JP2006245220A5 - - Google Patents

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Publication number
JP2006245220A5
JP2006245220A5 JP2005057704A JP2005057704A JP2006245220A5 JP 2006245220 A5 JP2006245220 A5 JP 2006245220A5 JP 2005057704 A JP2005057704 A JP 2005057704A JP 2005057704 A JP2005057704 A JP 2005057704A JP 2006245220 A5 JP2006245220 A5 JP 2006245220A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005057704A
Other languages
Japanese (ja)
Other versions
JP4403090B2 (ja
JP2006245220A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005057704A priority Critical patent/JP4403090B2/ja
Priority claimed from JP2005057704A external-priority patent/JP4403090B2/ja
Priority to CN2006100515272A priority patent/CN1829413B/zh
Priority to US11/365,845 priority patent/US7182606B2/en
Publication of JP2006245220A publication Critical patent/JP2006245220A/ja
Publication of JP2006245220A5 publication Critical patent/JP2006245220A5/ja
Application granted granted Critical
Publication of JP4403090B2 publication Critical patent/JP4403090B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005057704A 2005-03-02 2005-03-02 配線回路基板 Expired - Fee Related JP4403090B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005057704A JP4403090B2 (ja) 2005-03-02 2005-03-02 配線回路基板
CN2006100515272A CN1829413B (zh) 2005-03-02 2006-02-27 布线电路基板
US11/365,845 US7182606B2 (en) 2005-03-02 2006-03-02 Wired circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005057704A JP4403090B2 (ja) 2005-03-02 2005-03-02 配線回路基板

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2007293369A Division JP4640852B2 (ja) 2007-11-12 2007-11-12 配線回路基板の製造方法
JP2007293370A Division JP4640853B2 (ja) 2007-11-12 2007-11-12 配線回路基板

Publications (3)

Publication Number Publication Date
JP2006245220A JP2006245220A (ja) 2006-09-14
JP2006245220A5 true JP2006245220A5 (enExample) 2007-05-10
JP4403090B2 JP4403090B2 (ja) 2010-01-20

Family

ID=36944656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005057704A Expired - Fee Related JP4403090B2 (ja) 2005-03-02 2005-03-02 配線回路基板

Country Status (3)

Country Link
US (1) US7182606B2 (enExample)
JP (1) JP4403090B2 (enExample)
CN (1) CN1829413B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7249954B2 (en) * 2002-02-26 2007-07-31 Paricon Technologies Corporation Separable electrical interconnect with anisotropic conductive elastomer for translating footprint
JP4640802B2 (ja) 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
JP4615427B2 (ja) 2005-12-01 2011-01-19 日東電工株式会社 配線回路基板
JP4725346B2 (ja) * 2006-02-08 2011-07-13 ソニー株式会社 半導体装置
US7284992B2 (en) * 2006-03-22 2007-10-23 International Business Machines Corporation Electronic package structures using land grid array interposers for module-to-board interconnection
US7520761B2 (en) * 2006-07-17 2009-04-21 Paricon Technologies Separable electrical interconnect with anisotropic conductive elastomer and adaptor with channel for engaging a frame
DE102006033269B4 (de) * 2006-07-18 2010-10-28 Continental Automotive Gmbh Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper
DE102006033477B3 (de) * 2006-07-19 2008-01-24 Siemens Ag Leiterträger und Anordnung mit Leiterträger
JP2008034639A (ja) * 2006-07-28 2008-02-14 Nitto Denko Corp 配線回路基板
JP4865453B2 (ja) 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
JP2008282995A (ja) 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
JP2009016610A (ja) 2007-07-05 2009-01-22 Nitto Denko Corp 配線回路基板およびその製造方法
JP4887232B2 (ja) 2007-07-24 2012-02-29 日東電工株式会社 配線回路基板の製造方法
JP6021211B2 (ja) * 2010-04-30 2016-11-09 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ
TWI442526B (zh) * 2010-09-17 2014-06-21 旭德科技股份有限公司 導熱基板及其製作方法
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
JP5349634B2 (ja) * 2012-03-16 2013-11-20 日東電工株式会社 回路付サスペンション基板
US9736924B2 (en) 2013-02-26 2017-08-15 Tatsuta Electric Wire & Cable Co., Ltd. Reinforcing member for flexible printed wiring board, flexible printed wiring board, and shield printed wiring board
JP6688667B2 (ja) 2016-04-18 2020-04-28 日東電工株式会社 配線回路基板およびその製造方法
JP6808266B2 (ja) * 2016-05-18 2021-01-06 日東電工株式会社 配線回路基板およびその製造方法
JP6909566B2 (ja) 2016-09-06 2021-07-28 日東電工株式会社 配線回路基板およびその製造方法
JP6802688B2 (ja) * 2016-11-02 2020-12-16 日東電工株式会社 配線回路基板
JP7757092B2 (ja) 2021-09-07 2025-10-21 日東電工株式会社 配線回路基板の製造方法
TW202406417A (zh) * 2022-06-15 2024-02-01 日商日東電工股份有限公司 配線電路基板、及配線電路基板之製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5612512A (en) * 1992-11-11 1997-03-18 Murata Manufacturing Co., Ltd. High frequency electronic component having base substrate formed of bismaleimide-triazine resin and resistant film formed on base substrate
JP3461204B2 (ja) * 1993-09-14 2003-10-27 株式会社東芝 マルチチップモジュール
US6162996A (en) * 1994-03-23 2000-12-19 Dyconex Patente Ag Insulating foil circuit board with rigid and flexible sections
US5776824A (en) * 1995-12-22 1998-07-07 Micron Technology, Inc. Method for producing laminated film/metal structures for known good die ("KG") applications
EP1100295B1 (en) * 1999-11-12 2012-03-28 Panasonic Corporation Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
JP2001209918A (ja) * 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
CN1415474A (zh) * 2001-10-29 2003-05-07 造利科技股份有限公司 具有载体的转印背胶式铜箔制造方法
KR100584965B1 (ko) * 2003-02-24 2006-05-29 삼성전기주식회사 패키지 기판 및 그 제조 방법
JP4222885B2 (ja) * 2003-06-04 2009-02-12 日東電工株式会社 配線回路基板
JP4178077B2 (ja) * 2003-06-04 2008-11-12 日東電工株式会社 配線回路基板
JP2005011387A (ja) * 2003-06-16 2005-01-13 Hitachi Global Storage Technologies Inc 磁気ディスク装置
JP4028477B2 (ja) * 2003-12-04 2007-12-26 日東電工株式会社 回路付サスペンション基板およびその製造方法
JP2005235318A (ja) * 2004-02-20 2005-09-02 Nitto Denko Corp 回路付サスペンション基板の製造方法

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