JP2012124053A - Back plate for plasma display, and plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a back plate for a plasma display, capable of being manufactured in the wide condition of exposure and development margins, in manufacturing the back plate using a photosensitive barrier rib paste.SOLUTION: A back plate for a plasma display includes on a substrate: an address electrode having a substantially stripe shape; a dielectric layer covering the address electrode; and a barrier rib located on the dielectric layer and having a lattice shape or honeycomb shape. One end of the address electrode is located within a projection plane of a bottom surface of the barrier rib on the substrate.

Description

  The present invention relates to a back plate for a plasma display and a plasma display panel.

  Plasma display panels (hereinafter referred to as PDPs) are attracting attention as displays that can be used in thin and large televisions because they can display at a higher speed and have a wider viewing angle than liquid crystal panels. The PDP causes plasma discharge between electrodes in a discharge space provided between a front glass substrate and a back glass substrate, and emits ultraviolet rays generated from the gas sealed in the discharge space to phosphors in the discharge space. The display is performed by hitting.

  FIG. 4 schematically shows the configuration of a general PDP. A plurality of paired scan electrodes 4 and sustain 3 electrodes are formed of a material such as silver, chromium, aluminum, or nickel on the glass substrate 1 on the side of the front plate 6 serving as a display surface. Furthermore, the dielectric layer 2 mainly composed of glass is formed with a thickness of 20 to 50 μm by covering the scan electrode 4 and the sustain electrode 3, and the MgO layer 5 is formed by covering the dielectric layer 2. On the other hand, on the glass substrate 7 on the back plate 13 side, a plurality of address electrodes 8 are formed in stripes, and a dielectric layer 9 mainly composed of glass is formed covering the address electrodes 8. A partition for partitioning the discharge cells is formed on the dielectric layer 9, and a phosphor layer is formed in a discharge space formed by the partition and the dielectric layer 9. Here, the barrier ribs are provided in order to suppress the spread of the discharge to a certain area and perform display in a prescribed cell, and at the same time, ensure a uniform discharge space, and have a width of about 20 to 80 μm and a height of about 20 μm. It has a shape of 20 to 200 μm. In the example shown in FIG. 5, the barrier ribs have a lattice shape including a main barrier rib 10 parallel to the address electrode and an auxiliary barrier rib 11 intersecting with the main barrier rib 10. Further, a phosphor layer 12 is formed in a discharge space surrounded by the barrier ribs and the dielectric layer 9. In a PDP capable of full color display, the phosphor layer is configured to emit light of each color of red (R), green (G), and blue (B). The front plate 6 and the back plate 13 are sealed so that the sustain electrodes 3 on the glass substrate 1 on the front plate 6 side and the address electrodes 8 on the back plate 13 side are orthogonal to each other, and helium, A rare gas composed of neon, xenon, or the like is filled to form a PDP. Since the pixel cell is formed around the intersection of the scan electrode 4 and the address electrode 8, the PDP has a plurality of pixel cells and can display an image.

  PDP partition wall shapes include stripes, grids, and honeycombs, but the grid and honeycomb partition walls are preferably used because they can suppress discharge interference between pixels and improve luminance. Is done.

  As a method of forming such partition walls, a glass paste is repeatedly printed and dried by screen printing many times, a screen printing method for forming a partition pattern having a predetermined height, and a subtractive mask layer formed by a photolithography technique. For example, a sand blasting method using sand blasting is known.

  However, the screen printing method and the sand blast method have many processes and have problems in terms of production cost. In order to solve this problem, a method has been proposed in which a barrier rib is formed by a photolithography technique using a photosensitive glass paste. (For example, refer to Patent Document 1). By performing coating, drying, exposure, and development once each, it is possible to form a partition wall having a pattern having grid-like or honeycomb-like intersections or tridents.

