JP2006352103A - 印刷配線板 - Google Patents
印刷配線板 Download PDFInfo
- Publication number
- JP2006352103A JP2006352103A JP2006139126A JP2006139126A JP2006352103A JP 2006352103 A JP2006352103 A JP 2006352103A JP 2006139126 A JP2006139126 A JP 2006139126A JP 2006139126 A JP2006139126 A JP 2006139126A JP 2006352103 A JP2006352103 A JP 2006352103A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- thickness
- conductor
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 113
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000005530 etching Methods 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 38
- 238000007747 plating Methods 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 238000005452 bending Methods 0.000 claims description 35
- 229920001187 thermosetting polymer Polymers 0.000 claims description 34
- 239000011342 resin composition Substances 0.000 claims description 28
- 239000000835 fiber Substances 0.000 claims description 22
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 12
- 125000003368 amide group Chemical group 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 82
- 239000011889 copper foil Substances 0.000 description 52
- 238000000034 method Methods 0.000 description 42
- 229910052802 copper Inorganic materials 0.000 description 31
- 239000010949 copper Substances 0.000 description 31
- 239000003822 epoxy resin Substances 0.000 description 19
- 229920000647 polyepoxide Polymers 0.000 description 19
- 239000004962 Polyamide-imide Substances 0.000 description 17
- 229920002312 polyamide-imide Polymers 0.000 description 17
- -1 siloxane structure Chemical group 0.000 description 16
- 150000001412 amines Chemical class 0.000 description 14
- 239000010410 layer Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000011888 foil Substances 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 150000004984 aromatic diamines Chemical class 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 2
- 229910000071 diazene Inorganic materials 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical class C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical class C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical compound C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 1
- NEAQRZUHTPSBBM-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-7-nitro-4h-isoquinolin-1-one Chemical compound C1=C([N+]([O-])=O)C=C2C(=O)N(O)C(C)(C)CC2=C1 NEAQRZUHTPSBBM-UHFFFAOYSA-N 0.000 description 1
- LGZNZXOHAFRWEN-UHFFFAOYSA-N 3-[4-(2,5-dioxopyrrol-3-yl)triazin-5-yl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C(=NN=NC=2)C=2C(NC(=O)C=2)=O)=C1 LGZNZXOHAFRWEN-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- PJCCVNKHRXIAHZ-UHFFFAOYSA-N 4-[4-[[4-(4-aminophenoxy)phenyl]methyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1CC(C=C1)=CC=C1OC1=CC=C(N)C=C1 PJCCVNKHRXIAHZ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000009261 D 400 Substances 0.000 description 1
