CN100520803C - 识别标记读取方法及其设备 - Google Patents

识别标记读取方法及其设备 Download PDF

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Publication number
CN100520803C
CN100520803C CNB200610172717XA CN200610172717A CN100520803C CN 100520803 C CN100520803 C CN 100520803C CN B200610172717X A CNB200610172717X A CN B200610172717XA CN 200610172717 A CN200610172717 A CN 200610172717A CN 100520803 C CN100520803 C CN 100520803C
Authority
CN
China
Prior art keywords
wafer
identification mark
infrared rays
main surface
reflected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200610172717XA
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English (en)
Chinese (zh)
Other versions
CN101008979A (zh
Inventor
佐佐木正治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Publication of CN101008979A publication Critical patent/CN101008979A/zh
Application granted granted Critical
Publication of CN100520803C publication Critical patent/CN100520803C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10544—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum
    • G06K7/10712—Fixed beam scanning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Coins (AREA)
CNB200610172717XA 2005-12-27 2006-12-26 识别标记读取方法及其设备 Expired - Fee Related CN100520803C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP375835/05 2005-12-27
JP2005375835A JP2007180200A (ja) 2005-12-27 2005-12-27 識別マークの読取方法及び識別マークの読取装置

Publications (2)

Publication Number Publication Date
CN101008979A CN101008979A (zh) 2007-08-01
CN100520803C true CN100520803C (zh) 2009-07-29

Family

ID=38305108

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200610172717XA Expired - Fee Related CN100520803C (zh) 2005-12-27 2006-12-26 识别标记读取方法及其设备

Country Status (5)

Country Link
US (1) US20070187514A1 (enExample)
JP (1) JP2007180200A (enExample)
KR (1) KR20070069071A (enExample)
CN (1) CN100520803C (enExample)
TW (1) TWI346900B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5078725B2 (ja) * 2008-04-22 2012-11-21 ラピスセミコンダクタ株式会社 半導体装置
JP5633537B2 (ja) 2012-05-07 2014-12-03 信越半導体株式会社 半導体ウエーハの評価方法および半導体ウエーハの評価装置
JP2014154661A (ja) * 2013-02-07 2014-08-25 Hitachi Metals Ltd 窒化物半導体ウェハおよび窒化物半導体ウェハのマーキング方法
JP6906859B2 (ja) * 2017-09-13 2021-07-21 株式会社ディスコ 加工装置
CN111723591B (zh) * 2020-05-22 2021-03-30 杭州长川科技股份有限公司 晶圆id读取装置
CN112509948A (zh) * 2020-12-18 2021-03-16 无锡奥特维科技股份有限公司 标记码识别装置、方法及硅片分选设备、电池片生产设备
CN112949804A (zh) * 2021-04-02 2021-06-11 Oppo广东移动通信有限公司 图形码、图形码识别方法、存储介质及相关装置
US11817357B2 (en) * 2021-06-09 2023-11-14 STATS ChipPAC Pte. Ltd. Region-of-interest positioning for laser-assisted bonding
CN114937619B (zh) * 2022-04-26 2024-08-20 沛顿科技（深圳）有限公司 一种倒装芯片固晶位置的检测方法
CN115714103B (zh) * 2022-11-25 2023-11-24 拓荆键科(海宁)半导体设备有限公司 用于晶圆键合对准及检测的装置和方法
CN116503586B (zh) * 2023-06-27 2023-09-05 钜宝(深圳)智能有限公司 一种金点检测机及检测方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812631A (en) * 1987-06-02 1989-03-14 Kam Kwong Lee Limited Bar code and read-out method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733711A (en) * 1996-01-02 1998-03-31 Micron Technology, Inc. Process for forming both fixed and variable patterns on a single photoresist resin mask
JPH10247613A (ja) * 1997-03-04 1998-09-14 Hitachi Ltd 識別パターン付き基板および識別パターン読取方法並びに装置
US7113258B2 (en) * 2001-01-15 2006-09-26 Asml Netherlands B.V. Lithographic apparatus
KR100579603B1 (ko) * 2001-01-15 2006-05-12 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치
US7018674B2 (en) * 2001-03-02 2006-03-28 Omron, Corporation Manufacturing methods and apparatuses of an optical device and a reflection plate provided with a resin thin film having a micro-asperity pattern
US7371663B2 (en) * 2005-07-06 2008-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Three dimensional IC device and alignment methods of IC device substrates
US8247773B2 (en) * 2007-06-26 2012-08-21 Yamaha Corporation Method and apparatus for reading identification mark on surface of wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812631A (en) * 1987-06-02 1989-03-14 Kam Kwong Lee Limited Bar code and read-out method thereof

Also Published As

Publication number Publication date
CN101008979A (zh) 2007-08-01
TWI346900B (en) 2011-08-11
TW200732981A (en) 2007-09-01
JP2007180200A (ja) 2007-07-12
US20070187514A1 (en) 2007-08-16
KR20070069071A (ko) 2007-07-02

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Granted publication date: 20090729

Termination date: 20161226

CF01 Termination of patent right due to non-payment of annual fee