JP2006521695A - 少なくとも1つの基板において少なくとも1つの構成要素を位置決めする方法及びシステム - Google Patents
少なくとも1つの基板において少なくとも1つの構成要素を位置決めする方法及びシステム Download PDFInfo
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- JP2006521695A JP2006521695A JP2006506759A JP2006506759A JP2006521695A JP 2006521695 A JP2006521695 A JP 2006521695A JP 2006506759 A JP2006506759 A JP 2006506759A JP 2006506759 A JP2006506759 A JP 2006506759A JP 2006521695 A JP2006521695 A JP 2006521695A
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- substrate
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- positioning
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- 239000000758 substrate Substances 0.000 title claims abstract description 133
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000010586 diagram Methods 0.000 description 17
- 238000005259 measurement Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
- Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (9)
- 少なくとも1つの基板(24)において少なくとも1つの構成要素(25)を位置決めする方法であって、構成要素(25)は少なくとも位置決め装置(2)により取り上げられ、前記基板(24)における所望の位置に位置決めされる、方法であり、前記構成要素(25)が前記基板(24)において位置決めされた後に、前記基板(24)において位置決めされた前記構成要素(25)の画像がカメラ(5、23)により形成され、前記基板(24)における前記構成要素(25)の実位置と前記基板(24)における前記構成要素(25)の所望の位置との間の差が前記画像に基づいて確定され、その後、位置決めされる次の構成要素(25)の位置決めは求められた前記差により適合されることを特徴とする方法。
- 請求項1に記載の方法であって、先ず、同じ種類の構成要素(25)が多くの基板(25)において実質的に同じ位置に位置決めされる一方、関連基板(24)に対する前記構成要素(25)の前記所望の位置と実位置との間の差が決定され、次の基板(24)において位置決めされる次の構成要素(25)の位置決めは求められた前記差により適合される、ことを特徴とする方法。
- 請求項1又は2に記載の方法であって、先ず、少なくとも1つの基板(24)において、多くの異なる構成要素(25)が位置決めされ、それらの実位置は所望の位置と比較され、それに続いて、前記基板(24)又は他の基板において位置決めされる次の構成要素の位置決めは統計的に決定される平均差に基づいて適合される、ことを特徴とする方法。
- 請求項1乃至3の何れ一項に記載の方法であって、一旦、多くの構成要素(25)が位置決めされると、前記実位置は前記所望の位置と比較される、ことを特徴とする方法。
- 請求項1乃至3の何れ一項に記載の方法であって、一旦、各々の構成要素(25)が位置決めされると、前記実位置は前記所望の位置と比較される、ことを特徴とする方法。
- 請求項1乃至5の何れ一項に記載の方法であって、構成要素(25)は隣り合って位置している多くの位置決め装置(2)により位置決めされ、各々の位置決め装置(2)は、前記基板(24)において位置決めされた前記構成要素(25)の前記所望の位置と前記実位置との間の差を決定するために前記基板(24)の少なくとも一部の画像が形成されるカメラ(5、23)を有する、ことを特徴とする方法。
- 請求項6に記載の方法であって、前記基板(24)のそれぞれの部分の位置決め装置(2)により形成された画像から、結合画像が基板(24)について形成され、前記構成要素(25)はその基板において位置決めされている、ことを特徴とする方法。
- 請求項1乃至7の何れ一項に記載の方法を実行するために適切なシステムであって、少なくとも位置決め装置(2)と該位置決め装置(2)と協働するカメラ(5、25)を有するシステムであり、前記位置決め装置(2)により基板(24)において位置決めされた構成要素の画像は前記カメラにより形成され、前記位置決め装置は処理器を更に有し、前記基板(24)における前記構成要素(25)の実位置と前記基板(24)に対する前記構成要素(25)の所望の位置との差は前記カメラ(5、23)により形成された前記画像から決定されることができることを特徴とするシステム。
- 請求項8に記載のシステムであって、位置決め装置(2)は求められた前記差により前記処理器により適合されることができる、ことを特徴とするシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03100813 | 2003-03-28 | ||
PCT/IB2004/050319 WO2004086840A2 (en) | 2003-03-28 | 2004-03-23 | Method of placing at least one component on at least one substrate and apparatus therefore |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006521695A true JP2006521695A (ja) | 2006-09-21 |
JP4527717B2 JP4527717B2 (ja) | 2010-08-18 |
Family
ID=33041061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006506759A Expired - Lifetime JP4527717B2 (ja) | 2003-03-28 | 2004-03-23 | 少なくとも1つの基板において少なくとも1つの構成要素を載置する方法及びシステム |
Country Status (4)
Country | Link |
---|---|
US (1) | US7542151B2 (ja) |
JP (1) | JP4527717B2 (ja) |
DE (1) | DE112004000479T5 (ja) |
