JP2007001800A - 炭化ケイ素基板の表面再構成方法 - Google Patents
炭化ケイ素基板の表面再構成方法 Download PDFInfo
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- JP2007001800A JP2007001800A JP2005183101A JP2005183101A JP2007001800A JP 2007001800 A JP2007001800 A JP 2007001800A JP 2005183101 A JP2005183101 A JP 2005183101A JP 2005183101 A JP2005183101 A JP 2005183101A JP 2007001800 A JP2007001800 A JP 2007001800A
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- silicon carbide
- silicon
- carbide substrate
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- silicon film
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 165
- 239000000758 substrate Substances 0.000 title claims abstract description 157
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 153
- 238000000034 method Methods 0.000 title claims abstract description 60
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 105
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 104
- 239000010703 silicon Substances 0.000 claims abstract description 104
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 11
- 238000005498 polishing Methods 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 239000013078 crystal Substances 0.000 description 43
- 239000007789 gas Substances 0.000 description 18
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 16
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 6
- 239000007791 liquid phase Substances 0.000 description 6
- 239000011259 mixed solution Substances 0.000 description 6
- 229910017604 nitric acid Inorganic materials 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006199 nebulizer Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/02—Heat treatment
Abstract
【解決手段】 炭化ケイ素基板1の表面上にシリコン膜2を形成するシリコン膜形成工程と、シリコン膜2の表面上に多結晶炭化ケイ素基板を設置することなく炭化ケイ素基板1およびシリコン膜2を熱処理する熱処理工程と、を含む、炭化ケイ素基板の表面再構成方法である。ここで、熱処理工程後にシリコン膜を除去するシリコン膜除去工程を含んでいてもよい。また、熱処理工程後にシリコン膜を酸化して酸化シリコン膜とする酸化シリコン膜形成工程と、酸化シリコン膜を除去する酸化シリコン膜除去工程と、を含んでいてもよい。
【選択図】 図1
Description
まず、市販の六方晶の炭化ケイ素結晶からなる口径2インチの円板状の炭化ケイ素基板を用意した。この炭化ケイ素基板の表面の(0001)面を[11−20]方向に8°傾斜させたオフ面について、光散乱を利用した方法を用いてマイクロパイプ密度(個/cm2)を調査したところ、マイクロパイプ密度は96(個/cm2)であった。
まず、実施例1と同様に、市販の六方晶の炭化ケイ素結晶からなる口径2インチの円板状の炭化ケイ素基板を用意した。この炭化ケイ素基板の表面の(0001)面を[11−20]方向に8°傾斜させたオフ面について、実施例1と同一の方法でマイクロパイプ密度(個/cm2)を調査したところ、マイクロパイプ密度は92(個/cm2)であった。
まず、実施例1と同様に、市販の六方晶の炭化ケイ素結晶からなる口径2インチの円板状の炭化ケイ素基板を用意した。この炭化ケイ素基板の表面の(0001)面を[11−20]方向に8°傾斜させたオフ面について、実施例1と同一の方法でマイクロパイプ密度(個/cm2)を調査したところ、マイクロパイプ密度は95(個/cm2)であった。
まず、実施例1と同様に、市販の六方晶の炭化ケイ素結晶からなる口径2インチの円板状の炭化ケイ素基板を用意した。この炭化ケイ素基板の表面の(0001)面を[11−20]方向に8°傾斜させたオフ面について、実施例1と同一の方法でマイクロパイプ密度(個/cm2)を調査したところ、マイクロパイプ密度は91(個/cm2)であった。
まず、市販の六方晶の炭化ケイ素結晶からなる口径2インチの円板状の炭化ケイ素基板を用意した。この炭化ケイ素基板の表面の(0001)面を[11−20]方向に8°傾斜させたオフ面について、光散乱を利用した方法を用いてマイクロパイプ密度(個/cm2)を調査したところ、マイクロパイプ密度は96(個/cm2)であった。
まず、市販の六方晶の炭化ケイ素結晶からなる口径2インチの円板状の炭化ケイ素基板を用意した。この炭化ケイ素基板の表面の(0001)面を[11−20]方向に8°傾斜させたオフ面について、光散乱を利用した方法を用いてマイクロパイプ密度(個/cm2)を調査したところ、マイクロパイプ密度は94(個/cm2)であった。
Claims (8)
- 炭化ケイ素基板の表面上にシリコン膜を形成するシリコン膜形成工程と、前記シリコン膜の表面上に多結晶炭化ケイ素基板を設置することなく前記炭化ケイ素基板および前記シリコン膜を熱処理する熱処理工程と、を含む、炭化ケイ素基板の表面再構成方法。
- 前記シリコン膜の形成前に前記炭化ケイ素基板の表面のエッチングまたは研磨による平坦化処理を行なう工程を含む、請求項1に記載の炭化ケイ素基板の表面再構成方法。
- 前記熱処理工程後に前記シリコン膜を除去するシリコン膜除去工程を含む、請求項1または2に記載の炭化ケイ素基板の表面再構成方法。
- 前記熱処理工程後に前記シリコン膜を酸化して酸化シリコン膜とする酸化シリコン膜形成工程と、前記酸化シリコン膜を除去する酸化シリコン膜除去工程と、を含む、請求項1または2に記載の炭化ケイ素基板の表面再構成方法。
- 前記シリコン膜は、スパッタリング法または蒸着法により形成されることを特徴とする、請求項1から4のいずれかに記載の炭化ケイ素基板の表面再構成方法。
