JP2007142479A5 - - Google Patents
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- Publication number
- JP2007142479A5 JP2007142479A5 JP2007049440A JP2007049440A JP2007142479A5 JP 2007142479 A5 JP2007142479 A5 JP 2007142479A5 JP 2007049440 A JP2007049440 A JP 2007049440A JP 2007049440 A JP2007049440 A JP 2007049440A JP 2007142479 A5 JP2007142479 A5 JP 2007142479A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- substrate
- emitting element
- semiconductor device
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 9
- 239000004065 semiconductor Substances 0.000 claims 8
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007049440A JP2007142479A (ja) | 2003-03-14 | 2007-02-28 | 半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003069711 | 2003-03-14 | ||
| JP2007049440A JP2007142479A (ja) | 2003-03-14 | 2007-02-28 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005503515A Division JP4001169B2 (ja) | 2003-03-14 | 2004-03-08 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007142479A JP2007142479A (ja) | 2007-06-07 |
| JP2007142479A5 true JP2007142479A5 (enExample) | 2007-08-23 |
Family
ID=38204872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007049440A Pending JP2007142479A (ja) | 2003-03-14 | 2007-02-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007142479A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI397193B (zh) * | 2007-11-05 | 2013-05-21 | Univ Nat Chunghsing | Light emitting diode chip element with heat dissipation substrate and method for making the same |
| JP2009123823A (ja) * | 2007-11-13 | 2009-06-04 | Denki Kagaku Kogyo Kk | 発光素子パッケージおよびそれを実装した発光装置 |
| JP5400290B2 (ja) * | 2007-11-13 | 2014-01-29 | 電気化学工業株式会社 | 発光装置 |
| JP5400289B2 (ja) * | 2007-11-13 | 2014-01-29 | 電気化学工業株式会社 | 発光装置 |
| TWI501432B (zh) * | 2009-07-17 | 2015-09-21 | 電氣化學工業股份有限公司 | Led晶片接合體、led封裝、及led封裝之製造方法 |
| WO2011007872A1 (ja) * | 2009-07-17 | 2011-01-20 | 電気化学工業株式会社 | Ledチップ接合体の製造方法 |
| JP5789512B2 (ja) * | 2009-07-31 | 2015-10-07 | 電気化学工業株式会社 | Led搭載用ウエハとその製造方法、及びそのウエハを用いたled搭載構造体 |
| JPWO2013038964A1 (ja) * | 2011-09-13 | 2015-03-26 | 電気化学工業株式会社 | Led発光素子保持基板用クラッド材及びその製造方法 |
| JP5792694B2 (ja) | 2012-08-14 | 2015-10-14 | 株式会社東芝 | 半導体発光素子 |
| WO2017014127A1 (ja) * | 2015-07-21 | 2017-01-26 | 株式会社村田製作所 | Led搭載基板 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074485A (ja) * | 1983-09-29 | 1985-04-26 | Toshiba Corp | 半導体発光装置 |
| JPH05211373A (ja) * | 1992-01-20 | 1993-08-20 | Nec Corp | 半導体レーザ |
| JPH0796620A (ja) * | 1993-09-30 | 1995-04-11 | Kyocera Corp | サーマルヘッド |
| JPH09234896A (ja) * | 1995-12-27 | 1997-09-09 | Kyocera Corp | サーマルヘッド |
| JPH1051065A (ja) * | 1996-08-02 | 1998-02-20 | Matsushita Electron Corp | 半導体レーザ装置 |
| JPH10150227A (ja) * | 1996-11-15 | 1998-06-02 | Rohm Co Ltd | チップ型発光素子 |
| JP3432113B2 (ja) * | 1997-07-07 | 2003-08-04 | シャープ株式会社 | 光半導体装置 |
| JPH11307875A (ja) * | 1998-04-24 | 1999-11-05 | Sony Corp | 電子装置 |
| EP1069659A4 (en) * | 1999-02-03 | 2003-03-05 | Furukawa Electric Co Ltd | SEMICONDUCTOR LASERS AND SEMICONDUCTOR LASER MODULES USING THEM |
| JP2001135886A (ja) * | 1999-08-24 | 2001-05-18 | Mitsui Chemicals Inc | 半導体レーザ素子、半導体レーザモジュールおよびファイバーモジュール |
| JP4897133B2 (ja) * | 1999-12-09 | 2012-03-14 | ソニー株式会社 | 半導体発光素子、その製造方法および配設基板 |
| JP4959071B2 (ja) * | 2001-07-04 | 2012-06-20 | ローム株式会社 | 面実装型半導体装置 |
| JP3912130B2 (ja) * | 2002-02-18 | 2007-05-09 | 住友電気工業株式会社 | サブマウント |
| JP2004235534A (ja) * | 2003-01-31 | 2004-08-19 | Fuji Photo Film Co Ltd | レーザ素子およびそのレーザ素子の製造方法並びにそのレーザ素子を用いたレーザモジュール |
-
2007
- 2007-02-28 JP JP2007049440A patent/JP2007142479A/ja active Pending
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