JP2006504138A5 - - Google Patents

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Publication number
JP2006504138A5
JP2006504138A5 JP2004546943A JP2004546943A JP2006504138A5 JP 2006504138 A5 JP2006504138 A5 JP 2006504138A5 JP 2004546943 A JP2004546943 A JP 2004546943A JP 2004546943 A JP2004546943 A JP 2004546943A JP 2006504138 A5 JP2006504138 A5 JP 2006504138A5
Authority
JP
Japan
Prior art keywords
substrate
window
optical device
optical
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004546943A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006504138A (ja
Filing date
Publication date
Priority claimed from US10/065,460 external-priority patent/US6935792B2/en
Application filed filed Critical
Publication of JP2006504138A publication Critical patent/JP2006504138A/ja
Publication of JP2006504138A5 publication Critical patent/JP2006504138A5/ja
Pending legal-status Critical Current

Links

JP2004546943A 2002-10-21 2003-10-20 光電子パッケージ及びその製造方法 Pending JP2006504138A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/065,460 US6935792B2 (en) 2002-10-21 2002-10-21 Optoelectronic package and fabrication method
PCT/US2003/033279 WO2004038468A2 (en) 2002-10-21 2003-10-20 Optoelectronic package and fabrication method

Publications (2)

Publication Number Publication Date
JP2006504138A JP2006504138A (ja) 2006-02-02
JP2006504138A5 true JP2006504138A5 (cg-RX-API-DMAC10.html) 2006-12-07

Family

ID=32092196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004546943A Pending JP2006504138A (ja) 2002-10-21 2003-10-20 光電子パッケージ及びその製造方法

Country Status (7)

Country Link
US (1) US6935792B2 (cg-RX-API-DMAC10.html)
EP (1) EP1556723B1 (cg-RX-API-DMAC10.html)
JP (1) JP2006504138A (cg-RX-API-DMAC10.html)
CN (1) CN100403082C (cg-RX-API-DMAC10.html)
AU (1) AU2003284300A1 (cg-RX-API-DMAC10.html)
DE (1) DE60321702D1 (cg-RX-API-DMAC10.html)
WO (1) WO2004038468A2 (cg-RX-API-DMAC10.html)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7786983B2 (en) 2003-04-08 2010-08-31 Poa Sana Liquidating Trust Apparatus and method for a data input device using a light lamina screen
US7203387B2 (en) * 2003-09-10 2007-04-10 Agency For Science, Technology And Research VLSI-photonic heterogeneous integration by wafer bonding
US6985645B2 (en) * 2003-09-24 2006-01-10 International Business Machines Corporation Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines
US7509011B2 (en) * 2004-01-15 2009-03-24 Poa Sana Liquidating Trust Hybrid waveguide
US7144788B2 (en) * 2004-02-19 2006-12-05 Sumitomo Electric Industries, Ltd. Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein
US7471865B2 (en) * 2004-06-04 2008-12-30 Poa Sana Liquidating Trust Apparatus and method for a molded waveguide for use with touch screen displays
US7267930B2 (en) * 2004-06-04 2007-09-11 National Semiconductor Corporation Techniques for manufacturing a waveguide with a three-dimensional lens
JP2006189483A (ja) * 2004-12-28 2006-07-20 Sumitomo Bakelite Co Ltd 光導波路形成基板の製造方法および光導波路形成基板
US7642628B2 (en) * 2005-01-11 2010-01-05 Rosemount Inc. MEMS packaging with improved reaction to temperature changes
JP4760127B2 (ja) * 2005-05-20 2011-08-31 住友ベークライト株式会社 光導波路構造体
US7551814B1 (en) 2006-02-21 2009-06-23 National Semiconductor Corporation Optical detection of user interaction based on external light source
US20080031584A1 (en) * 2006-08-02 2008-02-07 National Semiconductor Corporation Apparatus and method for a singulation of polymer waveguides using photolithography
US7369724B2 (en) 2006-10-03 2008-05-06 National Semiconductor Corporation Apparatus and method for an improved lens structure for polymer wave guides which maximizes free space light coupling
JP4825729B2 (ja) * 2007-05-24 2011-11-30 日東電工株式会社 光導波路デバイスおよびその製造方法
US8138616B2 (en) * 2008-07-07 2012-03-20 Mediatek Inc. Bond pad structure
JP5272999B2 (ja) * 2009-09-30 2013-08-28 凸版印刷株式会社 光基板の製造方法
US8488921B2 (en) * 2010-07-16 2013-07-16 International Business Machines Corporation Packaged multicore fiber optical transceiver module
US9551844B2 (en) 2011-01-11 2017-01-24 Hewlett Packard Enterprise Development Lp Passive optical alignment
US8901576B2 (en) 2012-01-18 2014-12-02 International Business Machines Corporation Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
CN104040397B (zh) * 2012-01-31 2016-01-27 惠普发展公司，有限责任合伙企业 用于光电引擎的组合底部填充挡墙和电互连结构
US20140319677A1 (en) * 2012-06-08 2014-10-30 Hoya Corporation Usa Submount for electronic, optoelectronic, optical, or photonic components
JP5989412B2 (ja) * 2012-06-11 2016-09-07 新光電気工業株式会社 光モジュール及び光モジュールの製造方法
US10094988B2 (en) 2012-08-31 2018-10-09 Micron Technology, Inc. Method of forming photonics structures
JP6319762B2 (ja) * 2013-10-31 2018-05-09 日東電工株式会社 光電気混載基板およびその製法
CN103762205B (zh) * 2014-01-28 2017-02-01 华进半导体封装先导技术研发中心有限公司 兼容pcb工艺的多功能基板及其制作方法
EP3662311A1 (en) * 2017-08-01 2020-06-10 Rockley Photonics Limited Module with transmit optical subassembly and receive optical subassembly
US11525967B1 (en) 2018-09-28 2022-12-13 Apple Inc. Photonics integrated circuit architecture
US11131929B2 (en) 2018-11-07 2021-09-28 Waymo Llc Systems and methods that utilize angled photolithography for manufacturing light guide elements
US11881678B1 (en) 2019-09-09 2024-01-23 Apple Inc. Photonics assembly with a photonics die stack
US11500154B1 (en) 2019-10-18 2022-11-15 Apple Inc. Asymmetric optical power splitting system and method
US11131934B2 (en) 2019-10-29 2021-09-28 Waymo Llc Non-telecentric light guide elements
DE102020115377B4 (de) 2019-11-27 2026-01-15 Taiwan Semiconductor Manufacturing Co., Ltd. Package und verfahren zu dessen herstellung
US11635566B2 (en) 2019-11-27 2023-04-25 Taiwan Semiconductor Manufacturing Co., Ltd. Package and method of forming same
KR102277800B1 (ko) * 2019-12-11 2021-07-16 현대모비스 주식회사 방열판 일체형 파워 모듈 및 이의 제조방법
US11886001B2 (en) * 2019-12-20 2024-01-30 Snap Inc. Optical waveguide fabrication process
EP4182747B1 (en) * 2020-07-20 2025-06-18 Apple Inc. Photonic integrated circuits with controlled collapse chip connections
WO2023283294A1 (en) 2021-07-08 2023-01-12 Apple Inc. Light source modules for noise mitigation
US20230077877A1 (en) * 2021-09-10 2023-03-16 Advanced Semiconductor Engineering, Inc. Photonic package and method of manufacturing the same
US11914201B2 (en) 2021-09-23 2024-02-27 Apple Inc. Mechanisms that transfer light between layers of multi-chip photonic assemblies
CN116031238A (zh) * 2021-10-26 2023-04-28 群创光电股份有限公司 电子装置
CN114899699B (zh) * 2022-06-11 2024-03-26 奕富通集成科技(珠海横琴)有限公司 垂直腔面激光器封装结构及封装方法
US12111207B2 (en) 2022-09-23 2024-10-08 Apple Inc. Despeckling in optical measurement systems
CN115939100A (zh) * 2022-11-25 2023-04-07 无锡芯光互连技术研究院有限公司 多芯片封装方法和多芯片模块