- 前記シリコン膜は、シリコンを含む液体またはシリコンを含むガスを用いて形成されることを特徴とする、請求項1から4のいずれかに記載の炭化ケイ素基板の表面再構成方法。
- 前記シリコン膜形成工程と、前記熱処理工程と、を同時に行なうことを特徴とする、請求項6に記載の炭化ケイ素基板の表面再構成方法。
- 前記シリコン膜は前記炭化ケイ素基板のオフ面上に形成されることを特徴とする、請求項1から7のいずれかに記載の炭化ケイ素基板の表面再構成方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005183101A JP4293165B2 (ja) | 2005-06-23 | 2005-06-23 | 炭化ケイ素基板の表面再構成方法 |
US11/664,318 US7846491B2 (en) | 2005-06-23 | 2006-03-02 | Surface reconstruction method for silicon carbide substrate |
CA2583683A CA2583683C (en) | 2005-06-23 | 2006-03-02 | Surface reconstruction method for silicon carbide substrate |
KR1020077010138A KR101302845B1 (ko) | 2005-06-23 | 2006-03-02 | 탄화규소 기판의 표면 재구성 방법 |
PCT/JP2006/303936 WO2006137192A1 (ja) | 2005-06-23 | 2006-03-02 | 炭化ケイ素基板の表面再構成方法 |
EP06728579A EP1806438A1 (en) | 2005-06-23 | 2006-03-02 | Method of surface reconstruction for silicon carbide substrate |
CN2006800010882A CN101052754B (zh) | 2005-06-23 | 2006-03-02 | 碳化硅衬底的表面重建方法 |
TW095108416A TWI384097B (zh) | 2005-06-23 | 2006-03-13 | Surface Reconstruction Method of Silicon Carbide Substrate |
Applications Claiming Priority (1)
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JP2005183101A JP4293165B2 (ja) | 2005-06-23 | 2005-06-23 | 炭化ケイ素基板の表面再構成方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007001800A true JP2007001800A (ja) | 2007-01-11 |
JP4293165B2 JP4293165B2 (ja) | 2009-07-08 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005183101A Expired - Fee Related JP4293165B2 (ja) | 2005-06-23 | 2005-06-23 | 炭化ケイ素基板の表面再構成方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7846491B2 (ja) |
EP (1) | EP1806438A1 (ja) |
JP (1) | JP4293165B2 (ja) |
KR (1) | KR101302845B1 (ja) |
CN (1) | CN101052754B (ja) |
CA (1) | CA2583683C (ja) |
TW (1) | TWI384097B (ja) |
WO (1) | WO2006137192A1 (ja) |
Cited By (4)
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KR100951617B1 (ko) * | 2008-01-23 | 2010-04-09 | 동의대학교 산학협력단 | 실리콘카바이드 기판의 표면 처리 방법 |
JP2013043822A (ja) * | 2011-08-26 | 2013-03-04 | Kwansei Gakuin | 半導体ウエハの製造方法及び半導体ウエハ |
JP2014225660A (ja) * | 2013-04-27 | 2014-12-04 | 日亜化学工業株式会社 | 半導体レーザ装置及びその製造方法並びにサブマウントの製造方法 |
JP2017010986A (ja) * | 2015-06-17 | 2017-01-12 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |
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2005
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100951617B1 (ko) * | 2008-01-23 | 2010-04-09 | 동의대학교 산학협력단 | 실리콘카바이드 기판의 표면 처리 방법 |
JP2013043822A (ja) * | 2011-08-26 | 2013-03-04 | Kwansei Gakuin | 半導体ウエハの製造方法及び半導体ウエハ |
JP2014225660A (ja) * | 2013-04-27 | 2014-12-04 | 日亜化学工業株式会社 | 半導体レーザ装置及びその製造方法並びにサブマウントの製造方法 |
JP2019062212A (ja) * | 2013-04-27 | 2019-04-18 | 日亜化学工業株式会社 | 半導体レーザ装置 |
JP2017010986A (ja) * | 2015-06-17 | 2017-01-12 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
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KR20080017291A (ko) | 2008-02-26 |
CA2583683C (en) | 2012-03-27 |
CN101052754B (zh) | 2011-11-09 |
TWI384097B (zh) | 2013-02-01 |
JP4293165B2 (ja) | 2009-07-08 |
US7846491B2 (en) | 2010-12-07 |
CA2583683A1 (en) | 2006-12-28 |
EP1806438A1 (en) | 2007-07-11 |
TW200722561A (en) | 2007-06-16 |
KR101302845B1 (ko) | 2013-09-02 |
CN101052754A (zh) | 2007-10-10 |
WO2006137192A1 (ja) | 2006-12-28 |
US20080050844A1 (en) | 2008-02-28 |
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