JP2007142366A - 露光装置及びデバイス製造方法 - Google Patents

露光装置及びデバイス製造方法 Download PDF

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Publication number
JP2007142366A
JP2007142366A JP2006219032A JP2006219032A JP2007142366A JP 2007142366 A JP2007142366 A JP 2007142366A JP 2006219032 A JP2006219032 A JP 2006219032A JP 2006219032 A JP2006219032 A JP 2006219032A JP 2007142366 A JP2007142366 A JP 2007142366A
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JP
Japan
Prior art keywords
gas
liquid
gas supply
supply port
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006219032A
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English (en)
Japanese (ja)
Other versions
JP2007142366A5 (enExample
Inventor
Takayasu Hasegawa
敬恭 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006219032A priority Critical patent/JP2007142366A/ja
Priority to KR1020087001419A priority patent/KR20080022201A/ko
Priority to PCT/JP2006/321001 priority patent/WO2007046523A1/en
Priority to US11/994,240 priority patent/US7907251B2/en
Priority to TW095138405A priority patent/TW200731335A/zh
Publication of JP2007142366A publication Critical patent/JP2007142366A/ja
Publication of JP2007142366A5 publication Critical patent/JP2007142366A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2006219032A 2005-10-18 2006-08-10 露光装置及びデバイス製造方法 Withdrawn JP2007142366A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006219032A JP2007142366A (ja) 2005-10-18 2006-08-10 露光装置及びデバイス製造方法
KR1020087001419A KR20080022201A (ko) 2005-10-18 2006-10-17 노광장치 및 디바이스의 제조방법
PCT/JP2006/321001 WO2007046523A1 (en) 2005-10-18 2006-10-17 Exposure apparatus and device manufacturing method
US11/994,240 US7907251B2 (en) 2005-10-18 2006-10-17 Exposure apparatus and device manufacturing method
TW095138405A TW200731335A (en) 2005-10-18 2006-10-18 Exposure apparatus and device manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005302577 2005-10-18
JP2006219032A JP2007142366A (ja) 2005-10-18 2006-08-10 露光装置及びデバイス製造方法

Publications (2)

Publication Number Publication Date
JP2007142366A true JP2007142366A (ja) 2007-06-07
JP2007142366A5 JP2007142366A5 (enExample) 2008-02-28

Family

ID=37962610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006219032A Withdrawn JP2007142366A (ja) 2005-10-18 2006-08-10 露光装置及びデバイス製造方法

Country Status (5)

Country Link
US (1) US7907251B2 (enExample)
JP (1) JP2007142366A (enExample)
KR (1) KR20080022201A (enExample)
TW (1) TW200731335A (enExample)
WO (1) WO2007046523A1 (enExample)

