DE60321702D1 - Hren - Google Patents

Hren

Info

Publication number
DE60321702D1
DE60321702D1 DE60321702T DE60321702T DE60321702D1 DE 60321702 D1 DE60321702 D1 DE 60321702D1 DE 60321702 T DE60321702 T DE 60321702T DE 60321702 T DE60321702 T DE 60321702T DE 60321702 D1 DE60321702 D1 DE 60321702D1
Authority
DE
Germany
Prior art keywords
fees
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60321702T
Other languages
English (en)
Inventor
Richard Joseph Saia
Thomas Bert Gorczyca
Christopher James Kapusta
Ernest Wayne Balch
Glenn Scott Claydon
Sahmita Dasgupta
Eladio Clemente Delgado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE60321702D1 publication Critical patent/DE60321702D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
DE60321702T 2002-10-21 2003-10-20 Hren Expired - Lifetime DE60321702D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/065,460 US6935792B2 (en) 2002-10-21 2002-10-21 Optoelectronic package and fabrication method
PCT/US2003/033279 WO2004038468A2 (en) 2002-10-21 2003-10-20 Optoelectronic package and fabrication method

Publications (1)

Publication Number Publication Date
DE60321702D1 true DE60321702D1 (de) 2008-07-31

Family

ID=32092196

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60321702T Expired - Lifetime DE60321702D1 (de) 2002-10-21 2003-10-20 Hren

Country Status (7)

