JP2007163467A - 放射線検出器 - Google Patents
放射線検出器 Download PDFInfo
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Abstract
【解決手段】照射された放射線を光に変換する2層のシンチレータと、2層のシンチレータの間に配置され、それらの2層のシンチレータにより変換された光を検出して電気信号に変換する固体光検出器とを備えた放射線検出器において、各シンチレータの該シンチレータの面に平行な方向に進む光に対する散乱長を100μm以下にする。
【選択図】図1
Description
dj/dz= (β+α)j−αi …… (2)
上記式において、「γ2 =β(β+2α)」、「ξ=(α+β−γ)/α」、「η=(α+β+γ)/α」とし、積分定数をKおよびLとすると、上記連立方程式のiおよびjに関する一般解は、下記式となる。
j(Z)=Kξexp(−γZ)+Lηexp(γZ)
厚さdのフィルム試料の透過率Tは「T=i(d)/i(0)」である。この際において、フィルム試料単独で透過率を測定する場合に、戻り光がない(すなわち、j(d)=0)と仮定すると、透過率Tはフィルム試料の厚さdの関数として、下記式(3)で示
すことができる。
測定した各フィルム試料の透過率Tと厚さdを、式(3)入れて、最小二乗法等を用いて最適化することにより、散乱長S=(1/α)、さらに吸収長1/βを求めることができる。
2 固体光検出器
3A,3B シンチレータ
4 X線源
5 X線
6 被写体
7 情報処理手段
8 再生手段
9 支持体
10 光導電部
12 光導電層
20 薄膜トランジスタ層
20a 薄膜トランジスタ
21 透明な薄い基板
Claims (7)
- 照射された放射線を光に変換する2層のシンチレータと、
該2層のシンチレータの間に配置された、該2層のシンチレータにより変換された光を検出して電気信号に変換する固体光検出器とを備えた放射線検出器において、
前記各シンチレータの該シンチレータの面に平行な方向に進む光に対する散乱長が100μm以下であることを特徴とする放射線検出器。 - 前記2層のシンチレータの対向する表面間の間隔が40μm以下であることを特徴とする請求項1記載の放射線検出器。
- 前記固体光検出器が、前記光により導電性を呈する光導電層と、該光導電層から電気信号を取り出すための薄膜トランジスタとが積層あるいは平面的に配置されてなるものであることを特徴とする請求項1または2記載の放射線検出器。
- 前記薄膜トランジスタが、基板上に形成され、該基板から剥離転写されたものであることを特徴とする請求項3項記載の放射線検出器。
- 前記薄膜トランジスタが、該薄膜トランジスタが形成された基板を、化学的溶解法または研磨法により薄くし、あるいは除去したものであることを特徴とする請求項3項記載の放射線検出器。
- 前記薄膜トランジスタが、支持体上に剥離可能に配された基板上に形成され、該基板ごと前記支持体から剥離されたものであることを特徴とする請求項3項記載の放射線検出器。
- 前記薄膜トランジスタが、透明薄膜トランジスタであることを特徴とする請求項3から6いずれか1項記載の放射線検出器。
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0727865A (ja) * | 1993-07-14 | 1995-01-31 | Fuji Photo Film Co Ltd | 放射線検出器 |
JPH0727864A (ja) * | 1993-07-14 | 1995-01-31 | Fuji Photo Film Co Ltd | 放射線検出器 |
JP2000249794A (ja) * | 1999-03-02 | 2000-09-14 | Fuji Photo Film Co Ltd | 両面集光型放射線像変換パネル |
JP2001318195A (ja) * | 2000-05-01 | 2001-11-16 | Fuji Photo Film Co Ltd | 放射線画像変換スクリーンおよびその製造方法 |
JP2003298029A (ja) * | 2002-03-28 | 2003-10-17 | Seiko Epson Corp | 剥離転写装置、剥離転写方法、半導体装置及びicカード |
JP2004064087A (ja) * | 2002-07-25 | 2004-02-26 | General Electric Co <Ge> | 可撓性イメージャ及びデジタル画像形成方法 |
JP2004109118A (ja) * | 2002-08-30 | 2004-04-08 | Fuji Photo Film Co Ltd | 放射線像変換パネルおよび放射線画像情報読取方法 |
JP2004119525A (ja) * | 2002-09-24 | 2004-04-15 | Japan Science & Technology Corp | 酸化物半導体pn接合デバイス |
JP2004349539A (ja) * | 2003-05-23 | 2004-12-09 | Seiko Epson Corp | 積層体の剥離方法、積層体の製造方法、電気光学装置及び電子機器 |
JP2005172511A (ja) * | 2003-12-09 | 2005-06-30 | Canon Inc | 放射線検出装置、その製造方法、および放射線撮像システム |
-
2006
- 2006-11-09 JP JP2006304241A patent/JP5129473B2/ja active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0727865A (ja) * | 1993-07-14 | 1995-01-31 | Fuji Photo Film Co Ltd | 放射線検出器 |
JPH0727864A (ja) * | 1993-07-14 | 1995-01-31 | Fuji Photo Film Co Ltd | 放射線検出器 |
JP2000249794A (ja) * | 1999-03-02 | 2000-09-14 | Fuji Photo Film Co Ltd | 両面集光型放射線像変換パネル |
JP2001318195A (ja) * | 2000-05-01 | 2001-11-16 | Fuji Photo Film Co Ltd | 放射線画像変換スクリーンおよびその製造方法 |
JP2003298029A (ja) * | 2002-03-28 | 2003-10-17 | Seiko Epson Corp | 剥離転写装置、剥離転写方法、半導体装置及びicカード |
JP2004064087A (ja) * | 2002-07-25 | 2004-02-26 | General Electric Co <Ge> | 可撓性イメージャ及びデジタル画像形成方法 |
JP2004109118A (ja) * | 2002-08-30 | 2004-04-08 | Fuji Photo Film Co Ltd | 放射線像変換パネルおよび放射線画像情報読取方法 |
JP2004119525A (ja) * | 2002-09-24 | 2004-04-15 | Japan Science & Technology Corp | 酸化物半導体pn接合デバイス |
JP2004349539A (ja) * | 2003-05-23 | 2004-12-09 | Seiko Epson Corp | 積層体の剥離方法、積層体の製造方法、電気光学装置及び電子機器 |
JP2005172511A (ja) * | 2003-12-09 | 2005-06-30 | Canon Inc | 放射線検出装置、その製造方法、および放射線撮像システム |
Cited By (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009032854A (ja) * | 2007-07-26 | 2009-02-12 | Fujifilm Corp | 放射線撮像素子 |
