JP2007142479A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2007142479A
JP2007142479A JP2007049440A JP2007049440A JP2007142479A JP 2007142479 A JP2007142479 A JP 2007142479A JP 2007049440 A JP2007049440 A JP 2007049440A JP 2007049440 A JP2007049440 A JP 2007049440A JP 2007142479 A JP2007142479 A JP 2007142479A
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JP
Japan
Prior art keywords
light emitting
substrate
semiconductor device
emitting element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007049440A
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English (en)
Japanese (ja)
Other versions
JP2007142479A5 (enExample
Inventor
Sadamu Ishizu
定 石津
Kenjiro Higaki
賢次郎 桧垣
Takashi Ishii
隆 石井
Yasushi Chikugi
保志 筑木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2007049440A priority Critical patent/JP2007142479A/ja
Publication of JP2007142479A publication Critical patent/JP2007142479A/ja
Publication of JP2007142479A5 publication Critical patent/JP2007142479A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

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  • Led Device Packages (AREA)
JP2007049440A 2003-03-14 2007-02-28 半導体装置 Pending JP2007142479A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007049440A JP2007142479A (ja) 2003-03-14 2007-02-28 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003069711 2003-03-14
JP2007049440A JP2007142479A (ja) 2003-03-14 2007-02-28 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005503515A Division JP4001169B2 (ja) 2003-03-14 2004-03-08 半導体装置

Publications (2)

Publication Number Publication Date
JP2007142479A true JP2007142479A (ja) 2007-06-07
JP2007142479A5 JP2007142479A5 (enExample) 2007-08-23

Family

ID=38204872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007049440A Pending JP2007142479A (ja) 2003-03-14 2007-02-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2007142479A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117788A (ja) * 2007-11-05 2009-05-28 Liangfeng Plastic Machinery Co 放熱基板を具えた発光ダイオード装置及びその製造方法
JP2009123829A (ja) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk 発光装置
JP2009123828A (ja) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk 発光装置
JP2009123823A (ja) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk 発光素子パッケージおよびそれを実装した発光装置
WO2011007872A1 (ja) * 2009-07-17 2011-01-20 電気化学工業株式会社 Ｌｅｄチップ接合体の製造方法
WO2011013754A1 (ja) * 2009-07-31 2011-02-03 電気化学工業株式会社 Ｌｅｄ搭載用ウエハとその製造方法、及びそのウエハを用いたｌｅｄ搭載構造体
JPWO2011007874A1 (ja) * 2009-07-17 2012-12-27 電気化学工業株式会社 Ｌｅｄチップ接合体、ｌｅｄパッケージ、及びｌｅｄパッケージの製造方法
US8890194B2 (en) 2012-08-14 2014-11-18 Kabushiki Kaisha Toshiba Semiconductor light emitting device
WO2017014127A1 (ja) * 2015-07-21 2017-01-26 株式会社村田製作所 Ｌｅｄ搭載基板
EP2757604B1 (en) * 2011-09-13 2018-06-13 Denka Company Limited Method of manufacturing a clad material for led light-emitting element holding substrate

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074485A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体発光装置
JPH05211373A (ja) * 1992-01-20 1993-08-20 Nec Corp 半導体レーザ
JPH0796620A (ja) * 1993-09-30 1995-04-11 Kyocera Corp サーマルヘッド
JPH09234896A (ja) * 1995-12-27 1997-09-09 Kyocera Corp サーマルヘッド
JPH1051065A (ja) * 1996-08-02 1998-02-20 Matsushita Electron Corp 半導体レーザ装置
JPH10150227A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
JPH1126647A (ja) * 1997-07-07 1999-01-29 Sharp Corp 光半導体装置
JPH11307875A (ja) * 1998-04-24 1999-11-05 Sony Corp 電子装置
WO2000046893A1 (en) * 1999-02-03 2000-08-10 The Furukawa Electric Co., Ltd. Semiconductor laser and semiconductor laser module using the same
JP2001135886A (ja) * 1999-08-24 2001-05-18 Mitsui Chemicals Inc 半導体レーザ素子、半導体レーザモジュールおよびファイバーモジュール
JP2001168444A (ja) * 1999-12-09 2001-06-22 Sony Corp 半導体発光素子、その製造方法および配設基板
JP2002359425A (ja) * 2002-02-18 2002-12-13 Sumitomo Electric Ind Ltd サブマウントおよび半導体装置
JP2003017754A (ja) * 2001-07-04 2003-01-17 Rohm Co Ltd 面実装型半導体装置
JP2004235534A (ja) * 2003-01-31 2004-08-19 Fuji Photo Film Co Ltd レーザ素子およびそのレーザ素子の製造方法並びにそのレーザ素子を用いたレーザモジュール