- SQSPRWMERUQXNE-UHFFFAOYSA-N Guanylurea Chemical compound NC(=N)NC(N)=O SQSPRWMERUQXNE-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- LSDYQEILXDCDTR-UHFFFAOYSA-N bis[4-(4-aminophenoxy)phenyl]methanone Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 LSDYQEILXDCDTR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- FNXLCIKXHOPCKH-UHFFFAOYSA-N bromamine Chemical compound BrN FNXLCIKXHOPCKH-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000006838 isophorone group Chemical group 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 125000005515 organic divalent group Chemical group 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical class CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical class CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
【解決手段】 印刷配線板40は、基材1と、屈曲領域36に形成された導体7と、非屈曲領域46に形成された導体8,9とを備える構成を有している。屈曲領域36に形成された導体7は、1〜30μmの総厚みを有しており、非屈曲領域46に形成された導体8,9は、30〜150μmの総厚みを有している。
【選択図】 図1
Description
図1は、屈曲領域に形成された導体をエッチングする工程を模式的に示す工程断面図である。まず、図1(a)に示すように、繊維基材、及び、柔軟性を有する熱硬化性樹脂組成物を含む基材1と、この基材1の片面に積層された厚み18μmの銅箔2と、基材1のもう一方の面に積層された厚み70μmの銅箔3とを備える銅張り積層板30を準備する。
図2は、非屈曲領域に形成された導体にめっきする工程を模式的に示す工程断面図である。まず、図2(a)に示すように、繊維基材、及び、柔軟性を有する熱硬化性樹脂組成物を含む基材1と、この基材1の両面に積層された厚み3μmの銅箔10とを備える銅張り積層板50を準備する。
なお、上記一般式(3)で表されるシロキサンジアミンとしては、X−22−161AS(アミン当量450)、X−22−161A(アミン当量840)、X−22−161B(アミン当量1500)(以上、信越化学工業株式会社製)、BY16−853(アミン当量650)、BY16−853B(アミン当量2200)、(以上、東レダウコーニングシリコーン株式会社製)等が例示できる。また、上記一般式(6)で表されるシロキサンジアミンとしては、X−22−9409(アミン当量700)、X−22−1660B−3(アミン当量2200)(以上、信越化学工業株式会社製)等が例示できる。
まず、厚み0.019mmのガラス布(旭シュエーベル株式会社製1027)を含む厚み50μmのイミド系プリプレグ(日立化成工業株式会社製)を準備した。次いで、このプリプレグの片側の面に、厚み18μmの銅箔(F2−WS−18、古河サーキットフォイル株式会社製)を、これと反対側の面に、厚み70μmの銅箔(SLP−70日本電解株式会社製)を、それぞれ接着面がプリプレグと合わさるようにして重ねた。そして、これを230℃、90分、4.0MPaのプレス条件でプレスし、これにより両面銅張り積層板を得た。
まず、厚み0.028mmのガラス布(旭シュエーベル株式会社製1037)を含む厚み50μmのアクリルエポキシ系プリプレグ(日立化成工業株式会社製)を準備した。次いで、このプリプレグの両側に厚み3μmの銅箔(マイクロシン、三井金属株式会社製)を接着面がプリプレグと合わさるようにして重ねた。そして、これを180℃、90分、4.0MPaのプレス条件でプレスし、これにより両面銅張り積層板を得た。
まず、厚み0.019mmのガラス布(旭シュエーベル株式会社製1027)を含む、厚み50μmのイミド系プリプレグ(日立化成工業(株)製)を準備した。次いで、このプリプレグの両側に、厚み35μmの銅箔(GTS−35、古河サーキットフォイル(株)製)を、接着面がプリプレグと合わさるようにして重ねた。そして、これを230℃、90分、4.0MPaのプレス条件でプレスし、これにより両面銅張積層板を作製した。
実施例1及び2で得られた印刷配線板について、それぞれ折り曲げ試験を行った。その結果、どちらの印刷配線板も、フレキシブル部分で任意に折り曲げることができた。具体的には、曲率半径0.5mmのピンに沿って180度折り曲げることが可能であった。また折り曲げた配線板を再度開いてみたところ、折り曲げ部分にはクラックなどの外観異常は見られなかった。
Claims (10)
- 屈曲性を有する基材と、この基材の少なくとも一側に形成された導体と、を備える印刷配線板であって、
屈曲される屈曲領域、及び、屈曲されない非屈曲領域を有し、
前記屈曲領域に形成された前記導体の厚みは1〜30μmであり、前記非屈曲領域に形成された前記導体の厚みは30〜150μmである、印刷配線板。 - 前記非屈曲領域に形成された前記導体の厚みは、前記屈曲領域に形成された前記導体の厚みよりも大きい、請求項1記載の印刷配線板。
- 前記屈曲領域に形成された前記導体の厚みは、前記非屈曲領域に形成された前記導体の厚みの6〜60%である、請求項1又は2記載の印刷配線板。
- 前記屈曲領域に形成された導体を、エッチングにより厚みを1〜30μmとした、請求項1〜3のいずれか一項に記載の印刷配線板。
- 前記非屈曲領域に形成された導体を、めっきにより厚みを30〜150μmとした、請求項1〜4のいずれか一項に記載の印刷配線板。
- 前記基材は、繊維基材を含み、且つ、該繊維基材が厚み50μm以下のガラスクロスである、請求項1〜5のいずれか一項に記載の印刷配線板。
- 前記基材が、熱硬化性樹脂組成物を含む、請求項1〜6のいずれか一項に記載の印刷配線板。
- 前記熱硬化性樹脂組成物は、グリシジル基を有する樹脂を含む、請求項7記載の印刷配線板。
- 前記熱硬化性樹脂組成物は、アミド基を有する樹脂を含む、請求項7又は8記載の印刷配線板。
- 前記熱硬化性樹脂組成物は、アクリル樹脂を含む、請求項7〜9のいずれか一項に記載の印刷配線板。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006139126A JP5124984B2 (ja) | 2005-05-20 | 2006-05-18 | 印刷配線板 |
PCT/JP2006/310046 WO2006123783A1 (ja) | 2005-05-20 | 2006-05-19 | 印刷配線板 |
