JP2006502557A5 - - Google Patents
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- Publication number
- JP2006502557A5 JP2006502557A5 JP2003541052A JP2003541052A JP2006502557A5 JP 2006502557 A5 JP2006502557 A5 JP 2006502557A5 JP 2003541052 A JP2003541052 A JP 2003541052A JP 2003541052 A JP2003541052 A JP 2003541052A JP 2006502557 A5 JP2006502557 A5 JP 2006502557A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/016,288 US6563905B1 (en) | 2001-10-30 | 2001-10-30 | Ball grid array X-ray orientation mark |
| PCT/US2002/034809 WO2003038896A2 (en) | 2001-10-30 | 2002-10-29 | Ball grid array with x-ray alignment mark |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009256294A Division JP2010103543A (ja) | 2001-10-30 | 2009-11-09 | ボールグリッドアレイｘ線方位マーク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006502557A JP2006502557A (ja) | 2006-01-19 |
| JP2006502557A5 true JP2006502557A5 (enExample) | 2009-03-19 |
Family
ID=21776350
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003541052A Pending JP2006502557A (ja) | 2001-10-30 | 2002-10-29 | ボール状のグリッドアレイｘ線方位マーク |
| JP2009256294A Pending JP2010103543A (ja) | 2001-10-30 | 2009-11-09 | ボールグリッドアレイｘ線方位マーク |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009256294A Pending JP2010103543A (ja) | 2001-10-30 | 2009-11-09 | ボールグリッドアレイｘ線方位マーク |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6563905B1 (enExample) |
| EP (1) | EP1440471A2 (enExample) |
| JP (2) | JP2006502557A (enExample) |
| CN (1) | CN100375281C (enExample) |
| AU (1) | AU2002342218A1 (enExample) |
| BR (1) | BR0206243A (enExample) |
| CA (1) | CA2433488A1 (enExample) |
| IL (2) | IL156724A0 (enExample) |
| WO (1) | WO2003038896A2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7027070B2 (en) * | 2001-11-29 | 2006-04-11 | Agilent Technologies, Inc. | Systems and methods for manipulating a graphical display of a printed circuit board model for an automated x-ray inspection system |
| US7386376B2 (en) | 2002-01-25 | 2008-06-10 | Intelligent Mechatronic Systems, Inc. | Vehicle visual and non-visual data recording system |
| US7529336B2 (en) | 2007-05-31 | 2009-05-05 | Test Research, Inc. | System and method for laminography inspection |
| US7989229B2 (en) * | 2007-09-10 | 2011-08-02 | International Business Machines Corporation | Tactile surface inspection during device fabrication or assembly |
| JP5493360B2 (ja) * | 2009-01-08 | 2014-05-14 | オムロン株式会社 | Ｘ線検査方法、ｘ線検査装置およびｘ線検査プログラム |
| JP2014192176A (ja) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | 配線基板 |
| CN109196339B (zh) * | 2016-04-04 | 2021-06-29 | 索雷克核研究中心 | 电子系统、验证电子系统的部件的兼容性的方法 |
| US11029267B2 (en) * | 2016-04-04 | 2021-06-08 | Security Matters Ltd. | Method and a system for XRF marking and reading XRF marks of electronic systems |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4926452A (en) * | 1987-10-30 | 1990-05-15 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
| GB8806232D0 (en) * | 1988-03-16 | 1988-04-13 | Plessey Co Plc | Vernier structure for flip chip bonded devices |
| JP3457348B2 (ja) * | 1993-01-15 | 2003-10-14 | 株式会社東芝 | 半導体装置の製造方法 |
| US5465152A (en) * | 1994-06-03 | 1995-11-07 | Robotic Vision Systems, Inc. | Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar structures |
| JPH10226A (ja) * | 1996-04-15 | 1998-01-06 | Mitsugi Sugiyama | Ｘ線により識別可能なプレス・スルー・パッケージ包装 |
| JPH1074802A (ja) * | 1996-08-30 | 1998-03-17 | Shimu:Kk | ボールグリッドアレイパッケージの接続構造及びその接続検査方法 |
| JP3535683B2 (ja) * | 1997-01-09 | 2004-06-07 | 株式会社ルネサステクノロジ | 位置認識用マーク付半導体装置 |
| JPH10284812A (ja) * | 1997-04-08 | 1998-10-23 | Mitsubishi Electric Corp | 半導体デバイス |
| DE59809216D1 (de) * | 1997-05-05 | 2003-09-11 | Macrotron Process Technologies | Verfahren und schaltungsanordnung zur prüfung von lötstellen |
| JPH11191575A (ja) * | 1997-12-25 | 1999-07-13 | Shinkawa Ltd | フリップチップボンディング用部品、フリップチップボンディング確認用部品及びフリップチップボンディング方法 |
| JP3929178B2 (ja) * | 1998-07-30 | 2007-06-13 | シチズン時計株式会社 | Ｉｃ実装構造 |
| GB2344550A (en) * | 1998-12-09 | 2000-06-14 | Ibm | Pad design for electronic package |
| US6272204B1 (en) * | 1999-02-23 | 2001-08-07 | Cr Technology, Inc. | Integrated X-ray and visual inspection systems |
| US6577019B1 (en) * | 2000-01-21 | 2003-06-10 | Micron Technology, Inc. | Alignment and orientation features for a semiconductor package |
| US6617702B2 (en) * | 2001-01-25 | 2003-09-09 | Ibm Corporation | Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate |
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2001
- 2001-10-30 US US10/016,288 patent/US6563905B1/en not_active Expired - Lifetime
-
2002
- 2002-10-29 WO PCT/US2002/034809 patent/WO2003038896A2/en not_active Ceased
- 2002-10-29 BR BR0206243-7A patent/BR0206243A/pt not_active IP Right Cessation
- 2002-10-29 JP JP2003541052A patent/JP2006502557A/ja active Pending
- 2002-10-29 EP EP02776377A patent/EP1440471A2/en not_active Withdrawn
- 2002-10-29 IL IL15672402A patent/IL156724A0/xx active IP Right Grant
- 2002-10-29 AU AU2002342218A patent/AU2002342218A1/en not_active Abandoned
- 2002-10-29 CA CA002433488A patent/CA2433488A1/en not_active Abandoned
- 2002-10-29 CN CNB028045300A patent/CN100375281C/zh not_active Expired - Fee Related
- 2002-12-06 US US10/313,401 patent/US6777821B2/en not_active Expired - Fee Related
-
2003
- 2003-06-30 IL IL156724A patent/IL156724A/en not_active IP Right Cessation
-
2009
- 2009-11-09 JP JP2009256294A patent/JP2010103543A/ja active Pending