JP2006332104A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2006332104A JP2006332104A JP2005149472A JP2005149472A JP2006332104A JP 2006332104 A JP2006332104 A JP 2006332104A JP 2005149472 A JP2005149472 A JP 2005149472A JP 2005149472 A JP2005149472 A JP 2005149472A JP 2006332104 A JP2006332104 A JP 2006332104A
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- 239000004065 semiconductor Substances 0.000 title claims description 114
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000005036 potential barrier Methods 0.000 claims abstract description 8
- 239000012535 impurity Substances 0.000 claims description 19
- 238000005192 partition Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 abstract description 40
- 238000005468 ion implantation Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 26
- 238000000926 separation method Methods 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000001514 detection method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001615 p wave Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02024—Position sensitive and lateral effect photodetectors; Quadrant photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
- H01L31/105—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PIN type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
Abstract
【解決手段】 区画毎のPINフォトダイオード(PIN−PD)の共通のアノードとなるP-sub層80の上に、PIN−PDのi層となる高比抵抗のエピタキシャル層82を成長させる。区画62境界に、基板表面からのイオン注入によって、p+領域である分離領域64を形成する。各区画毎に形成したカソード領域66と、P-sub層80とを逆バイアスしてPIN−PDを機能させる際、分離領域64はP-sub層80と共に接地電位とされアノードとなる。その結果、分離領域64とP-sub層80とに挟まれた位置のエピタキシャル層82には、電子に対する電位障壁が形成される。これにより、各区画にて光の吸収で発生した電子が隣接する区画へ移動することが防止され、素子分離が実現される。
【選択図】 図2
Description
[実施形態1]
[実施形態2]
Claims (6)
- 複数区画に分割された受光部を半導体基板の主面に形成された半導体装置であって、
前記主面に設けられた低不純物濃度の中間半導体領域と、
前記中間半導体領域の下面に接して配置され、第1電圧を印加される、前記中間半導体領域よりも高不純物濃度の第1導電型の下部半導体領域と、
前記区画相互間の境界に沿って前記中間半導体領域の表面に形成され、第2電圧を印加される、前記中間半導体領域よりも高不純物濃度の前記第1導電型の境界半導体領域と、
それぞれ前記中間半導体領域の表面の前記各区画に対応した位置に形成され、第3電圧を印加される、前記中間半導体領域よりも高不純物濃度の第2導電型の複数の上部半導体領域と、
を有し、
前記各上部半導体領域と前記下部半導体領域とは、前記第1電圧及び前記第3電圧により逆バイアス状態とされて、前記中間半導体領域に空乏層を形成し、
前記境界半導体領域は、前記第2電圧に応じて、前記下部半導体領域との間に前記信号電荷の前記区画間の移動に対する電位障壁を形成すること、
を特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
前記下部半導体領域は、前記境界半導体領域に対向する位置に上向きに突出した凸部を有すること、を特徴とする半導体装置。 - 請求項1又は請求項2に記載の半導体装置において、
前記中間半導体領域は、前記第1導電型であること、を特徴とする半導体装置。 - 請求項1から請求項3のいずれか1つに記載の半導体装置において、
前記上部半導体領域の深さは、前記境界半導体領域の深さよりも浅いこと、を特徴とする半導体装置。 - 請求項1から請求項4のいずれか1つに記載の半導体装置において、
前記境界半導体領域の表面に信号光が入射可能に構成されること、を特徴とする半導体装置。 - 請求項1から請求項5のいずれか1つに記載の半導体装置において、
前記中間半導体領域は、エピタキシャル成長層であること、を特徴とする半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005149472A JP4086860B2 (ja) | 2005-05-23 | 2005-05-23 | 半導体装置 |
CNB2006100817592A CN100446265C (zh) | 2005-05-23 | 2006-05-11 | 半导体装置 |
TW095118062A TWI307172B (en) | 2005-05-23 | 2006-05-22 | Semiconductor device |
US11/438,068 US7176547B2 (en) | 2005-05-23 | 2006-05-22 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005149472A JP4086860B2 (ja) | 2005-05-23 | 2005-05-23 | 半導体装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007234188A Division JP2007329512A (ja) | 2007-09-10 | 2007-09-10 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006332104A true JP2006332104A (ja) | 2006-12-07 |
JP4086860B2 JP4086860B2 (ja) | 2008-05-14 |
Family
ID=37443876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005149472A Expired - Fee Related JP4086860B2 (ja) | 2005-05-23 | 2005-05-23 | 半導体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7176547B2 (ja) |
JP (1) | JP4086860B2 (ja) |
CN (1) | CN100446265C (ja) |
TW (1) | TWI307172B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011151305A (ja) * | 2010-01-25 | 2011-08-04 | Sharp Corp | 太陽電池ならびにこれを搭載した電気部品および電子機器 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339533A (ja) * | 2005-06-03 | 2006-12-14 | Sanyo Electric Co Ltd | 半導体装置 |
JP2008244133A (ja) * | 2007-03-27 | 2008-10-09 | Sanyo Electric Co Ltd | 受光素子 |
JP2008251924A (ja) * | 2007-03-30 | 2008-10-16 | Sanyo Electric Co Ltd | 受光素子 |
JP4601679B2 (ja) * | 2008-02-21 | 2010-12-22 | 三洋電機株式会社 | 太陽電池モジュール |
US8237832B2 (en) * | 2008-05-30 | 2012-08-07 | Omnivision Technologies, Inc. | Image sensor with focusing interconnections |
JP7163307B2 (ja) * | 2017-11-15 | 2022-10-31 | 株式会社カネカ | 光電変換素子および光電変換装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0982989A (ja) * | 1995-09-12 | 1997-03-28 | Rohm Co Ltd | 受光装置及びこれを用いた電気機器 |
JPH09213917A (ja) * | 1996-01-31 | 1997-08-15 | Sanyo Electric Co Ltd | 光半導体集積回路装置 |
JP3170463B2 (ja) | 1996-09-30 | 2001-05-28 | シャープ株式会社 | 回路内蔵受光素子 |
JP4131059B2 (ja) | 1999-08-23 | 2008-08-13 | ソニー株式会社 | 受光素子を有する半導体装置、光学ピックアップ装置、および受光素子を有する半導体装置の製造方法 |
JP3317942B2 (ja) * | 1999-11-08 | 2002-08-26 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP2003092424A (ja) * | 2001-07-12 | 2003-03-28 | Sharp Corp | 分割型受光素子および回路内蔵型受光素子および光ディスク装置 |
-
2005
- 2005-05-23 JP JP2005149472A patent/JP4086860B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-11 CN CNB2006100817592A patent/CN100446265C/zh not_active Expired - Fee Related
- 2006-05-22 TW TW095118062A patent/TWI307172B/zh not_active IP Right Cessation
- 2006-05-22 US US11/438,068 patent/US7176547B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011151305A (ja) * | 2010-01-25 | 2011-08-04 | Sharp Corp | 太陽電池ならびにこれを搭載した電気部品および電子機器 |
Also Published As
Publication number | Publication date |
---|---|
CN1870279A (zh) | 2006-11-29 |
US7176547B2 (en) | 2007-02-13 |
US20060261429A1 (en) | 2006-11-23 |
TW200703701A (en) | 2007-01-16 |
TWI307172B (en) | 2009-03-01 |
CN100446265C (zh) | 2008-12-24 |
JP4086860B2 (ja) | 2008-05-14 |
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