KR1020077029536A KR20080012980A (ko) | 2005-05-20 | 2006-05-19 | 인쇄 배선판 |
CN2006800175866A CN101180925B (zh) | 2005-05-20 | 2006-05-19 | 印制电路板 |
TW095118057A TWI391040B (zh) | 2005-05-20 | 2006-05-19 | A printed circuit board |
US11/915,097 US8664534B2 (en) | 2005-05-20 | 2006-05-19 | Printed wiring board |
DE112006001295T DE112006001295T5 (de) | 2005-05-20 | 2006-05-19 | Leiterplatte |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005148150 | 2005-05-20 | ||
JP2005148150 | 2005-05-20 | ||
JP2006139126A JP5124984B2 (ja) | 2005-05-20 | 2006-05-18 | 印刷配線板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012134043A Division JP2012169680A (ja) | 2005-05-20 | 2012-06-13 | 印刷配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006352103A true JP2006352103A (ja) | 2006-12-28 |
JP5124984B2 JP5124984B2 (ja) | 2013-01-23 |
Family
ID=37431352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006139126A Active JP5124984B2 (ja) | 2005-05-20 | 2006-05-18 | 印刷配線板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8664534B2 (ja) |
JP (1) | JP5124984B2 (ja) |
KR (1) | KR20080012980A (ja) |
CN (1) | CN101180925B (ja) |
DE (1) | DE112006001295T5 (ja) |
TW (1) | TWI391040B (ja) |
WO (1) | WO2006123783A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011109082A (ja) * | 2009-10-22 | 2011-06-02 | Nippon Steel Chem Co Ltd | フレキシブル両面銅張積層板及びフレキシブル回路基板並びに多層回路基板 |
US20130092421A1 (en) * | 2010-05-27 | 2013-04-18 | Nippon Mektron, Ltd. | Flexible circuit board |
KR20140068946A (ko) | 2011-08-30 | 2014-06-09 | 히타치가세이가부시끼가이샤 | 액상 잉크 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008035416A1 (fr) * | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Plaquette de circuit imprimé flexorigide et procédé de fabrication de la plaquette de circuit imprimé flexorigide |
FR2966692B1 (fr) * | 2010-10-26 | 2012-12-14 | Sagem Defense Securite | Carte electronique, dispositif electronique comportant une telle carte et procede de protection d'une carte electronique |
US8823186B2 (en) | 2010-12-27 | 2014-09-02 | Shin-Etsu Chemical Co., Ltd. | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus |
JP5934078B2 (ja) * | 2012-11-19 | 2016-06-15 | 信越化学工業株式会社 | 繊維含有樹脂基板及び半導体装置の製造方法 |
CN106063393B (zh) * | 2015-02-16 | 2019-03-22 | 日本梅克特隆株式会社 | 柔性印刷布线板的制造方法 |
EP3358359B1 (de) * | 2017-02-01 | 2019-08-28 | Siemens Aktiengesellschaft | Leiterplatte mit implantiertem optischen stromsensor |
DE102018212272A1 (de) * | 2018-07-24 | 2020-01-30 | Robert Bosch Gmbh | Keramischer Schaltungsträger und Elektronikeinheit |
DE102019201281B4 (de) * | 2019-01-31 | 2022-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Trägeranordnung und Verfahren zur Herstellung einer Trägeranordnung |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012991A (ja) * | 1998-06-18 | 2000-01-14 | Nitto Denko Corp | 異なる厚さの導体層を有する回路基板形成部材およびそれを用いた回路基板 |
JP2000196205A (ja) * | 1998-12-28 | 2000-07-14 | Fujitsu Ltd | フレキシブルプリント基板 |
JP2001351448A (ja) * | 2000-06-06 | 2001-12-21 | Mitsui Chemicals Inc | フラットケーブルの製造方法及びフラットケーブル |
JP2004168942A (ja) * | 2002-11-21 | 2004-06-17 | Hitachi Chem Co Ltd | 接着剤層付きプリプレグの製造方法及び接着剤層付きプリプレグ |
