JP2006523763A5 - - Google Patents
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- Publication number
- JP2006523763A5 JP2006523763A5 JP2006509939A JP2006509939A JP2006523763A5 JP 2006523763 A5 JP2006523763 A5 JP 2006523763A5 JP 2006509939 A JP2006509939 A JP 2006509939A JP 2006509939 A JP2006509939 A JP 2006509939A JP 2006523763 A5 JP2006523763 A5 JP 2006523763A5
- Authority
- JP
- Japan
- Prior art keywords
- stabilizers
- aliphatic diamine
- composition
- weight percent
- diamine component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 44
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical group NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 28
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 26
- -1 aliphatic diamine Chemical class 0.000 claims description 24
- 239000003381 stabilizer Substances 0.000 claims description 20
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 15
- 150000001735 carboxylic acids Chemical class 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 150000008064 anhydrides Chemical class 0.000 claims description 6
- 239000004760 aramid Substances 0.000 claims description 6
- 229920003235 aromatic polyamide Polymers 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 6
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004609 Impact Modifier Substances 0.000 claims description 5
- 229920001038 ethylene copolymer Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- XGJHPGPVESLKKD-UHFFFAOYSA-N 2-ethylbutane-1,4-diamine Chemical compound CCC(CN)CCN XGJHPGPVESLKKD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Chemical class 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920006465 Styrenic thermoplastic elastomer Polymers 0.000 claims description 4
- 150000001336 alkenes Chemical class 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000004982 aromatic amines Chemical class 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 229920000554 ionomer Polymers 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 4
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical compound OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 claims description 4
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 4
- 229920006122 polyamide resin Polymers 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 4
- 229920001897 terpolymer Polymers 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46271603P | 2003-04-14 | 2003-04-14 | |
| US60/462,716 | 2003-04-14 | ||
| PCT/US2004/011250 WO2004092274A1 (en) | 2003-04-14 | 2004-04-08 | Polyamide composition for blow molded articles |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006523763A JP2006523763A (ja) | 2006-10-19 |
| JP2006523763A5 true JP2006523763A5 (enExample) | 2007-05-31 |
| JP5226211B2 JP5226211B2 (ja) | 2013-07-03 |
Family
ID=33299982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006509939A Expired - Fee Related JP5226211B2 (ja) | 2003-04-14 | 2004-04-08 | ブロー成形物品用のポリアミド組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20040242737A1 (enExample) |
| EP (1) | EP1613697A1 (enExample) |
| JP (1) | JP5226211B2 (enExample) |
| KR (1) | KR101070502B1 (enExample) |
| CN (1) | CN100480328C (enExample) |
| BR (1) | BRPI0409758A (enExample) |
| WO (1) | WO2004092274A1 (enExample) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1658163B1 (en) | 2003-08-19 | 2020-01-01 | Solvay Specialty Polymers USA, LLC. | Impact-modified polyamide hollow body |
| EP1683830A1 (en) * | 2005-01-12 | 2006-07-26 | DSM IP Assets B.V. | Heat stabilized moulding composition |
