JP2007165870A - スリム型バックライトユニット - Google Patents
スリム型バックライトユニット Download PDFInfo
- Publication number
- JP2007165870A JP2007165870A JP2006314002A JP2006314002A JP2007165870A JP 2007165870 A JP2007165870 A JP 2007165870A JP 2006314002 A JP2006314002 A JP 2006314002A JP 2006314002 A JP2006314002 A JP 2006314002A JP 2007165870 A JP2007165870 A JP 2007165870A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- backlight unit
- flexible printed
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Abstract
【解決手段】本発明によるスリム型バックライトユニットは、一つ以上の貫通口が形成される軟性印刷回路基板と、上記貫通口と対応される部位の上記軟性印刷回路基板の上側に結合されるエルイーディーパッケージとを含んで構成される。
本発明によるバックライトユニットは、エルイーディーパッケージに電流を伝達するための部材として金属印刷回路基板の代わりに軟性印刷回路基板を使用するため、厚さ及び重量減少によりスリム化及び軽量化が可能となり製造原価が節減され、さらに放熱接着剤によってエルイーディーパッケージが底板に直接結合されるので、エルイーディーパッケージから発生される熱をより速かに放出することができるという長所がある。
【選択図】図4
Description
200 軟性印刷回路基板
202 貫通口
210 パターン
300 エルイーディーパッケージ
310 リードフレーム
400 光学シート
500 放熱接着剤
Claims (7)
- 一つ以上の貫通口が形成される軟性印刷回路基板と、
前記貫通口と対応される部位の前記軟性印刷回路基板の上側に結合されるエルイーディーパッケージと、
を含んで構成されることを特徴とするバックライトユニット。 - 前記軟性印刷回路基板は、電流伝達のためのパターンが上面に形成され、
前記エルイーディーパッケージは前記パターンに連結され電流の伝達を受けるリードフレームをさらに備えることを特徴とする、請求項1に記載のバックライトユニット。 - 前記軟性印刷回路基板は、ポリイミド(Polyimide)で製作されることを特徴とする、請求項1に記載のバックライトユニット。
- 前記軟性印刷回路基板の上面または底面には補強板がさらに備えられることを特徴とする、請求項1に記載のバックライトユニット。
- 前記軟性印刷回路基板が安着される底板と、
前記貫通口に備えられ前記エルイーディーパッケージの底面と前記底板の上面を結合させる放熱接着剤とをさらに含むことを特徴とする、請求項1に記載のバックライトユニット。 - 前記エルイーディーパッケージは、前記放熱接着剤が接着される部位にヒートシンク(Heat sink)が位置されるように構成されることを特徴とする、請求項5に記載のバックライトユニット。
- 前記底板は、金属材質の物質で製作されることを特徴とする、請求項5に記載のバックライトユニット。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0124444 | 2005-12-16 | ||
KR1020050124444A KR100764380B1 (ko) | 2005-12-16 | 2005-12-16 | 슬림형 백라이트유닛 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010152437A Division JP5453187B2 (ja) | 2005-12-16 | 2010-07-02 | バックライトユニット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007165870A true JP2007165870A (ja) | 2007-06-28 |
JP2007165870A5 JP2007165870A5 (ja) | 2010-05-20 |
JP4757174B2 JP4757174B2 (ja) | 2011-08-24 |
Family
ID=37722112
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006314002A Active JP4757174B2 (ja) | 2005-12-16 | 2006-11-21 | バックライトユニット |
JP2010152437A Active JP5453187B2 (ja) | 2005-12-16 | 2010-07-02 | バックライトユニット |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010152437A Active JP5453187B2 (ja) | 2005-12-16 | 2010-07-02 | バックライトユニット |
Country Status (4)
Country | Link |
---|---|
US (3) | US20070139929A1 (ja) |
EP (2) | EP1799020A1 (ja) |
JP (2) | JP4757174B2 (ja) |
KR (1) | KR100764380B1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008060070A (ja) * | 2006-07-06 | 2008-03-13 | Chi Mei Optoelectronics Corp | 液晶ディスプレイ及びそのバックライトモジュール |
JP2009200187A (ja) * | 2008-02-21 | 2009-09-03 | Kamakura Denshi Kogyo Kk | 照明装置のled実装方法及びled照明装置 |
JP2010186914A (ja) * | 2009-02-13 | 2010-08-26 | Iwasaki Electric Co Ltd | Ledユニット |
WO2013108934A1 (ja) * | 2012-01-17 | 2013-07-25 | 日清紡メカトロニクス株式会社 | Led発光装置およびその製造方法ならびにled照明装置 |