  However, when the partition walls are formed by the photolithography technique, there are the following problems. That is, since the reflectance with respect to the exposure light on the surface of the dielectric layer is different between the portion where the address electrode is formed and the portion where the address electrode is not formed, the conventional back plate as shown in FIG. If it does not coincide with the end of the main partition wall, the width of the pattern insolubilized or solubilized in the developing solution by exposure can be made in the portion where the address electrode is not formed and the portion where the address electrode is not formed. For example, when using a negative photosensitive glass paste that is insolubilized in the developer by exposure, the main partition in the part where the address electrode is formed tends to be thin, and the main partition in the part where the address electrode is not formed tends to be thick. There is. If the line width of the partition walls is not uniform and a thin part and a thick part are mixed, the thin part is easily peeled off, and the thick part is likely to be buried where the partition wall is not sufficiently removed. In particular, as shown in FIG. 5, the peeling becomes noticeable when there are areas where the auxiliary partition walls are not formed at the upper and lower ends of the main partition walls, and the peeling is achieved by increasing the line width of the main partition walls in the areas. Measures such as suppression are taken, but if parts with different line widths are mixed on the same line, exposure and development margins for conditions where peeling and embedding do not occur with high-definition patterns with small spacing between barrier ribs are reduced and stable. There was a problem that production was difficult.

JP-A-9-223462

  An object of the present invention is to provide a back plate for a plasma display and a plasma display panel that can be stably produced without causing the filling and peeling of the partition walls.

  In order to solve the above-mentioned problems, a plasma display back plate according to the present invention includes a substantially stripe-shaped address electrode on a substrate, a dielectric layer covering the address electrode, and a lattice-shaped or positioned on the dielectric layer. A back plate for a plasma display having a honeycomb-shaped partition wall, wherein one end of the address electrode is located in a projection plane onto the substrate of the partition wall bottom surface.

  In addition, another plasma display back plate according to the present invention includes a substantially striped address electrode on a substrate, a dielectric layer covering the address electrode, and a substantially parallel to the address electrode located on the dielectric layer. A back plate for a plasma display having a main partition and a grid-like partition composed of an auxiliary partition substantially orthogonal to the main partition, wherein one end of the address electrode is within the projection plane onto the wall substrate of the auxiliary partition It consists of what is characterized by being located.

  Further, the plasma display panel according to the present invention includes a plurality of pairs of sustain electrodes and scan electrodes for selecting a row on a substrate, a dielectric layer covering the sustain electrodes and the scan electrodes, and a position on the dielectric layer. A plasma display front plate having a protective layer, and the plasma display back plate described above.

  According to the present invention, it is possible to provide a plasma display back plate and a plasma display panel that can be stably produced without causing the barrier ribs to be buried or peeled off.

It is a top view which shows the positional relationship of the partition and address electrode in the vicinity of the main partition edge part based on an example of the back plate for plasma displays of this invention. It is a top view which shows the positional relationship of the partition and the address electrode in the vicinity of the edge part of the main partition which concerns on the other example of the back plate for plasma displays of this invention. It is a conceptual diagram which shows the positional relationship of the whole back plate for plasma displays. It is a conceptual diagram which shows the structure of the back plate for general plasma displays. It is a top view which shows the positional relationship of the partition and the address electrode in the vicinity of the edge part of the main partition of the backplate for the conventional plasma display.

  The back plate for a plasma display according to the present invention is for a plasma display having a substantially striped address electrode on a substrate, a dielectric layer covering the address electrode, and a grid-like or honeycomb-like partition located on the dielectric layer. The back plate is characterized in that one end of the address electrode is located in a projection plane onto the substrate of the bottom surface of the partition wall.

  The back plate for plasma display of the present invention has a substantially striped address electrode for selecting a column and a dielectric layer covering the same on a substrate.

  The back plate for plasma display of the present invention further has a grid-like or honeycomb-like partition for separating pixels on the dielectric layer. Examples of the lattice-shaped partition include a lattice-shaped partition composed of a main partition substantially parallel to the address electrode and an auxiliary partition substantially orthogonal to the main partition.

  A feature of the back plate for plasma display of the present invention is that one end portion of the address electrode is located in a projection plane onto the substrate of the bottom surface of the partition wall. In the case where the above-described grid-shaped partition wall including the main partition wall and the auxiliary partition wall is provided, one end portion of the address electrode is located in a projection plane onto the substrate of the auxiliary partition wall.

  FIG. 3 is a conceptual diagram showing the positional relationship of the entire back plate for plasma display. An address electrode formation region 15 is provided so as to include the display region, and a partition wall formation region 14 is provided so as to include this. The address electrode has a connection portion on one side in the row direction (lower side in FIG. 3) and is provided in a stripe shape extending toward the other side (upper side in FIG. 3). The present invention is characterized by the positional relationship between the partition walls and the address electrodes in the main partition wall end region A.