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JP2009231838A (ja) * 2008-03-24 2009-10-08 Asml Netherlands Bv 液浸リソグラフィ装置及びデバイス製造方法
JP2010287889A (ja) * 2009-06-09 2010-12-24 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
JP2011071511A (ja) * 2009-09-23 2011-04-07 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
JP2011176308A (ja) * 2010-02-09 2011-09-08 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置およびデバイス製造方法
JP2012089843A (ja) * 2010-10-18 2012-05-10 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置、及びデバイス製造方法
JP2012191219A (ja) * 2006-05-10 2012-10-04 Nikon Corp 露光装置及びデバイス製造方法
JP2013021332A (ja) * 2011-07-11 2013-01-31 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置およびデバイス製造方法
JP2013065829A (ja) * 2011-09-15 2013-04-11 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置およびデバイス製造方法
JP2013131746A (ja) * 2011-12-20 2013-07-04 Asml Netherlands Bv ポンプシステム、二酸化炭素供給システム、抽出システム、リソグラフィ装置、およびデバイス製造方法
JP2013251580A (ja) * 2009-12-09 2013-12-12 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
KR101341927B1 (ko) * 2010-08-23 2014-01-02 에이에스엠엘 네델란즈 비.브이. 유체 핸들링 구조체, 침지 리소그래피 장치용 모듈, 리소그래피 장치, 및 디바이스 제조 방법
US8988650B2 (en) 2010-08-24 2015-03-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2017073388A1 (ja) * 2015-10-29 2017-05-04 国立研究開発法人産業技術総合研究所 インプリント装置
US9846372B2 (en) 2010-04-22 2017-12-19 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005104195A1 (ja) 2004-04-19 2005-11-03 Nikon Corporation 露光装置及びデバイス製造方法
US8289497B2 (en) 2008-03-18 2012-10-16 Nikon Corporation Apparatus and methods for recovering fluid in immersion lithography
WO2010103822A1 (ja) * 2009-03-10 2010-09-16 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
NL2008199A (en) 2011-02-28 2012-08-29 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
US9256137B2 (en) * 2011-08-25 2016-02-09 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US20130050666A1 (en) * 2011-08-26 2013-02-28 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
NL2009378A (en) 2011-10-07 2013-04-09 Asml Netherlands Bv Lithographic apparatus and method of cooling a component in a lithographic apparatus.
JP2017538159A (ja) 2014-12-19 2017-12-21 エーエスエムエル ネザーランズ ビー．ブイ． 流体取扱構造、リソグラフィ装置及びデバイス製造方法
KR102328077B1 (ko) 2016-12-14 2021-11-17 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US10503085B2 (en) * 2017-11-16 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Lithography apparatus and method
JP7166089B2 (ja) * 2018-06-29 2022-11-07 東京エレクトロン株式会社 基板処理装置、基板処理システムおよび基板処理方法
CN114402263A (zh) 2019-09-13 2022-04-26 Asml荷兰有限公司 流体处置系统和光刻设备
CN112684665B (zh) * 2020-12-25 2024-06-25 浙江启尔机电技术有限公司 一种浸液供给回收装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
SG121818A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE60326384D1 (de) 2002-12-13 2009-04-09 Koninkl Philips Electronics Nv Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht
KR101345474B1 (ko) * 2003-03-25 2013-12-27 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP4488004B2 (ja) * 2003-04-09 2010-06-23 株式会社ニコン 液浸リソグラフィ流体制御システム
EP1498778A1 (en) * 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005183744A (ja) 2003-12-22 2005-07-07 Nikon Corp 露光装置及びデバイス製造方法
EP1706793B1 (en) * 2004-01-20 2010-03-03 Carl Zeiss SMT AG Exposure apparatus and measuring device for a projection lens
JP5040646B2 (ja) 2005-03-23 2012-10-03 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法

Cited By (41)

