JP2003249172A - Member for plasma display panel, and manufacturing method for the plasma display panel and the member for the plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display panel which need not a black electrode, facilitates increasing degree of flexibility in forming a pattern of light shielding layer within a display area, and realizes excellent contrast and color purity characteristics, to provide a member for the plasma display panel, and to provide manufacturing methods for them. <P>SOLUTION: The light shielding layer, transparent electrodes and electrodes are stacked in this order on an insulating base plate. The transparent layer can be formed simply and at low cost by the manufacturing method using photosensitive transparent electrically conductive paste. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a member for a plasma display panel, a plasma display panel and a method for manufacturing the same, and more particularly to a display side having at least a light-shielding layer, a transparent electrode, and an electrode on an insulating substrate. It relates to the front plate.

[0002]

2. Description of the Related Art In a general AC type plasma display panel including a front plate and a rear plate, a light-shielding layer is formed on the display side in addition to a light emitting region in order to improve contrast and color purity.

This light-shielding layer may be formed on the front plate that forms the discharge space, or may be formed on the filter or the like that is provided closer to the viewer than the front plate.

In the latter case, the positioning accuracy between the front plate and the filter and the dimensional accuracy become problems, and it is very difficult for the high definition type. On the other hand, the former is an effective means that can easily match the formed light emitting region and can cope with high definition.

A front plate that realizes the former is generally disclosed in JP-A-10-283937 and JP-A-10-2699.
As disclosed in JP-A-51-51 and JP-A-10-241574, it is manufactured by forming a transparent electrode on an insulating substrate and then sequentially forming a black electrode, an electrode, a light shielding layer and the like. Here, the light-shielding layer formed to increase the contrast and the color purity is composed of two layers of a black electrode and a light-shielding layer. The reason for having such a layer structure is mainly the method of forming the transparent electrode. It is in.

There are the following methods for forming the transparent electrode. 1. 1. Screen printing method with a screen plate having a desired pattern interposed Vapor deposition with a mask having a desired pattern
Sputtering method 3. After forming a transparent conductive layer in the area including the desired pattern area on the substrate by various coating methods, vapor deposition / sputtering method, etc., a resist layer is formed, and then patterning, etching, resist A method of obtaining a desired pattern by peeling layers.

On the other hand, in recent years, in various patterns, there is an increasing demand for higher positional accuracy, higher density, and higher definition, and along with this, improvement in pattern processing technology is desired. In particular, regarding a plasma display panel (PDP) member, unlike a circuit board, there is a demand for pattern formation accuracy on a large-sized substrate having a diagonal of 20 to 40 inches or higher and higher definition. .

In response to these demands, the screen printing method of 1 above inevitably causes bleeding and elongation of the screen plate. Even if the size of the screen mesh and the printing conditions are optimized, the width and width of the screen are reduced. It was difficult to improve the positional accuracy, and there was a limit to fine patterning. In addition, in the pattern vapor deposition / pattern sputtering method of the above 2, although it is better than that of the above 1, since there is wraparound from the opening portion to the mask shielding portion, there is a limit to high density and high definition. . Therefore, as a method for responding to these demands, the above-mentioned method 3 in which a photo process is interposed is often used.

In this method, when patterning is performed using a resist layer, it is preferable that the transparent electrode is first formed on a flat substrate because the pattern forming surface is preferably flat.

The transparent electrode is generally made of indium tin oxide (I
It often consists of (TO), but in any material system,
Since a high resistance value is required for driving, it is common to further stack and form an electrode made of silver or the like having a low resistance value. The electrode having a low resistance value is generally formed thinner than the transparent electrode in order to make the light emitting region larger. This low-resistance electrode made of silver or the like has a high reflectance, and in order to improve the deterioration of contrast and color purity caused by this high-reflectance electrode, a light-shielding electrode is formed on a transparent electrode formed on an insulating substrate. It is common to stack a black electrode having electrical conductivity and conductivity and further forming the electrode having a low resistance value thereon.

The light-shielding layer formed after the electrode having a low resistance value is formed plays a role in light-shielding for partitioning the light-emitting region other than the electrode pattern.

There are the following methods for forming these black electrodes, electrodes and light-shielding layers. 1. 1. Screen printing method with a screen plate having a desired pattern interposed Vapor deposition with a mask having a desired pattern
Sputtering method 3. An area including a desired pattern area on the substrate is solidly coated with a paste by various coating methods, and then a resist layer is formed, and then a desired pattern is formed by patterning the resist layer by a photo process, etching, and peeling the resist layer. How to get. 4. A method in which a desired pattern is obtained by a photo process after solid-coating a photosensitive paste onto an area including a desired pattern area on a substrate by various coating methods.

In the method of forming the black electrode, the electrode and the light shielding layer, the photo process is used similarly to the case of the transparent electrode, but the method using the photosensitive paste of the above 4 which is a simple method with a smaller number of steps is preferable. It is used.

For these reasons, a black electrode is indispensable for the front plate, and its constitution is a transparent electrode, a black electrode, an electrode, and a light-shielding layer in order from the insulating substrate.

[0015]

However, when the front plate is formed by the above procedure, the number of steps is increased by forming the two layers of the black electrode and the light-shielding layer which are necessary for improving the contrast and the color purity. There were challenges.

In order to solve the increase in the number of steps, Japanese Patent Laid-Open No. 10-92325 proposes to form a light shielding layer at the same time with the same composition as the black electrode. However, in this method, since the light-shielding layer also has conductivity, it is limited to a parallel pattern that does not intersect with the electrodes, and there is a high possibility of causing defects due to erroneous discharge, migration of electrode materials, and the like.

As a method that does not use a black electrode, Japanese Patent Laid-Open No. HEI 1
As disclosed in Japanese Patent Laid-Open No. 1-65482, a method has been proposed in which a recess (groove) is provided in an insulating substrate, a light-shielding layer and an electrode are formed in the recess, and then a transparent electrode is formed by two layers. However, in this method, a step of forming a recess in the glass substrate and a step of forming the transparent electrode by two layers are newly required. Further, in this method, since the electrode is formed in the recess, the light shielding layer is limited to the same pattern as the electrode pattern.