JP2009146100A (ja) * | 2007-12-13 | 2009-07-02 | Sony Corp | 表示装置および光センサ素子 |
KR20090109061A (ko) * | 2008-04-14 | 2009-10-19 | 케어스트림 헬스 인코포레이티드 | 방사선 촬영 장치 |
KR101683873B1 (ko) | 2008-04-14 | 2016-12-07 | 케어스트림 헬스 인코포레이티드 | 방사선 촬영 장치 |
CN101753861A (zh) * | 2008-11-28 | 2010-06-23 | 株式会社半导体能源研究所 | 光传感器和显示装置 |
JP2010153834A (ja) * | 2008-11-28 | 2010-07-08 | Semiconductor Energy Lab Co Ltd | フォトセンサ及び表示装置 |
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US9153602B2 (en) | 2009-08-07 | 2015-10-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein an oxide semiconductor layer comprises a crystal and has a degree of crystallization of 80% or more |
US8912541B2 (en) | 2009-08-07 | 2014-12-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US10373843B2 (en) | 2009-08-27 | 2019-08-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US8698970B2 (en) | 2009-08-27 | 2014-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US11532488B2 (en) | 2009-08-27 | 2022-12-20 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US8879011B2 (en) | 2009-08-27 | 2014-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US8488077B2 (en) | 2009-08-27 | 2013-07-16 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US8115883B2 (en) | 2009-08-27 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US11024516B2 (en) | 2009-08-27 | 2021-06-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US8994889B2 (en) | 2009-08-27 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US11923206B2 (en) | 2009-08-27 | 2024-03-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US8466014B2 (en) | 2009-09-04 | 2013-06-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
US8502225B2 (en) | 2009-09-04 | 2013-08-06 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
US8890166B2 (en) | 2009-09-04 | 2014-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
US8889496B2 (en) | 2009-09-04 | 2014-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
US12057511B2 (en) | 2009-09-04 | 2024-08-06 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
US9768207B2 (en) | 2009-09-04 | 2017-09-19 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
US10672915B2 (en) | 2009-09-04 | 2020-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
US8218099B2 (en) | 2009-09-04 | 2012-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
US8742422B2 (en) | 2009-09-04 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US11626521B2 (en) | 2009-09-04 | 2023-04-11 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
US9601516B2 (en) | 2009-09-04 | 2017-03-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US11695019B2 (en) | 2009-09-04 | 2023-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US10854640B2 (en) | 2009-09-04 | 2020-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US8957411B2 (en) | 2009-09-04 | 2015-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
US8236627B2 (en) | 2009-09-04 | 2012-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
US12002818B2 (en) | 2009-09-04 | 2024-06-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US9431465B2 (en) | 2009-09-04 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
US10629627B2 (en) | 2009-09-04 | 2020-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US9530806B2 (en) | 2009-09-04 | 2016-12-27 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
US8378344B2 (en) | 2009-09-04 | 2013-02-19 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device with plural kinds of thin film transistors and circuits over one substrate |