| EP1681313A1 (en) * | 2005-01-17 | 2006-07-19 | DSM IP Assets B.V. | Heat stabilized moulding composition |
| KR100756349B1 (ko) * | 2006-12-18 | 2007-09-10 | 제일모직주식회사 | 나일론계 수지 복합재 |
| WO2008079078A1 (en) * | 2006-12-22 | 2008-07-03 | Qunano Ab | Elevated led and method of producing such |
| WO2009045415A1 (en) * | 2007-10-04 | 2009-04-09 | E. I. Du Pont De Nemours And Company | Internal combustion engine covers |
| US20100270767A1 (en) * | 2007-10-04 | 2010-10-28 | Morph Technologies, Inc. | Vehicular suspension components |
| ES2403135T3 (es) * | 2007-10-04 | 2013-05-14 | Integran Technologies | Piezas de transmisión para vehículos |
| EP2193664B1 (en) * | 2007-10-04 | 2013-02-20 | Integran Technologies | Vehicular electrical and electronic housings |
| US20100291381A1 (en) * | 2007-10-04 | 2010-11-18 | Elia Andri E | Metal coated structural parts for portable electronic devices |
| WO2009045428A1 (en) * | 2007-10-04 | 2009-04-09 | E.I.Du Pont De Nemours And Company | Vehicular turbocharger components |
| US20090127740A1 (en) * | 2007-11-19 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Use of polyamide compositions for making molded articles having improved adhesion, molded articles thereof and methods for adhering such materials |
| KR100878574B1 (ko) * | 2007-12-28 | 2009-01-15 | 제일모직주식회사 | 나일론/보강 섬유 조성물 |
| ITTO20080404A1 (it) * | 2008-05-27 | 2009-11-28 | Dayco Fluid Technologies Spa | Elemento cavo per il trasporto di un fluido refrigerante in un autoveicolo |
| WO2010014795A1 (en) * | 2008-07-30 | 2010-02-04 | E. I. Du Pont De Nemours And Company | Thermoplastic articles including polyhydroxy polymers |
| IT1391195B1 (it) * | 2008-08-06 | 2011-11-18 | Dayco Fluid Technologies Spa | Gruppo di adduzione per un circuito di aria condizionata e relativo metodo di realizzazione |
| US8293831B2 (en) * | 2008-10-30 | 2012-10-23 | E I Du Pont De Nemours And Company | Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide |
| US20100168270A1 (en) * | 2008-12-31 | 2010-07-01 | Xiaoping Guo | Biocompatible polycarbonate and radiopaque polymer compositions and methods of manufacturing medical devices with same |
| US20110028621A1 (en) * | 2009-07-30 | 2011-02-03 | E. I. Du Pont De Nemours And Company | Heat aging resistant polyamide compositions including polyhydroxy polymers |
| WO2011015790A2 (fr) * | 2009-08-06 | 2011-02-10 | Arkema France | Composition comprenant un copolyamide et une polyolefine reticulee |
| KR101203339B1 (ko) | 2009-09-30 | 2012-11-20 | 코오롱인더스트리 주식회사 | 아라미드 섬유 및 그 제조방법 |
| MX365310B (es) | 2010-03-08 | 2019-05-29 | Ube Industries | Composición de resina de poliamida. |
| EP2410020B1 (de) * | 2010-07-23 | 2013-01-30 | Ems-Patent Ag | Teilaromatische Polyamid-Formmassen und deren Verwendungen |
| TWI529212B (zh) * | 2010-08-18 | 2016-04-11 | Vertellus Specialties Inc | 由混練聚醯胺與烯烴-順丁烯二酐聚合物所形成之組合物、方法及製品 |
| KR101374361B1 (ko) * | 2010-08-20 | 2014-03-18 | 제일모직주식회사 | 휴대용 디스플레이 제품의 lcd 보호용 브라켓 |
| WO2012023671A1 (ko) * | 2010-08-20 | 2012-02-23 | 제일모직 주식회사 | 휴대용 디스플레이 제품의 lcd 보호용 브라켓 |
| US9988198B2 (en) | 2010-08-23 | 2018-06-05 | Cryovac, Inc. | Ovenable heat-sealed package |
| US20120108122A1 (en) * | 2010-10-29 | 2012-05-03 | E. I. Du Pont De Nemours And Company | Overmolded polyamide composite structures and processes for their preparation |
| US20120177858A1 (en) * | 2011-01-10 | 2012-07-12 | E.I. Du Pont De Nemours And Company | Polyamide compositions for flow molding |
| US20120196962A1 (en) * | 2011-01-31 | 2012-08-02 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with heat stabilizer |