Country Link
US (1) US6935792B2 (de)
EP (1) EP1556723B1 (de)
JP (1) JP2006504138A (de)
CN (1) CN100403082C (de)
AU (1) AU2003284300A1 (de)
DE (1) DE60321702D1 (de)
WO (1) WO2004038468A2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7786983B2 (en) 2003-04-08 2010-08-31 Poa Sana Liquidating Trust Apparatus and method for a data input device using a light lamina screen
US7203387B2 (en) * 2003-09-10 2007-04-10 Agency For Science, Technology And Research VLSI-photonic heterogeneous integration by wafer bonding
US6985645B2 (en) * 2003-09-24 2006-01-10 International Business Machines Corporation Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines
US7509011B2 (en) * 2004-01-15 2009-03-24 Poa Sana Liquidating Trust Hybrid waveguide
US7144788B2 (en) * 2004-02-19 2006-12-05 Sumitomo Electric Industries, Ltd. Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein
US7267930B2 (en) * 2004-06-04 2007-09-11 National Semiconductor Corporation Techniques for manufacturing a waveguide with a three-dimensional lens
US7471865B2 (en) 2004-06-04 2008-12-30 Poa Sana Liquidating Trust Apparatus and method for a molded waveguide for use with touch screen displays
JP2006189483A (ja) * 2004-12-28 2006-07-20 Sumitomo Bakelite Co Ltd 光導波路形成基板の製造方法および光導波路形成基板
US7642628B2 (en) * 2005-01-11 2010-01-05 Rosemount Inc. MEMS packaging with improved reaction to temperature changes
JP4760127B2 (ja) * 2005-05-20 2011-08-31 住友ベークライト株式会社 光導波路構造体
US7551814B1 (en) 2006-02-21 2009-06-23 National Semiconductor Corporation Optical detection of user interaction based on external light source
US20080031584A1 (en) * 2006-08-02 2008-02-07 National Semiconductor Corporation Apparatus and method for a singulation of polymer waveguides using photolithography
US7369724B2 (en) 2006-10-03 2008-05-06 National Semiconductor Corporation Apparatus and method for an improved lens structure for polymer wave guides which maximizes free space light coupling
JP4825729B2 (ja) * 2007-05-24 2011-11-30 日東電工株式会社 光導波路デバイスおよびその製造方法
US8138616B2 (en) * 2008-07-07 2012-03-20 Mediatek Inc. Bond pad structure
JP5272999B2 (ja) * 2009-09-30 2013-08-28 凸版印刷株式会社 光基板の製造方法
US8488921B2 (en) * 2010-07-16 2013-07-16 International Business Machines Corporation Packaged multicore fiber optical transceiver module
WO2012096651A1 (en) 2011-01-11 2012-07-19 Hewlett-Packard Development Company, L.P. Passive optical alignment
US8901576B2 (en) 2012-01-18 2014-12-02 International Business Machines Corporation Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
US9917647B2 (en) 2012-01-31 2018-03-13 Hewlett Packard Enterprise Development Lp Combination underfill-dam and electrical-interconnect structure for an opto-electronic engine
KR20150020278A (ko) * 2012-06-08 2015-02-25 호야 코포레이션 유에스에이 전자, 광전자, 광학 또는 광자 컴포넌트를 위한 서브마운트
JP5989412B2 (ja) * 2012-06-11 2016-09-07 新光電気工業株式会社 光モジュール及び光モジュールの製造方法
US10094988B2 (en) * 2012-08-31 2018-10-09 Micron Technology, Inc. Method of forming photonics structures
JP6319762B2 (ja) * 2013-10-31 2018-05-09 日東電工株式会社 光電気混載基板およびその製法
CN103762205B (zh) * 2014-01-28 2017-02-01 华进半导体封装先导技术研发中心有限公司 兼容pcb工艺的多功能基板及其制作方法
GB2579936B (en) * 2017-08-01 2022-08-10 Rockley Photonics Ltd Module with transmit optical subassembly and receive optical subassembly
US11525967B1 (en) 2018-09-28 2022-12-13 Apple Inc. Photonics integrated circuit architecture
US11881678B1 (en) 2019-09-09 2024-01-23 Apple Inc. Photonics assembly with a photonics die stack
US11500154B1 (en) 2019-10-18 2022-11-15 Apple Inc. Asymmetric optical power splitting system and method
US11131934B2 (en) * 2019-10-29 2021-09-28 Waymo Llc Non-telecentric light guide elements
US11635566B2 (en) * 2019-11-27 2023-04-25 Taiwan Semiconductor Manufacturing Co., Ltd. Package and method of forming same
KR102277800B1 (ko) * 2019-12-11 2021-07-16 현대모비스 주식회사 방열판 일체형 파워 모듈 및 이의 제조방법
US11886001B2 (en) * 2019-12-20 2024-01-30 Snap Inc. Optical waveguide fabrication process
WO2022020257A1 (en) * 2020-07-20 2022-01-27 Apple Inc. Photonic integrated circuits with controlled collapse chip connections
US20230077877A1 (en) * 2021-09-10 2023-03-16 Advanced Semiconductor Engineering, Inc. Photonic package and method of manufacturing the same
US11914201B2 (en) 2021-09-23 2024-02-27 Apple Inc. Mechanisms that transfer light between layers of multi-chip photonic assemblies
CN114899699B (zh) * 2022-06-11 2024-03-26 奕富通集成科技(珠海横琴)有限公司 垂直腔面激光器封装结构及封装方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353498A (en) 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5428704A (en) * 1993-07-19 1995-06-27 Motorola, Inc. Optoelectronic interface and method of making
US5854866A (en) * 1995-03-14 1998-12-29 Texas Instruments Incorporated Multi-level architecture for optical time delays in integrated circuits
US5533151A (en) * 1995-04-28 1996-07-02 Texas Instruments Incorporated Active cladding optical modulator using an electro-optic polymer on an inorganic waveguide
US5932387A (en) * 1996-08-09 1999-08-03 Fuji Xerox Co., Ltd. Charged member for electrostatic development and sleeve for electrostatic development
US20020019305A1 (en) 1996-10-31 2002-02-14 Che-Kuang Wu Gray scale all-glass photomasks
US5900674A (en) 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US6381380B1 (en) 1998-06-24 2002-04-30 The Trustees Of Princeton University Twin waveguide based design for photonic integrated circuits
US6706546B2 (en) 1998-10-09 2004-03-16 Fujitsu Limited Optical reflective structures and method for making
US6684007B2 (en) 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
JP3100584B2 (ja) 1999-02-15 2000-10-16 日本電信電話株式会社 光電子集積回路およびその作製方法
US6236774B1 (en) * 1999-03-22 2001-05-22 Gemfire Corporation Optoelectronic and photonic devices formed of materials which inhibit degradation and failure
US6301401B1 (en) * 1999-04-02 2001-10-09 Convergence Technologies, Ltd. Electro-optical package for reducing parasitic effects
JP2001059923A (ja) * 1999-06-16 2001-03-06 Seiko Epson Corp 光モジュール及びその製造方法、半導体装置並びに光伝達装置
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6293688B1 (en) 1999-11-12 2001-09-25 Sparkolor Corporation Tapered optical waveguide coupler

Also Published As

Publication number Publication date
EP1556723A2 (de) 2005-07-27
JP2006504138A (ja) 2006-02-02
WO2004038468A3 (en) 2004-06-17
AU2003284300A1 (en) 2004-05-13
US6935792B2 (en) 2005-08-30
EP1556723B1 (de) 2008-06-18
CN100403082C (zh) 2008-07-16
AU2003284300A8 (en) 2004-05-13
CN1723405A (zh) 2006-01-18
WO2004038468A2 (en) 2004-05-06
US20040076382A1 (en) 2004-04-22

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