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5428704A (en) * 1993-07-19 1995-06-27 Motorola, Inc. Optoelectronic interface and method of making
US5854866A (en) * 1995-03-14 1998-12-29 Texas Instruments Incorporated Multi-level architecture for optical time delays in integrated circuits
US5533151A (en) * 1995-04-28 1996-07-02 Texas Instruments Incorporated Active cladding optical modulator using an electro-optic polymer on an inorganic waveguide
US5932387A (en) * 1996-08-09 1999-08-03 Fuji Xerox Co., Ltd. Charged member for electrostatic development and sleeve for electrostatic development
US20020019305A1 (en) 1996-10-31 2002-02-14 Che-Kuang Wu Gray scale all-glass photomasks
US5900674A (en) * 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US6381380B1 (en) 1998-06-24 2002-04-30 The Trustees Of Princeton University Twin waveguide based design for photonic integrated circuits
US6706546B2 (en) * 1998-10-09 2004-03-16 Fujitsu Limited Optical reflective structures and method for making
US6684007B2 (en) 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
JP3100584B2 (ja) 1999-02-15 2000-10-16 日本電信電話株式会社 光電子集積回路およびその作製方法
US6236774B1 (en) * 1999-03-22 2001-05-22 Gemfire Corporation Optoelectronic and photonic devices formed of materials which inhibit degradation and failure
US6301401B1 (en) * 1999-04-02 2001-10-09 Convergence Technologies, Ltd. Electro-optical package for reducing parasitic effects
JP2001059923A (ja) * 1999-06-16 2001-03-06 Seiko Epson Corp 光モジュール及びその製造方法、半導体装置並びに光伝達装置
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6293688B1 (en) * 1999-11-12 2001-09-25 Sparkolor Corporation Tapered optical waveguide coupler

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