JP2006301715A5 - - Google Patents

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Publication number
JP2006301715A5
JP2006301715A5 JP2005118641A JP2005118641A JP2006301715A5 JP 2006301715 A5 JP2006301715 A5 JP 2006301715A5 JP 2005118641 A JP2005118641 A JP 2005118641A JP 2005118641 A JP2005118641 A JP 2005118641A JP 2006301715 A5 JP2006301715 A5 JP 2006301715A5
Authority
JP
Japan
Prior art keywords
circuit board
housing
heating element
fan
bottom wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005118641A
Other languages
English (en)
Japanese (ja)
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JP2006301715A (ja
JP4675666B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005118641A priority Critical patent/JP4675666B2/ja
Priority claimed from JP2005118641A external-priority patent/JP4675666B2/ja
Priority to US11/392,347 priority patent/US7310227B2/en
Priority to CNB2006100747922A priority patent/CN100377036C/zh
Publication of JP2006301715A publication Critical patent/JP2006301715A/ja
Publication of JP2006301715A5 publication Critical patent/JP2006301715A5/ja
Application granted granted Critical
Publication of JP4675666B2 publication Critical patent/JP4675666B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005118641A 2005-04-15 2005-04-15 電子機器 Expired - Fee Related JP4675666B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005118641A JP4675666B2 (ja) 2005-04-15 2005-04-15 電子機器
US11/392,347 US7310227B2 (en) 2005-04-15 2006-03-29 Electronic apparatus
CNB2006100747922A CN100377036C (zh) 2005-04-15 2006-04-14 电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005118641A JP4675666B2 (ja) 2005-04-15 2005-04-15 電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010275677A Division JP5197725B2 (ja) 2010-12-10 2010-12-10 電子機器

Publications (3)

Publication Number Publication Date
JP2006301715A JP2006301715A (ja) 2006-11-02
JP2006301715A5 true JP2006301715A5 (enExample) 2008-05-29
JP4675666B2 JP4675666B2 (ja) 2011-04-27

Family

ID=37077627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005118641A Expired - Fee Related JP4675666B2 (ja) 2005-04-15 2005-04-15 電子機器

Country Status (3)

Country Link
US (1) US7310227B2 (enExample)
JP (1) JP4675666B2 (enExample)
CN (1) CN100377036C (enExample)

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WO2008109805A2 (en) * 2007-03-07 2008-09-12 Asetek Usa Inc. Hybrid liquid-air cooled graphics display adapter
JP2008251687A (ja) * 2007-03-29 2008-10-16 Toshiba Corp プリント回路板、およびこれを備えた電子機器
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US7957140B2 (en) * 2007-12-31 2011-06-07 Intel Corporation Air mover for device surface cooling
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US8107239B2 (en) 2009-02-27 2012-01-31 Kabushiki Kaisha Toshiba Electronic apparatus and cooling fan
JP2015038897A (ja) * 2009-03-30 2015-02-26 株式会社東芝 電子機器
JP4802272B2 (ja) * 2009-09-30 2011-10-26 株式会社東芝 電子機器
JP4693925B2 (ja) * 2009-09-30 2011-06-01 株式会社東芝 電子機器
JP4999943B2 (ja) * 2010-01-27 2012-08-15 東芝テック株式会社 情報処理端末
US8233280B2 (en) * 2010-03-15 2012-07-31 Lincoln Global, Inc. Electronic module with center mounting fasteners
JP4892078B2 (ja) 2010-05-11 2012-03-07 株式会社東芝 電子機器
JP4823374B1 (ja) 2010-05-11 2011-11-24 株式会社東芝 電子機器
JP5445507B2 (ja) * 2010-06-03 2014-03-19 株式会社デンソー 電力変換装置
JP4818452B2 (ja) * 2010-07-23 2011-11-16 株式会社東芝 電子機器
US8953313B2 (en) * 2010-09-24 2015-02-10 Intel Corporation Method and apparatus for enhanced cooling of mobile computing device surfaces
EP2586277B1 (en) * 2010-09-29 2014-06-18 Siemens Aktiengesellschaft Subsea control system
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JP2012190060A (ja) * 2011-03-08 2012-10-04 Toshiba Corp 電子機器
JP5238841B2 (ja) * 2011-03-08 2013-07-17 株式会社東芝 電子機器
JP5927539B2 (ja) * 2011-07-25 2016-06-01 パナソニックＩｐマネジメント株式会社 電子機器
JP4922473B2 (ja) * 2011-10-07 2012-04-25 株式会社東芝 電子機器
TWI505073B (zh) * 2012-03-22 2015-10-21 Compal Electronics Inc 電子裝置
JP5306511B1 (ja) * 2012-04-27 2013-10-02 株式会社東芝 電子機器
US8936164B2 (en) 2012-07-06 2015-01-20 Industrial Origami, Inc. Solar panel rack
CN202870717U (zh) * 2012-08-27 2013-04-10 高亿实业有限公司 笔记本电脑散热装置
US9538632B2 (en) * 2012-10-18 2017-01-03 Apple Inc. Printed circuit board features of a portable computer
JP6201511B2 (ja) * 2013-08-15 2017-09-27 富士通株式会社 電子機器
IN2013CH04361A (enExample) * 2013-09-26 2015-04-03 Intel Corp
WO2015149212A1 (en) * 2014-03-31 2015-10-08 Intel Corporation Sonic dust remediation
KR102568676B1 (ko) * 2016-12-14 2023-08-22 삼성전자주식회사 방음 구조를 구비한 전자 장치
CN109362207A (zh) * 2018-10-26 2019-02-19 努比亚技术有限公司 一种风冷散热装置及终端
US10969838B2 (en) * 2019-09-05 2021-04-06 Dell Products, L.P. Hybrid cooling system with multiple outlet blowers
US11681340B2 (en) * 2020-03-17 2023-06-20 Nvidia Corporation Blow-through axial fan for a graphics processing unit
TWI763256B (zh) * 2021-01-15 2022-05-01 宏碁股份有限公司 可攜式電子裝置的散熱系統
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US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
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TWI870136B (zh) * 2023-10-20 2025-01-11 仁寶電腦工業股份有限公司 電子裝置

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JP4195952B2 (ja) * 1999-09-03 2008-12-17 パナソニック株式会社 冷却構造を有する携帯型情報処理装置
JP2001142574A (ja) * 1999-11-18 2001-05-25 Hitachi Ltd 電子装置
JP2002009214A (ja) * 2000-06-26 2002-01-11 Toshiba Corp 放熱部材取付構造
JP3530151B2 (ja) * 2001-06-08 2004-05-24 株式会社東芝 発熱体を内蔵する電子機器およびこの電子機器に用いる冷却装置
JP3690658B2 (ja) * 2001-07-13 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション ヒートシンク、冷却部材、半導体基板冷却装置、コンピュータ、および放熱方法
JP4896359B2 (ja) * 2003-01-28 2012-03-14 富士通株式会社 電子装置
JP2005107122A (ja) * 2003-09-30 2005-04-21 Toshiba Corp 電子機器
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JP2006207881A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd 冷却装置及びそれを備えた電子機器
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JP2007149007A (ja) * 2005-11-30 2007-06-14 Toshiba Corp 電子機器

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