JP2007123484A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2007123484A JP2007123484A JP2005312589A JP2005312589A JP2007123484A JP 2007123484 A JP2007123484 A JP 2007123484A JP 2005312589 A JP2005312589 A JP 2005312589A JP 2005312589 A JP2005312589 A JP 2005312589A JP 2007123484 A JP2007123484 A JP 2007123484A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- filler
- emitting device
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
【解決手段】発光素子13を収納する凹状の収納部を備えた発光素子用配線基板の前記収納部に発光素子13を搭載してなる発光装置であって、前記収納部の内法が開口に向けて等しいかまたは大きくなっているとともに、前記収納部の側壁10aのうち前記発光素子13の発光面13aよりも前記収納部の底側に、前記収納部の内側に突出し、前記収納部の底側に空間11aを備えた凸部11が配設され、前記発光素子13と前記凸部11とを一体的に覆うように前記収納部に充填材17が配設され、該充填材17が前記凸部11の下側の空間11aに回り込んでいることを特徴とする。
【選択図】図1
Description
3・・・絶縁基体
5・・・接続端子
7・・・外部電極端子
9・・・貫通導体
10・・・枠体
11・・・凸部
11a・・・空間
13・・・発光素子
17・・・充填材
Claims (3)
- 発光素子を収納する凹状の収納部を備えた発光素子用配線基板の前記収納部に発光素子を搭載してなる発光装置であって、前記収納部の内法が開口に向けて等しいかまたは大きくなっているとともに、前記収納部の側壁のうち前記発光素子の発光面よりも前記収納部の底側に、前記収納部の内側に突出し、前記収納部の底側に空間を備えた凸部が配設され、前記発光素子と前記凸部とを一体的に覆うように前記収納部に充填材が配設され、該充填材が前記凸部の下側の前記空間に回り込んでいることを特徴とする発光装置。
- 前記凸部が、前記収納部の周方向に複数形成されていることを特徴とする請求項1記載の発光装置。
- 前記凸部が、前記収納部の周方向に長く形成されていることを特徴とする請求項1又は2記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005312589A JP5046507B2 (ja) | 2005-10-27 | 2005-10-27 | 発光素子用配線基板および発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005312589A JP5046507B2 (ja) | 2005-10-27 | 2005-10-27 | 発光素子用配線基板および発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007123484A true JP2007123484A (ja) | 2007-05-17 |
JP5046507B2 JP5046507B2 (ja) | 2012-10-10 |
Family
ID=38147015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005312589A Expired - Fee Related JP5046507B2 (ja) | 2005-10-27 | 2005-10-27 | 発光素子用配線基板および発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5046507B2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009038215A (ja) * | 2007-08-01 | 2009-02-19 | Nippon Carbide Ind Co Inc | 発光素子収納用パッケージおよび発光装置 |
JP2009135405A (ja) * | 2007-11-28 | 2009-06-18 | Samsung Electronics Co Ltd | Ledパッケージ、その製造方法およびそれを含むバックライトアセンブリ |
WO2009132508A1 (zh) * | 2008-04-30 | 2009-11-05 | Lou Mane | 白光发光二极管及白光发光二极管灯 |
JP2012049378A (ja) * | 2010-08-27 | 2012-03-08 | Kyocera Corp | 発光素子搭載用基板およびその製造方法 |
JP2013172154A (ja) * | 2012-02-21 | 2013-09-02 | Lg Innotek Co Ltd | 発光素子、発光素子製造方法、及びこれを備えた照明システム |
KR101811885B1 (ko) * | 2009-10-29 | 2017-12-22 | 니치아 카가쿠 고교 가부시키가이샤 | 발광장치 및 그 제조방법 |
JP2018098458A (ja) * | 2016-12-16 | 2018-06-21 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6370589U (ja) * | 1986-10-27 | 1988-05-12 | ||
JP2002182589A (ja) * | 2000-12-11 | 2002-06-26 | Rohm Co Ltd | 発光表示装置 |
JP2004288935A (ja) * | 2003-03-24 | 2004-10-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2004289106A (ja) * | 2003-01-27 | 2004-10-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2004327632A (ja) * | 2003-04-23 | 2004-11-18 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005019688A (ja) * | 2003-06-26 | 2005-01-20 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2006269485A (ja) * | 2005-03-22 | 2006-10-05 | Ngk Spark Plug Co Ltd | 発光素子実装用配線基板 |
-
2005
- 2005-10-27 JP JP2005312589A patent/JP5046507B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6370589U (ja) * | 1986-10-27 | 1988-05-12 | ||
JP2002182589A (ja) * | 2000-12-11 | 2002-06-26 | Rohm Co Ltd | 発光表示装置 |
JP2004289106A (ja) * | 2003-01-27 | 2004-10-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2004288935A (ja) * | 2003-03-24 | 2004-10-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2004327632A (ja) * | 2003-04-23 | 2004-11-18 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005019688A (ja) * | 2003-06-26 | 2005-01-20 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2006269485A (ja) * | 2005-03-22 | 2006-10-05 | Ngk Spark Plug Co Ltd | 発光素子実装用配線基板 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009038215A (ja) * | 2007-08-01 | 2009-02-19 | Nippon Carbide Ind Co Inc | 発光素子収納用パッケージおよび発光装置 |
JP2009135405A (ja) * | 2007-11-28 | 2009-06-18 | Samsung Electronics Co Ltd | Ledパッケージ、その製造方法およびそれを含むバックライトアセンブリ |
WO2009132508A1 (zh) * | 2008-04-30 | 2009-11-05 | Lou Mane | 白光发光二极管及白光发光二极管灯 |
KR101811885B1 (ko) * | 2009-10-29 | 2017-12-22 | 니치아 카가쿠 고교 가부시키가이샤 | 발광장치 및 그 제조방법 |
JP2012049378A (ja) * | 2010-08-27 | 2012-03-08 | Kyocera Corp | 発光素子搭載用基板およびその製造方法 |
JP2013172154A (ja) * | 2012-02-21 | 2013-09-02 | Lg Innotek Co Ltd | 発光素子、発光素子製造方法、及びこれを備えた照明システム |
JP2018098458A (ja) * | 2016-12-16 | 2018-06-21 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
US10193027B2 (en) | 2016-12-16 | 2019-01-29 | Nichia Corporation | Light emitting device and method of producing the same |
US10490704B2 (en) | 2016-12-16 | 2019-11-26 | Nichia Corporation | Light emitting device and method of producing the same |
Also Published As
Publication number | Publication date |
---|---|
JP5046507B2 (ja) | 2012-10-10 |
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