JP2007180200A - 識別マークの読取方法及び識別マークの読取装置 - Google Patents

識別マークの読取方法及び識別マークの読取装置 Download PDF

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Publication number
JP2007180200A
JP2007180200A JP2005375835A JP2005375835A JP2007180200A JP 2007180200 A JP2007180200 A JP 2007180200A JP 2005375835 A JP2005375835 A JP 2005375835A JP 2005375835 A JP2005375835 A JP 2005375835A JP 2007180200 A JP2007180200 A JP 2007180200A
Authority
JP
Japan
Prior art keywords
wafer
identification mark
main surface
reading
infrared ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005375835A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007180200A5 (enExample
Inventor
Masaharu Sasaki
正治 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP2005375835A priority Critical patent/JP2007180200A/ja
Priority to CNB200610172717XA priority patent/CN100520803C/zh
Priority to TW095148994A priority patent/TWI346900B/zh
Priority to US11/616,153 priority patent/US20070187514A1/en
Priority to KR1020060134687A priority patent/KR20070069071A/ko
Publication of JP2007180200A publication Critical patent/JP2007180200A/ja
Publication of JP2007180200A5 publication Critical patent/JP2007180200A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10544—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum
    • G06K7/10712—Fixed beam scanning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Coins (AREA)
JP2005375835A 2005-12-27 2005-12-27 識別マークの読取方法及び識別マークの読取装置 Pending JP2007180200A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005375835A JP2007180200A (ja) 2005-12-27 2005-12-27 識別マークの読取方法及び識別マークの読取装置
CNB200610172717XA CN100520803C (zh) 2005-12-27 2006-12-26 识别标记读取方法及其设备
TW095148994A TWI346900B (en) 2005-12-27 2006-12-26 Identification mark reading method and apparatus for the same
US11/616,153 US20070187514A1 (en) 2005-12-27 2006-12-26 Identification mark reading method and apparatus for the same
KR1020060134687A KR20070069071A (ko) 2005-12-27 2006-12-27 식별 마크의 판독 방법 및 식별 마크의 판독 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005375835A JP2007180200A (ja) 2005-12-27 2005-12-27 識別マークの読取方法及び識別マークの読取装置

Publications (2)

Publication Number Publication Date
JP2007180200A true JP2007180200A (ja) 2007-07-12
JP2007180200A5 JP2007180200A5 (enExample) 2009-02-12

Family

ID=38305108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005375835A Pending JP2007180200A (ja) 2005-12-27 2005-12-27 識別マークの読取方法及び識別マークの読取装置

Country Status (5)

Country Link
US (1) US20070187514A1 (enExample)
JP (1) JP2007180200A (enExample)
KR (1) KR20070069071A (enExample)
CN (1) CN100520803C (enExample)
TW (1) TWI346900B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154661A (ja) * 2013-02-07 2014-08-25 Hitachi Metals Ltd 窒化物半導体ウェハおよび窒化物半導体ウェハのマーキング方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5078725B2 (ja) * 2008-04-22 2012-11-21 ラピスセミコンダクタ株式会社 半導体装置
JP5633537B2 (ja) 2012-05-07 2014-12-03 信越半導体株式会社 半導体ウエーハの評価方法および半導体ウエーハの評価装置
JP6906859B2 (ja) * 2017-09-13 2021-07-21 株式会社ディスコ 加工装置
CN111723591B (zh) * 2020-05-22 2021-03-30 杭州长川科技股份有限公司 晶圆id读取装置
CN112509948A (zh) * 2020-12-18 2021-03-16 无锡奥特维科技股份有限公司 标记码识别装置、方法及硅片分选设备、电池片生产设备
CN112949804A (zh) * 2021-04-02 2021-06-11 Oppo广东移动通信有限公司 图形码、图形码识别方法、存储介质及相关装置
US11817357B2 (en) * 2021-06-09 2023-11-14 STATS ChipPAC Pte. Ltd. Region-of-interest positioning for laser-assisted bonding
CN114937619B (zh) * 2022-04-26 2024-08-20 沛顿科技（深圳）有限公司 一种倒装芯片固晶位置的检测方法
CN115714103B (zh) * 2022-11-25 2023-11-24 拓荆键科(海宁)半导体设备有限公司 用于晶圆键合对准及检测的装置和方法
CN116503586B (zh) * 2023-06-27 2023-09-05 钜宝(深圳)智能有限公司 一种金点检测机及检测方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247613A (ja) * 1997-03-04 1998-09-14 Hitachi Ltd 識別パターン付き基板および識別パターン読取方法並びに装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812631A (en) * 1987-06-02 1989-03-14 Kam Kwong Lee Limited Bar code and read-out method thereof
US5733711A (en) * 1996-01-02 1998-03-31 Micron Technology, Inc. Process for forming both fixed and variable patterns on a single photoresist resin mask
US7113258B2 (en) * 2001-01-15 2006-09-26 Asml Netherlands B.V. Lithographic apparatus
KR100579603B1 (ko) * 2001-01-15 2006-05-12 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치
US7018674B2 (en) * 2001-03-02 2006-03-28 Omron, Corporation Manufacturing methods and apparatuses of an optical device and a reflection plate provided with a resin thin film having a micro-asperity pattern
US7371663B2 (en) * 2005-07-06 2008-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Three dimensional IC device and alignment methods of IC device substrates
US8247773B2 (en) * 2007-06-26 2012-08-21 Yamaha Corporation Method and apparatus for reading identification mark on surface of wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247613A (ja) * 1997-03-04 1998-09-14 Hitachi Ltd 識別パターン付き基板および識別パターン読取方法並びに装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154661A (ja) * 2013-02-07 2014-08-25 Hitachi Metals Ltd 窒化物半導体ウェハおよび窒化物半導体ウェハのマーキング方法

Also Published As

Publication number Publication date
CN100520803C (zh) 2009-07-29
CN101008979A (zh) 2007-08-01
TWI346900B (en) 2011-08-11
TW200732981A (en) 2007-09-01
US20070187514A1 (en) 2007-08-16
KR20070069071A (ko) 2007-07-02

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