  FIG. 5 is a plan view showing the positional relationship between the partition walls and address electrodes in the vicinity of the main partition wall end portion of the conventional plasma display back plate. In the conventional back plate for a plasma display, one end of the address electrode is not located in the projection plane onto the substrate of the bottom surface of the partition wall. Therefore, in the main partition 10 in the region B where the address electrode 8 is provided. A portion (a portion located below the end of the address electrode 8) and a portion of the main partition 10 that is located in a region C where the address electrode 8 is not provided (more than the end of the address electrode 8) Since the intensity of the exposure light reflected from the lower part differs when the exposure for forming the barrier ribs is performed on the upper portion), the barrier ribs are peeled off or buried as described above, and crosstalk due to them is caused. There was a problem of occurrence.

  On the other hand, in the back plate for plasma display of the present invention, one end of the address electrode is in the projection surface onto the substrate of the partition wall, the main partition substantially parallel to the address electrode, and the auxiliary substantially orthogonal to the main partition. In the case of having a grid-like partition made up of partition walls, the auxiliary partition walls are located in the projection plane onto the substrate, so that the intensity of the exposure light reflected from the lower part of the partition walls does not change, and the partition walls are peeled off. And the problem of occurrence of crosstalk caused by them is solved.

  FIG. 1 is a plan view showing the positional relationship between partition walls and address electrodes in the vicinity of the main partition wall end portions of an example of the back plate for plasma display of the present invention. Since the end of the address electrode 8 is located in the projection plane onto the substrate of the auxiliary partition 11 located near the end of the main partition 10, the width of the main partition 10 changes in the middle of the main partition 10. In addition, there is an extraordinary effect that problems such as peeling, embedding and occurrence of crosstalk are solved.

  FIG. 2 is a plan view showing the positional relationship between the barrier ribs and the address electrodes in the vicinity of the end portion of the main barrier rib in another example of the back plate for plasma display of the present invention. Since the end portion of the address electrode 8 is located in the projection plane onto the substrate of the auxiliary partition wall 11 positioned at the end portion of the main partition wall 10, the width of the main partition wall 10 does not change in the middle of the main partition wall 10. It has a special effect of eliminating problems such as peeling, embedding and occurrence of crosstalk.

  Below, this invention is demonstrated along the preparation procedure of PDP.

  As the substrate used for the back plate as the PDP member of the present invention, “PD200” manufactured by Asahi Glass Co., Ltd., “PP8” manufactured by Nippon Electric Glass Co., Ltd., which is a high strain point glass for PDP, etc. is used in addition to soda glass. be able to.

  Address electrodes are formed of a metal such as silver, aluminum, chromium, or nickel on a glass substrate. Forming methods include a method of pattern printing a metal paste mainly composed of these metal powders and an organic binder by screen printing, or after applying a photosensitive metal paste using a photosensitive organic component as an organic binder, through a photomask. It is possible to use a photosensitive paste method in which pattern exposure is performed, uncured portions are dissolved and removed in a development step, and baking is performed at a temperature of 400 to 600 ° C. to form a metal pattern. Further, an etching method in which a metal such as chromium, aluminum, copper, or the like is sputtered on a glass substrate, a resist is applied, the resist is subjected to pattern exposure / development, and an unnecessary portion of the metal is removed by etching can be used. The electrode thickness is preferably 1 to 10 μm, and more preferably 2 to 5 μm. If the electrode thickness is too thin, the resistance value becomes large, and a burden is imposed on accurate driving. If it is too thick, the cost tends to be disadvantageous. The width of the address electrode is preferably 20 to 200 μm. If the width of the address electrode is too thin, defects such as disconnection and chipping are likely to occur, resulting in a decrease in yield, a high resistance value, and difficulty in accurate driving. Moreover, since the distance between adjacent electrodes will become small when too thick, it exists in the tendency for a short defect to produce easily. Further, the address electrodes are formed at a pitch corresponding to the display cell (region where each RGB of the pixel is formed). The pitch is preferably 100 to 500 μm for a normal PDP and 100 to 250 μm for a high definition PDP.

  The address electrode includes one having a connection part of a drive circuit at both ends and one having only one end, but the present invention relates to one having a connection part only at one end as shown in FIG.