Therefore, an object of the present invention is to eliminate the need for the above-mentioned black electrode and to increase the degree of freedom of the pattern for forming the light-shielding layer in the display area, which is excellent in contrast and color purity. It is to provide a member for a display panel and a method for manufacturing the same. The display area refers to an area where light can be selectively emitted when the plasma display panel is driven, and is usually an area where an image can be displayed as a monitor.

[0019]

In order to solve the above problems, the present invention has the following constitution. That is, the present invention is
In a member for a plasma display panel having at least an insulating substrate, a first electrode, a second electrode and a light shielding layer, the light shielding layer, the first electrode,
A member for a plasma display panel, a plasma display panel using the same, and a method for manufacturing the plasma display panel, wherein the second electrode is laminated in this order and the first electrode is transparent.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION A member for a plasma display panel of the present invention and a plasma display panel using the same have at least an insulating substrate, a transparent electrode, an electrode, and a light-shielding layer. , A transparent electrode, and an electrode are laminated in this order. Hereinafter, the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

FIG. 1 shows an example of an embodiment of a member for a plasma display panel of the present invention.

In FIG. 1, first, the light shielding layer 2 is formed on the insulating substrate 1. Examples of the insulating substrate used in the present invention include a glass substrate and a plastic substrate. From the viewpoint of dimension control, it is preferable that it has heat resistance because it includes a drying process and a baking process in the subsequent process. Also, since the viewer will see the phosphor emission light through this insulating substrate, the insulating substrate must be transparent. Is preferred. From these points, as the glass substrate, in addition to soda glass, “PD200” manufactured by Asahi Glass Co., Ltd., “PP8” manufactured by Nippon Electric Glass Co., Ltd., which is a heat-resistant glass for PDP, can be preferably used.

The light-shielding layer according to the present invention has a visible light reflectance of at least a part of a part which divides a certain light-emitting unit cell, other than the light-emitting region, in order to improve contrast and color purity when the panel is turned on. A layer having a visible light transmittance of 30% or less and a visible light transmittance of 30% or less. Here, the light emitting unit cell 10
Is a rib (partition wall) 8 for partitioning the discharge space, and an electrode pair 9 composed of a first electrode 3 and a second electrode 4 for generating plasma discharge.
The area 11 partitioned by and corresponds to the area 11 for partitioning the light emitting unit cell, that is, the area overlapping with the rib and the area between the adjacent electrode pairs (FIG. 3A and FIG. 3).
(B)). Here, the visible light reflectance is a wavelength of 400 to 8
This refers to the average value of reflectance for visible light of 00 nm, which can be measured by, for example, a spectrophotometer. Also,
Visible light transmittance refers to an average value of transmittance for visible light having a wavelength of 400 to 800 nm, which can be measured by, for example, a spectrophotometer.

When the panel is viewed from the viewer side, the visible light reflectance contributes to the contrast due to external light, and the higher the visible light reflectance, the more difficult it is to obtain the contrast. When the visible light reflectance is 30% or less, sufficient contrast can be obtained. More preferably, the visible light reflectance is 20% or less,
More preferably, it is a black light shielding layer of 10% or less. Further, the visible light transmittance is involved in the contrast due to the light emitted from the inside of the panel, and the larger the visible light transmittance, the more difficult it is to obtain the contrast. If the visible light transmittance is 30% or less, sufficient contrast can be obtained. The visible light transmittance is more preferably 20% or less, still more preferably 10% or less.

The light-shielding layer is preferably an insulating layer. This is because the conductive layer may cause a defect due to a short circuit, erroneous discharge, migration of electrode material, or the like in the subsequent electrode formation, and the pattern for forming the light shielding layer is limited, that is, the degree of freedom becomes low. .

As the thickness of the light shielding layer becomes thinner, the visible light transmittance increases, and the effect of improving the desired contrast and color purity becomes smaller. In this case, by including fine inorganic fine particles in the light shielding layer, the visible light transmittance can be suppressed even in a thin film. The average particle diameter of the inorganic fine particles is preferably within the range of 10 to 500 nm. When it is less than 10 nm, it is difficult to produce such fine particles, and when used in a paste, the thixotropy of the paste becomes too large. If the thickness exceeds 500 nm, it becomes difficult to make it densely contained in the light-shielding layer, and it becomes difficult to suppress the visible light transmittance when the thickness is reduced. More preferably 10 to 100n
It is within the range of m.

In order to suppress visible light reflectance, it is preferable to use black inorganic pigments or black metal fine particles as the inorganic fine particles. For example, an oxide such as Cr, Co, Ni, Fe, Mn, or a complex oxide corresponds to this, and a complex oxide is C.
o-Cr-Fe, Co-Mn-Fe, Co-Fe-Mn
-Al, Co-Ni-Cr-Fe, etc. can be mentioned. These may be used alone or in combination of two or more. Further, the light-shielding layer can also be formed by using a black glass powder made by containing these inorganic fine particles exhibiting a black color when the glass is melted.

The light-shielding layer can be formed by any of the screen printing method, the vapor deposition / sputtering method, the photo process method, etc., but the photo process method, especially the photosensitive paste method is preferably used. It can be formed easily and accurately.

For example, a photosensitive black paste is prepared by mixing a black inorganic pigment composed of an oxide of Cr, Co, Ni and a low-melting glass frit with a binder containing a photosensitive organic component. The photosensitive black paste thus obtained is applied onto the insulating substrate 1, exposed to light and developed to form a desired pattern, and then baked to obtain a light-shielding layer 2 of the present invention.
Can be obtained.

As for the shape of the light-shielding layer, it may be formed on at least a part of the part that divides the light emitting unit cell,
When the panel is lit, any shape may be provided outside the display area that is not involved in the display. In the display area,
It is more preferable to use a stripe pattern consisting of two sides or a matrix pattern consisting of four sides among the approximately four sides that divide the light-emitting unit cell, because a formation confirmation inspection and the like can be easily performed.

Further, in order to prevent reflection at the electrode formed thereafter, it is more preferable to have a shape including the shape of the electrode in the display area. (FIGS. 4 to 6) The thinner the light-shielding layer, the better because the transparent electrode or the like formed in a later step can be easily applied and formed. Preferably 0.1
˜2 μm. More preferably 0.1 to 1 μm
Within the range of.

Next, the first electrode 3 is formed on the light shielding layer 2. This first electrode is a transparent electrode, but since it needs to be formed on the insulating substrate on which the light-shielding layer is formed, that is, on the surface having the step, the vacuum evaporation method or the sputtering method. However, since there is difficulty in joining at the step portion, the photo-process method using a photosensitive transparent conductive paste described below is the most effective means.