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074485A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体発光装置
JPH05211373A (ja) * 1992-01-20 1993-08-20 Nec Corp 半導体レーザ
JPH0796620A (ja) * 1993-09-30 1995-04-11 Kyocera Corp サーマルヘッド
JPH09234896A (ja) * 1995-12-27 1997-09-09 Kyocera Corp サーマルヘッド
JPH1051065A (ja) * 1996-08-02 1998-02-20 Matsushita Electron Corp 半導体レーザ装置
JPH10150227A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
JPH1126647A (ja) * 1997-07-07 1999-01-29 Sharp Corp 光半導体装置
JPH11307875A (ja) * 1998-04-24 1999-11-05 Sony Corp 電子装置
WO2000046893A1 (en) * 1999-02-03 2000-08-10 The Furukawa Electric Co., Ltd. Semiconductor laser and semiconductor laser module using the same
JP2001135886A (ja) * 1999-08-24 2001-05-18 Mitsui Chemicals Inc 半導体レーザ素子、半導体レーザモジュールおよびファイバーモジュール
JP2001168444A (ja) * 1999-12-09 2001-06-22 Sony Corp 半導体発光素子、その製造方法および配設基板
JP2003017754A (ja) * 2001-07-04 2003-01-17 Rohm Co Ltd 面実装型半導体装置
JP2002359425A (ja) * 2002-02-18 2002-12-13 Sumitomo Electric Ind Ltd サブマウントおよび半導体装置
JP2004235534A (ja) * 2003-01-31 2004-08-19 Fuji Photo Film Co Ltd レーザ素子およびそのレーザ素子の製造方法並びにそのレーザ素子を用いたレーザモジュール

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117788A (ja) * 2007-11-05 2009-05-28 Liangfeng Plastic Machinery Co 放熱基板を具えた発光ダイオード装置及びその製造方法
JP2009123829A (ja) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk 発光装置
JP2009123828A (ja) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk 発光装置
JP2009123823A (ja) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk 発光素子パッケージおよびそれを実装した発光装置
JPWO2011007874A1 (ja) * 2009-07-17 2012-12-27 電気化学工業株式会社 Ｌｅｄチップ接合体、ｌｅｄパッケージ、及びｌｅｄパッケージの製造方法
WO2011007872A1 (ja) * 2009-07-17 2011-01-20 電気化学工業株式会社 Ｌｅｄチップ接合体の製造方法
JP5759376B2 (ja) * 2009-07-17 2015-08-05 電気化学工業株式会社 Ｌｅｄチップ接合体の製造方法
US8890189B2 (en) 2009-07-31 2014-11-18 Denki Kagaku Kogyo Kabushiki Kaisha Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the wafer
KR20120082865A (ko) * 2009-07-31 2012-07-24 덴끼 가가꾸 고교 가부시키가이샤 Ｌｅｄ 탑재용 웨이퍼와 그 제조 방법, 및 그 웨이퍼를 이용한 ｌｅｄ 탑재 구조체
WO2011013754A1 (ja) * 2009-07-31 2011-02-03 電気化学工業株式会社 Ｌｅｄ搭載用ウエハとその製造方法、及びそのウエハを用いたｌｅｄ搭載構造体
JP5789512B2 (ja) * 2009-07-31 2015-10-07 電気化学工業株式会社 Ｌｅｄ搭載用ウエハとその製造方法、及びそのウエハを用いたｌｅｄ搭載構造体
KR101685231B1 (ko) 2009-07-31 2016-12-09 덴카 주식회사 Ｌｅｄ 탑재용 웨이퍼와 그 제조 방법, 및 그 웨이퍼를 이용한 ｌｅｄ 탑재 구조체
EP2757604B1 (en) * 2011-09-13 2018-06-13 Denka Company Limited Method of manufacturing a clad material for led light-emitting element holding substrate
US8890194B2 (en) 2012-08-14 2014-11-18 Kabushiki Kaisha Toshiba Semiconductor light emitting device
WO2017014127A1 (ja) * 2015-07-21 2017-01-26 株式会社村田製作所 Ｌｅｄ搭載基板
JPWO2017014127A1 (ja) * 2015-07-21 2018-05-24 株式会社村田製作所 Ｌｅｄ搭載基板

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