JP2006216776A - 樹脂封止型半導体装置 - Google Patents
樹脂封止型半導体装置 Download PDFInfo
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Abstract
【解決手段】 半導体装置において、半導体素子の外周部に複数の電極パッドが列状に配設される。基板にはその第1の面に電極パッドと接続するための複数のボンディングパッドが配設され、反対側の第2の面に複数の外部電極端子が配設され、接着剤により第1の半導体素子が接着固定される。ワイヤにより、電極パッドとボンディングパッドとが電気的に接続される。板状部材を半導体素子上であって電極パッド列の内側に接着固定する。封止樹脂により、半導体素子、ワイヤ、及び板状部材の少なくとも外周側面を一体的に封止する。この半導体装置において、板状部材は封止樹脂の熱膨張係数よりも小さい熱膨張係数を有する。
【選択図】 図7
Description
また、封止樹脂15としては、熱硬化性のエポキシ樹脂が用いられる。
11、11a、11b 半導体素子
12、12a、12b 電極パッド
13、13a、13b ワイヤ
14、14a、14b、14c 板状部材
15 封止樹脂
16、16a、16b、16c 接着剤
17 ボンディングパッド
18 基板
19 半田ボール
21 バンプ
22 スペーサ
23 接着剤
31a、31b 半導体素子
32 電極パッド
33a、33b ワイヤ
35 封止樹脂
36a、36b 接着剤
Claims (5)
- 外周部に複数の電極パッドが列状に配設される半導体素子と、
第1の面に前記電極パッドと接続するための複数のボンディングパッドが配設され、第1の面と反対側の第2の面に複数の外部電極端子が配設され、かつ接着剤により前記半導体素子が接着固定される基板と、
前記電極パッドと前記ボンディングパッドとを電気的に接続するワイヤと、
前記半導体素子上であって前記電極パッド列の内側に接着固定される板状部材と、
前記半導体素子、前記ワイヤ、及び前記板状部材の少なくとも外周側面を一体的に封止する封止樹脂と
を備え、前記板状部材の熱膨張係数が前記封止樹脂の熱膨張係数より小さいことを特徴とする半導体装置。 - 外周部に複数の第1の電極パッドが列状に配置される第1の半導体素子と、
外周部に複数の第2の電極パッドが列状に配置され、前記第1の半導体素子上に積層配置される第2の半導体素子と、
第1の面に前記第1及び前記第2の電極パッドと接続するための複数のボンディングパッドが配設され、第1の面と反対側の第2の面に複数の外部電極端子が配設され、かつ接着剤により前記第2の半導体素子が接着固定される基板と、
前記第1の電極パッドと前記ボンディングパッドとを電気的に接続する第1のワイヤと、
前記第2の電極パッドと前記ボンディングパッドとを電気的に接続する第2のワイヤ又はバンプと、
前記第1の半導体素子上であって前記第1の電極パッド列の内側に接着固定される板状部材と、
前記第1の半導体素子、前記第2の半導体素子、前記第1のワイヤ、及び前記板状部材の少なくとも外周側面を一体的に封止する封止樹脂と
を備え、前記板状部材の熱膨張係数が前記封止樹脂の熱膨張係数より小さいことを特徴とする半導体装置。 - 前記第1の半導体素子の少なくとも1辺の端部にオーバーハング部が形成されるように前記第1の半導体素子が前記第2の半導体素子上に積層配置され、前記第1の電極パッドが前記オーバーハング部に配置され、かつ前記板状部材が端部において前記オーバーハング部に重なるように接着固定されることを特徴とする請求項2記載の半導体装置。
- 前記第1の半導体素子と前記第2の半導体素子を所定の間隔で離間させるスペーサ部材が前記第1の半導体素子と前記第2の半導体素子の間に配設されることを特徴とする請求項2又は3記載の半導体装置。
- 前記第1の半導体素子の前記オーバーハング部下方に前記第2のワイヤの少なくとも一部が重なるように配設されることを特徴とする請求項3又は4記載の半導体装置。
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Cited By (10)
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JP2008147669A (ja) * | 2006-12-09 | 2008-06-26 | Stats Chippac Ltd | 積み重ねられた集積回路パッケージインパッケージシステム |
JP2009117702A (ja) * | 2007-11-08 | 2009-05-28 | Nec Electronics Corp | 半導体装置 |
JP2009194189A (ja) * | 2008-02-15 | 2009-08-27 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2012015225A (ja) * | 2010-06-30 | 2012-01-19 | Hitachi Ltd | 半導体装置 |
JP2012043881A (ja) * | 2010-08-17 | 2012-03-01 | Tdk Corp | 端子構造、プリント配線板、モジュール基板及び電子デバイス |
WO2014103855A1 (ja) * | 2012-12-25 | 2014-07-03 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置およびその製造方法 |
WO2014156921A1 (ja) * | 2013-03-26 | 2014-10-02 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置 |
KR101454884B1 (ko) * | 2006-12-09 | 2014-10-27 | 스태츠 칩팩 엘티디 | 적층된 집적회로 패키지 인 패키지 시스템 |
US9059128B2 (en) | 2012-04-27 | 2015-06-16 | Mitsubishi Electric Corporation | Semiconductor device having improved thermal properties |
WO2022244629A1 (ja) * | 2021-05-18 | 2022-11-24 | ローム株式会社 | 半導体装置 |
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JP2000174169A (ja) * | 1998-12-03 | 2000-06-23 | Sanyo Electric Co Ltd | 半導体装置 |
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Cited By (11)
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JP2008147669A (ja) * | 2006-12-09 | 2008-06-26 | Stats Chippac Ltd | 積み重ねられた集積回路パッケージインパッケージシステム |
KR101454884B1 (ko) * | 2006-12-09 | 2014-10-27 | 스태츠 칩팩 엘티디 | 적층된 집적회로 패키지 인 패키지 시스템 |
JP2009117702A (ja) * | 2007-11-08 | 2009-05-28 | Nec Electronics Corp | 半導体装置 |
JP2009194189A (ja) * | 2008-02-15 | 2009-08-27 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2012015225A (ja) * | 2010-06-30 | 2012-01-19 | Hitachi Ltd | 半導体装置 |
JP2012043881A (ja) * | 2010-08-17 | 2012-03-01 | Tdk Corp | 端子構造、プリント配線板、モジュール基板及び電子デバイス |
US9059128B2 (en) | 2012-04-27 | 2015-06-16 | Mitsubishi Electric Corporation | Semiconductor device having improved thermal properties |
WO2014103855A1 (ja) * | 2012-12-25 | 2014-07-03 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置およびその製造方法 |
WO2014156921A1 (ja) * | 2013-03-26 | 2014-10-02 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置 |
US10342118B2 (en) | 2013-03-26 | 2019-07-02 | Longitude Licensing Limited | Semiconductor device |
WO2022244629A1 (ja) * | 2021-05-18 | 2022-11-24 | ローム株式会社 | 半導体装置 |
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