In order to form this transparent electrode, in the present invention, it is preferable to use a paste containing a transparent conductive powder and an organic component, and containing at least a photoreactive compound as the organic component. The photosensitive transparent conductive paste used in the present invention is preferably used when a pattern is formed by photolithography and then baked to form a pattern substantially made of an inorganic material.

The organic component used in such a photosensitive transparent conductive paste is at least a photoreactive compound, for example,
It is necessary to include a photoreactive monomer, a photoreactive oligomer, a photoreactive polymer and the like. Here, the reactivity means that when the photosensitive paste is exposed to actinic rays, the reactive monomer, the reactive oligomer, and the reactive polymer are photocrosslinked, photopolymerized, photodepolymerized, and photomodified. Means that the chemical structure changes through the reaction.

The organic component used in the photosensitive transparent conductive paste preferably contains a copolymer having a carboxyl group. As the copolymer having a carboxyl group, for example, acrylic acid, methacrylic acid, itaconic acid,
Select a carboxyl group-containing monomer such as crotonic acid, maleic acid, fumaric acid, vinyl acetic acid or an acid anhydride thereof and a monomer such as methacrylic acid ester, acrylic acid ester, styrene, acrylonitrile, vinyl acetate, 2-hydroxy acrylate, Examples thereof include those obtained by copolymerizing with an initiator such as azobisisobutyronitrile.

Further, a copolymer having a carboxyl group has a low thermal decomposition temperature during firing, and therefore (meth)
A copolymer containing acrylic acid ester and (meth) acrylic acid as a copolymerization component is preferably used. Above all,
A styrene / methyl methacrylate / methacrylic acid copolymer is preferably used.

The resin acid value of the copolymer having a carboxyl group is preferably 50 to 150 mgKOH / g. By setting the acid value to 150 mgKOH / g or less, it is possible to widen the development allowable range. Also, the acid value is 50m
By setting it to gKOH / g or more, the solubility of the unexposed area in the developing solution does not decrease, and therefore it is not necessary to increase the concentration of the developing solution and the exfoliation of the exposed area can be prevented, and a highly precise pattern can be obtained. .

Further, it is also preferable that the copolymer having a carboxyl group has an ethylenically unsaturated group in its side chain.
Examples of the ethylenically unsaturated group include an acrylic group, a methacrylic group, a vinyl group and an allyl group.

The addition amount of the copolymer having a carboxyl group is preferably 10 to 90% by weight in the organic component excluding the solvent from the viewpoint that an appropriate exposure amount can be obtained.

The photosensitive paste used in the present invention is
It is preferable to include transparent conductive powder. As the transparent conductive powder, a powder containing a known transparent conductive metal oxide such as tin oxide, indium oxide, and indium tin oxide (ITO) that is a composite oxide thereof as a main component, or transparent glass powder such as transparent A powder obtained by coating a non-conductive inorganic powder with these transparent conductive metal oxides is preferably used.

Here, the transparent conductive powder is preferably contained in the paste in an amount of 10 to 60% by weight. It is more preferably in the range of 15 to 50% by weight. This is because it becomes easy to perform pattern processing on a substrate used for a normal display. Further, in the present invention, a transparent non-conductive inorganic powder can be further included. This makes it possible to achieve a pattern having a desired resistance value or an anisotropic conductive film by adjusting the pattern formation thickness and the ratio of the transparent conductive powder to the transparent non-conductive inorganic powder.

The average particle diameter of the transparent conductive powder is 10
It is preferably from nm to 500 nm. Thereby,
This is because a thin film pattern having a pattern formation thickness of 1 μm or less can be achieved. Particularly, by setting the average particle size of the transparent conductive powder to 10 nm to 100 nm, a thin film and a low resistance pattern can be achieved. In the present invention, the average particle size of the transparent conductive powder is measured by observing the transparent conductive powder in the paste with a scanning electron microscope, and measuring the diameter of the transparent conductive powder in the longitudinal direction to 10
Zero particles were measured, and the average value thereof was defined as the average particle diameter of the transparent conductive powder. In the observation, 100 particles whose diameter in the longitudinal direction could be confirmed and measured were selected, and transparent conductive powder which could not be confirmed because it overlapped with other powders was excluded from the object.

The photosensitive paste used in the present invention may further contain a photopolymerization initiator. The photopolymerization initiator may be selected from those that generate radical species, and may be used alone or in combination of two or more. The photopolymerization initiator is preferably 0.05 to 20% by weight in the total amount of organic components excluding the solvent, more preferably,
It is 0.1 to 20% by weight. By setting the addition amount of the photopolymerization initiator within this range, good photosensitivity can be obtained while maintaining the residual ratio of the exposed portion.

Further, by using a sensitizer together with the photopolymerization initiator, the sensitivity can be improved and the wavelength range effective for the reaction can be expanded. Moreover, 1 type (s) or 2 or more types can be used. Some sensitizers can also be used as photopolymerization initiators. When the sensitizer is added to the photosensitive transparent conductive paste, the amount thereof added is preferably 0.05 to 20% by weight, more preferably 0.1 to 20% by weight, based on the total amount of the organic components excluding the solvent. By setting the addition amount of the sensitizer within this range, good photosensitivity can be obtained while maintaining the residual ratio of the exposed portion.

In the photosensitive paste, it is usually difficult to avoid light scattering inside the paste due to exposure light due to the difference in refractive index between the fine particles to be dispersed and the organic component. (Residual film formation)
Is likely to occur and is likely to be affected in a finer and finer pattern.

Therefore, a polymerization inhibitor is preferably added to the photosensitive paste used in the present invention. By adding the polymerization inhibitor, it is possible to suppress a certain amount of radical polymerization, which occurs in the paste due to exposure light, depending on the type of the polymerization inhibitor and the addition amount thereof. This makes it possible to suppress photoreaction to weak light such as scattered light. Therefore, a finer pattern can be formed sharply, which is preferably used. The polymerization inhibitor in the present invention is not particularly limited as long as it can be used as a polymerization inhibitor, and examples thereof include p-benzoquinone, naphthoquinone, di-t-butyl paracresol, hydroquinone monomethyl ether, α-naphthol and acetani. Ginacetate, hydrazine hydrochloride,
Trimethylbenzylammonium chloride, dinitrobenzene, picric acid, quinone dioxime, pyrogallol, tannic acid, resormine, cuperone and the like can be mentioned.

