JP2007115954A5 - - Google Patents

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Publication number
JP2007115954A5
JP2007115954A5 JP2005306929A JP2005306929A JP2007115954A5 JP 2007115954 A5 JP2007115954 A5 JP 2007115954A5 JP 2005306929 A JP2005306929 A JP 2005306929A JP 2005306929 A JP2005306929 A JP 2005306929A JP 2007115954 A5 JP2007115954 A5 JP 2007115954A5
Authority
JP
Japan
Prior art keywords
layer
paste
multilayer printed
counted
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005306929A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007115954A (ja
JP4899409B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005306929A priority Critical patent/JP4899409B2/ja
Priority claimed from JP2005306929A external-priority patent/JP4899409B2/ja
Publication of JP2007115954A publication Critical patent/JP2007115954A/ja
Publication of JP2007115954A5 publication Critical patent/JP2007115954A5/ja
Application granted granted Critical
Publication of JP4899409B2 publication Critical patent/JP4899409B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2005306929A 2005-10-21 2005-10-21 多層プリント配線基板及びその製造方法 Expired - Fee Related JP4899409B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005306929A JP4899409B2 (ja) 2005-10-21 2005-10-21 多層プリント配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005306929A JP4899409B2 (ja) 2005-10-21 2005-10-21 多層プリント配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007115954A JP2007115954A (ja) 2007-05-10
JP2007115954A5 true JP2007115954A5 (ko) 2008-11-27
JP4899409B2 JP4899409B2 (ja) 2012-03-21

Family

ID=38097867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005306929A Expired - Fee Related JP4899409B2 (ja) 2005-10-21 2005-10-21 多層プリント配線基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP4899409B2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110028951A (ko) * 2009-09-14 2011-03-22 삼성전기주식회사 인쇄회로기판 및 그의 제조방법
KR101148385B1 (ko) 2010-12-08 2012-05-21 삼성전기주식회사 비아 구조물 및 그 형성 방법, 그리고 상기 비아 구조물을 갖는 회로 기판 및 상기 회로 기판의 제조 방법
JP2017123376A (ja) 2016-01-05 2017-07-13 イビデン株式会社 プリント配線板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2587596B2 (ja) * 1993-09-21 1997-03-05 松下電器産業株式会社 回路基板接続材とそれを用いた多層回路基板の製造方法
JP3311899B2 (ja) * 1995-01-20 2002-08-05 松下電器産業株式会社 回路基板及びその製造方法
JPH09148739A (ja) * 1995-11-24 1997-06-06 Toray Ind Inc 多層回路板およびその製造方法
JPH09246724A (ja) * 1996-03-04 1997-09-19 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP3395621B2 (ja) * 1997-02-03 2003-04-14 イビデン株式会社 プリント配線板及びその製造方法
JP3053790B2 (ja) * 1997-09-30 2000-06-19 松下電器産業株式会社 回路基板接続用部材、回路基板の製造方法および回路基板
JP3431523B2 (ja) * 1998-12-09 2003-07-28 松下電器産業株式会社 回路基板接続材とその製造方法及び回路基板接続材を用いた多層回路基板の製造方法
JP3760101B2 (ja) * 2001-02-13 2006-03-29 富士通株式会社 多層プリント配線板およびその製造方法
JP4705261B2 (ja) * 2001-04-02 2011-06-22 日本シイエムケイ株式会社 ビルドアップ多層プリント配線板
JP2003168861A (ja) * 2001-11-30 2003-06-13 Cmk Corp ビルドアップ多層配線基板の回路形成方法

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