  Next, a dielectric layer is formed. The dielectric layer can be formed by applying a glass paste mainly composed of glass powder and an organic binder on the pattern of the address electrode and firing at 400 to 600 ° C. The thickness of the dielectric layer is preferably 3 to 30 μm, more preferably 3 to 20 μm. If the thickness of the dielectric layer is too thin, pinholes tend to occur frequently, and if it is too thick, the discharge voltage tends to be high and the power consumption tends to increase. The dielectric layer can be formed by applying a glass paste containing glass powder and an organic binder as main components so as to cover the address electrodes, and then baking at 400 to 600 ° C. As the glass paste used for the dielectric layer, glass powder containing at least one of lead oxide, bismuth oxide, zinc oxide and phosphorus oxide and containing 10 to 80% by weight in total can be preferably used. By making this blend 10% by weight or more, firing at 600 ° C. or less becomes easy, and by making it 80% by weight or less, crystallization is prevented and a decrease in transmittance is prevented.

  A partition for partitioning the discharge cell is formed on the dielectric layer. The height of the partition wall is suitably 80 μm to 200 μm. By setting the thickness to 80 μm or more, the phosphor and the scan electrode can be prevented from being too close to each other, and the phosphor can be prevented from being deteriorated by discharge. Further, by setting the thickness to 200 μm or less, the distance between the discharge at the scan electrode and the phosphor can be reduced, and sufficient luminance can be obtained. The partition pitch (P) is often 100 μm ≦ P ≦ 500 μm. In the high-definition plasma display, the partition pitch (P) is 100 μm ≦ P ≦ 300 μm. By setting the thickness to 100 μm or more, the discharge space can be widened and sufficient luminance can be obtained, and by setting the thickness to 500 μm or less, a fine image with fine pixels can be displayed. By setting the thickness to 300 μm or less, it is possible to display a beautiful video of HDTV (high definition) level. The line width (L) is preferably 10 μm ≦ L ≦ 50 μm in half width. By setting the thickness to 10 μm or more, strength can be maintained, and damage can be prevented from occurring when the front plate and the back plate are sealed. Further, when the thickness is 50 μm or less, the formation area of the phosphor can be increased and high luminance can be obtained.

  The partition walls can be formed by forming a pattern by a photolithography method using a photosensitive paste made of an organic component containing inorganic fine particles and a photosensitive component, and firing the pattern.

  As the inorganic fine particles of the photosensitive paste, glass, ceramic (alumina, cordierite, etc.) and the like can be used. In particular, glass or ceramics containing silicon oxide, boron oxide, or aluminum oxide as an essential component is preferable.

The particle diameter of the inorganic fine particles is selected in consideration of the shape of the pattern to be produced, but the volume average particle diameter (D50) is preferably 1 to 10 μm, and more preferably 1 to 5 μm. By setting D50 to 10 μm or less, it is possible to prevent surface irregularities from occurring. Moreover, the viscosity adjustment of a paste can be made easy by setting it as 1 micrometer or more. Further, it is particularly preferable in the pattern formation to use glass fine particles having a specific surface area of 0.2 to ³ m ² / g.

  Since the partition walls are preferably patterned on a glass substrate having a low heat softening point, it is preferable to use inorganic particles containing 60% by weight or more of glass particles having a heat softening temperature of 350 ° C. to 600 ° C. as the inorganic particles. Further, by adding glass fine particles or ceramic fine particles having a heat softening temperature of 600 ° C. or higher, the shrinkage ratio during firing can be suppressed, but the amount is preferably 40% by weight or less.

As a glass powder to be used, a glass having a linear expansion coefficient of 50 × 10 ^{−7 to} 90 × 10 ⁻⁷ , or 60 × 10 ^{−7 to} 90 × 10 ⁻⁷ in order to prevent warping of the glass substrate during firing. It is preferable to use fine particles.

  As a material for forming the inorganic fine particles, a glass material containing an oxide of silicon and / or boron is preferably used.

  Furthermore, by containing at least one of bismuth oxide, lead oxide, and zinc oxide in a total amount of 5 to 50% by weight, a glass paste having temperature characteristics suitable for patterning on a glass substrate can be obtained. it can. In particular, when glass fine particles containing 5 to 50% by weight of bismuth oxide are used, advantages such as a long pot life of the paste can be obtained.

  Moreover, you may use the glass fine particle which contains 3-20 weight% of at least 1 sort (s) among lithium oxide, sodium oxide, and potassium oxide. The addition amount of the alkali metal oxide is 20% by weight or less, preferably 15% by weight or less in order to improve the stability of the paste. In addition, if glass fine particles containing both metal oxides such as lead oxide, bismuth oxide and zinc oxide and alkali metal oxides such as lithium oxide, sodium oxide and potassium oxide are used, with a lower alkali content, The thermal softening temperature and linear expansion coefficient can be easily controlled.

