was sealed, and a driving circuit was joined to produce a plasma display (PDP). A voltage was applied to this panel and the display was observed to confirm the presence or absence of erroneous discharge at the edge of the panel.

Table 1 shows the height of each partition wall of Examples 1 and 2 and Comparative Example 1, and the panel edge erroneous discharge evaluation results.
The back plates obtained in Examples 1 and 2 were free from erroneous discharge at the end of the panel and had good display characteristics. For Comparative Example 1, erroneous discharge occurred at the edge of the panel, and the target PDP performance was not obtained.

Here, the height described in Table 1 is as follows.
Outermost partition wall height: A value obtained by measuring the height of the outermost partition wall, with the outermost partition wall in the display region being one of the outermost partition walls. Measured at 35 points not including the outermost partition wall, and averaged value. Auxiliary partition wall height: 35 points were measured on the same substrate, and the average value was measured. One of the outermost dummy partitions that is farthest from the display area is the outermost dummy partition, and the height of the outermost dummy partition is measured. Dummy partition height: The dummy partition that is farthest from the display area Measured and averaged the height of five dummy bulkheads other than one, and averaged them Dummy auxiliary bulkhead height: measured and averaged five dummy auxiliary bulkhead heights on the same substrate

It is a schematic diagram of the partition shape formed in one board | substrate.

Explanation of symbols

1: non-display area 2: display area 3: partition wall 4: auxiliary partition wall 5: dummy partition wall 6: dummy auxiliary partition wall 7: outermost dummy partition wall

Claims (1)

Forming a plurality of partition walls formed in parallel with each other in a display region on the substrate; and forming a plurality of auxiliary partition walls perpendicular to the partition walls,
Forming a plurality of dummy barrier ribs in parallel with the barrier ribs in a non-display area outside the display area; and a plurality of dummy auxiliary barrier ribs extending perpendicularly to the dummy barrier ribs on an extension of the auxiliary barrier ribs. A method of manufacturing a plasma display panel having a forming step ,
The auxiliary partition formed on the display area by applying a photosensitive paste on the substrate and exposing the coating film of the photosensitive paste, the dummy partition formed on the outermost edge of the non-display area, and the non-display area A latent image of a portion corresponding to the dummy auxiliary barrier ribs formed on the substrate is formed, and a photosensitive paste is further applied thereon to correspond to the barrier ribs formed in at least the display region of the coating film of the photosensitive paste. A method for producing a plasma display panel, comprising exposing a portion to be developed, developing the portion, and then firing the portion.

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