The amount of the polymerization inhibitor added is preferably 0.001 to 3% by weight, more preferably 0.01 to 2% by weight, based on the total amount of the organic components excluding the solvent. If the amount is less than this range, the effect of inhibiting the polymerization is not exhibited, and even if the exposure amount is low due to light scattering, the composition is cured and the pattern shape is likely to be thickened. Further, if the amount is more than this range, the sensitivity is lowered and a large amount of exposure is required.

An ultraviolet absorber is preferably added to the photosensitive paste used in the present invention. By adding the ultraviolet absorber, the scattered light inside the paste due to the exposure light can be absorbed and the scattered light can be weakened. This makes it possible to form a finer pattern sharply, and therefore can be preferably used. As the ultraviolet absorber, those composed of organic dyes are preferably used. Specifically, azo dyes, aminoketone dyes,
Xanthene dyes, quinoline dyes, anthraquinone dyes, benzophenone dyes, diphenylcyanoacrylate dyes, triazine dyes, p-aminobenzoic acid dyes and the like can be used. The organic dye is preferable because it does not remain in the insulating film after firing, and thus the deterioration of the insulating film characteristics due to the ultraviolet absorber can be suppressed. Among these,
Azo and benzophenone dyes are preferred.

The amount of the ultraviolet absorber added is preferably 0.001 to 2% by weight, more preferably 0.01 to 1% by weight, based on the total amount of the organic components excluding the solvent. This is because by setting it within this range, it is possible to keep the transmission limit wavelength and the wavelength inclination width within the desired range, and obtain the effect of absorbing scattered light while maintaining the transmittance of exposure light and the sensitivity of the photosensitive paste. .

An organic solvent is often used to adjust the viscosity when the paste is applied to the substrate according to the application method. As the organic solvent used at this time, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, Chlorobenzene, dibromobenzene, dichlorobenzene,
Bromobenzoic acid, chlorobenzoic acid, etc., and an organic solvent mixture containing one or more of them are used.

In the photosensitive paste used in the present invention, in addition, if necessary, a photo-acid generator, a photo-base generator, a sensitization aid, a dispersant, a plasticizer, a thickener, an acid, a base and a precipitate. Inhibitor,
Additive components such as antioxidants can be added.

For example, when a binder component is required, the polymer such as polyvinyl alcohol,
Polyvinyl butyral, methacrylic acid ester polymer,
Acrylic acid ester polymers, acrylic acid ester-methacrylic acid ester copolymers, butyl methacrylate resins and the like can be used.

The photosensitive paste used in the present invention has various components such as transparent conductive powder, transparent non-conductive inorganic powder, photosensitive organic component, binder component, photopolymerization initiator, and organic solvent in a predetermined composition. After being mixed as described above, it is prepared by uniformly mixing and dispersing with a three-roller or a kneader.

The viscosity of the paste is appropriately adjusted by the addition ratio of transparent conductive powder, transparent non-conductive inorganic powder, thickener, organic solvent, plasticizer, anti-settling agent, etc., but the range is 100,000 to 200,000. cps (centimeter poise).
For example, 10 to 5000 cps when the substrate is coated by spin coating, dip coating, or spraying.
Is preferred. 5000 when using screen printing
~ 200,000 cps is preferred. When using a blade coater method or a die coater method, 5000-50,000 cps
Is preferred.

The transparent electrode 3 of the present invention is prepared by applying the photosensitive transparent conductive paste thus obtained on the formation surface, exposing and developing it to form a pattern, and then baking it.
(First electrode) can be obtained. An example of performing the pattern processing here will be described, but the present invention is not limited to this.

The photosensitive transparent conductive paste is applied on the entire surface or partially on the formation surface. As a coating method, a screen printing method, a bar coater, a roll coater, a die coater, a blade coater, or the like can be used. The coating thickness can be adjusted by selecting the number of coatings, the screen mesh, and the viscosity of the paste.

After coating, exposure is performed using an exposure device. As the exposure device, a proximity exposure device or the like can be used. When exposing a large area,
A large area can be exposed by an exposure device having a small exposure area by applying the photosensitive transparent conductive paste on the formation surface and then performing exposure while transporting.

After the exposure, the development is carried out by utilizing the difference in the solubility between the exposed portion and the unexposed portion in the developing solution. In this case, the dipping method, the spray method or the brush method is used. It is preferable that the developing solution used for the developing treatment contains water as a main component in terms of cost and environmental load. As the developing solution, an organic solvent capable of dissolving the organic component in the photosensitive transparent conductive paste, for example, alcohols such as ethyl alcohol and methyl alcohol can be used. Further, water may be added to the organic solvent within the range in which the dissolving power is not lost. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, it can be developed with an aqueous alkaline solution.
As the alkaline aqueous solution, sodium hydroxide, sodium carbonate, calcium hydroxide aqueous solution or the like can be used, but it is preferable to use the organic alkaline aqueous solution because the alkaline component can be easily removed during firing.

As the organic alkali, a general amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine and diethanolamine.

The concentration of the alkaline aqueous solution is usually 0.05 to 5
%, More preferably 0.1 to 1% by weight. If the alkali concentration is too low, the soluble portion is not removed. If the alkali concentration is too high, the pattern portion may be peeled off and the non-soluble portion may be corroded, which is not good. The development temperature during development is preferably 20 to 50 ° C. for process control.

Next, firing is performed in a firing furnace. The firing atmosphere and temperature vary depending on the type of paste and insulating substrate,
Firing is performed in air, in an atmosphere of nitrogen, hydrogen, or the like. As the firing furnace, a batch firing furnace or a belt type continuous firing furnace can be used.

The firing is usually carried out at 400 to 1000 ° C. When patterning on a glass substrate, 480-610
It is preferable to carry out the firing while maintaining the temperature at 10 ° C for 10 to 120 minutes.

