DE60321702D1 - Hren - Google Patents

Hren

Info

Publication number
DE60321702D1
DE60321702D1 DE60321702T DE60321702T DE60321702D1 DE 60321702 D1 DE60321702 D1 DE 60321702D1 DE 60321702 T DE60321702 T DE 60321702T DE 60321702 T DE60321702 T DE 60321702T DE 60321702 D1 DE60321702 D1 DE 60321702D1
Authority
DE
Germany
Prior art keywords
fees
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60321702T
Other languages
German (de)
English (en)
Inventor
Richard Joseph Saia
Thomas Bert Gorczyca
Christopher James Kapusta
Ernest Wayne Balch
Glenn Scott Claydon
Sahmita Dasgupta
Eladio Clemente Delgado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE60321702D1 publication Critical patent/DE60321702D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
DE60321702T 2002-10-21 2003-10-20 Hren Expired - Lifetime DE60321702D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/065,460 US6935792B2 (en) 2002-10-21 2002-10-21 Optoelectronic package and fabrication method
PCT/US2003/033279 WO2004038468A2 (en) 2002-10-21 2003-10-20 Optoelectronic package and fabrication method

Publications (1)

Publication Number Publication Date
DE60321702D1 true DE60321702D1 (de) 2008-07-31

Family

ID=32092196

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60321702T Expired - Lifetime DE60321702D1 (de) 2002-10-21 2003-10-20 Hren

Country Status (7)

Country Link
US (1) US6935792B2 (cg-RX-API-DMAC10.html)
EP (1) EP1556723B1 (cg-RX-API-DMAC10.html)
JP (1) JP2006504138A (cg-RX-API-DMAC10.html)
CN (1) CN100403082C (cg-RX-API-DMAC10.html)
AU (1) AU2003284300A1 (cg-RX-API-DMAC10.html)
DE (1) DE60321702D1 (cg-RX-API-DMAC10.html)
WO (1) WO2004038468A2 (cg-RX-API-DMAC10.html)