JP2006269979A (ja) * | 2005-03-25 | 2006-10-05 | Daisho Denshi:Kk | フレックスリジッドプリント配線板およびフレックスリジッドプリント配線板の製造方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825057A (ja) | 1981-07-16 | 1983-02-15 | Jeol Ltd | 質量分析装置 |
DE4003345C1 (ja) * | 1990-02-05 | 1991-08-08 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
JPH0462885A (ja) | 1990-06-25 | 1992-02-27 | Seiko Epson Corp | フレキシブル回路基板 |
JP2875076B2 (ja) * | 1990-11-29 | 1999-03-24 | 三井化学株式会社 | フレキシブル配線基板 |
JPH06302962A (ja) | 1993-02-19 | 1994-10-28 | Mitsubishi Rayon Co Ltd | リジッド−フレキシブル配線板およびその製造方法 |
JPH08193139A (ja) | 1995-01-17 | 1996-07-30 | Nippon Steel Chem Co Ltd | プリント配線板用プリプレグ及びそれを用いた金属張積層板 |
US5758575A (en) * | 1995-06-07 | 1998-06-02 | Bemis Company Inc. | Apparatus for printing an electrical circuit component with print cells in liquid communication |
EP0913429B1 (en) * | 1997-10-29 | 2005-12-28 | Hitachi Chemical Company, Ltd. | Siloxane-modified polyamideimide resin composition adhesive film, adhesive sheet and semiconductor device |
US6198634B1 (en) * | 1999-03-31 | 2001-03-06 | International Business Machines Corporation | Electronic package with stacked connections |
JP4442832B2 (ja) * | 1999-04-13 | 2010-03-31 | イビデン株式会社 | 多層プリント配線板 |
JP3744383B2 (ja) | 2000-06-09 | 2006-02-08 | 松下電器産業株式会社 | 複合配線基板及びその製造方法 |
JP2002246748A (ja) * | 2001-02-16 | 2002-08-30 | Nippon Mektron Ltd | フレキシブルプリント基板およびその製造方法 |
JP4455806B2 (ja) | 2001-05-24 | 2010-04-21 | 日立化成工業株式会社 | プリプレグ及び積層板 |
JP4412864B2 (ja) * | 2001-05-30 | 2010-02-10 | 日本メクトロン株式会社 | 両面可撓性回路基板の製造法 |
KR100515492B1 (ko) * | 2001-12-27 | 2005-09-20 | 미쓰이 가가쿠 가부시키가이샤 | 회로기판 및 그 제조방법 |
JP2004051689A (ja) | 2002-07-17 | 2004-02-19 | Sumitomo Chem Co Ltd | プリプレグ及び基板材料 |
JP2004266170A (ja) * | 2003-03-04 | 2004-09-24 | Showa Denko Kk | プリント配線基板用積層体の製造方法 |
TW200500387A (en) | 2003-06-02 | 2005-01-01 | Showa Denko Kk | Flexible wiring board and flex-rigid wiring board |
JP4363137B2 (ja) * | 2003-09-16 | 2009-11-11 | 日立化成工業株式会社 | 金属箔層付き基板フィルム及び両面金属箔付き基板フィルム |
JP4536430B2 (ja) * | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
JP5007057B2 (ja) | 2006-03-17 | 2012-08-22 | 公益財団法人高輝度光科学研究センター | 電子ビーム発生装置 |
-
2006
- 2006-05-18 JP JP2006139126A patent/JP5124984B2/ja active Active
- 2006-05-19 TW TW095118057A patent/TWI391040B/zh not_active IP Right Cessation
- 2006-05-19 KR KR1020077029536A patent/KR20080012980A/ko not_active Application Discontinuation
- 2006-05-19 US US11/915,097 patent/US8664534B2/en not_active Expired - Fee Related
- 2006-05-19 WO PCT/JP2006/310046 patent/WO2006123783A1/ja active Application Filing
- 2006-05-19 DE DE112006001295T patent/DE112006001295T5/de not_active Withdrawn
- 2006-05-19 CN CN2006800175866A patent/CN101180925B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012991A (ja) * | 1998-06-18 | 2000-01-14 | Nitto Denko Corp | 異なる厚さの導体層を有する回路基板形成部材およびそれを用いた回路基板 |
JP2000196205A (ja) * | 1998-12-28 | 2000-07-14 | Fujitsu Ltd | フレキシブルプリント基板 |
JP2001351448A (ja) * | 2000-06-06 | 2001-12-21 | Mitsui Chemicals Inc | フラットケーブルの製造方法及びフラットケーブル |