| US20120196961A1 (en) * | 2011-01-31 | 2012-08-02 | E. I. Du Pont De Nemours And Company | Thermoplastic composition with hydroxy amino acid heat stabilizer |
| US8691911B2 (en) * | 2011-01-31 | 2014-04-08 | E I Du Pont De Nemours And Company | Melt-blended thermoplastic composition |
| EP2692801B1 (en) * | 2011-03-31 | 2016-08-24 | Nitta Corporation | Thermoplastic resin composition having high durability |
| EP2580285B8 (en) | 2011-06-21 | 2014-02-19 | E. I. Du Pont de Nemours and Company | Process for production of a heat-stabilised polyamide-filled acrylate polymer |
| US8940824B2 (en) | 2011-06-21 | 2015-01-27 | E.I. Du Pont De Nemours And Company | Heat-stabilized acrylate elastomer composition and process for its production |
| JP6000084B2 (ja) * | 2011-11-17 | 2016-09-28 | ユニチカ株式会社 | 半芳香族ポリアミド樹脂組成物 |
| CN102702733B (zh) * | 2012-06-15 | 2014-11-26 | 东莞市意普万尼龙科技股份有限公司 | 一种增强型尼龙进气管吹塑专用复合材料及其制备方法 |
| CN103073880A (zh) * | 2012-12-25 | 2013-05-01 | 广州鹿山新材料股份有限公司 | 一种增韧尼龙复合物及其制备方法 |
| US20140187691A1 (en) * | 2012-12-28 | 2014-07-03 | Cheil Industries Inc. | Flame Retardant Polyamide Resin Composition and Molded Article Comprising the Same |
| KR101690832B1 (ko) * | 2014-02-27 | 2016-12-28 | 롯데첨단소재(주) | 도장 성형품 |
| EP2927272B1 (de) | 2014-03-31 | 2017-08-16 | Ems-Patent Ag | Polyamid-Formmassen, Verfahren zu deren Herstellung und Verwendungen dieser Polyamid-Formmassen |
| WO2016012558A1 (en) * | 2014-07-25 | 2016-01-28 | Dsm Ip Assets B.V. | Blow molded container |
| CN106536632B (zh) * | 2014-07-25 | 2019-06-11 | 帝斯曼知识产权资产管理有限公司 | 热稳定的聚酰胺组合物 |
| US10494525B2 (en) | 2015-02-27 | 2019-12-03 | 3M Innovative Properties Company | Polyamide composition including hollow glass microspheres and articles and methods relating to the same |
| CN105733254B (zh) * | 2016-05-16 | 2018-02-13 | 上海日之升科技有限公司 | 一种熔体稳定且具有耐氯化物溶液特性的聚酰胺材料及其制备方法 |
| US20190225803A1 (en) * | 2016-09-28 | 2019-07-25 | Dsm Ip Assets B.V. | Polymer composition, molded part and processes for production thereof |
| US10920026B2 (en) * | 2016-09-28 | 2021-02-16 | Dsm Ip Assets B.V. | Polymer composition, molded part and processes for production thereof |
| CN106543717B (zh) * | 2016-11-05 | 2018-02-09 | 上海耐特复合材料制品有限公司 | 一种高强度透纤尼龙复合材料 |
| WO2019012061A1 (de) * | 2017-07-13 | 2019-01-17 | Lanxess Deutschland Gmbh | Thermostabilisierte zusammensetzungen |
| KR20200030530A (ko) * | 2017-07-13 | 2020-03-20 | 란세스 도이치란트 게엠베하 | 열적 안정화된 조성물 |
| EP3476898B1 (en) * | 2017-10-27 | 2021-05-05 | Henkel AG & Co. KGaA | Thermoplastic composition for 3d printing |
| CN111433026B (zh) * | 2017-12-05 | 2021-09-17 | 利安德巴塞尔先进聚合物公司 | 高性能聚酰胺化合物及其用途 |
| CN107868257B (zh) * | 2017-12-06 | 2020-11-17 | 广州辰东新材料有限公司 | 半芳香族尼龙-长链脂肪族尼龙复合物及其制备方法、尼龙复合材料及其制备方法与应用 |
| JP7328894B2 (ja) * | 2017-12-11 | 2023-08-17 | Ube株式会社 | ポリアミド樹脂組成物 |
| JP7074531B2 (ja) * | 2018-03-28 | 2022-05-24 | 旭化成株式会社 | ポリアミド樹脂組成物及び成形品 |
| JP7379003B2 (ja) * | 2018-09-07 | 2023-11-14 | Ube株式会社 | ポリアミド樹脂組成物 |
| WO2020120492A1 (en) | 2018-12-14 | 2020-06-18 | Dsm Ip Assets B.V. | Blow molded plastic container and gas storage tank comprising the blow molded plastic container as a liner |
| BR112021014981A2 (pt) | 2019-01-30 | 2021-10-05 | Basf Se | Método para produzir uma poliamida espumada intrinsecamente, poliamida intrinsecamente espumada e artigo moldado |
| EP3966285A1 (en) | 2019-05-08 | 2022-03-16 | Basf Se | A polyamide composition and a tubular or pipe multilayer structure comprising the same |
| EP4328455A3 (en) | 2019-12-16 | 2024-05-01 | Basf Se | Industrial fan or blower comprising a flame-retardant polyamide composition |
| JP7468189B2 (ja) * | 2020-06-26 | 2024-04-16 | Ube株式会社 | ポリアミド樹脂組成物 |