  The organic component including the photosensitive component preferably contains a photosensitive component selected from at least one of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer, and, if necessary, photopolymerization. An initiator, a light absorber, a sensitizer, an organic solvent, a sensitization aid, and a polymerization inhibitor are added.

  The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include monofunctional and polyfunctional (meth) acrylates, vinyl compounds, allyl compounds, and the like. be able to. These can be used alone or in combination of two or more. As the (meth) acrylate compound, an acrylic compound or a methacrylic compound having an alkyl group represented by the chemical formulas (1), (2), (3), and (4) is preferably used.

_{^{CH 2 = CR 3 COO-R}} 4 (1)
_{^{CH 2 = CR 3 COO-R}} 4 -OCOCHR 1 = CH 2 (2)
_{^{CH 2 = CR 3 COO-R}} 5 -OCO-R 6 -COO-R 5 -OCOCHR 3 = CH 2 (3)
_{^{(CH 2 = CR 3 COO- (}} CH 2 CHR 6 O) m) n -R 7 (4)

In the formulas (1) to (4), R ³ and R ⁶ are each hydrogen, a methyl group or a methylene group, R ⁴ is an alkyl group or alkylene group having 1 to 20 carbon atoms, and R ⁵ is a hydroxyalkylene having 3 or more carbon atoms. Group, R ⁷ is an alkyl group having 1 to 20 carbon atoms, an aryl group, an aralkyl group, m is an integer of 0 to 30, and n is an integer of 3 to 6. However, the monomer used here is not limited to these.

  As the photosensitive oligomer and photosensitive polymer, for example, those obtained by homo- or copolymerizing (meth) acrylic acid or alkyl (meth) acrylates are preferable, and can be appropriately selected so as to give preferable properties to the paste. . Specifically, polyacrylic acid, polymethacrylic acid, polymethyl acrylate, polyethyl acrylate, polymethyl methacrylate, polyethyl methacrylate, polypropyl methacrylate, polybutyl methacrylate, polyhexyl methacrylate, etc. alone A polymer and a copolymer obtained by a combination of monomers constituting these polymers are preferable. By copolymerizing an unsaturated acid such as an unsaturated carboxylic acid with a polymer or oligomer, the developability after exposure can be improved.

  Moreover, as a photosensitive oligomer and a photosensitive polymer, the oligomer and polymer obtained by superposing | polymerizing at least 1 type of the compound which has a carbon-carbon double bond can be used.

  Specific examples of the photopolymerization initiator include benzophenone, methyl O-benzoylbenzoate, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4- Examples include benzoyl-4-methylphenyl ketone, dibenzyl ketone, fluorenone, 2,3-diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, and the like. One or more of these can be used. The photopolymerization initiator is preferably added in the range of 0.05 to 10% by weight, more preferably 0.1 to 5% by weight, based on the photosensitive component. If the amount of the polymerization initiator is too small, the photosensitivity tends to decrease, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion tends to be too small.

  It is also effective to add a light absorber. By adding a compound having a high absorption effect of ultraviolet light or visible light, a high aspect ratio, high definition, and high resolution can be obtained. As the light absorber, those composed of organic dyes are preferably used. Specifically, azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, anthraquinone dyes, benzophenone dyes, diphenylcyanoacrylate dyes are used. Dyes, triazine dyes, p-aminobenzoic acid dyes, and the like can be used. Since organic dye does not remain in the insulating film after baking, it is preferable because the deterioration of the insulating film characteristics due to the light absorber can be reduced. Among these, azo dyes and benzophenone dyes are preferable. The addition amount of the organic dye is preferably 0.05 to 5% by weight, and more preferably 0.05 to 1% by weight. When the addition amount is too small, the effect of adding the light absorber tends to decrease, and when it is too large, the insulating film characteristics after firing tend to decrease.

  A sensitizer is added in order to improve sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-dimethylaminobenzal) cyclohexanone, and the like. Is mentioned. One or more of these can be used.

  Examples of the organic solvent include methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether acetate, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, and γ-butyllactone. , N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid and the like, and one or more of these An organic solvent mixture is used.