Here, the thickness of the transparent electrode 3 formed is preferably 0.5 times or more the thickness of the light shielding layer 2. This is because conduction can be obtained without breaking even in a portion where the transparent electrode pattern is wider than the light shielding layer pattern. The thickness of the transparent electrode 3 formed is 50 times the thickness of the light shielding layer 2.
If the thickness is more than doubled and becomes too thick, the transmittance of the transparent electrode is lowered and the display quality tends to be deteriorated, which is not preferable.
More preferably, the thickness of the transparent electrode 3 is in the range of 0.5 to 20 times the thickness of the light-shielding layer 2, and even more preferably 0.
It is in the range of 5 to 5 times. The thickness range of the transparent electrode is preferably 0.01 to 2 μm, and particularly preferably 0.0.
It is within the range of 5 to 1 μm.

Next, the second electrode 4 is formed on the transparent electrode 3. The second electrode 4 is silver, gold, Al, Ni, Cu, C
A known metal conductive material such as r can be formed as a main component.

The electrodes can be formed by any of the screen printing method, the vapor deposition / sputtering method, the photo process method, etc., but the photo process method, especially the photosensitive paste method is preferably used. It can be formed easily and accurately. For example, a photosensitive conductive paste is prepared by mixing metal conductive fine particles made of silver, a low melting point glass frit, and a binder containing a photosensitive organic component.
The second electrode 4 of the present invention can be obtained by applying the photosensitive conductive paste thus obtained on the formation surface, exposing and developing it to form a pattern, and then baking.

After that, a dielectric layer having a thickness of 20 to 50 μm, which is generally made of an insulating film such as low melting point glass, is formed, and a protective layer made of magnesium oxide (MgO) and having a thickness of about several thousand angstroms is formed on the entire surface thereof. Although the front plate can be manufactured by forming the above, the present invention is not limited to this, and a color filter or the like may be formed on the second electrode or in the dielectric layer, or a partition wall may be formed on the protective layer. (Rib) or a phosphor layer may be formed.

On the other hand, the back plate can be generally manufactured by sequentially forming an address electrode, a back dielectric layer, a rib and a phosphor layer on an insulating substrate. Address electrodes are silver, gold, A
A known metal conductive material such as 1, Ni, Cu, or Cr is formed as a main component, and the formation method can be the same as that of the second electrode of the front plate. The back dielectric layer is not always essential, but it is preferably formed for the stability of discharge, and in that case, an insulating film of 5 to 30 μm in thickness made of low melting point glass or the like is formed. The ribs that partition a part or the whole of the discharge space are made of low-melting glass or the like and have a rectangular shape, a trapezoidal shape, a tapered shape or the like with a height of 50 to 200 μm and a width of 20 to 200 μm. The phosphor layer is R
The three primary colors of (red), G (green), and B (blue) are formed in the discharge space where each color is to be emitted, that is, between the ribs where emission is desired. At this time, it is preferable to form so as to cover the inner surface of the back plate including the upper surface of the address electrode and the rib side surface, because the light emission luminance and the light emission efficiency can be increased.

The front plate and the back plate thus obtained are arranged so as to oppose each other, the periphery of the gap is hermetically sealed, the interior is temporarily evacuated to a vacuum, and the discharge gas is enclosed by a series of steps. A PDP can be made.

[0069]

EXAMPLES The present invention will be specifically described below with reference to examples. However, the present invention is not limited to this. The concentration (%) in the examples is% by weight.

(Measurement Method) (1) Measurement of Average Particle Size The powder to be measured was scanned with an electron microscope (S manufactured by Hitachi, Ltd.).
-2400 type), 100 diameters in the longitudinal direction of the powder to be measured were measured, and the average value was taken as the average particle diameter of the powder to be measured. In the observation, 100 powders that can be confirmed and measured in the longitudinal direction of the measured powder were selected, and the measured powders that could not be confirmed because they overlapped with other powders were excluded from the target.

(2) Thickness measurement (less than 5 μm) The object to be measured is a scanning electron microscope (S- manufactured by Hitachi, Ltd.).
2400 type), and the thickness of the measured object was measured.

(3) Thickness measurement (5 μm or more and less than 1 mm) The object to be measured is a digital microscope (manufactured by KEYENCE)
And the thickness of the object to be measured was measured.

(Organic component A) Photosensitive polymer (X-40
07) 55 parts by weight of a photosensitive monomer (trimethylolpropane triacrylate) and 100 parts by weight of a photopolymerization initiator (2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1. ) 30 parts by weight (organic component B) Photosensitive polymer (X-4007) 100
57 parts by weight of a photosensitive monomer (trimethylolpropane triacrylate), and a photopolymerization initiator (2
-Methyl-1- [4- (methylthio) phenyl] -2-
Morpholino-propanone-1) 35 parts by weight, photopolymerization inhibitor (hydroquinone monomethyl ether) 0.8 parts by weight (organic component C) Photosensitive polymer (X-4007) 100
57 parts by weight of a photosensitive monomer (trimethylolpropane triacrylate), and a photopolymerization initiator (2
-Methyl-1- [4- (methylthio) phenyl] -2-
Morpholino-propanone-1) 35 parts by weight X-4007: Weight obtained by addition-polymerizing 0.4 equivalent of glycidyl methacrylate with respect to a carboxyl group of a copolymer composed of 40% methacrylic acid, 30% methyl methacrylate and 30% styrene. A polymer having an average molecular weight of 43,000 and an acid value of 95.

TPM: tripropylene glycol methyl ether.

Example 1 First, a front plate was prepared. Cobalt oxide powder having an average particle diameter of 80 nm is used as an organic solvent TPM.
A solution having 60% dispersed therein is prepared, and this solution is
25 low-melting glass powder containing 75% by weight of lead oxide
%, 23% of organic component A and 27% of organic solvent (γ-butyrolactone) were dissolved / mixed / dispersed and uniformly kneaded with a three-roller to prepare a photosensitive black paste. The paste viscosity was 5000 cps.

This photosensitive black paste was screen-printed (420) on a glass substrate "PD200" manufactured by Asahi Glass Co., Ltd.
A polyester screen printing plate of mesh was used for coating, and then the coating film was dried at 80 ° C. for 40 minutes. The thickness after drying was 2 μm.

An ultra-high pressure mercury lamp having an output of 15 mW / cm ² through a negative photomask having a stripe shape in the display area and having a light-shielding layer pattern (line widths of 50 μm and 150 μm) including an electrode pattern to be formed later. UV exposure was performed for about 30 seconds. Development is carried out in a shower of 30% monoethanolamine 0.2% aqueous solution,
The unexposed areas were removed. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 15 minutes.

