JP5338010B2 - ヒートスプレッダの縁部封止方法 - Google Patents
ヒートスプレッダの縁部封止方法 Download PDFInfo
- Publication number
- JP5338010B2 JP5338010B2 JP2010294157A JP2010294157A JP5338010B2 JP 5338010 B2 JP5338010 B2 JP 5338010B2 JP 2010294157 A JP2010294157 A JP 2010294157A JP 2010294157 A JP2010294157 A JP 2010294157A JP 5338010 B2 JP5338010 B2 JP 5338010B2
- Authority
- JP
- Japan
- Prior art keywords
- edge
- bent
- cover plate
- heat spreader
- bent edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01B—BOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
- B01B1/00—Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B37/00—Component parts or details of steam boilers
- F22B37/02—Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
- F22B37/10—Water tubes; Accessories therefor
- F22B37/105—Penetrations of tubes through a wall and their sealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49364—Tube joined to flat sheet longitudinally, i.e., tube sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Vapour Deposition (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Description
10 第1のカバープレート
11 第1の折曲げ縁
110、111 凸部
20 第2のカバープレート
21 第2の折曲げ縁
210、211 凹部
22 封入パイプ
30 支持構造
31 凹凸部
32 貫通穴
40 毛細管構造
50 溶接材料
60 作動液
S1〜S5 工程
Claims (4)
- ヒートスプレッダの縁部封止方法であって、
a)周辺が折曲げられて延在している第1の折曲げ縁を有する第1のカバープレートと、周辺が折曲げられて延在しており、一方の側には凹部が設けられている第2の折曲げ縁を有する第2のカバープレートとを準備する工程と、
b) 支持構造と毛細管構造とを準備して、当該支持構造と当該毛細管構造とを前記第1のカバープレートと第2のカバープレートとの間に設ける工程と、
c)前記工程b)の後に、前記第2のカバープレートを前記第1のカバープレートの上に覆合して、前記第2の折曲げ縁を前記第1の折曲げ縁に重ねる工程と、
d)前記工程c)の後に、前記第1の折曲げ縁を折曲げて、前記第2の折曲げ縁を覆う工程と、
e)前記工程d)の後に、圧着工具を準備して、当該圧着工具で前記第1の折曲げ縁を圧着した時に、前記第1の折曲げ縁における前記第2の折曲げ縁の凹部に対応する位置に凸部が形成されて、互いに係合固定されて、前記第1の折曲げ縁および前記第2の折曲げ縁を密着接合する工程と、を含むを特徴とするヒートスプレッダの縁部封止方法。 - 前記工程a)において、前記第1の折曲げ縁の長さが前記第2の折曲げ縁の長さよりも長いことを特徴とする請求項1に記載のヒートスプレッダの縁部封止方法。
- 前記工程e)の後に、前記第1の折曲げ縁と前記第2の折曲げ縁との接合箇所に溶接作業を施す工程f)を更に含むことを特徴とする請求項1に記載のヒートスプレッダの縁部封止方法。
- 前記第2の折曲げ縁の対向する二つの側に凹部がそれぞれ設けられ、前記工程e)において、前記圧着工具で圧着した時に、前記第1の折曲げ縁の二つの側において第2の折曲げ縁の凹部に対応する位置に凸部がそれぞれ形成されて、互いに係合固定されることを特徴とする請求項1に記載のヒートスプレッダの縁部封止方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099104405 | 2010-02-11 | ||
TW099104405A TWI427259B (en) | 2010-02-11 | 2010-02-11 | Vapor chamber and sealing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011166121A JP2011166121A (ja) | 2011-08-25 |
JP5338010B2 true JP5338010B2 (ja) | 2013-11-13 |
Family
ID=44316787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010294157A Expired - Fee Related JP5338010B2 (ja) | 2010-02-11 | 2010-12-28 | ヒートスプレッダの縁部封止方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8505183B2 (ja) |
JP (1) | JP5338010B2 (ja) |
DE (1) | DE102011000133A1 (ja) |
TW (1) | TWI427259B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI612266B (zh) * | 2016-06-28 | 2018-01-21 | Cai Ming Kun | 均溫裝置之腔體之製造方法及其結構 |
TWI707118B (zh) * | 2018-01-23 | 2020-10-11 | 訊凱國際股份有限公司 | 均溫板 |
CN110740611A (zh) * | 2018-07-20 | 2020-01-31 | 深圳富泰宏精密工业有限公司 | 散热器及具有该散热器的电子装置 |
WO2020100533A1 (ja) | 2018-11-16 | 2020-05-22 | 株式会社村田製作所 | ベーパーチャンバー |
CN112222236B (zh) * | 2020-10-21 | 2024-06-18 | 碳元科技股份有限公司 | 可弯折超薄均温板及其折弯机构 |
EP4043821B1 (en) | 2021-02-12 | 2024-04-03 | ABB Schweiz AG | Blank for a heat-transfer device and method to produce a heat-transfer device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4258859A (en) * | 1979-02-02 | 1981-03-31 | Boise Cascade Corporation | No-fin scored metal ends for containers |
US5692633A (en) * | 1996-01-02 | 1997-12-02 | Hullko Corporation | Beverage container lid |
JP2002310581A (ja) * | 2001-04-09 | 2002-10-23 | Furukawa Electric Co Ltd:The | 板型ヒートパイプおよびその実装方法 |
JP4305644B2 (ja) * | 2003-10-30 | 2009-07-29 | 大成プラス株式会社 | 固着機能を有する電子部品の熱保護装置 |
JP2006200775A (ja) * | 2005-01-19 | 2006-08-03 | Furukawa Sky Kk | ヒートパイプ及びその製造方法 |
CN101162134A (zh) * | 2006-10-10 | 2008-04-16 | 台达电子工业股份有限公司 | 热管及其制造方法 |
TW200848682A (en) * | 2007-06-15 | 2008-12-16 | Fu-Chia Chang | Super-conductor member and implantation process thereof |
US20090040726A1 (en) * | 2007-08-09 | 2009-02-12 | Paul Hoffman | Vapor chamber structure and method for manufacturing the same |
TW200936976A (en) * | 2008-02-22 | 2009-09-01 | Hyper Green Technology Co Ltd | The fabrication method for inner supporting body of heat spreader and product thereof |
-
2010
- 2010-02-11 TW TW099104405A patent/TWI427259B/zh not_active IP Right Cessation
- 2010-12-28 JP JP2010294157A patent/JP5338010B2/ja not_active Expired - Fee Related
- 2010-12-29 US US12/981,422 patent/US8505183B2/en not_active Expired - Fee Related
-
2011
- 2011-01-14 DE DE102011000133A patent/DE102011000133A1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
TWI427259B (en) | 2014-02-21 |
TW201128161A (en) | 2011-08-16 |
US8505183B2 (en) | 2013-08-13 |
DE102011000133A1 (de) | 2011-08-11 |
US20110192004A1 (en) | 2011-08-11 |
JP2011166121A (ja) | 2011-08-25 |
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