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US7786983B2 (en) 2003-04-08 2010-08-31 Poa Sana Liquidating Trust Apparatus and method for a data input device using a light lamina screen
US7203387B2 (en) * 2003-09-10 2007-04-10 Agency For Science, Technology And Research VLSI-photonic heterogeneous integration by wafer bonding
US6985645B2 (en) * 2003-09-24 2006-01-10 International Business Machines Corporation Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines
US7509011B2 (en) * 2004-01-15 2009-03-24 Poa Sana Liquidating Trust Hybrid waveguide
US7144788B2 (en) * 2004-02-19 2006-12-05 Sumitomo Electric Industries, Ltd. Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein
US7471865B2 (en) * 2004-06-04 2008-12-30 Poa Sana Liquidating Trust Apparatus and method for a molded waveguide for use with touch screen displays
US7267930B2 (en) * 2004-06-04 2007-09-11 National Semiconductor Corporation Techniques for manufacturing a waveguide with a three-dimensional lens
JP2006189483A (ja) * 2004-12-28 2006-07-20 Sumitomo Bakelite Co Ltd 光導波路形成基板の製造方法および光導波路形成基板
US7642628B2 (en) * 2005-01-11 2010-01-05 Rosemount Inc. MEMS packaging with improved reaction to temperature changes
JP4760127B2 (ja) * 2005-05-20 2011-08-31 住友ベークライト株式会社 光導波路構造体
US7551814B1 (en) 2006-02-21 2009-06-23 National Semiconductor Corporation Optical detection of user interaction based on external light source
US20080031584A1 (en) * 2006-08-02 2008-02-07 National Semiconductor Corporation Apparatus and method for a singulation of polymer waveguides using photolithography
US7369724B2 (en) 2006-10-03 2008-05-06 National Semiconductor Corporation Apparatus and method for an improved lens structure for polymer wave guides which maximizes free space light coupling
JP4825729B2 (ja) * 2007-05-24 2011-11-30 日東電工株式会社 光導波路デバイスおよびその製造方法
US8138616B2 (en) * 2008-07-07 2012-03-20 Mediatek Inc. Bond pad structure
JP5272999B2 (ja) * 2009-09-30 2013-08-28 凸版印刷株式会社 光基板の製造方法
US8488921B2 (en) * 2010-07-16 2013-07-16 International Business Machines Corporation Packaged multicore fiber optical transceiver module
US9551844B2 (en) 2011-01-11 2017-01-24 Hewlett Packard Enterprise Development Lp Passive optical alignment
US8901576B2 (en) 2012-01-18 2014-12-02 International Business Machines Corporation Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
CN104040397B (zh) * 2012-01-31 2016-01-27 惠普发展公司，有限责任合伙企业 用于光电引擎的组合底部填充挡墙和电互连结构
US20140319677A1 (en) * 2012-06-08 2014-10-30 Hoya Corporation Usa Submount for electronic, optoelectronic, optical, or photonic components
JP5989412B2 (ja) * 2012-06-11 2016-09-07 新光電気工業株式会社 光モジュール及び光モジュールの製造方法
US10094988B2 (en) 2012-08-31 2018-10-09 Micron Technology, Inc. Method of forming photonics structures
JP6319762B2 (ja) * 2013-10-31 2018-05-09 日東電工株式会社 光電気混載基板およびその製法
CN103762205B (zh) * 2014-01-28 2017-02-01 华进半导体封装先导技术研发中心有限公司 兼容pcb工艺的多功能基板及其制作方法
EP3662311A1 (en) * 2017-08-01 2020-06-10 Rockley Photonics Limited Module with transmit optical subassembly and receive optical subassembly
US11525967B1 (en) 2018-09-28 2022-12-13 Apple Inc. Photonics integrated circuit architecture
US11131929B2 (en) 2018-11-07 2021-09-28 Waymo Llc Systems and methods that utilize angled photolithography for manufacturing light guide elements
US11881678B1 (en) 2019-09-09 2024-01-23 Apple Inc. Photonics assembly with a photonics die stack
US11500154B1 (en) 2019-10-18 2022-11-15 Apple Inc. Asymmetric optical power splitting system and method
US11131934B2 (en) 2019-10-29 2021-09-28 Waymo Llc Non-telecentric light guide elements
DE102020115377B4 (de) 2019-11-27 2026-01-15 Taiwan Semiconductor Manufacturing Co., Ltd. Package und verfahren zu dessen herstellung
US11635566B2 (en) 2019-11-27 2023-04-25 Taiwan Semiconductor Manufacturing Co., Ltd. Package and method of forming same
KR102277800B1 (ko) * 2019-12-11 2021-07-16 현대모비스 주식회사 방열판 일체형 파워 모듈 및 이의 제조방법
US11886001B2 (en) * 2019-12-20 2024-01-30 Snap Inc. Optical waveguide fabrication process
EP4182747B1 (en) * 2020-07-20 2025-06-18 Apple Inc. Photonic integrated circuits with controlled collapse chip connections
WO2023283294A1 (en) 2021-07-08 2023-01-12 Apple Inc. Light source modules for noise mitigation
US20230077877A1 (en) * 2021-09-10 2023-03-16 Advanced Semiconductor Engineering, Inc. Photonic package and method of manufacturing the same
US11914201B2 (en) 2021-09-23 2024-02-27 Apple Inc. Mechanisms that transfer light between layers of multi-chip photonic assemblies
CN116031238A (zh) * 2021-10-26 2023-04-28 群创光电股份有限公司 电子装置
CN114899699B (zh) * 2022-06-11 2024-03-26 奕富通集成科技(珠海横琴)有限公司 垂直腔面激光器封装结构及封装方法
US12111207B2 (en) 2022-09-23 2024-10-08 Apple Inc. Despeckling in optical measurement systems
CN115939100A (zh) * 2022-11-25 2023-04-07 无锡芯光互连技术研究院有限公司 多芯片封装方法和多芯片模块

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Also Published As

Publication number Publication date
CN1723405A (zh) 2006-01-18
US20040076382A1 (en) 2004-04-22
AU2003284300A8 (en) 2004-05-13
EP1556723A2 (en) 2005-07-27
US6935792B2 (en) 2005-08-30
WO2004038468A2 (en) 2004-05-06
AU2003284300A1 (en) 2004-05-13
JP2006504138A (ja) 2006-02-02
WO2004038468A3 (en) 2004-06-17
EP1556723B1 (en) 2008-06-18
CN100403082C (zh) 2008-07-16

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