Thus, there is no pinhole or disconnection, the thickness is 1 μm, the visible light reflectance is 2%, and the visible light transmittance is 7%.
A good light-shielding layer was obtained.

Next, an ITO powder (manufactured by Mitsui Kinzoku Co., Ltd .: PASSTRA) which is a transparent conductive powder having an average particle diameter of 18 nm.
35% of N), 25% of the organic component B excluding the solvent and 40% of γ-butyrolactone as the organic solvent were dissolved, mixed and dispersed, and uniformly kneaded with a kneader to prepare a photosensitive transparent conductive paste. The paste viscosity was 500 cps.

This photosensitive transparent conductive paste was applied onto a substrate having a light shielding layer formed thereon by a spin coater method, and then the applied film was dried at 80 ° C. for 40 minutes. Thickness after drying is 2
was μm. Transparent electrode pattern (pitch 375 μm,
Through a negative type photomask having a line width of 150 μm), UV exposure was performed for about 30 seconds by an ultrahigh pressure mercury lamp with an output of 15 mW / cm ² . The development was carried out in a shower of a 30% monoethanolamine 0.2% aqueous solution to remove the unexposed portion. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 60 minutes. In this way, a good transparent electrode having a thickness of 1.0 μm without pinholes or disconnection was obtained.

Subsequently, 35% of silver powder having an average particle diameter of 1.5 μm, 25% of organic component C excluding the solvent and 40% of γ-butyrolactone as an organic solvent were dissolved, mixed and dispersed, and homogenized with three rollers. Was kneaded to prepare a photosensitive silver paste. The paste viscosity was 5000 cps.

A transparent electrode is formed from this photosensitive silver paste.
Screen printing method (350 mesh poly
Apply with a screen printing plate made of ester)
Next, the coating film was dried at 80 ° C. for 40 minutes. Thickness after drying
It was 6 μm. Has an electrode pattern (line width 50 μm)
Output 15 mW / cm through negative photomask ²
Ultraviolet light exposure was performed for about 30 seconds with the ultra-high pressure mercury lamp. Present
The image is of a 30% monoethanolamine 0.2% aqueous solution.
A shower was performed to remove the unexposed portion. So
After that, the remaining developing solution is washed away with a pure water shower,
It was dried at 0 ° C. for 20 minutes. Firing speed of 250 ℃ / hour
The temperature is raised at, and the maximum temperature is kept at 590 ℃ for 60 minutes.
It was

In this way, a good electrode having a thickness of 3 μm and free from pinholes or disconnection was obtained. Further, it was confirmed that the electrodes formed here were hidden by the light shielding layer when viewed from the glass substrate side.

Furthermore, a glass paste obtained by kneading 70% of a low-melting glass powder containing 75% by weight of lead oxide, 20% of ethyl cellulose and 10% of terpineol was screen-printed to cover the electrodes in the display area. After applying a thickness of 20 μm as shown in FIG.
Baking for 5 minutes formed the front dielectric. A thickness of 0.5 is formed by electron beam evaporation on the substrate on which the front surface dielectric is formed.
A μm magnesium oxide layer was formed to prepare a front plate.

Next, a back plate was prepared. "PD200"
An address electrode was prepared by using a photosensitive silver paste on the above.
A line width of 50 μm, a thickness of 3 μm, and a pitch of 250 μm are applied through a process of applying a photosensitive silver paste, drying, exposing, developing and baking.
The address electrode of was formed. Subsequently, a glass paste obtained by kneading 60% of a low-melting glass powder containing 75% by weight of bismuth oxide, 10% of titanium oxide powder having an average particle diameter of 0.3 μm, 15% of ethyl cellulose, and 15% of terpineol. 20μm by screen printing
And then baked at 570 ° C. for 15 minutes to form a back surface dielectric layer.

Partition walls were formed on the dielectric layer by a photosensitive paste method. After applying the photosensitive paste, exposure was performed using a photomask having a line width of the opening of 30 μm, and then 0.
By developing in a 5 wt% aqueous solution of ethanolamine and baking at 560 ° C. for 15 minutes, pitch 2
A partition wall having a thickness of 50 μm, a line width of 30 μm and a height of 130 μm was formed.

Next, a phosphor was applied between the adjacent partition walls. The phosphor is applied at 64 holes (caliber: 130μ).
m) was formed by a dispenser method in which the phosphor paste was discharged from the tip of the nozzle. The phosphor has a thickness of 25 μm after firing on the side walls of the partition wall and a thickness of 25 μ after firing on the dielectric.
After coating so as to have a thickness of m, baking was performed at 500 ° C. for 10 minutes to complete the back plate.

The front plate and the rear plate were sealed with a sealing glass, and Ne gas containing 5% Xe was used as the internal gas pressure 66500.
It was enclosed so that it would be Pa. The manufactured PDP was driven normally over the entire surface, and had high display contrast and color purity and excellent display quality.

Example 2 As a photomask for the light-shielding layer, the light-shielding layer pattern (line width 30) having a matrix shape in the display area and including an electrode pattern to be formed later is used.
Example 1 was repeated except that a negative photomask having a thickness of 50 μm, 150 μm and 150 μm) was used.
Was produced. Since the light-shielding layer separated the periphery of the display pixel, it was possible to obtain a PDP having higher display contrast and color purity than Example 1 and excellent display quality.

(Example 3) As a photomask for a light-shielding layer, a light-shielding layer pattern (linewidth) having a stripe shape having a different linewidth for each cell of RGB colors in a display area and including an electrode pattern to be formed later (linewidth 30 μm and line width 300
A PDP was manufactured by repeating Example 1 except that a negative-type photomask having (B) / 325 (G) / 350 (R) μm stepped lines) was used. Since the luminance balance for each of the RGB colors could be corrected by the light-shielding layer, a PDP having higher display contrast and color purity than that of Example 1 and excellent in display quality could be obtained.

(Example 4) A PDP was manufactured by repeating Example 1 except that the light shielding layer on the front plate was manufactured by the following method.

A solution was prepared by dispersing 60% of cobalt oxide powder having an average particle diameter of 80 nm in an organic solvent TPM, 26% of this solution, 26% of a low melting point glass powder containing 75% by weight of lead oxide, and an organic solvent. 24% of component A and 24% of γ-butyrolactone were dissolved, mixed and dispersed, and then uniformly kneaded with a three roller to prepare a photosensitive black paste. The paste viscosity was 8000 cps.

