JP2013511853A5 - - Google Patents
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- Publication number
- JP2013511853A5 JP2013511853A5 JP2012540516A JP2012540516A JP2013511853A5 JP 2013511853 A5 JP2013511853 A5 JP 2013511853A5 JP 2012540516 A JP2012540516 A JP 2012540516A JP 2012540516 A JP2012540516 A JP 2012540516A JP 2013511853 A5 JP2013511853 A5 JP 2013511853A5
- Authority
- JP
- Japan
- Prior art keywords
- iii nitride
- transparent conductive
- nitride material
- conductive non
- type region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 20
- 150000004767 nitrides Chemical class 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/624,268 | 2009-11-23 | ||
| US12/624,268 US8581229B2 (en) | 2009-11-23 | 2009-11-23 | III-V light emitting device with thin n-type region |
| PCT/IB2010/055147 WO2011061664A1 (en) | 2009-11-23 | 2010-11-12 | Iii-v light emitting device with thin n-type region |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013511853A JP2013511853A (ja) | 2013-04-04 |
| JP2013511853A5 true JP2013511853A5 (enExample) | 2013-12-26 |
| JP5674806B2 JP5674806B2 (ja) | 2015-02-25 |
Family
ID=43502070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012540516A Active JP5674806B2 (ja) | 2009-11-23 | 2010-11-12 | 薄いn型領域を有するIII−V族発光デバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8581229B2 (enExample) |
| EP (1) | EP2504868B1 (enExample) |
| JP (1) | JP5674806B2 (enExample) |
| KR (2) | KR101905590B1 (enExample) |
| CN (1) | CN102714255B (enExample) |
| TW (1) | TWI523258B (enExample) |
| WO (1) | WO2011061664A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011012298A1 (de) * | 2010-12-28 | 2012-06-28 | Osram Opto Semiconductors Gmbh | Verbundsubstrat, Halbleiterchip mit Verbundsubstrat und Verfahren zur Herstellung von Verbundsubstraten und Halbleiterchips |
| KR20120099318A (ko) * | 2011-01-26 | 2012-09-10 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
| CN103748696B (zh) | 2011-08-26 | 2018-06-22 | 亮锐控股有限公司 | 加工半导体结构的方法 |
| JP2014027092A (ja) * | 2012-07-26 | 2014-02-06 | Sharp Corp | 半導体発光素子 |
| CN104508815B (zh) | 2012-07-31 | 2018-02-13 | 索泰克公司 | 使用激光剥离过程制造半导体结构的方法和相关的半导体结构 |
| US9653647B2 (en) | 2013-06-14 | 2017-05-16 | Micron Technology, Inc. | Ultrathin solid state dies and methods of manufacturing the same |
| EA201691900A1 (ru) * | 2014-03-31 | 2017-05-31 | Наньян Текнолоджикал Юнивёрсити | Способ повторного использования подложек и несущих подложек |
| DE102016124646A1 (de) * | 2016-12-16 | 2018-06-21 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements |
| CN111933765B (zh) * | 2020-07-03 | 2022-04-26 | 厦门士兰明镓化合物半导体有限公司 | 微型发光二极管及制作方法,微型led显示模块及制作方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3757544B2 (ja) * | 1997-05-21 | 2006-03-22 | 昭和電工株式会社 | Iii族窒化物半導体発光素子 |
| US20040248335A1 (en) | 2001-01-09 | 2004-12-09 | Ivan Eliashevich | Electrode structures for p-type nitride semiconductores and methods of making same |
| JP3896027B2 (ja) * | 2002-04-17 | 2007-03-22 | シャープ株式会社 | 窒化物系半導体発光素子およびその製造方法 |
| TWI249148B (en) * | 2004-04-13 | 2006-02-11 | Epistar Corp | Light-emitting device array having binding layer |
| US7880182B2 (en) * | 2002-07-15 | 2011-02-01 | Epistar Corporation | Light-emitting element array |
| JP4295669B2 (ja) * | 2003-05-22 | 2009-07-15 | パナソニック株式会社 | 半導体素子の製造方法 |
| JP4135567B2 (ja) * | 2003-06-10 | 2008-08-20 | 松下電器産業株式会社 | キャップ取り外し装置 |