US11024747B2 (en) | 2009-09-04 | 2021-06-01 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
US8377762B2 (en) | 2009-09-16 | 2013-02-19 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof |
US9935202B2 (en) | 2009-09-16 | 2018-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and display device comprising oxide semiconductor layer |
US10374184B2 (en) | 2009-09-16 | 2019-08-06 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof |
US9666820B2 (en) | 2009-09-16 | 2017-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof |
US11171298B2 (en) | 2009-09-16 | 2021-11-09 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof |
US11469387B2 (en) | 2009-09-16 | 2022-10-11 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof |
US11997859B2 (en) | 2009-09-16 | 2024-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof |
US9853167B2 (en) | 2009-09-24 | 2017-12-26 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US9520288B2 (en) | 2009-09-24 | 2016-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including IGZO layer and manufacturing method thereof |
US8492758B2 (en) | 2009-09-24 | 2013-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US9318617B2 (en) | 2009-09-24 | 2016-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
US9214563B2 (en) | 2009-09-24 | 2015-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US10418491B2 (en) | 2009-09-24 | 2019-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US9048094B2 (en) | 2009-09-24 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device comprising forming oxide semiconductor by sputtering |
US8324621B2 (en) | 2009-10-14 | 2012-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer |
US8563976B2 (en) | 2009-12-11 | 2013-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US9142683B2 (en) | 2009-12-11 | 2015-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US8889499B2 (en) | 2009-12-11 | 2014-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US8994021B2 (en) | 2010-12-03 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US8680522B2 (en) | 2010-12-03 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US10916663B2 (en) | 2010-12-03 | 2021-02-09 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US10103277B2 (en) | 2010-12-03 | 2018-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing oxide semiconductor film |
US9711655B2 (en) | 2010-12-03 | 2017-07-18 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US9331208B2 (en) | 2010-12-03 | 2016-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
US8669556B2 (en) | 2010-12-03 | 2014-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2012168009A (ja) * | 2011-02-14 | 2012-09-06 | Fujifilm Corp | 放射線画像検出装置及びその製造方法 |
US8525121B2 (en) | 2011-02-14 | 2013-09-03 | Fujifilm Corporation | Radiological image detection apparatus and method of manufacturing the same |
JP2012177623A (ja) * | 2011-02-25 | 2012-09-13 | Fujifilm Corp | 放射線画像検出装置、及び放射線画像検出装置の製造方法 |
JP2012177624A (ja) * | 2011-02-25 | 2012-09-13 | Fujifilm Corp | 放射線画像検出装置及び放射線画像検出装置の製造方法 |
CN102651380A (zh) * | 2011-02-25 | 2012-08-29 | 富士胶片株式会社 | 放射线图像检测装置及其制造方法 |
CN102279409A (zh) * | 2011-06-28 | 2011-12-14 | 中国原子能科学研究院 | 中子束流位置探测仪 |
JP2015079944A (ja) * | 2013-09-10 | 2015-04-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JPWO2018016224A1 (ja) * | 2016-07-20 | 2019-05-16 | 株式会社日立製作所 | 放射線モニタ |
JP2018085387A (ja) * | 2016-11-21 | 2018-05-31 | 株式会社東芝 | 放射線検出器 |
CN110308475A (zh) * | 2019-08-01 | 2019-10-08 | 深圳市安健科技股份有限公司 | 一种x射线探测器及其制备方法 |
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