JP2007169777A5 - - Google Patents

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Publication number
JP2007169777A5
JP2007169777A5 JP2006282866A JP2006282866A JP2007169777A5 JP 2007169777 A5 JP2007169777 A5 JP 2007169777A5 JP 2006282866 A JP2006282866 A JP 2006282866A JP 2006282866 A JP2006282866 A JP 2006282866A JP 2007169777 A5 JP2007169777 A5 JP 2007169777A5
Authority
JP
Japan
Prior art keywords
substrate support
support assembly
heating element
cooling channel
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006282866A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007169777A (ja
Filing date
Publication date
Priority claimed from US11/341,297 external-priority patent/US20070090516A1/en
Application filed filed Critical
Publication of JP2007169777A publication Critical patent/JP2007169777A/ja
Publication of JP2007169777A5 publication Critical patent/JP2007169777A5/ja
Pending legal-status Critical Current

Links

JP2006282866A 2005-10-18 2006-10-17 加熱型基板支持体及びその製造方法 Pending JP2007169777A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72793005P 2005-10-18 2005-10-18
US11/341,297 US20070090516A1 (en) 2005-10-18 2006-01-27 Heated substrate support and method of fabricating same

Publications (2)

Publication Number Publication Date
JP2007169777A JP2007169777A (ja) 2007-07-05
JP2007169777A5 true JP2007169777A5 (enExample) 2009-11-26

Family

ID=38058764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006282866A Pending JP2007169777A (ja) 2005-10-18 2006-10-17 加熱型基板支持体及びその製造方法

Country Status (5)

Country Link
US (1) US20070090516A1 (enExample)
JP (1) JP2007169777A (enExample)
KR (1) KR20070042469A (enExample)
CN (1) CN1952211A (enExample)
TW (1) TW200717748A (enExample)

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KR20090001091A (ko) * 2007-06-29 2009-01-08 (주)티티에스 외부발열부재가 구성된 반도체 제조장치
KR100934403B1 (ko) * 2007-11-30 2009-12-29 (주)위지트 냉각 수단을 구비한 서셉터
US9917001B2 (en) * 2008-01-21 2018-03-13 Applied Materials, Inc. High temperature fine grain aluminum heater
KR101179353B1 (ko) * 2008-05-20 2012-09-03 니폰게이긴조쿠가부시키가이샤 전열판의 제조 방법 및 전열판
KR101010646B1 (ko) * 2008-11-17 2011-01-24 주식회사 메카로닉스 히터블록
JP5331582B2 (ja) * 2009-06-05 2013-10-30 シャープ株式会社 冷却機能を有する加熱装置
KR101220306B1 (ko) * 2010-01-06 2013-01-22 (주)티티에스 서셉터 및 이의 제조 방법
US20120285383A1 (en) * 2010-01-14 2012-11-15 Oerlikon Solar Ag, Trubbach Mounting for fixing a reactor in a vacuum chamber
CN102922124A (zh) * 2011-08-10 2013-02-13 富泰华工业（深圳）有限公司 金属壳体的制造方法
US8941969B2 (en) * 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
JP2015088643A (ja) 2013-10-31 2015-05-07 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体
JP2015088644A (ja) * 2013-10-31 2015-05-07 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体
JP5857081B2 (ja) * 2014-02-17 2016-02-10 助川電気工業株式会社 基板加熱プレートヒータの製造方法
US9543171B2 (en) * 2014-06-17 2017-01-10 Lam Research Corporation Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element
US10020218B2 (en) 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
US10369748B2 (en) * 2017-10-26 2019-08-06 Battelle Memorial Institute Friction stirring interlocking of dissimilar materials
US11330673B2 (en) * 2017-11-20 2022-05-10 Applied Materials, Inc. Heated substrate support
KR20200040398A (ko) * 2018-10-10 2020-04-20 안범모 디스플레이 제조 공정용 접합부품 및 디스플레이 제조 공정 장비
CN111266724A (zh) * 2018-12-05 2020-06-12 杭州三花研究院有限公司 电加热器的制造方法
TWI841699B (zh) * 2019-03-15 2024-05-11 美商蘭姆研究公司 半導體製造應用中的摩擦攪拌銲接
JP7401279B2 (ja) * 2019-12-06 2023-12-19 株式会社アドバンテック 対象物を加熱及び冷却するためのステージ
JP7458337B2 (ja) * 2021-02-09 2024-03-29 株式会社アドバンテック 対象物を加熱及び冷却するためのステージ
CN221202786U (zh) * 2021-05-04 2024-06-21 沃特洛电气制造公司 带有嵌入式电阻加热器的金属加热器组件
US12074010B2 (en) * 2021-09-09 2024-08-27 Applied Materials, Inc. Atomic layer deposition part coating chamber
US12546003B2 (en) * 2022-09-16 2026-02-10 Applied Materials Inc. Atomic layer deposition part coating chamber
CN115635262A (zh) * 2022-11-29 2023-01-24 合肥升滕半导体技术有限公司 一种光伏加热板及其加工方法

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US5558717A (en) * 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
US5846375A (en) * 1996-09-26 1998-12-08 Micron Technology, Inc. Area specific temperature control for electrode plates and chucks used in semiconductor processing equipment
JP3897391B2 (ja) * 1997-03-25 2007-03-22 昭和電工株式会社 金属製接合部材の摩擦撹拌接合法
JP3070735B2 (ja) * 1997-07-23 2000-07-31 株式会社日立製作所 摩擦攪拌接合方法
JPH11204239A (ja) * 1998-01-12 1999-07-30 Fuji Electric Corp Res & Dev Ltd プレート型ヒータおよびその製造方法および薄膜製造装置
US6290117B1 (en) * 1998-02-17 2001-09-18 Hitachi, Ltd. Friction stir welding method and friction stir welding apparatus
US5971247A (en) * 1998-03-09 1999-10-26 Lockheed Martin Corporation Friction stir welding with roller stops for controlling weld depth
JP2000073164A (ja) * 1998-08-28 2000-03-07 Showa Alum Corp スパッタリング用バッキングプレート
US6247633B1 (en) * 1999-03-02 2001-06-19 Ford Global Technologies, Inc. Fabricating low distortion lap weld construction
US6227433B1 (en) * 2000-04-04 2001-05-08 The Boeing Company Friction welded fastener process
JP3553012B2 (ja) * 2000-11-17 2004-08-11 株式会社日立製作所 摩擦攪拌接合方法
JP4385533B2 (ja) * 2001-03-02 2009-12-16 日本軽金属株式会社 ヒートプレートの製造方法
JP2002270346A (ja) * 2001-03-09 2002-09-20 Mitsubishi Heavy Ind Ltd 加熱装置及びその製造方法並びに被膜形成装置
JP2004071172A (ja) * 2002-08-01 2004-03-04 Mitsubishi Heavy Ind Ltd 加熱装置およびその製造方法並びに被膜形成装置
JP2004106037A (ja) * 2002-09-20 2004-04-08 Hitachi Ltd 金属材料の結合方法
JP4325260B2 (ja) * 2003-04-15 2009-09-02 日本軽金属株式会社 伝熱素子の製造方法
JP4806179B2 (ja) * 2004-10-08 2011-11-02 古河スカイ株式会社 ヒータプレートの製造方法
JP4808949B2 (ja) * 2004-10-12 2011-11-02 助川電気工業株式会社 埋込ヒータを有する発熱体の製造方法

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