JP2017163029A (ja) * | 2016-03-10 | 2017-09-14 | オムロン株式会社 | 電子部品実装方法、基板、電子回路、面光源装置、表示装置、及び、電子機器 |
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KR100764380B1 (ko) * | 2005-12-16 | 2007-10-08 | 삼성전기주식회사 | 슬림형 백라이트유닛 |
KR100858287B1 (ko) | 2007-05-04 | 2008-09-11 | 한국광기술원 | 표면 실장을 하지 않는 발광 다이오드 패키지 및 그의 제작방법 |
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WO2005100194A1 (en) | 2004-04-16 | 2005-10-27 | Bottles Of Australia Pty Limited | Beverage container carrier |
KR100576865B1 (ko) * | 2004-05-03 | 2006-05-10 | 삼성전기주식회사 | 백라이트용 발광 다이오드 어레이 모듈 및 이를 구비한백라이트 유닛 |
ATE444660T1 (de) | 2004-05-11 | 2009-10-15 | Ascom Ag | Verfahren zum testen eines zellularen netzwerksystems |
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2005
- 2005-12-16 KR KR1020050124444A patent/KR100764380B1/ko active IP Right Grant
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2006
- 2006-11-15 EP EP06255851A patent/EP1799020A1/en not_active Withdrawn
- 2006-11-15 EP EP10010229A patent/EP2288239A1/en not_active Withdrawn
- 2006-11-16 US US11/600,059 patent/US20070139929A1/en not_active Abandoned
- 2006-11-21 JP JP2006314002A patent/JP4757174B2/ja active Active
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2010
- 2010-07-02 JP JP2010152437A patent/JP5453187B2/ja active Active
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2011
- 2011-02-02 US US13/019,523 patent/US8500306B2/en active Active
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2013
- 2013-07-09 US US13/938,128 patent/US8721126B2/en active Active
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JP2002162626A (ja) * | 2000-11-22 | 2002-06-07 | Sony Corp | 液晶表示用光源の放熱装置及びその製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008060070A (ja) * | 2006-07-06 | 2008-03-13 | Chi Mei Optoelectronics Corp | 液晶ディスプレイ及びそのバックライトモジュール |
JP2009200187A (ja) * | 2008-02-21 | 2009-09-03 | Kamakura Denshi Kogyo Kk | 照明装置のled実装方法及びled照明装置 |
JP2010186914A (ja) * | 2009-02-13 | 2010-08-26 | Iwasaki Electric Co Ltd | Ledユニット |
WO2013108934A1 (ja) * | 2012-01-17 | 2013-07-25 | 日清紡メカトロニクス株式会社 | Led発光装置およびその製造方法ならびにled照明装置 |
JP2013149683A (ja) * | 2012-01-17 | 2013-08-01 | Nisshinbo Mechatronics Inc | Led発光装置およびその製造方法ならびにled照明装置 |
JP2017163029A (ja) * | 2016-03-10 | 2017-09-14 | オムロン株式会社 | 電子部品実装方法、基板、電子回路、面光源装置、表示装置、及び、電子機器 |
CN107182198A (zh) * | 2016-03-10 | 2017-09-19 | 欧姆龙株式会社 | 电子部件安装方法、基板、电子电路以及面光源装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5453187B2 (ja) | 2014-03-26 |
EP1799020A1 (en) | 2007-06-20 |
US20070139929A1 (en) | 2007-06-21 |
KR100764380B1 (ko) | 2007-10-08 |
EP2288239A1 (en) | 2011-02-23 |
US8500306B2 (en) | 2013-08-06 |
JP4757174B2 (ja) | 2011-08-24 |
US8721126B2 (en) | 2014-05-13 |
KR20070063978A (ko) | 2007-06-20 |
JP2010283358A (ja) | 2010-12-16 |
US20130301276A1 (en) | 2013-11-14 |
US20110122600A1 (en) | 2011-05-26 |
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