JP2007142479A5 - - Google Patents

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Publication number
JP2007142479A5
JP2007142479A5 JP2007049440A JP2007049440A JP2007142479A5 JP 2007142479 A5 JP2007142479 A5 JP 2007142479A5 JP 2007049440 A JP2007049440 A JP 2007049440A JP 2007049440 A JP2007049440 A JP 2007049440A JP 2007142479 A5 JP2007142479 A5 JP 2007142479A5
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JP
Japan
Prior art keywords
light emitting
substrate
emitting element
semiconductor device
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007049440A
Other languages
English (en)
Japanese (ja)
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JP2007142479A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007049440A priority Critical patent/JP2007142479A/ja
Priority claimed from JP2007049440A external-priority patent/JP2007142479A/ja
Publication of JP2007142479A publication Critical patent/JP2007142479A/ja
Publication of JP2007142479A5 publication Critical patent/JP2007142479A5/ja
Pending legal-status Critical Current

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JP2007049440A 2003-03-14 2007-02-28 半導体装置 Pending JP2007142479A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007049440A JP2007142479A (ja) 2003-03-14 2007-02-28 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003069711 2003-03-14
JP2007049440A JP2007142479A (ja) 2003-03-14 2007-02-28 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005503515A Division JP4001169B2 (ja) 2003-03-14 2004-03-08 半導体装置

Publications (2)

Publication Number Publication Date
JP2007142479A JP2007142479A (ja) 2007-06-07
JP2007142479A5 true JP2007142479A5 (enExample) 2007-08-23

Family

ID=38204872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007049440A Pending JP2007142479A (ja) 2003-03-14 2007-02-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2007142479A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397193B (zh) * 2007-11-05 2013-05-21 Univ Nat Chunghsing Light emitting diode chip element with heat dissipation substrate and method for making the same
JP2009123823A (ja) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk 発光素子パッケージおよびそれを実装した発光装置
JP5400289B2 (ja) * 2007-11-13 2014-01-29 電気化学工業株式会社 発光装置
JP5400290B2 (ja) * 2007-11-13 2014-01-29 電気化学工業株式会社 発光装置
EP2455991B1 (en) * 2009-07-17 2017-05-10 Denka Company Limited Led chip assembly, led package, and manufacturing method of led package
WO2011007872A1 (ja) * 2009-07-17 2011-01-20 電気化学工業株式会社 Ｌｅｄチップ接合体の製造方法
KR101685231B1 (ko) * 2009-07-31 2016-12-09 덴카 주식회사 Ｌｅｄ 탑재용 웨이퍼와 그 제조 방법, 및 그 웨이퍼를 이용한 ｌｅｄ 탑재 구조체
US9299888B2 (en) * 2011-09-13 2016-03-29 Denka Company Limited Clad material for LED light-emitting element holding substrate, and method for manufacturing same
JP5792694B2 (ja) 2012-08-14 2015-10-14 株式会社東芝 半導体発光素子
WO2017014127A1 (ja) * 2015-07-21 2017-01-26 株式会社村田製作所 Ｌｅｄ搭載基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074485A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体発光装置
JPH05211373A (ja) * 1992-01-20 1993-08-20 Nec Corp 半導体レーザ
JPH0796620A (ja) * 1993-09-30 1995-04-11 Kyocera Corp サーマルヘッド
JPH09234896A (ja) * 1995-12-27 1997-09-09 Kyocera Corp サーマルヘッド
JPH1051065A (ja) * 1996-08-02 1998-02-20 Matsushita Electron Corp 半導体レーザ装置
JPH10150227A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
JP3432113B2 (ja) * 1997-07-07 2003-08-04 シャープ株式会社 光半導体装置
JPH11307875A (ja) * 1998-04-24 1999-11-05 Sony Corp 電子装置
EP1069659A4 (en) * 1999-02-03 2003-03-05 Furukawa Electric Co Ltd SEMICONDUCTOR LASERS AND SEMICONDUCTOR LASER MODULES USING THEM
JP2001135886A (ja) * 1999-08-24 2001-05-18 Mitsui Chemicals Inc 半導体レーザ素子、半導体レーザモジュールおよびファイバーモジュール
JP4897133B2 (ja) * 1999-12-09 2012-03-14 ソニー株式会社 半導体発光素子、その製造方法および配設基板
JP4959071B2 (ja) * 2001-07-04 2012-06-20 ローム株式会社 面実装型半導体装置
JP3912130B2 (ja) * 2002-02-18 2007-05-09 住友電気工業株式会社 サブマウント
JP2004235534A (ja) * 2003-01-31 2004-08-19 Fuji Photo Film Co Ltd レーザ素子およびそのレーザ素子の製造方法並びにそのレーザ素子を用いたレーザモジュール

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