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JP2012191219A (ja) * 2006-05-10 2012-10-04 Nikon Corp 露光装置及びデバイス製造方法
US8477283B2 (en) 2006-05-10 2013-07-02 Nikon Corporation Exposure apparatus and device manufacturing method
JP5151977B2 (ja) * 2006-05-10 2013-02-27 株式会社ニコン 露光装置及びデバイス製造方法
US8259283B2 (en) 2008-03-24 2012-09-04 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
JP2009231838A (ja) * 2008-03-24 2009-10-08 Asml Netherlands Bv 液浸リソグラフィ装置及びデバイス製造方法
US8405815B2 (en) 2009-06-09 2013-03-26 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
JP2010287889A (ja) * 2009-06-09 2010-12-24 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
US8614784B2 (en) 2009-09-23 2013-12-24 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method, involving gas supply
JP2011071511A (ja) * 2009-09-23 2011-04-07 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
US10018921B2 (en) 2009-12-09 2018-07-10 Asml Netherlands B.V. Lithographic apparatus and a device manufacturing method
US9746782B2 (en) 2009-12-09 2017-08-29 Asml Netherlands B.V. Lithographic apparatus and a device manufacturing method
JP2016075935A (ja) * 2009-12-09 2016-05-12 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
JP2013251580A (ja) * 2009-12-09 2013-12-12 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
JP2011176308A (ja) * 2010-02-09 2011-09-08 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置およびデバイス製造方法
US9625828B2 (en) 2010-02-09 2017-04-18 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US9846372B2 (en) 2010-04-22 2017-12-19 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US10620544B2 (en) 2010-04-22 2020-04-14 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US10209624B2 (en) 2010-04-22 2019-02-19 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
KR101341927B1 (ko) * 2010-08-23 2014-01-02 에이에스엠엘 네델란즈 비.브이. 유체 핸들링 구조체, 침지 리소그래피 장치용 모듈, 리소그래피 장치, 및 디바이스 제조 방법
US9529277B2 (en) 2010-08-24 2016-12-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10620553B2 (en) 2010-08-24 2020-04-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8988650B2 (en) 2010-08-24 2015-03-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10216102B2 (en) 2010-08-24 2019-02-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9891542B2 (en) 2010-08-24 2018-02-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2012089843A (ja) * 2010-10-18 2012-05-10 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置、及びデバイス製造方法
CN102455604A (zh) * 2010-10-18 2012-05-16 Asml荷兰有限公司 流体处理结构、光刻设备和器件制造方法
CN102455604B (zh) * 2010-10-18 2014-08-20 Asml荷兰有限公司 流体处理结构、光刻设备和器件制造方法
US8836912B2 (en) 2010-10-18 2014-09-16 Asml Netherlands B.V. Fluid handling structure, a lithographic apparatus and a device manufacturing method
US9291914B2 (en) 2010-10-18 2016-03-22 Asml Netherlands B.V. Fluid handling structure, a lithographic apparatus and a device manufacturing method
US9069262B2 (en) 2011-07-11 2015-06-30 Asml Netherlands B.V. Fluid handling structure including gas supply and gas recovery openings, lithographic apparatus and device manufacturing method
JP2013021332A (ja) * 2011-07-11 2013-01-31 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置およびデバイス製造方法
US10133190B2 (en) 2011-07-11 2018-11-20 Asml Netherlands B.V. Fluid handling structure, a lithographic apparatus and a device manufacturing method
US9442390B2 (en) 2011-07-11 2016-09-13 Asml Netherlands B.V. Fluid handling structure including gas supply and gas recovery openings, a lithographic apparatus and a device manufacturing method
JP2013065829A (ja) * 2011-09-15 2013-04-11 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置およびデバイス製造方法
JP2013131746A (ja) * 2011-12-20 2013-07-04 Asml Netherlands Bv ポンプシステム、二酸化炭素供給システム、抽出システム、リソグラフィ装置、およびデバイス製造方法
JP2015146047A (ja) * 2011-12-20 2015-08-13 エーエスエムエル ネザーランズ ビー．ブイ． ポンプシステム、二酸化炭素供給システム、抽出システム、リソグラフィ装置、およびデバイス製造方法
US9575406B2 (en) 2011-12-20 2017-02-21 Asml Netherlands B.V. Pump system, a carbon dioxide supply system, an extraction system, a lithographic apparatus and a device manufacturing method
KR20180073645A (ko) * 2015-10-29 2018-07-02 내셔날 인스티튜트 오브 어드밴스드 인더스트리얼 사이언스 앤드 테크놀로지 임프린트 장치
JPWO2017073388A1 (ja) * 2015-10-29 2018-07-05 国立研究開発法人産業技術総合研究所 インプリント装置
WO2017073388A1 (ja) * 2015-10-29 2017-05-04 国立研究開発法人産業技術総合研究所 インプリント装置
KR102021713B1 (ko) 2015-10-29 2019-09-16 내셔날 인스티튜트 오브 어드밴스드 인더스트리얼 사이언스 앤드 테크놀로지 임프린트 장치

Also Published As

Publication number Publication date
WO2007046523A1 (en) 2007-04-26
US7907251B2 (en) 2011-03-15
TW200731335A (en) 2007-08-16
US20090122283A1 (en) 2009-05-14
KR20080022201A (ko) 2008-03-10

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