JP2004168942A (ja) * | 2002-11-21 | 2004-06-17 | Hitachi Chem Co Ltd | 接着剤層付きプリプレグの製造方法及び接着剤層付きプリプレグ |
JP2006269979A (ja) * | 2005-03-25 | 2006-10-05 | Daisho Denshi:Kk | フレックスリジッドプリント配線板およびフレックスリジッドプリント配線板の製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011109082A (ja) * | 2009-10-22 | 2011-06-02 | Nippon Steel Chem Co Ltd | フレキシブル両面銅張積層板及びフレキシブル回路基板並びに多層回路基板 |
US20130092421A1 (en) * | 2010-05-27 | 2013-04-18 | Nippon Mektron, Ltd. | Flexible circuit board |
US9089050B2 (en) * | 2010-05-27 | 2015-07-21 | Nippon Mektron, Ltd. | Flexible circuit board |
KR20140068946A (ko) | 2011-08-30 | 2014-06-09 | 히타치가세이가부시끼가이샤 | 액상 잉크 |
Also Published As
Publication number | Publication date |
---|---|
JP5124984B2 (ja) | 2013-01-23 |
KR20080012980A (ko) | 2008-02-12 |
TWI391040B (zh) | 2013-03-21 |
DE112006001295T5 (de) | 2008-04-17 |
US8664534B2 (en) | 2014-03-04 |
CN101180925A (zh) | 2008-05-14 |
WO2006123783A1 (ja) | 2006-11-23 |
US20100270059A1 (en) | 2010-10-28 |
CN101180925B (zh) | 2010-05-19 |
TW200704295A (en) | 2007-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5124984B2 (ja) | 印刷配線板 | |
TWI450651B (zh) | Multilayer wiring board | |
JP5470725B2 (ja) | 金属箔張積層板及びプリント配線板 | |
JP2006066894A (ja) | 印刷回路板 | |
JP4517749B2 (ja) | プリプレグ並びにこれを用いた金属張積層板及び印刷回路板 | |
JP4735092B2 (ja) | 印刷回路板 | |
JP4962001B2 (ja) | 絶縁性基板、金属箔付き基板、及びプリント配線板 | |
JP2008201117A (ja) | 樹脂付き金属薄膜、印刷回路板及びその製造方法、並びに、多層配線板及びその製造方法 | |
JP4736671B2 (ja) | プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板 | |
JP5018011B2 (ja) | 金属箔張り積層板、樹脂付き金属箔及び多層プリント配線板 | |
JP4555985B2 (ja) | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 | |
JP4075581B2 (ja) | 接着剤層付きプリプレグ、金属張積層板の製造方法及び金属張積層板 | |
JP4590982B2 (ja) | 樹脂付き金属箔 | |
JP5241992B2 (ja) | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 | |
JP2008137367A (ja) | 金属張積層板、並びに印刷回路板及びその製造方法 | |
JP4586424B2 (ja) | 印刷回路板 | |
JP2012169680A (ja) | 印刷配線板 | |
JP4774702B2 (ja) | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 | |
JP4595434B2 (ja) | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 | |
JP2010037489A (ja) | 接着フィルム及び樹脂付き金属箔 | |
JP2004168942A (ja) | 接着剤層付きプリプレグの製造方法及び接着剤層付きプリプレグ | |
JP2012069989A (ja) | 多層配線板 | |
JP2005325162A (ja) | プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板 | |
JP2005330433A (ja) | プリプレグ、積層板及びこれらを使用した印刷回路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081224 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110517 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110719 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120313 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120613 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120726 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20120801 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121002 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121015 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5124984 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151109 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151109 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |