JP2006310280A - Back plate for plasma display and plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display hardly reflecting external light and having high display contrast. <P>SOLUTION: This back plate for a plasma display is so structured that at least patterns for partitioning pixels in a longitudinal direction and a lateral direction are arranged on a substrate when it is assumed that the direction of a short-side of a display area and a direction of a long side thereof are the longitudinal direction and the lateral direction, respectively. The back plate for a plasma display is characterized in that at least the pattern for partitioning the pixels in the longitudinal direction is black. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a plasma display panel capable of obtaining a high contrast and a back plate for a plasma display constituting the plasma display panel.

Plasma displays are attracting attention as displays that can be used in thin and large televisions. As shown in the schematic diagram of FIG. 7, in the plasma display, for example, a plurality of sustain electrodes 10 and scan electrodes 11 that are paired with a glass substrate 8 on the front plate 22 side serving as a display surface are made of silver, chromium, or aluminum. It is made of a material such as nickel, and is formed in a stripe shape with the short side direction of the display region as the vertical direction and the long side direction as the horizontal direction, with the horizontal direction as the long direction. Further, a black stripe 9 may be formed between the pixels in the vertical direction of the plasma display including the sustain electrode 10 and the scan electrode 11 in order to maintain the contrast during image display.
Further, the dielectric layer 4 having a glass as a main component and covering the sustain electrode 10 is formed with a thickness of 20 to 50 μm, and the dielectric layer 4 is covered and the MgO layer 12 is formed. On the other hand, on the glass substrate on the back plate side, a plurality of address electrodes 3 are formed in a stripe shape with the longitudinal direction as the longitudinal direction, and the dielectric layer 4 whose main component is glass is formed by covering the address electrodes 3. Has been. A partition wall 1 for partitioning discharge cells is formed on the dielectric layer 4, and phosphor layers 13, 14 and 15 are formed in a discharge space formed by the partition wall 1 and the dielectric layer 4. In a plasma display capable of full color display, the phosphor layer is configured to emit light in each color of red (R), green (G), and blue (B). The front plate and the back plate are sealed so that the sustain electrode 10 on the front plate 22 side and the address electrode 3 on the back plate side are orthogonal to each other, and helium, neon, xenon, or the like is formed in the gap between the substrates. A rare gas is enclosed to form a plasma display. Since the pixel cell is formed around the intersection of the scan electrode 11 and the address electrode 3, the plasma display has a plurality of pixel cells and can display an image.

  When performing display on the plasma display, if a voltage higher than the discharge start voltage is applied between the sustain electrode 10 and the address electrode 3 from a state where no light is emitted in the selected pixel cell, cations and electrons generated by ionization are Since the pixel cell has a capacitive load, it moves in the discharge space toward the electrode of the opposite polarity and charges the inner wall of the MgO layer 12, and the charge on the inner wall is attenuated due to the high resistance of the MgO layer 12. Without remaining as wall charges.

  Next, a sustaining voltage is applied between the scan electrode 10 and the sustain electrode 11. Where there is a wall charge, it can be discharged even at a voltage lower than the discharge start voltage. The discharge causes the xenon gas in the discharge space to be excited, and ultraviolet light having a wavelength of 147 nm is generated. The ultraviolet light excites the phosphor layers 13, 14, and 15, thereby enabling light emission display.

  In such a plasma display, it is important to increase the luminance when the phosphor screen emits light. As a means for increasing the luminance, as shown in a schematic diagram in FIG. 8, in addition to the partition wall 1, a stripe-shaped auxiliary partition wall 2 having a horizontal direction as a longitudinal direction is provided, and a phosphor screen is also formed on the surface of the auxiliary partition wall. Thus, it has been proposed to increase the light emission area of the phosphor screen, to efficiently cause ultraviolet rays to act on the phosphor screen, and to increase the luminance (for example, see Patent Document 1).

  The auxiliary barrier ribs also have an effect of suppressing the movement of charges generated by voltage application to the adjacent cells in the vertical direction. Therefore, the distance between the electrodes of the pair of sustain electrodes (hereinafter referred to as the main gap) is increased. There is an advantage that the luminance can be improved.

However, when the main gap is simply widened, there is a problem that even if an auxiliary partition is formed, light leaks from a cell emitting light in the vertical direction to an adjacent cell that does not emit light and the contrast is lowered.
JP 10-32148 A (Claim 1 etc.)

  The problem to be solved by the present invention is to provide a high-contrast plasma display capable of suppressing leakage of light emission in the vertical direction even when the main gap contributing to light emission is widened in order to ensure the brightness of the plasma display. Is to provide a back plate for a plasma display, and a plasma display panel using the same.

  That is, the present invention provides a plasma display in which a pattern for partitioning at least vertical and horizontal pixels is disposed on a substrate when the short side direction of the display region is the vertical direction and the long side direction is the horizontal direction. A back plate for a plasma display, wherein at least a part of a pattern partitioning pixels in a vertical direction is black.

  Moreover, this invention makes the summary the panel for plasma displays containing the said back plate for plasma displays.

  According to the present invention, it is possible to provide a plasma display panel having high brightness and contrast, and a plasma display back plate used therefor.

  Hereinafter, the present invention will be described in detail.

  In the present invention, it is necessary that at least a part of the pattern partitioning the pixels in the vertical direction is black. The reflectance of the black pattern is preferably 25% or less. If there is no pattern that partitions the pixels in the vertical direction but a striped pattern that partitions the pixels in the horizontal direction, the light emission of a specific cell leaks to the adjacent cells in the vertical direction, which reduces the contrast. there were. Further, even when there is a pattern for partitioning pixels in the vertical direction, if the reflectance of the pattern is not black, there is a problem that light emission leakage to cells adjacent in the vertical direction cannot be sufficiently prevented. Even if the pattern is blackened and the reflectance is preferably 25% or less, for example, when the main gap contributing to light emission is enlarged and the brightness of the plasma display is increased, it is possible to increase the brightness of adjacent pixels in the vertical direction. Light emission leakage can be suppressed, and high contrast can be obtained.

  In the present invention, it is preferable that the reflectance of at least the top portion of the partition wall that partitions the pixels in the horizontal direction is 35% or more. The light emitted from the cell is divided into one that directly emits in the direction of the front plate and one that is reflected near the top of the partition wall and emerges in the direction of the front plate, but is issued when the reflectance at the top of the partition wall is less than 35%. Since light is not sufficiently reflected in the vicinity of the top of the partition wall, there is a problem that the efficiency of extracting emitted light is lowered and the brightness of the panel is lowered. In addition, in a plasma display that performs color display, cells adjacent in the horizontal direction do not emit the same color as described above, so if there is a problem that the contrast leaks due to light leaking in the horizontal direction. Few.

  In the present invention, black means a material having a reflectance of 30% or less with respect to a light beam having a wavelength of at least 400 to 600 nm.

  Hereinafter, the configuration and manufacturing method of the back plate for plasma display of the present invention will be described in detail.

  As the substrate used for the back plate for the plasma display of the present invention, soda glass or the like can be used. Specifically, PD200 manufactured by Asahi Glass Co., Ltd. or Nippon Electric Glass Co., Ltd., which is a heat resistant glass for plasma display. PP8 and the like.

  On the substrate, stripe-like address electrodes having a longitudinal direction as a longitudinal direction are formed of a metal such as silver, aluminum, chromium, or nickel. As a forming method, a metal paste mainly composed of these metal powders and an organic binder is printed by screen printing, and heated and baked at 400 to 600 ° C. to form a metal pattern, After applying a photosensitive metal paste containing a photosensitive organic component, after pattern exposure using a photomask, unnecessary portions are dissolved and removed in a development process, and further heated and baked at 400 to 600 ° C. to form a metal pattern. A photosensitive paste method can be used. Alternatively, an etching method may be used in which a resist is applied after sputtering a metal such as chromium or aluminum on a glass substrate, and after the resist is subjected to pattern exposure and development, an unnecessary portion of the metal is removed by etching. The electrode thickness is preferably 1.5 to 10 μm, more preferably 2 to 8 μm. If the electrode thickness is too thin, the resistance value tends to be large and accurate driving tends to be difficult, and if it is too thick, a large amount of material is required, which tends to be disadvantageous in terms of cost. The width of the address electrode is preferably 30 to 150 μm, more preferably 35 to 240 μm. If the width of the address electrode is too thin, the resistance value tends to be high and accurate driving tends to be difficult, and if it is too thick, the distance between adjacent electrodes tends to be small, so that a short defect tends to occur. Further, the address electrodes are formed at a pitch corresponding to the display cell (region where each RGB of the pixel is formed). It is preferable to form at a pitch of 100 to 500 μm for a normal plasma display and 100 to 400 μm for a high definition plasma display.

  A dielectric layer is formed to cover the address electrodes. The dielectric layer can be formed by applying a glass paste containing glass powder and an organic binder as main components so as to cover the address electrodes, and then baking at 400 to 600 ° C. The glass paste used for the dielectric layer preferably includes a low melting glass powder containing at least one of lead oxide, bismuth oxide, zinc oxide and phosphorus oxide, and containing 10 to 80% by mass in total. it can. By setting the blend to 10% by mass or more, firing at 600 ° C. or less is facilitated, and by setting it to 80% by mass or less, crystallization is prevented and a decrease in transmittance is prevented.

  A paste is prepared by kneading the low-melting glass powder and an organic binder. As the organic binder to be used, cellulose compounds typified by ethyl cellulose, methyl cellulose and the like, acrylic compounds such as methyl methacrylate, ethyl methacrylate, isobutyl methacrylate, methyl acrylate, ethyl acrylate and isobutyl acrylate can be used. Moreover, you may add additives, such as a solvent and a plasticizer, in glass paste. As the solvent, general-purpose solvents such as terpineol, butyrolactone, toluene and methyl cellosolve can be used. As the plasticizer, dibutyl phthalate, diethyl phthalate, or the like can be used. By adding a filler component having a high softening temperature and not softening during firing, in addition to the low-melting glass powder, a PDP having a high reflectance and a high luminance can be obtained. As the filler, titanium oxide, aluminum oxide, zirconium oxide and the like are preferable, and it is particularly preferable to use titanium oxide having a 50% particle diameter in a volume distribution curve of 0.05 to 3 μm. The filler content is preferably a glass powder: filler mass ratio of 1: 1 to 10: 1. By making the filler content 1/10 or more of the glass powder content by weight ratio, the effect of improving the luminance can be obtained. Moreover, sinterability can be maintained by setting it as the same amount or less of content of glass powder.

  Further, by adding conductive fine particles to the glass paste used for the dielectric layer, a plasma display with high reliability during driving can be produced. The conductive fine particles are preferably metal powders such as nickel and chromium, and the 50% particle diameter in the volume distribution curve is preferably 1 to 10 μm. When the thickness is 1 μm or more, a sufficient effect can be exhibited, and when the thickness is 10 μm or less, unevenness on the dielectric can be suppressed, and formation of a partition wall described later on the dielectric layer can be facilitated. As content in which these electroconductive fine particles are contained in a dielectric material layer, 0.1-10 mass% is preferable. When the content is 0.1% by mass or more, conductivity can be obtained, and when the content is 10% by mass or less, a short circuit between adjacent address electrodes in the horizontal direction can be prevented. The thickness of the dielectric layer is preferably 3 to 30 μm, more preferably 3 to 15 μm. If the thickness of the dielectric layer is too thin, pinholes tend to occur frequently, and if it is too thick, the discharge voltage tends to be high and the power consumption tends to increase.

  In the member for plasma display of the present invention, a pattern for partitioning pixels in the vertical direction and the horizontal direction is disposed on the substrate or the dielectric layer.

  In the present invention, the pattern is preferably composed of a partition mainly composed of low-melting glass for partitioning pixels in the horizontal direction and an auxiliary partition composed mainly of low-melting glass for partitioning the pixels in the vertical direction. Further, the pattern for partitioning the pixels in the vertical direction can be constituted by two or more auxiliary partitions mainly composed of low melting point glass and a region formed between the two or more auxiliary partitions.

  The main component in the present invention refers to a component constituting 70% by mass or more, preferably 80% by mass or more, of all components constituting the pattern.

  In many cases, the partition wall and the auxiliary partition wall are formed so as to be orthogonal to each other. By forming the auxiliary barrier rib, a phosphor layer can be formed also on the wall surface of the auxiliary barrier rib, and a light emitting area can be increased. Furthermore, when a voltage is applied, it is possible to suppress the loss of electric charges to pixels adjacent in the vertical direction, and it is possible to widen the main gap that contributes to the light emission of the front plate. By widening the main gap, it is possible to increase the luminance because ultraviolet rays efficiently act on the phosphor screen. In addition, the presence of the auxiliary barrier ribs increases the total bottom area of the barrier ribs and the auxiliary barrier ribs, improves the strength of the barrier ribs, and prevents the barrier ribs from falling or peeling off. As a result, the width of the barrier rib can be reduced and the discharge volume in the display cell portion can be increased, so that the discharge efficiency can be further improved.

  The cross-sectional shape of the partition wall and the auxiliary partition wall can be a trapezoid or a rectangle. The top width of the partition wall is preferably 25 to 80 μm, and more preferably 30 to 75 μm. If the top width of the partition walls is less than 25 μm, the strength is low, and problems such as collapse of the partition walls during sealing with the front plate tend to occur. On the other hand, when the thickness exceeds 80 μm, the formation area of the phosphor layer is reduced, and the luminance tends to be lowered. The bottom width of the partition walls is preferably 1.0 to 2.3 times the top width, more preferably 1.1 to 2 times.

  The height of the partition walls is preferably 80 to 180 μm, and more preferably 90 to 150 μm. By setting the thickness to 80 μm or more, the phosphor and the scan electrode can be prevented from being too close to each other, and the phosphor can be prevented from being deteriorated by discharge. Further, by setting the thickness to 180 μm or less, the distance between the discharge at the scan electrode and the phosphor can be reduced, and sufficient luminance can be obtained.

  The height of the partition wall is preferably higher than the height of the auxiliary partition wall, and the difference between the height of the partition wall and the height of the auxiliary partition wall is preferably 2 to 40 μm, more preferably 3 to 30 μm. When the difference between the height of the partition wall and the height of the auxiliary partition wall is less than 2 μm, the exhaust path of the gas component remaining in the cell surrounded by the front plate, the back plate, the partition wall, and the auxiliary partition wall when sealing and exhausting the panel Therefore, impure gas tends to remain, and as a result, panel characteristics may be adversely affected. On the other hand, when the thickness exceeds 40 μm, the charge accumulated in the cell due to the voltage application tends to easily escape to the adjacent cell in the vertical direction, and the function as an auxiliary partition tends not to be performed.

  The positions and pitches for forming the auxiliary barrier ribs are preferably formed at positions where the pixels are divided when the plasma display is combined with the front plate from the viewpoint of gas discharge and light emission efficiency of the phosphor layer.

  In addition to the partition wall and the auxiliary partition wall, it is preferable to form a bonding auxiliary wall. The auxiliary joining wall is formed on the upper and lower outer sides of the image display portion made up of pixels with the horizontal direction as the longitudinal direction, thereby preventing the separation of the end of the partition wall. The length of the end portion where the partition wall protrudes from the joining auxiliary wall is preferably 0.5 mm or less in order to obtain the effect of preventing peeling.

  Next, the formation method of the partition and the auxiliary partition in this invention is demonstrated. The partition walls and the auxiliary partition walls are known using screen paste, sand blasting, photosensitive paste method (photolithography method), mold transfer method, lift-off method, etc., using paste made of insulating inorganic and organic components on the substrate. It is formed by forming a pattern with this technique and baking it, but for the reason that high shape control and uniformity can be obtained, the photosensitive paste is applied to the substrate and dried to form a photosensitive paste film. A so-called photosensitive paste method (photolithographic method) in which exposure and development are performed through a photomask is preferably applied in the present invention.

  Hereinafter, the photosensitive paste method preferably applied in the present invention will be described in detail.

  The photosensitive paste for forming a partition used in the photosensitive paste method is mainly composed of inorganic fine particles and a photosensitive organic component, and if necessary, a photopolymerization initiator, a light absorber, a sensitizer, an organic solvent, and a sensitization aid. Contains a polymerization inhibitor.

  As the inorganic fine particles of the barrier rib forming photosensitive paste, glass, ceramic (alumina, cordierite, etc.) and the like can be used. In particular, glass or ceramics containing silicon oxide, boron oxide, or aluminum oxide as an essential component is preferable.

The particle diameter of the inorganic fine particles is selected in consideration of the shape of the pattern to be produced, but the 50% particle diameter in the volume distribution curve is preferably 1 to 10 μm, more preferably 1 to 5 μm. . By setting the 50% particle diameter in the volume distribution curve to 10 μm or less, it is possible to prevent surface irregularities from occurring. Moreover, the viscosity adjustment of a paste can be made easy by setting it as 1 micrometer or more. Furthermore, it is particularly preferable in the pattern formation to use glass fine particles having a specific surface area of 0.2 to ³ m ² / g.

Since the partition walls and the auxiliary partition walls are preferably patterned on a glass substrate having a low heat softening point, inorganic particles containing 60% by mass or more of low melting glass particles having a thermal softening temperature of 350 to 600 ° C. are used as the inorganic particles. It is preferable. Moreover, by adding a filler component composed of high melting point glass fine particles or ceramic fine particles having a heat softening temperature of 600 ° C. or more, the shrinkage rate during firing can be suppressed, but the amount is equal to the total amount of inorganic fine particles. The amount is preferably 40% by mass or less. The low-melting glass fine particles have a linear expansion coefficient of 50 × 10 ^{−7 to} 90 × 10 ⁻⁷ K ⁻¹ , and further 60 × 10 ^{−7 to} 90 × 10 in order to prevent warping of the glass substrate during firing. It is preferable to use low-melting glass particles of ⁻⁷ K ⁻¹ .

  As the low-melting glass fine particles, glass containing silicon and / or boron oxide is preferably used.

  The silicon oxide is preferably blended in the range of 3 to 60% by mass. By setting the content to 3% by mass or more, the denseness, strength and stability of the glass layer are improved, and the thermal expansion coefficient is set within a desired range to prevent the problem of warpage due to the difference in thermal expansion coefficient with the glass substrate. be able to. Moreover, by setting it as 60 mass% or less, there exists an advantage that a thermal softening point becomes low and baking to a glass substrate is attained.

  Boron oxide can improve electrical, mechanical, and thermal characteristics such as electrical insulation, strength, thermal expansion coefficient, and denseness of the insulating layer by blending in the range of 5 to 50% by mass. The stability of glass can be maintained by setting it as 50 mass% or less.

Furthermore, by containing at least one of bismuth oxide, lead oxide, and zinc oxide in a total amount of 5 to 50% by mass, a glass paste having temperature characteristics suitable for patterning on a glass substrate can be obtained. it can. In particular, when glass fine particles containing 5 to 50% by mass of bismuth oxide are used, advantages such as a long pot life of the paste can be obtained. As the bismuth-based glass fine particles, glass powder having the following composition is preferably used.
Bismuth oxide: 10 to 40% by mass
Silicon oxide: 3-50 mass%
Boron oxide: 10 to 40% by mass
Barium oxide: 8-20% by mass
Aluminum oxide: 10-30% by mass
Moreover, you may use the glass fine particle which contains 3-20 mass% of at least 1 sort (s) among lithium oxide, sodium oxide, and potassium oxide. By adding the alkali metal oxide in an amount of 20% by mass or less, preferably 15% by mass or less, the stability of the paste can be improved. Of the above three types of alkali metal oxides, lithium oxide is particularly preferred from the viewpoint of paste stability. As the lithium glass fine particles, for example, glass powder containing the following composition is preferably used.
Lithium oxide: 2 to 15% by mass
Silicon oxide: 15-50 mass%
Boron oxide: 15-40% by mass
Barium oxide: 2 to 15% by mass
Aluminum oxide: 6-25% by mass
If glass particles containing both metal oxides such as lead oxide, bismuth oxide and zinc oxide and alkali metal oxides such as lithium oxide, sodium oxide and potassium oxide are used, the alkali metal content can be reduced. In addition, the heat softening temperature and the linear expansion coefficient can be easily controlled.

  Also, workability is improved by adding aluminum oxide, barium oxide, calcium oxide, magnesium oxide, titanium oxide, zinc oxide, zirconium oxide, etc., especially aluminum oxide, barium oxide, zinc oxide, etc. to the glass fine particles. However, from the viewpoint of the thermal softening point and the thermal expansion coefficient, the content is preferably 40% by mass or less, more preferably 25% by mass or less.

  The photosensitive organic component preferably contains at least one of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer.

  The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include monofunctional and polyfunctional (meth) acrylates, vinyl compounds, allylic compounds such as allyl compounds. It is preferable to use a monomer. These can be used alone or in combination of two or more.

  As the photosensitive oligomer and photosensitive polymer, an oligomer or polymer obtained by polymerizing at least one of monomers having a carbon-carbon double bond can be used. Preferably, it is an oligomer or polymer obtained by polymerizing at least one of the acrylic monomers, and the content of the monomer is 10% by mass or more, more preferably 35% by mass or more. It can be copolymerized with a photosensitive monomer. By copolymerizing an unsaturated acid such as an unsaturated carboxylic acid with a polymer or oligomer, the developability after exposure can be improved. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof. The acid value (AV) of the polymer or oligomer having an acidic group such as a carboxyl group in the side chain thus obtained is preferably in the range of 50 to 180, and more preferably in the range of 70 to 140. By adding a photoreactive group to the side chain or molecular end of the polymer or oligomer shown above, it can be used as a photosensitive polymer or photosensitive oligomer having photosensitivity. Preferred photoreactive groups are those having an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acrylic group, and a methacryl group.

  Specific examples of the photopolymerization initiator include benzophenone, methyl O-benzoylbenzoate, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4- Examples include benzoyl-4-methylphenyl ketone, dibenzyl ketone, fluorenone, 2,3-diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, and the like. One or more of these can be used. The photopolymerization initiator is preferably added in a range of 0.05 to 10% by mass, and more preferably in a range of 0.1 to 5% by mass with respect to the photosensitive component. If the amount of the polymerization initiator is too small, the photosensitivity tends to decrease, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion tends to be too small.

  It is also effective to add a light absorber. By adding a compound having a high absorption effect of ultraviolet light or visible light, a high aspect ratio, high definition, and high resolution can be obtained. As the light absorber, an organic dye is preferably used. Specifically, an azo dye, an aminoketone dye, a xanthene dye, a quinoline dye, an anthraquinone dye, a benzophenone dye, a diphenylcyanoacrylate dye. Dyes, triazine dyes, p-aminobenzoic acid dyes, and the like can be used. Since organic dye does not remain in the insulating film after baking, it is preferable because the deterioration of the insulating film characteristics due to the light absorber can be reduced. Among these, azo dyes and benzophenone dyes are preferable. The addition amount of the organic dye is preferably 0.05 to 5% by mass, and more preferably 0.05 to 1% by mass. When the addition amount is less than the above range, the effect of adding the light absorber tends to be reduced, and when it is more than the above range, the insulating film characteristics after firing tend to be lowered.

  A sensitizer is preferably added in order to improve sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-dimethylaminobenzal) cyclohexanone, and the like. Is mentioned. One or more of these can be used. When adding a sensitizer to a photosensitive paste, the addition amount is 0.05-10 mass% normally with respect to the photosensitive component, More preferably, it is 0.1-10 mass%. When the amount of the sensitizer is less than the above range, the effect of improving the sensitivity tends not to be exhibited, and when the amount of the sensitizer is larger than the above range, the residual ratio of the exposed portion tends to be small.

  Examples of the organic solvent include methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether acetate, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, and γ-butyllactone. , N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid and the like, and one or more of these An organic solvent mixture is used.

  The partition-forming photosensitive paste is usually prepared by mixing the above-mentioned inorganic fine particles and organic components so as to have a predetermined composition, and then uniformly mixing and dispersing them with a three roller or kneader. Next, a photosensitive paste is applied, dried, exposed, developed, and the like.

  As a method for applying the barrier rib forming photosensitive paste, a screen printing method, a bar coater, a roll coater, a die coater, a blade coater or the like can be used. The coating thickness can be adjusted by selecting the number of coatings, screen mesh, and paste viscosity.

  In addition, a drying oven, a hot plate, an IR (infrared) furnace or the like can be used for drying after application.

Examples of the active light source used for exposure include visible light, near ultraviolet light, ultraviolet light, electron beam, X-ray, and laser light. Among these, ultraviolet rays are most preferable, and as the light source, for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a halogen lamp, or a germicidal lamp can be used. Among these, an ultrahigh pressure mercury lamp is suitable. Exposure conditions vary depending on the coating thickness, but exposure is performed for 0.1 to 10 minutes using an ultrahigh pressure mercury lamp with an output of 1 to 100 mW / cm ² .

  Here, the distance between the photomask and the surface of the photosensitive paste coating film (hereinafter referred to as the gap amount) is preferably adjusted to 50 to 500 μm, more preferably 70 to 400 μm. By setting the gap amount to 50 μm or more, more preferably 70 μm or more, contact between the photosensitive paste coating film and the photomask can be prevented, and destruction or contamination of both can be prevented. Moreover, sharp patterning is attained by setting it as 500 micrometers or less, More preferably, it is 400 micrometers or less.

  Development is performed using the difference in solubility between the exposed portion and the unexposed portion in the developer. Development can be performed by a dipping method, a spray method, a brush method, or the like.

  Developer can dissolve organic components in the photosensitive paste, that is, photosensitive organic components before exposure in the case of negative photosensitive paste, and organic components after exposure in the case of positive photosensitive paste. Is used. When a compound having an acidic group such as a carboxyl group is present in the organic component to be dissolved, development can be performed with an alkaline aqueous solution. As the alkaline aqueous solution, an inorganic alkaline aqueous solution such as sodium hydroxide, sodium carbonate, sodium carbonate aqueous solution, calcium hydroxide aqueous solution or the like can be used. However, the use of the organic alkaline aqueous solution facilitates removal of alkali components during firing. preferable. As the organic alkali, a general amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, and diethanolamine. The density | concentration of aqueous alkali solution is 0.01-10 mass% normally, More preferably, it is 0.1-5 mass%. If the alkali concentration is too low, the soluble portion tends to be difficult to remove, and if the alkali concentration is too high, the pattern portion tends to be peeled off or the insoluble portion tends to be corroded. The development temperature during development is preferably 20 to 50 ° C. in terms of process control.

  Next, the pattern of the partition walls and auxiliary partition walls obtained by development is fired in a firing furnace. The firing atmosphere and temperature vary depending on the type of paste and substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a roller hearth-type continuous firing furnace can be used. The firing temperature is preferably 400 to 800 ° C. In the case where the partition wall is directly formed on the glass substrate, it is preferable to perform baking while maintaining the temperature at 450 to 620 ° C. for 10 to 60 minutes.

  In the present invention, there are, for example, the following three methods for blackening at least part of the pattern that partitions the pixels in the vertical direction.

  As a first method, as shown in FIG. 1, there is a method in which the entire auxiliary partition wall that partitions the pixels in the vertical direction is a black portion. As a method for blackening the entire auxiliary partition wall, a method of adding a black pigment to the photosensitive paste described above is the simplest. Specifically, a black pigment is contained in the photosensitive paste, the paste is applied and dried at a desired thickness, and exposure / development is performed through a photomask on which desired barrier ribs and / or auxiliary barrier rib patterns are arranged. And the like.

  The second method includes a method in which at least the top of the auxiliary partition, the side surface of the auxiliary partition, the top of the partition, and a part of the side surface of the partition are black portions.

  As a method of making at least the top of the auxiliary barrier rib, the side surface of the auxiliary barrier rib, the top of the barrier rib, and a part of the side wall of the barrier rib a black portion, a photosensitive paste containing no black pigment is formed on the substrate or the dielectric with a desired thickness. Then, after applying and drying a photosensitive paste containing a black pigment with a desired thickness, it is exposed and developed through a photomask on which desired barrier ribs and / or auxiliary barrier rib patterns are arranged. 2. A method for obtaining a back plate for a plasma display having the structure shown in FIG. 2, after applying and drying a photosensitive paste containing a black pigment, once exposing through a photomask on which a desired auxiliary barrier rib pattern is arranged, After applying and drying the photosensitive paste with a thickness, it is exposed and developed through a photomask on which a desired partition wall pattern is arranged, and a plasma display having the structure shown in FIG. How to obtain a play Backplate, a method of obtaining a back panel for a plasma display having the configuration shown in FIG. 4 and the like using a photosensitive paste containing a black pigment layer constituting the auxiliary barrier rib tops as three layers. Here, the thickness of the black part constituting the top of the auxiliary partition wall is not particularly defined, but it is usually 5 to 50 μm, preferably 13 to 45 μm in many cases.

  Further, as shown in FIG. 5, the third method divides pixels adjacent in the horizontal direction by one partition, and separates pixels adjacent in the vertical direction between two or more auxiliary partitions and the two or more auxiliary partitions. In this method, the vertical pixels are partitioned by the black portions formed on the substrate, and the barrier ribs and auxiliary barrier ribs are formed by applying, drying, exposing, and developing using a photosensitive paste that does not contain a black pigment. The method of apply | coating the black paste containing a black pigment between these auxiliary partitions (FIG. 6) is mentioned.

  Here, as a method of applying the black paste between the auxiliary barrier ribs, a known technique, for example, a screen printing method, a dispenser coating method, or the like can be used.

  As the black pigment, it is preferable to use at least one metal selected from the group consisting of Ru, Cr, Fe, Co, Mn, Cu and Ni or an oxide thereof. Preferably, an oxide of Ru is used.

  The maximum particle size of the black pigment used in the present invention is preferably 20 μm or less. If the maximum particle diameter exceeds 20 μm, there may be a portion where light is largely blocked during exposure, and a defective portion may be formed in the pattern. During firing, a large disconnection or color mixing at the time of phosphor formation may occur from this defective portion. It may be a cause. Here, the particle diameter is a value measured by a laser scattering / diffraction method, and the 50% particle diameter in the volume distribution curve is a particle in which particles smaller than or equal to the particle diameter in the volume distribution curve are 50% of all particles. The diameter (median type) and the maximum particle diameter are the maximum value of the particle diameter.

  Moreover, it is preferable that the 50% particle diameter in the volume distribution curve of the black pigment is less than 2 μm from the viewpoint of forming a defect-free partition wall. If it is 2 μm or more, there is a tendency that the partition wall is chipped when the partition wall is formed. Therefore, when the panel is sealed with the front plate, an erroneous discharge may occur.

  When the black pigment is added to the photosensitive black paste, it is preferably 0.5 to 10% by mass in the paste. When the amount is less than 0.5% by mass, the blackness becomes weak and grayish, and the contrast is not improved. On the other hand, when the content is more than 10% by mass, the softening point of the glass may increase or it may be difficult to match the thermal expansion coefficient with the glass substrate. In addition, the blackness becomes too strong, making it difficult for the ultraviolet rays to reach the lower part, and the pattern formability may be lowered. However, when black paste is applied between the auxiliary barrier ribs, the amount of black pigment added is not limited to the above range because leakage of light emission can be controlled by the application width and application thickness.

For the black pigment of the present invention and the glass powder, the 50% particle diameter in the volume distribution curve of the black powder is D _b (μm), and the 50% particle diameter in the volume distribution curve of the glass powder is D _g (μm). It is preferable that the following formula (1) is satisfied.
0.01 < _Db / _Dg <1 (1)
By satisfying the formula (1), an excellent black partition for a plasma display without defects can be obtained.

  Next, a phosphor layer that emits light of each color of red (R), green (G), and blue (B) is formed between barrier ribs formed in a direction parallel to a predetermined address electrode. The phosphor layer can be formed by applying a phosphor paste containing phosphor powder, an organic binder, and an organic solvent as main components between predetermined partitions, drying, and firing as necessary.

  As a method of applying the phosphor paste between predetermined partitions, a screen printing method in which a pattern is printed using a screen printing plate, a dispenser method in which the phosphor paste is discharged from the tip of a discharge nozzle, or a phosphor paste The phosphor paste of each color can be applied to a predetermined place by the above-described photosensitive paste method using the photosensitive organic component, but the screen printing method and the dispenser method are preferably applied in the present invention for cost reasons. .

When the thickness of the red phosphor layer is T _r (μm), the thickness of the green phosphor layer is T _g (μm), and the thickness of the blue phosphor layer is T _b (μm), equations (2) and (3 ) Is preferably satisfied.
10 ≦ T _r ≦ T _b ≦ 50 (2),
10 ≦ T _g ≦ T _b ≦ 50 (3)
That is, a plasma display having a better color balance (high color temperature) can be produced by making the thickness of blue with low emission luminance thicker than green and red. A sufficient luminance can be obtained by setting the thickness of the phosphor layer to 10 μm or more. Further, by setting the thickness to 50 μm or less, it is possible to obtain a wide brightness and high brightness. The thickness of the phosphor layer in this case is measured as the thickness after firing at the midpoint between the adjacent partition walls. That is, it is measured as the thickness of the phosphor layer formed at the bottom of the discharge space (in the pixel cell surrounded by the barrier ribs and the auxiliary barrier ribs).

  By baking the coated phosphor layer at 400 to 550 ° C. as necessary, the back plate for plasma display of the present invention can be produced.

  Using this back plate for plasma display, after sealing with the front plate, the discharge circuit composed of helium, neon, xenon, etc. is sealed in the space formed between the front and back substrates, and the drive circuit is installed. Can produce plasma displays. The front plate is a member in which a transparent electrode, a bus electrode, a dielectric, and an MgO layer are formed on a substrate in a predetermined pattern. You may form a color filter layer in the part corresponding to the RGB each color phosphor layer formed on the back plate. Further, a black stripe may be formed in order to improve contrast.

Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to this.
A 42-inch AC (alternating current) type plasma display panel back plate was formed and evaluated. An evaluation method will be described.
<Reflectance>
The reflectance of the pattern portion was measured with a single back plate. Using a microspectrophotometer (MISM-05 manufactured by Sakai Corporation), the reflectance for a wavelength of 400 to 600 nm is measured in a range of 10 μm × 10 μm at a desired position such as the top of a partition wall, and the reflection for a wavelength of 550 nm The rate was taken as the reflectance at that point. The same measurement was repeated at 9 locations on the back plate surface, and the average value of 9 points was taken as the reflectance value.
<Contrast>
Under an environment of 100 lux, white was displayed by applying a voltage to the panel, and the luminance was measured with a spot having a diameter of 1 cm using a luminance measuring device (LMK2000 manufactured by Technoteam Co., Ltd.). Next, black was displayed and the luminance was measured in the same manner, and the ratio of the two luminances was taken as contrast. The same measurement was repeated at 9 points on the panel surface, and the average value was taken as the contrast of the panel.
<Luminance>
A voltage was applied to the panel to display white, and the luminance was measured with a spot having a diameter of 1 cm using a luminance measuring device (LMK2000 manufactured by Technoteam Co., Ltd.). The same measurement was repeated at 9 points on the panel surface, and the average value of 9 points was used as the brightness of the panel.

Next, a formation method is demonstrated in order.
(Examples 1-5, Comparative Example 1)
As a glass substrate, PD-200 (manufactured by Asahi Glass Co., Ltd.) having a size of 590 × 964 × 2.8 mm and 42 inches was used. On this substrate, as a writing electrode, 70 parts by weight of silver powder having an average particle diameter of 2.0 μm, Bi ₂ O ₃ / SiO ₂ / Al ₂ O ₃ / B ₂ O ₃ = 69/24/4/3 (mass %) Glass powder with an average particle size of 2.2 μm, acrylic acid, methyl methacrylate, styrene copolymer 8 parts by weight, trimethylolpropane triacrylate 7 parts by weight, benzophenone 3 parts by weight, butyl carbitol acrylate A striped electrode having a pitch of 240 μm, a line width of 100 μm, and a thickness of 3 μm after firing was formed by photolithography using a photosensitive silver paste comprising 7 parts by weight and 3 parts by weight of benzyl alcohol.

On this substrate, low-melting glass particles having a volume average particle diameter of 2 μm composed of Bi ₂ O ₃ / SiO ₂ / Al ₂ O ₃ / ZnO / B ₂ O ₃ = 78/14/3/3/2 (mass%) are formed. A dielectric paste consisting of 60 parts by weight, 10 parts by weight of titanium oxide powder having an average particle size of 0.3 μm, 15 parts by weight of ethyl cellulose, and 15 parts by weight of terpineol, and then firing at 580 ° C. to form a dielectric having a thickness of 10 μm A layer was formed.

The photosensitive paste for partition formation used the following composition.
(Photosensitive paste A for partition wall formation)
The following components were blended and used.
Glass powder: Bi ₂ O ₃ / SiO ₂ / Al ₂ O ₃ / ZnO / B ₂ O ₃ = 82/5/3/5/3/2 (mass%), glass powder having an average particle diameter of 2 μm 67 weight Part filler: Titanium oxide having an average particle size of 0.2 μm 3 parts by weight Polymer: “Cyclomer” P (ACA250, manufactured by Daicel Chemical Industries) 10 parts by weight Organic solvent (1): Benzyl alcohol 4 parts by weight Organic solvent (2) : Butyl carbitol acetate 3 parts by weight Monomer: Dipentaerythritol hexaacrylate 8 parts by weight Photopolymerization initiator: Benzophenone 3 parts by weight Antioxidant: 1,6-hexanediol-bis [(3,5-di-t-butyl -4-hydroxyphenyl) propionate] 1 part by weight Organic dye: Basic Blue 26 0.01 part by weight thixotropic agent: N, N′-12 -Butyrylenediamine hydroxystearate: 0.5 part by weight Surfactant: Polyoxyethylene cetyl ether: 0.49 part by weight.
(Photosensitive paste B for partition wall formation)
The partition wall forming photosensitive paste A and the black pigment were mixed and dispersed at the following ratio.
Partition-forming photosensitive paste A: 98 parts by weight Black pigment (RuO ₃ ): 2 parts by weight (Example 1)
The barrier rib forming photosensitive paste B was applied to a thickness of 300 μm using a die coater, and then dried in a clean oven at 100 ° C. for 40 minutes to form a coating film. A gap between the formed coating film and a predetermined photomask was set to 150 μm, and exposure of the partition walls and auxiliary partition walls was performed at an exposure amount of 300 mJ. The partition wall width was 50 μm, the pitch was 300 μm, the auxiliary partition wall width was 50 μm, and the pitch was 700 μm.

  The exposed substrate formed as described above was developed with a 0.5% by mass aqueous ethanolamine solution to form a partition pattern. The substrate on which pattern formation was completed was baked at 560 ° C. for 15 minutes. A schematic diagram of the obtained substrate is shown in FIG.

Each color phosphor paste was applied to the formed barrier ribs using a screen printing method and baked (500 ° C., 30 minutes) to form phosphor layers on the side and bottom portions of the barrier ribs.
Next, the front plate was produced by the following steps. First, a 590 × 964 × 2.8 mm 42-inch PD-200 (manufactured by Asahi Glass Co., Ltd.) was used as a glass substrate, ITO was formed on this glass substrate by sputtering, resist was applied, exposure, development A transparent electrode having a thickness of 0.1 μm and a line width of 200 μm was formed by the treatment and the etching treatment. Further, a bus electrode having a thickness of 5 μm after firing was formed by photolithography using a photosensitive silver paste made of black silver powder. Electrodes with a pitch of 375 μm and a line width of 100 μm were produced.

  Next, a glass paste obtained by kneading 70 parts by weight of low melting point glass powder containing 75% by weight of lead oxide, 20 parts by weight of ethyl cellulose, and 10 parts by weight of terpineol was screen-printed to obtain a bus electrode for the display part. After coating with a thickness of 50 μm so as to be covered, baking was performed at 570 ° C. for 15 minutes to form a front dielectric.

  A magnesium oxide layer having a thickness of 0.5 μm was formed as a protective film on the substrate on which the dielectric was formed by electron beam vapor deposition to produce a front plate.

  When the reflectance of the back plate was measured, it was 6% at the top of the partition wall and 6% at the top of the auxiliary partition wall.

The obtained front glass substrate was bonded and sealed to the rear glass substrate, and then a discharge gas was sealed, and a driving circuit was joined to produce a plasma display. When a voltage was applied to this panel and the display was observed, a contrast of 320: 1 was obtained at 100 lux. The luminance was 550 cd / m ² .
(Example 2)
The partition wall forming photosensitive paste A was applied to a thickness of 250 μm using a die coater, and then dried in a clean oven at 100 ° C. for 40 minutes to form a coating film. Further, the barrier rib-forming photosensitive paste B was applied to a thickness of 50 μm using a die coater, and then dried at 100 ° C. for 30 minutes in a clean oven to form a coating film. A gap between the formed coating film and a predetermined photomask was set to 150 μm with respect to the formed coating film, and exposure of the partition walls and the auxiliary partition walls was performed at an exposure amount of 300 mJ. The partition wall width was 50 μm, the pitch was 300 μm, the auxiliary partition wall width was 50 μm, and the pitch was 700 μm.

  The exposed substrate formed as described above was developed with a 0.5% by mass aqueous ethanolamine solution to form a partition pattern. The substrate on which pattern formation was completed was baked at 560 ° C. for 15 minutes. A schematic view of the obtained substrate is shown in FIG.

  Each color phosphor paste was applied to the formed barrier ribs using a screen printing method and baked (500 ° C., 30 minutes) to form phosphor layers on the side and bottom portions of the barrier ribs.

  When the reflectance of the back plate was measured, it was 12% at the top of the partition wall and 12% at the top of the auxiliary partition wall.

Using the obtained back glass substrate, a plasma display (PDP) was produced in the same manner as in Example 1. When a voltage was applied to this panel and the display was observed, a contrast of 315: 1 was obtained at 100 lux. The luminance was 580 cd / m ² .
(Example 3)
The barrier rib forming photosensitive paste B was applied to a thickness of 250 μm using a die coater, and then dried in a clean oven at 100 ° C. for 40 minutes to form a coating film. A gap with a predetermined photomask was set to 150 μm for the formed coating film, and exposure of the partition wall lower layer and auxiliary partition walls was performed at an exposure amount of 300 mJ. The auxiliary partition walls had a width of 50 μm and a pitch of 700 μm. After applying the photosensitive paste A for partition formation on the obtained exposed substrate to a thickness of 50 μm using a die coater, drying was performed at 100 ° C. for 40 minutes in a clean oven to form a coating film. With respect to the formed coating film, a gap with a predetermined photomask was set to 150 μm with respect to the formed coating film, and the exposure of the partition walls was performed at an exposure amount of 300 mJ. The width of the partition walls was 50 μm, and the pitch was 300 μm.

  The exposed substrate formed as described above was developed with a 0.5% by mass aqueous ethanolamine solution to form a partition pattern. The substrate on which pattern formation was completed was baked at 560 ° C. for 15 minutes. A schematic diagram of the obtained substrate is shown in FIG.

  Each color phosphor paste was applied to the formed barrier ribs using a screen printing method and baked (500 ° C., 30 minutes) to form phosphor layers on the side and bottom portions of the barrier ribs.

  When the reflectance of the back plate was measured, it was 40% at the top of the partition wall and 6% at the top of the auxiliary partition wall.

Using the obtained back glass substrate, a plasma display (PDP) was produced in the same manner as in Example 1. When a voltage was applied to this panel and the display was observed, a contrast of 307: 1 was obtained at 100 lux. The luminance was 630 cd / m ² .
Example 4
The barrier rib forming photosensitive paste A was applied to a thickness of 200 μm using a die coater, and then dried in a clean oven at 100 ° C. for 40 minutes to form a coating film. Further, the barrier rib-forming photosensitive paste B was applied to a thickness of 50 μm using a die coater, and then dried at 100 ° C. for 30 minutes in a clean oven to form a coating film. With respect to the formed coating film, a gap with a predetermined photomask was set to 150 μm with respect to the formed coating film, and the auxiliary partition wall was exposed at an exposure amount of 300 mJ. A photosensitive paste for partition formation was applied to the obtained exposed substrate having a width of 50 μm and a pitch of 700 μm to a thickness of 50 μm using a die coater, and then was cleaned at 100 ° C. for 40 minutes in a clean oven. Drying was performed to form a coating film. With respect to the formed coating film, a gap with a predetermined photomask was set to 150 μm with respect to the formed coating film, and the exposure of the partition walls was performed at an exposure amount of 300 mJ. The width of the partition walls was 50 μm, and the pitch was 300 μm.

  The exposed substrate formed as described above was developed with a 0.5% by mass aqueous ethanolamine solution to form a partition pattern. The substrate on which pattern formation was completed was baked at 560 ° C. for 15 minutes. A schematic diagram of the obtained substrate is shown in FIG.

  Each color phosphor paste was applied to the formed barrier ribs using a screen printing method and baked (500 ° C., 30 minutes) to form phosphor layers on the side and bottom portions of the barrier ribs.

  When the reflectance of the back plate was measured, it was 40% at the top of the partition wall and 12% at the top of the auxiliary partition wall.

Using the obtained back glass substrate, a plasma display (PDP) was produced in the same manner as in Example 1. When voltage was applied to this panel and the display was observed, a contrast of 302: 1 was obtained at 100 lux. The luminance was 640 cd / m ² .
(Example 5)
After applying the photosensitive paste for partition formation to a thickness of 300 μm using a die coater, drying was performed at 100 ° C. for 40 minutes in a clean oven to form a coating film. A gap between the formed coating film and a predetermined photomask was set to 150 μm with respect to the formed coating film, and exposure of the partition walls and the auxiliary partition walls was performed at an exposure amount of 300 mJ. Two auxiliary partition walls for separating the pixels in the vertical direction were arranged as a set. The auxiliary partition walls had a width of 50 μm and a pitch of 700 μm.

  The exposed substrate formed as described above was developed with a 0.5% by mass aqueous ethanolamine solution to form a partition pattern. The substrate on which pattern formation was completed was baked at 560 ° C. for 15 minutes. A schematic diagram of the obtained substrate is shown in FIG.

Each color phosphor paste was applied to the formed barrier ribs using a screen printing method. Further, a black paste having the following composition was applied between two auxiliary partition walls forming a set by using a screen printing method. The coating thickness was 90 μm.
Terpineol: 80 parts by weight Ethyl cellulose: 10 parts by weight Black pigment (CuCr ₂ O ₄ ): 10 parts by weight This substrate was baked (500 ° C., 30 minutes) to form phosphor layers on the side and bottom of the partition walls, A black layer was formed on the side and bottom between the two auxiliary partitions. A schematic diagram of the substrate on which the black layer is formed is shown in FIG.

  When the reflectance of the back plate was measured, it was 45% at the top of the partition wall and 8% at the black portion.

A plasma display was produced in the same manner as in Example 1 using the obtained back glass substrate. When a voltage was applied to this panel and the display was observed, a contrast of 323: 1 was obtained at 100 lux. The luminance was 650 cd / m ² .
(Comparative Example 1)
After applying the photosensitive paste for partition formation to a thickness of 300 μm using a die coater, drying was performed at 100 ° C. for 40 minutes in a clean oven to form a coating film. With respect to the formed coating film, a gap with a predetermined photomask was set to 150 μm with respect to the formed coating film, and the exposure of the partition walls was performed at an exposure amount of 300 mJ. The width of the partition walls was 50 μm, and the pitch was 300 μm.

  The exposed substrate formed as described above was developed with a 0.5% by mass aqueous ethanolamine solution to form a partition pattern. The substrate on which pattern formation was completed was baked at 560 ° C. for 15 minutes.

  Each color phosphor paste was applied to the formed barrier ribs using a screen printing method.

  When the reflectance of the back plate was measured, it was 45% at the top of the partition wall and 45% at the top of the auxiliary partition wall.

A plasma display was produced in the same manner as in Example 1 using the obtained back glass substrate. When a voltage was applied to this panel and the display was observed, a contrast of 250: 1 was obtained at 100 lux. The luminance was 650 cd / m ² .

It is a schematic diagram of the back plate for plasma displays by the 1st method of this invention. It is a schematic diagram of the back plate for plasma displays by the 2nd method of this invention. It is a schematic diagram of the backplate for plasma displays by another mode of the 2nd method of this invention. It is a schematic diagram of the backplate for plasma displays by another mode of the 2nd method of this invention. It is a schematic diagram of the partition shape used for the backplate for plasma displays by the 3rd method of this invention. It is a top view of the back plate for plasma displays by another mode of the 3rd method of this invention. It is a schematic diagram of a plasma display panel. It is a schematic diagram of the back plate for plasma displays.

Explanation of symbols

1: partition wall 2: auxiliary partition wall 3: address electrode 4: dielectric layer 5: glass substrate 6: black portion 7: main cell 8: glass substrate 9: black stripe 10: sustain electrode 11: scan electrode 12: MgO layer 13: Phosphor layer (R)
14: Phosphor (G)
15: Phosphor (B)
21: Back plate 22: Front plate

Claims (7)

  A back plate for a plasma display in which a pattern for partitioning at least vertical and horizontal pixels is disposed on a substrate when the short side direction of the display area is the vertical direction and the long side direction is the horizontal direction. A back plate for a plasma display, wherein at least a part of a pattern for partitioning pixels in the vertical direction is black.   The pattern that partitions the pixels in the vertical direction and the horizontal direction includes a partition mainly composed of low-melting glass that partitions the pixels in the horizontal direction and an auxiliary partition mainly composed of low-melting glass that partitions the pixels in the vertical direction. The back plate for a plasma display according to claim 1.   The back plate for a plasma display according to claim 2, wherein at least a top portion of the auxiliary partition wall is black.   The back plate for a plasma display according to claim 2 or 3, wherein the height of the partition walls is higher than the height of the auxiliary partition walls.   The pattern for partitioning the pixels in the vertical direction is composed of two or more auxiliary partitions mainly composed of low-melting glass and a black portion formed between the two or more auxiliary partitions. Back plate for plasma display.   6. The reflectance of at least the top of the partition wall that partitions the pixels in the horizontal direction is 35% or more, and the reflectance of the black part of the pattern that partitions the pixels in the vertical direction is 25% or less. The back plate for a plasma display according to any one of the above.     The plasma display panel containing the back plate for plasma displays in any one of the said Claims 1-6.

Images