| US20050173724A1 (en) * | 2004-02-11 | 2005-08-11 | Heng Liu | Group III-nitride based LED having a transparent current spreading layer |
| JP2005268581A (ja) * | 2004-03-19 | 2005-09-29 | Matsushita Electric Ind Co Ltd | 窒化ガリウム系化合物半導体発光素子 |
| TWM255518U (en) * | 2004-04-23 | 2005-01-11 | Super Nova Optoelectronics Cor | Vertical electrode structure of Gallium Nitride based LED |
| US7361938B2 (en) * | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
| TWI299914B (en) * | 2004-07-12 | 2008-08-11 | Epistar Corp | Light emitting diode with transparent electrically conductive layer and omni directional reflector |
| US8334155B2 (en) * | 2005-09-27 | 2012-12-18 | Philips Lumileds Lighting Company Llc | Substrate for growing a III-V light emitting device |
| JP5232970B2 (ja) * | 2006-04-13 | 2013-07-10 | 豊田合成株式会社 | 半導体発光素子の製造方法及び半導体発光素子とそれを備えたランプ |
| JP2008053425A (ja) * | 2006-08-24 | 2008-03-06 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
| JP4929924B2 (ja) * | 2006-08-25 | 2012-05-09 | サンケン電気株式会社 | 半導体発光素子、その製造方法、及び複合半導体装置 |
| JP2008177525A (ja) * | 2006-12-20 | 2008-07-31 | Showa Denko Kk | Iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ |
| US8704254B2 (en) * | 2006-12-22 | 2014-04-22 | Philips Lumileds Lighting Company, Llc | Light emitting device including a filter |
| US7951693B2 (en) * | 2006-12-22 | 2011-05-31 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting devices grown on templates to reduce strain |
| TWI331411B (en) * | 2006-12-29 | 2010-10-01 | Epistar Corp | High efficiency light-emitting diode and method for manufacturing the same |
| US7791096B2 (en) * | 2007-06-08 | 2010-09-07 | Koninklijke Philips Electronics N.V. | Mount for a semiconductor light emitting device |
| US20090050905A1 (en) * | 2007-08-20 | 2009-02-26 | Abu-Ageel Nayef M | Highly Efficient Light-Emitting Diode |
| US20090140279A1 (en) * | 2007-12-03 | 2009-06-04 | Goldeneye, Inc. | Substrate-free light emitting diode chip |
| KR101025948B1 (ko) * | 2007-12-21 | 2011-03-30 | 삼성엘이디 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| US7939839B2 (en) * | 2008-09-11 | 2011-05-10 | Bridgelux, Inc. | Series connected segmented LED |
| US9117944B2 (en) * | 2008-09-24 | 2015-08-25 | Koninklijke Philips N.V. | Semiconductor light emitting devices grown on composite substrates |
| US8089091B2 (en) * | 2009-06-18 | 2012-01-03 | Koninklijke Philips Electronics N.V. | Semiconductor light emitting device with a contact formed on a textured surface |
| US20100327300A1 (en) * | 2009-06-25 | 2010-12-30 | Koninklijke Philips Electronics N.V. | Contact for a semiconductor light emitting device |
-
2009
- 2009-11-23 US US12/624,268 patent/US8581229B2/en active Active
-
2010
- 2010-11-12 KR KR1020177020575A patent/KR101905590B1/ko active Active
- 2010-11-12 EP EP10788136.9A patent/EP2504868B1/en active Active
- 2010-11-12 KR KR1020127016290A patent/KR101762368B1/ko active Active
- 2010-11-12 JP JP2012540516A patent/JP5674806B2/ja active Active
- 2010-11-12 WO PCT/IB2010/055147 patent/WO2011061664A1/en not_active Ceased
- 2010-11-12 CN CN201080062108.3A patent/CN102714255B/zh active Active
- 2010-11-23 TW TW099140450A patent/TWI523258B/zh active
-
2013
- 2013-10-09 US US14/049,282 patent/US8878160B2/en active Active
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