| CA3236251A1 (en) * | 2021-11-09 | 2023-05-19 | Ascend Performance Materials Operations Llc | Polyamide formulations for long term high temperature performance |
| US20250304789A1 (en) * | 2024-04-01 | 2025-10-02 | Celanese Polymers Holding, Inc. | Polymer Composition for Contact with Cooling Fluids |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5251464A (en) * | 1975-10-23 | 1977-04-25 | Toppan Printing Co Ltd | Method and device for producing plastic tube |
| FR2656823B1 (fr) * | 1990-01-09 | 1992-06-12 | Kerplas Snc | Poincon pour injection-soufflage d'un corps creux et machine utilisant un tel poincon. |
| JPH04159362A (ja) * | 1990-10-22 | 1992-06-02 | Mitsui Petrochem Ind Ltd | ポリアミド中空成形品 |
| JPH051223A (ja) * | 1991-06-27 | 1993-01-08 | Showa Denko Kk | 耐光性に優れたポリアミド樹脂組成物 |
| SE9202892D0 (sv) * | 1992-10-02 | 1992-10-02 | Kabi Pharmacia Ab | Dna encoding a prostaglandin receptor, a host cell transformed therewith and an expression product thereof |
| US5500473A (en) * | 1993-04-30 | 1996-03-19 | E. I. Du Pont De Nemours And Company | Mineral filled copolyamide compositions |
| US5750639A (en) * | 1994-01-26 | 1998-05-12 | E. I. Du Pont De Nemours And Company | Polyamide resin composition and molding thereof |
| JPH09316325A (ja) * | 1996-05-24 | 1997-12-09 | Du Pont Kk | 剛性および靭性のバランスに優れた芳香族ポリアミド樹脂組成物 |
| US5969014A (en) * | 1997-09-23 | 1999-10-19 | Clariant Finance (Bvi) Limited | Synergistic polyamide stabilization method |
| US6319986B1 (en) * | 1998-07-02 | 2001-11-20 | Mitsui Chemicals | Semiaromatic polyamide resin composition |
| JP2000080270A (ja) * | 1998-07-02 | 2000-03-21 | Mitsui Chemicals Inc | 半芳香族ポリアミド樹脂組成物 |
| WO2000006649A1 (en) * | 1998-07-30 | 2000-02-10 | Toray Industries, Inc. | Polyamide resin composition and process for producing the same |
| DE69925576T2 (de) * | 1998-12-17 | 2006-01-19 | Basell Poliolefine Italia S.P.A. | Polyolefinpfropfcopolymere/polyamid mischung |
| JP2001002917A (ja) * | 1999-06-18 | 2001-01-09 | Toyobo Co Ltd | ポリアミド組成物 |
| US6423768B1 (en) * | 1999-09-07 | 2002-07-23 | General Electric Company | Polymer-organoclay composite compositions, method for making and articles therefrom |
| JP2001088200A (ja) * | 1999-09-21 | 2001-04-03 | Idemitsu Petrochem Co Ltd | 中空成形品の成形方法 |
| JP2001164109A (ja) * | 1999-12-03 | 2001-06-19 | Mitsubishi Gas Chem Co Inc | ポリアミド樹脂組成物 |
| WO2001053369A1 (en) * | 2000-01-21 | 2001-07-26 | Mitsui Chemicals, Inc. | Olefin block copolymers, production processes of the same and use thereof |
| KR100448115B1 (ko) * | 2000-11-30 | 2004-09-10 | 현대자동차주식회사 | 폴리아미드 수지 조성물 |
| US20020187291A1 (en) * | 2001-04-12 | 2002-12-12 | Jean-Michel Philippoz | Long solidified hollow thermoplastic articles |
| EP1443080B1 (en) * | 2001-07-23 | 2009-07-15 | Teijin Chemicals, Ltd. | Thermoplastic resin composition, molded article, and process for producing the same |
-
2004
- 2004-04-07 US US10/819,766 patent/US20040242737A1/en not_active Abandoned
- 2004-04-08 BR BRPI0409758-0A patent/BRPI0409758A/pt not_active IP Right Cessation
- 2004-04-08 EP EP04750025A patent/EP1613697A1/en not_active Withdrawn
- 2004-04-08 CN CNB2004800161135A patent/CN100480328C/zh not_active Expired - Fee Related
- 2004-04-08 WO PCT/US2004/011250 patent/WO2004092274A1/en not_active Ceased
- 2004-04-08 JP JP2006509939A patent/JP5226211B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-13 KR KR1020057019443A patent/KR101070502B1/ko not_active Expired - Fee Related
-
2007
- 2007-11-16 US US11/985,677 patent/US20080070023A1/en not_active Abandoned
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