JP2007036129A5 - - Google Patents
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- Publication number
- JP2007036129A5 JP2007036129A5 JP2005221107A JP2005221107A JP2007036129A5 JP 2007036129 A5 JP2007036129 A5 JP 2007036129A5 JP 2005221107 A JP2005221107 A JP 2005221107A JP 2005221107 A JP2005221107 A JP 2005221107A JP 2007036129 A5 JP2007036129 A5 JP 2007036129A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- passivation film
- chips
- scribe line
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002161 passivation Methods 0.000 claims 21
- 238000004519 manufacturing process Methods 0.000 claims 5
- 230000002093 peripheral effect Effects 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 230000001681 protective effect Effects 0.000 claims 4
- 239000004642 Polyimide Substances 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005221107A JP2007036129A (ja) | 2005-07-29 | 2005-07-29 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005221107A JP2007036129A (ja) | 2005-07-29 | 2005-07-29 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007036129A JP2007036129A (ja) | 2007-02-08 |
| JP2007036129A5 true JP2007036129A5 (enExample) | 2008-08-21 |
Family
ID=37794973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005221107A Pending JP2007036129A (ja) | 2005-07-29 | 2005-07-29 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007036129A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007214268A (ja) * | 2006-02-08 | 2007-08-23 | Seiko Instruments Inc | 半導体装置の製造方法 |
| CN103069546B (zh) * | 2010-09-22 | 2016-05-04 | 富士电机株式会社 | 半导体器件的制造方法 |
| JP2014138143A (ja) | 2013-01-18 | 2014-07-28 | Toyota Motor Corp | 半導体装置の製造方法、半導体ウエハ、及び、半導体装置 |
| JP6503286B2 (ja) | 2015-12-24 | 2019-04-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体ウェハ |
| JP6770443B2 (ja) | 2017-01-10 | 2020-10-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体ウェハ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315304A (ja) * | 1992-05-12 | 1993-11-26 | Sony Corp | ウエハの裏面研削方法 |
| JPH10312980A (ja) * | 1997-05-13 | 1998-11-24 | Sony Corp | 半導体装置の製造方法 |
-
2005
- 2005-07-29 JP JP2005221107A patent/JP2007036129A/ja active Pending
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