  The photosensitive paste is usually prepared by mixing the above-mentioned inorganic fine particles and organic components so as to have a predetermined composition, and then uniformly mixing and dispersing them with a three roller or kneader.

  Next, the formation method of the partition wall in the present invention will be described. The barrier rib forming method in the present invention is effective for barrier rib patterns of all shapes, but is particularly effective for the barrier rib pattern formation having a trident portion or an intersecting portion, and the forming method will be described.

  First, a photosensitive paste is applied on a substrate on which an electrode is formed or a dielectric layer. As a coating method, a screen printing method, a bar coater, a roll coater, a direct coater, a blade coater, or the like can be used. The coating thickness can be adjusted by selecting the number of coatings, screen mesh, paste viscosity, and the like. Among these, it is preferable to use a direct coater that can be applied with high accuracy and a thick film.

  After the photosensitive paste is applied, it is dried using a ventilating oven, a hot plate, an IR furnace, or the like to form a coating film of the photosensitive paste.

Subsequently, a desired pattern is formed by exposure and development. First, exposure is performed using an exposure apparatus. Mask exposure is performed using a photomask, as is done by ordinary photolithography. Examples of the active light source used at this time include visible light, near ultraviolet light, ultraviolet light, electron beam, X-ray, and laser light. Among these, ultraviolet rays are most preferable, and as the light source, for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a halogen lamp, or a germicidal lamp can be used. Among these, an ultrahigh pressure mercury lamp is suitable. Exposure conditions vary depending on the coating thickness, but exposure is performed for 0.1 to 10 minutes using an ultrahigh pressure mercury lamp with an output of 1 to 100 mW / cm ² .

  At this time, the shape of the partition wall pattern to be formed and the width of the partition wall are determined by the photomask pattern to be used and the line width of the photomask. Here, the line width of the photomask represents the line width of the slit portion, that is, the portion through which light is transmitted. For example, when forming a stripe-shaped partition wall, exposure is performed with a photomask having a stripe pattern parallel to the address electrode, and when forming a lattice-like pattern, a photo having a stripe pattern parallel to the address electrode is formed. A photomask having a stripe pattern in the direction perpendicular to the mask is used, or exposure is performed with a photomask having a lattice pattern.

  Next, the development process will be described. Development is performed using the difference in solubility between the exposed portion and the unexposed portion in the developer. Development can be performed by a dipping method, a spray method, a brush method, or the like.

  As the developer, a solution in which an organic component to be dissolved in the photosensitive paste can be dissolved is used. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, it can be developed with an alkaline aqueous solution. As the alkaline aqueous solution, sodium hydroxide, sodium carbonate, sodium carbonate aqueous solution, calcium hydroxide aqueous solution or the like can be used. However, it is preferable to use an organic alkaline aqueous solution because an alkaline component can be easily removed during firing. As the organic alkali, a general amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, and diethanolamine. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the soluble portion tends not to be removed. If the alkali concentration is too high, the pattern portion tends to be peeled off or the insoluble portion tends to be corroded. The development temperature during development is preferably 20 to 50 ° C. in terms of process control.

  The partition wall pattern thus formed is fired in a firing furnace. The firing atmosphere and temperature vary depending on the type of paste and substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a roller hearth-type continuous firing furnace can be used. The firing temperature is preferably 400 to 800 ° C. In the case where the partition wall is directly formed on the glass substrate, it is preferable to perform baking while maintaining the temperature at 450 to 620 ° C. for 10 to 60 minutes.

  Next, phosphor layers that emit light of each color of R (red), G (green), and B (blue) are formed between main barrier ribs formed in a direction parallel to predetermined address electrodes. The phosphor layer can be formed by applying a phosphor paste mainly composed of phosphor powder, an organic binder, and an organic solvent between predetermined main partition walls, drying, and firing if necessary.

  As a method for applying the phosphor paste between predetermined main partitions, a screen printing method for pattern printing using a screen printing plate, a dispenser method for pattern discharge of the phosphor paste from the tip of the discharge nozzle, and a phosphor paste The phosphor paste of each color can be applied to a predetermined place by the above-described photosensitive paste method using the organic component having photosensitivity as the organic binder, but the screen printing method and the dispenser method are the present invention for cost reasons. Then, it is preferably applied.

  Furthermore, although it has been described that the previous electrode and dielectric formation are each performed as a firing step, by changing each electrode paste and dielectric paste, electrodes / dielectrics, dielectrics / partitions, electrodes / dielectrics / It is also possible to fire the partition walls at once. Even in this case, the effect of the present invention is not impaired.

  Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to this.

  A 42-inch AC (alternating current) type plasma display panel back plate was formed and evaluated. The forming method will be described in order.

[Example 1]
As a glass substrate, PD-200 (manufactured by Asahi Glass Co., Ltd.) having a size of 590 × 964 × 2.8 mm and 42 inches was used. On this substrate, as a writing electrode, a composition of 70 parts by weight of silver powder having an average particle diameter of 2.0 μm, 69% by weight of bismuth oxide, 24% by weight of silicon oxide, 4% by weight of aluminum oxide, and 3% by weight of boron oxide. 2 parts by weight of glass powder having an average particle size of 2.2 μm, 8 parts by weight of a copolymer of acrylic acid, methyl methacrylate and styrene, 7 parts by weight of trimethylolpropane triacrylate, 3 parts by weight of benzophenone, 7 parts by weight of butyl carbitol acrylate A striped electrode having a pitch of 160 μm, a line width of 60 μm, and a thickness after firing of 3 μm was formed by photolithography using a photosensitive silver paste comprising 3 parts by weight of benzyl alcohol.

  On this substrate, 60% by weight of low melting point glass powder containing 78% by weight of bismuth oxide, 14% by weight of silicon oxide, 3% by weight of aluminum oxide, 3% by weight of zinc oxide and 2% by weight of boron oxide, average particle diameter A dielectric paste having a thickness of 10 μm was formed by applying 0.3% of titanium oxide powder 10% by weight, 15% by weight of ethyl cellulose and 15% by weight of terpineol and then baking at 580 ° C.

  The photosensitive paste for partition formation used the following composition.

Glass powder: Bi ₂ O ₃ / SiO ₂ / Al ₂ O ₃ / ZnO / B ₂ O ₃ = 82/5/3/5/3/2 glass: glass powder with an average particle diameter of 2 μm: 67 parts by weight filler : Titanium oxide having an average particle size of 0.2 μm: 3 parts by weight Polymer: “Cyclomer” P (ACA250, manufactured by Daicel Chemical Industries): 10 parts by weight organic solvent (1): benzyl alcohol: 4 parts by weight organic solvent (2 ): Butyl carbitol acetate: 3 parts by weight Monomer: Dipentaerythritol hexaacrylate: 8 parts by weight Photopolymerization initiator: Benzophenone: 3 parts by weight Antioxidant: 1,6-hexanediol-bis [(3,5-di -T-butyl-4-hydroxyphenyl) propionate]: 1 part by weight Organic dye: Basic Blue 26: 0.01 part by weight thixotropic agent: N, '12-hydroxystearic acid butylene diamine: 0.5 parts by weight Surfactant: Polyoxyethylene cetyl ether: 0.49 parts by weight.

  The paste was applied with a slit die coater to a thickness of 260 μm, and then dried in a clean oven at 100 ° C. for 40 minutes to form the first photosensitive paste film. On the other hand, the first exposure was performed with a gap of 150 μm from a predetermined photomask. Next, the paste was applied on the exposed film with a slit die coater to a thickness of 37 μm, and then dried in a clean oven at 100 ° C. for 40 minutes to form the second photosensitive paste film. On the other hand, the second exposure was performed with a gap of 150 μm from a predetermined photomask.

  The pitch of the main partition walls of the photomask used in the first and second exposures used in this example is 160 μm, and the pitch of the auxiliary partition walls is 480 μm.

  The exposed substrate formed as described above was developed with a 5.0 wt% aqueous sodium carbonate solution to form a partition pattern. The substrate after pattern formation was baked at 590 ° C. for 15 minutes to form a partition pattern having a line width of 60 μm. The address electrodes and the partition walls were in the positional relationship shown in FIG. The length of the main partition outside the auxiliary partition located near the end of the main partition was 7 mm.

  Table 1 shows the exposure conditions (main partition wall end mask opening width, exposure amount), and electrode and partition pattern of the partition wall of this example. Table 2 shows the results of evaluation of the back plate end shape obtained at this time based on the presence or absence of peeling and filling.

  Each color phosphor paste was applied to the formed barrier ribs by a dispenser method and baked (500 ° C., 30 minutes) to form phosphor layers on the side and bottom portions of the barrier ribs.

  Next, the front plate was produced by the following steps. First, ITO was formed on the same glass substrate as the back plate by sputtering, and then a resist was applied thereon, and a transparent electrode having a thickness of 0.1 μm and a line width of 200 μm was formed by exposure / development processing and etching processing. Further, a bus electrode having a thickness of 5 μm after firing was formed by photolithography using a photosensitive silver paste made of black silver powder. Electrodes with a pitch of 375 μm and a line width of 100 μm were produced.

  Next, a glass paste obtained by kneading 70% by weight of a low melting glass powder containing 75% by weight of lead oxide, 20% by weight of ethyl cellulose, and 10% by weight of terpineol is screen-printed to form a bus electrode in the display portion. After coating to a thickness of 50 μm, baking was performed at 570 ° C. for 15 minutes to form a dielectric for the front plate.

  A front plate was produced by forming a 0.5 μm thick magnesium oxide layer as a protective film by electron beam evaporation on the substrate on which the dielectric was formed.

The obtained front glass substrate was bonded and sealed to the rear glass substrate, and then a discharge gas was sealed, and a driving circuit was joined to produce a plasma display (PDP).
A voltage was applied to this panel and the display was observed. As an evaluation of display characteristics, “X” indicates that crosstalk occurred, and “◯” indicates that no crosstalk occurred.

  Table 2 shows the crosstalk evaluation when the panel is lit. A partition wall pattern without peeling or filling of the partition wall end could be formed. The display characteristics of the PDP were also good.

[Examples 2 to 4]
A plasma display panel was prepared under the same conditions as in Example 1 except that the exposure conditions for the barrier ribs (main barrier rib edge mask opening width, exposure amount) were the conditions shown in Table 1. Note that the positional relationship between the address electrodes and the partition walls is the positional relationship shown in FIG. 1 for Examples 2 and 3 as in Example 1, and the positional relationship shown in FIG. 2 for Example 4. Table 2 shows the results of evaluation of the end plate shape of the back plate obtained as a result of peeling and embedding and the display characteristics. A partition wall pattern without peeling or filling of the partition wall end could be formed. The display characteristics of the PDP were also good.

[Comparative Examples 1 and 2]
The exposure conditions for the barrier ribs (main barrier rib edge mask opening width, exposure dose) are as shown in Table 1, and the positional relationship between the address electrodes and the barrier ribs is the positional relationship shown in FIG. A plasma display panel was created under the same conditions. Table 2 shows the results of evaluation of the end plate shape of the back plate obtained as a result of peeling and embedding and the display characteristics. The length of the main partition outside the auxiliary partition located near the end of the main partition was 7 mm, and the length of the address electrode outside the supplementary partition located near the end of the main partition was 2 mm.

  Further, in the comparative example, peeling or embedding occurred at the end of the partition wall. As a result, a gap was generated between the front plate and the back plate, and crosstalk was generated, so that the target PDP performance could not be obtained.

  The back plate for plasma display and the plasma display panel according to the present invention can be used for the production of a plasma display panel used for thin and large-sized televisions.

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Dielectric layer 3 Sustain electrode 4 Scan electrode 5 MgO layer 6 Front plate 7 Glass substrate 8 Address electrode 9 Dielectric layer 10 Main partition 11 Auxiliary partition 12 Phosphor layer 13 Back plate 14 Partition formation area 15 Address electrode formation Area A Main partition wall end area B Area where address electrode is provided C Area where address electrode is not provided

Claims (3)

  A back plate for a plasma display having a substantially striped address electrode on a substrate, a dielectric layer covering the address electrode, and a grid-like or honeycomb-like partition located on the dielectric layer, 1. A back plate for a plasma display, wherein one end portion is located in a projection plane onto the substrate of the bottom surface of the partition wall.   A lattice comprising a substantially stripe-shaped address electrode on a substrate, a dielectric layer covering the address electrode, a main partition substantially parallel to the address electrode located on the dielectric layer, and an auxiliary partition substantially orthogonal to the main partition A back plate for a plasma display having a partition wall, wherein one end of the address electrode is located in a projection plane onto the substrate of the auxiliary partition wall. The back plate for plasma display according to claim 1 or 2, a sustain electrode and a scan electrode which form a plurality of pairs for selecting a row on the substrate, a dielectric layer covering the sustain electrode and the scan electrode, and the dielectric A plasma display panel, comprising: a front panel for plasma display having a protective layer positioned on the layer.

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