WO (1) | WO2004086840A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004086840A2 (en) * | 2003-03-28 | 2004-10-07 | Assembleon N.V. | Method of placing at least one component on at least one substrate and apparatus therefore |
KR101750521B1 (ko) * | 2015-07-27 | 2017-07-03 | 주식회사 고영테크놀러지 | 기판 검사 장치 및 방법 |
DE102015220746A1 (de) * | 2015-10-23 | 2017-04-27 | Ersa Gmbh | Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134899A (ja) * | 2000-10-25 | 2002-05-10 | Matsushita Electric Ind Co Ltd | 電子部品実装システムおよび電子部品実装方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4978224A (en) * | 1987-07-14 | 1990-12-18 | Sharp Kabushiki Kaisha | Method of and apparatus for inspecting mounting of chip components |
CA1285661C (en) | 1988-08-19 | 1991-07-02 | Randy Tsang | Automatic visual measurement of surface mount device placement |
WO1997022238A1 (en) * | 1995-12-14 | 1997-06-19 | Philips Electronics N.V. | Component placement machine and method of placing a component on a carrier by means of said component placement machine |
US5739846A (en) * | 1996-02-05 | 1998-04-14 | Universal Instruments Corporation | Method of inspecting component placement accuracy for each first selected circuit board to be assembled of a batch |
US6085407A (en) * | 1997-08-21 | 2000-07-11 | Micron Technology, Inc. | Component alignment apparatuses and methods |
US6408090B1 (en) | 1998-09-28 | 2002-06-18 | Siemens Production And Logistics System Aktiengesellschaft | Method for position recognition of components equipped on a substrate in an automatic equipping unit |
US20010055069A1 (en) | 2000-03-10 | 2001-12-27 | Hudson Edison T. | One camera system for component to substrate registration |
US20020030736A1 (en) * | 2000-03-10 | 2002-03-14 | Infotech Ag | Single camera alignment system using up/down optics |
WO2004086840A2 (en) * | 2003-03-28 | 2004-10-07 | Assembleon N.V. | Method of placing at least one component on at least one substrate and apparatus therefore |
DE602004010262T2 (de) * | 2003-06-24 | 2008-09-25 | Koninklijke Philips Electronics N.V. | Verfahren zum bewegen einer mit einer kamera versehenen vorrichtung zu einer zielposition mittels eines steuersytems und steuersystem dafür |
JP2005229111A (ja) * | 2004-02-13 | 2005-08-25 | Assembleon Nv | 基体上の少なくとも1つの部品配置位置を推定する方法及びかかる方法を実施する装置 |
US7657997B2 (en) * | 2004-08-20 | 2010-02-09 | Panasonic Corporation | Reference position determining method |
-
2004
- 2004-03-23 WO PCT/IB2004/050319 patent/WO2004086840A2/en active Application Filing
- 2004-03-23 US US10/550,603 patent/US7542151B2/en active Active
- 2004-03-23 DE DE112004000479T patent/DE112004000479T5/de not_active Ceased
- 2004-03-23 JP JP2006506759A patent/JP4527717B2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134899A (ja) * | 2000-10-25 | 2002-05-10 | Matsushita Electric Ind Co Ltd | 電子部品実装システムおよび電子部品実装方法 |
Also Published As
Publication number | Publication date |
---|---|
DE112004000479T5 (de) | 2006-02-16 |
WO2004086840A2 (en) | 2004-10-07 |
WO2004086840A3 (en) | 2005-02-10 |
JP4527717B2 (ja) | 2010-08-18 |
US20070165247A1 (en) | 2007-07-19 |
US7542151B2 (en) | 2009-06-02 |
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