This photosensitive black paste was applied onto a glass substrate PD200 manufactured by Asahi Glass Co., Ltd. by a screen printing method (using a 350 mesh polyester screen printing plate), and then the applied film was dried at 80 ° C. for 40 minutes. did. After drying, the thickness was 4 μm.

An ultrahigh pressure mercury lamp having an output of 15 mW / cm ² through a negative photomask having a stripe shape in the display area and having a light shielding layer pattern (line widths 50 μm and 150 μm) including an electrode pattern to be formed later. UV exposure was performed for about 30 seconds. Development is carried out in a shower of 30% monoethanolamine 0.2% aqueous solution,
The unexposed areas were removed. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 15 minutes.

The light-shielding layer thus obtained has a thickness of 2 μm,
The visible light reflectance was 2% and the visible light transmittance was 4%, and the manufactured PDP had high display contrast and color purity and excellent display quality, as in Example 1.

(Example 5) A PDP was manufactured by repeating Example 1 except that the light-shielding layer and the transparent electrode on the front plate were manufactured by the following method. The light shielding layer was produced by the following method.

A solution was prepared by dispersing 60% of cobalt oxide powder having an average particle diameter of 80 nm in an organic solvent TPM, and 26% of this solution and 26% of a low melting point glass powder containing 75% by weight of lead oxide were prepared. 24% of component A and 24% of γ-butyrolactone were dissolved, mixed and dispersed, and then uniformly kneaded with a three roller to prepare a photosensitive black paste. The paste viscosity was 8000 cps.

This photosensitive black paste was applied onto a glass substrate PD200 manufactured by Asahi Glass Co., Ltd. by screen printing (using a 350 mesh polyester screen printing plate), and then the applied film was dried at 80 ° C. for 40 minutes. did. After drying, the thickness was 4 μm.

An ultrahigh pressure mercury lamp having an output of 15 mW / cm ² through a negative type photomask having a stripe shape in the display area and having a light shielding layer pattern (line widths 50 μm and 150 μm) including an electrode pattern to be formed later. UV exposure was performed for about 30 seconds. Development is carried out in a shower of 30% monoethanolamine 0.2% aqueous solution,
The unexposed areas were removed. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 15 minutes. The light-shielding layer thus obtained had a thickness of 2 μm, a visible light reflectance of 2%, and a visible light transmittance of 4%.

The transparent electrode was produced by the following method. 20% of ITO powder having an average particle diameter of 18 nm as transparent conductive powder, 15% of organic component B excluding solvent and 65% of γ-butyrolactone are dissolved / mixed / dispersed and uniformly kneaded by a kneading machine to obtain transparent conductivity. A paste was made. The paste viscosity was 50 cps.

This photosensitive transparent conductive paste was applied onto a substrate having a light shielding layer formed thereon by a spin coater method, and then the applied film was dried at 80 ° C. for 40 minutes. The dry film was found to have coating defects such as pinholes in the light shielding layer pattern.
The thickness after drying was 2 μm.

Ultraviolet exposure was carried out for about 30 seconds with an ultrahigh pressure mercury lamp with an output of 15 mW / cm ² through a negative type photomask having a transparent electrode pattern (pitch 375 μm, line width 150 μm). The development was carried out in a shower of a 30% monoethanolamine 0.2% aqueous solution to remove the unexposed portion. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 60 minutes. The transparent electrode thus obtained had a thickness of 0.5 μm. There was a portion where the light shielding layer was exposed from the transparent electrode.

Although the produced PDP had some discharge abnormalities such as discharge delay and no discharge, it was driven all over.

Example 6 A PDP was manufactured by repeating Example 1 except that the light-shielding layer and the transparent electrode on the front plate were manufactured by the following method. The light shielding layer was produced by the following method.

A solution of 60% of cobalt oxide powder having an average particle diameter of 80 nm dispersed in an organic solvent TPM was prepared, and 27% of this solution and 27% of a low melting point glass powder containing 75% by weight of lead oxide were prepared. Dissolve, mix and disperse 25% of component A and 21% of organic solvent (γ-butyrolactone) 3
This roller was kneaded uniformly to prepare a photosensitive black paste. The paste viscosity was 12000 cps.

This photosensitive black paste was applied onto a glass substrate PD200 manufactured by Asahi Glass Co., Ltd. by a screen printing method (using a 350 mesh polyester screen printing plate), and then the applied film was dried at 80 ° C. for 40 minutes. did. After drying, the thickness was 6 μm.

An ultrahigh pressure mercury lamp having an output of 15 mW / cm ² through a negative photomask having a stripe shape in the display area and having a light shielding layer pattern (line widths 50 μm and 150 μm) including an electrode pattern to be formed later. UV exposure was performed for about 30 seconds. Development is carried out in a shower of 30% monoethanolamine 0.2% aqueous solution,
The unexposed areas were removed. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 15 minutes.

The light-shielding layer thus obtained has a thickness of 3 μm,
The visible light reflectance was 2% and the visible light transmittance was 3%. The transparent electrode was produced by the following method.

The transparent conductive powder has an average particle diameter of 18 n.
50% of the ITO powder of m and the organic component B excluding the solvent is 2
0% and γ-butyrolactone 30% as an organic solvent were dissolved, mixed and dispersed, and then uniformly kneaded by a kneader to prepare a transparent conductive paste. The paste viscosity was 5000 cps.

This photosensitive transparent conductive paste was applied onto a substrate having a light-shielding layer formed thereon by a screen printing method using a 350 mesh polyester screen printing plate, and then the coating film was dried at 80 ° C. for 40 minutes. did. Uneven coating along the light-shielding layer pattern was observed in the dried film. After drying, the thickness was 4 μm. Transparent electrode pattern (pitch 3
Ultraviolet exposure was performed for about 30 seconds with an ultrahigh pressure mercury lamp with an output of 15 mW / cm ² through a negative type photomask having a line width of 75 μm and a line width of 150 μm). The development was carried out in a shower of a 30% monoethanolamine 0.2% aqueous solution to remove the unexposed portion. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 60 minutes.

The transparent electrode thus obtained has a thickness of 2 μm.
Met. The transparent electrode had uneven thickness due to uneven coating.

Although the produced PDP had some discharge abnormality such as discharge delay or no discharge, it was driven all over.

(Example 7) A PDP was manufactured by repeating Example 1 except that the light-shielding layer and the transparent electrode on the front plate were manufactured by the following method. The light shielding layer was produced by the following method.

One cobalt oxide powder having an average particle diameter of 1 μm was used.
7%, 25% low melting point glass powder containing 75% by weight of lead oxide, 25% of organic component A and 33% of organic solvent (γ-butyrolactone) are dissolved / mixed / dispersed and homogeneously kneaded with three rollers. Then, a photosensitive black paste was prepared. The paste viscosity was 8000 cps.

This photosensitive black paste was screen-printed (350) on a glass substrate "PD200" manufactured by Asahi Glass Co., Ltd.
A polyester screen printing plate of mesh was used for coating, and then the coating film was dried at 80 ° C. for 40 minutes. After drying, the thickness was 4 μm.

An ultrahigh pressure mercury lamp with an output of 15 mW / cm ² through a negative photomask having a stripe shape in the display area and having a light shielding layer pattern (line widths 50 μm and 150 μm) including an electrode pattern to be formed later. UV exposure was performed for about 30 seconds. Development is carried out in a shower of 30% monoethanolamine 0.2% aqueous solution,
The unexposed areas were removed. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 15 minutes.

The thickness of the light-shielding layer thus obtained was 2 μm, but color unevenness was observed due to the difference in the density of cobalt oxide. The transparent electrode was produced by the following method.

The transparent conductive powder has an average particle diameter of 18n.
50% of the ITO powder of m and the organic component B excluding the solvent is 2
0% and γ-butyrolactone 30% as an organic solvent were dissolved, mixed and dispersed, and then uniformly kneaded by a kneader to prepare a transparent conductive paste. The paste viscosity was 5000 cps.

This photosensitive transparent conductive paste was applied onto a substrate having a light-shielding layer formed thereon by a screen printing method using a 350 mesh polyester screen printing plate, and then the coating film was dried at 80 ° C. for 40 minutes. did. Uneven coating along the light-shielding layer pattern was observed in the dried film. After drying, the thickness was 4 μm. Transparent electrode pattern (pitch 3
Ultraviolet exposure was carried out for about 30 seconds with an ultrahigh pressure mercury lamp with an output of 15 mW / cm ² through a negative type photomask having a line width of 75 μm and a line width of 150 μm). The development was carried out in a shower of a 30% monoethanolamine 0.2% aqueous solution to remove the unexposed portion. Then, the remaining developing solution was washed away with a pure water shower and dried at 80 ° C. for 20 minutes. The firing was performed by raising the temperature at a rate of 250 ° C./hour and maintaining the maximum temperature of 590 ° C. for 60 minutes. The transparent electrode thus obtained had a thickness of 2 μm.

Although the produced PDP showed some color unevenness in the light-shielding layer, it was driven over the entire surface.

[0121]

According to the present invention, the improvement of contrast and color purity, which has been conventionally achieved by two layers of a black electrode and a light shielding layer, can be achieved only by the light shielding layer, and the light shielding layer is formed in the display area. The degree of freedom of the pattern can be increased. Also, the manufacturing method thereof can be achieved by a simple and inexpensive method with fewer steps as compared with the conventional method.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a plasma display panel member of the present invention.

FIG. 2 is a perspective view showing an embodiment of a plasma display panel member of the present invention.

FIG. 3 is a cutout view of the light emitting unit cell and a portion that divides the light emitting unit cell as seen from the top surface of the display unit.

FIG. 4 is a cutout view showing a pattern of a light shielding layer as seen from the upper surface of a display unit.

FIG. 5 is a cutout view showing a pattern of a light shielding layer different from that of FIG.

FIG. 6 is a cutout view showing a pattern of a light-shielding layer in a mode different from that shown in FIGS.

FIG. 7 is a sectional view showing an example of a conventional plasma display panel member.

[Explanation of symbols]

1 Insulation board 2 light-shielding layer 3 First electrode 4 Second electrode 5 Dielectric layer 6 protective film 7 Black electrode 8 ribs (partition wall) 9 electrode pairs 10 Light emitting unit cell 11 Part that divides the light emitting unit cell

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5C027 AA02 AA10                 5C028 AA10                 5C040 FA01 FA04 GA02 GB03 GC05                       GC06 GH06 GH07 JA15 KA16                       KB09 LA05 LA10 MA02 MA22                       MA26

Claims (14)

[Claims] 1. A member for a plasma display panel having at least an insulating substrate, a first electrode, a second electrode and a light shielding layer, wherein a light shielding layer, a first electrode and a second electrode are laminated in this order from the insulating substrate side. And a first electrode is transparent, the member for a plasma display panel. 2. The member for a plasma display panel according to claim 1, wherein the light shielding layer is an insulating layer. 3. The member for plasma display panel according to claim 1, wherein the light shielding layer is black. 4. The member for a plasma display panel according to claim 1, wherein the shape of the light shielding layer in the display area is a stripe pattern. 5. The member for plasma display panel according to claim 1, wherein the shape of the light shielding layer in the display area is a matrix pattern. 6. The member for plasma display panel according to claim 1, wherein the shape of the light shielding layer in the display area is larger than the shape of the electrode. 7. The shape of the second electrode in the display area is
The member for a plasma display panel according to claim 1, which is a stripe pattern. 8. The thickness of the first electrode is 0.5 of the thickness of the light shielding layer.
It is about 50 times, The member for plasma display panels of Claim 1 characterized by the above-mentioned. 9. A member for a plasma display panel according to claim 1, wherein the thickness of the light shielding layer is 0.1 to 2 μm. 10. The light-shielding layer has an average particle diameter of 10 to 500 nm.
2. The member for a plasma display panel according to claim 1, which contains inorganic fine particles within the range. 11. A plasma display panel using the member for a plasma display panel according to claim 1. 12. A method of manufacturing a member for a plasma display panel, which comprises at least an insulating substrate, a transparent first electrode, a second electrode and a light-shielding layer, wherein the light-shielding layer and the transparent first layer are arranged from the insulating substrate side. 2. The method for manufacturing a member for a plasma display panel, comprising: 13. The method of manufacturing a member for a plasma display panel according to claim 12, wherein a photo process is used when forming the first electrode. 14. The method for manufacturing a member for a plasma display panel according to claim 12, wherein a photosensitive paste is used when forming the first electrode.