JP2006208000A - 熱/電力管理装置 - Google Patents
熱/電力管理装置 Download PDFInfo
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- JP2006208000A JP2006208000A JP2006017621A JP2006017621A JP2006208000A JP 2006208000 A JP2006208000 A JP 2006208000A JP 2006017621 A JP2006017621 A JP 2006017621A JP 2006017621 A JP2006017621 A JP 2006017621A JP 2006208000 A JP2006208000 A JP 2006208000A
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- 238000009423 ventilation Methods 0.000 claims abstract description 86
- 238000001816 cooling Methods 0.000 claims abstract description 27
- 230000004044 response Effects 0.000 claims abstract description 14
- 238000013507 mapping Methods 0.000 claims description 40
- 238000004378 air conditioning Methods 0.000 claims description 11
- 238000009529 body temperature measurement Methods 0.000 claims description 8
- 239000003570 air Substances 0.000 description 106
- 238000000034 method Methods 0.000 description 35
- 238000005259 measurement Methods 0.000 description 23
- 238000007726 management method Methods 0.000 description 20
- 238000012544 monitoring process Methods 0.000 description 15
- 230000006870 function Effects 0.000 description 11
- 238000012512 characterization method Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000012080 ambient air Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/0001—Control or safety arrangements for ventilation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/10—Temperature
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/007—Ventilation with forced flow
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/30—Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/30—Velocity
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Air Conditioning Control Device (AREA)
Abstract
【解決手段】データセンタ(102)内で使用する空気流分配装置(100)は、前記データセンタ(102)内の少なくとも1つのサーバ(108)における複数のファン(106)に結合されている少なくとも1つの空気流センサ(104)と、前記少なくとも1つの空気流センサ(104)に結合されるとともに、前記複数のファンについて空気流を監視するとともに、検知された空気流に応じて前記データセンタ(102)内での冷却を制御するように構成されるコントローラ(110)とを備える。
【選択図】図1
Description
前記コントローラ(110、216)は、前記温度計インタフェース(118)に結合され、前記データセンタ(102、202)内の前記少なくとも1つの位置における周囲温度を測定するとともに、検知された空気流及びファンの場所に応じて多次元で空気流をマッピングするように構成され、前記空気流のマッピング及び前記少なくとも1つの位置での周囲温度測定値に応じてデータセンタの換気状態をマッピングするようにさらに構成されることを特徴とする、実施態様1又は2に記載の空気分配装置又は換気システム。
106 ファン
108 サーバ
110 コントローラ
112 グラフィカル・ユーザ・インタフェース(GUI)
114 制御インタフェース
116 コンピュータ室空調設備(CRAC)
118 温度計インタフェース
122 サーバインタフェース
200 換気システム
202 データセンタ
204 上床
206 床下プレナム空間
208 空気流センサ
210 ファン
212 サーバ
214 キャビネット
216 コントローラ
Claims (10)
- データセンタ内で使用する空気流分配装置であって、
前記データセンタ内の少なくとも1つのサーバにおける複数のファンに結合されている少なくとも1つの空気流センサと、
前記少なくとも1つの空気流センサに結合されるとともに、前記複数のファンについて空気流を監視するとともに、検知された空気流に応じて前記データセンタ内での冷却を制御するように構成されるコントローラと
を備えることを特徴とする、空気流分配装置。 - データセンタのための換気システムであって、
床下プレナム空間の上にある上床と、
前記データセンタ内の少なくとも1つのキャビネットに配置されている複数のサーバにおける複数のファンに結合されている少なくとも1つの空気流センサと、
前記少なくとも1つの空気流センサに結合されるとともに、前記複数のファンについて空気流を監視するとともに、検知された空気流に応じて前記データセンタ内での冷却を制御するように構成されるコントローラと
を備えることを特徴とする、換気システム。 - 空気流分配装置又は換気システムであって、
前記コントローラは、検知された空気流から空気流のリアルタイムな動的マッピングを作成するようにさらに構成されることをさらに含むことを特徴とする、請求項1又は2に記載の空気分配装置又は換気システム。 - 空気流分配装置又は換気システムであって、
グラフィカル・ユーザ・インタフェースをさらに備え、
前記コントローラは、前記グラフィカル・ユーザ・インタフェースを介して、現在のデータセンタ構成及び該データセンタ構成内の場所全体にわたる空気流を記述する、空気流のリアルタイムな動的マッピングを表示するように構成されることを特徴とする、請求項1又は2に記載の空気分配装置又は換気システム。 - 空気流分配装置又は換気システムであって、
コンピュータ室空調設備システムに結合される制御インタフェースをさらに備え、
前記コントローラは、前記制御インタフェースに結合されるとともに、検知された空気流に応じて前記コンピュータ室空調設備システムを制御するようにさらに構成されることを特徴とする、請求項1又は2に記載の空気分配装置又は換気システム。 - 空気流分配装置又は換気システムであって、
前記コントローラは、検知された空気流及びファンの場所に応じて三次元で空気流をマッピングするようにさらに構成されることをさらに含むことを特徴とする、請求項1又は2に記載の空気分配装置又は換気システム。 - 空気流分配装置又は換気システムであって、
前記データセンタ内の少なくとも1つの位置にある少なくとも1つの温度計に結合するようになっている温度計インタフェースをさらに備え、
前記コントローラは、前記温度計インタフェースに結合され、前記データセンタ内の前記少なくとも1つの位置における周囲温度を測定するとともに、検知された空気流及びファンの場所に応じて多次元で空気流をマッピングするように構成され、
前記空気流のマッピング及び前記少なくとも1つの位置での周囲温度測定値に応じてデータセンタの換気状態をマッピングするようにさらに構成されることを特徴とする、請求項1又は2に記載の空気分配装置又は換気システム。 - 空気流分配装置又は換気システムであって、
前記データセンタ内の複数のサーバに結合するようになっているサーバインタフェースをさらに備え、
前記コントローラは、前記サーバインタフェースに結合され、前記複数のサーバにおける消費電力を監視すること、検知された空気流及びファンの場所に応じて多次元で空気流をマッピングすること、及び、前記サーバの消費電力及び前記空気流のマッピングに応じて前記データセンタ内での冷却を制御すること、を行うようにさらに構成される、請求項1又は2に記載の空気分配装置又は換気システム。 - 空気流分配装置又は換気システムであって、
前記データセンタ内の複数のサーバに結合するようになっているサーバインタフェースをさらに備え、
前記コントローラは、前記サーバインタフェースに結合され、前記複数のサーバにおけるソフトウェア実行負荷を監視すること、検知された空気流及びファンの場所に応じて多次元で空気流をマッピングすること、及び、前記サーバのソフトウェア実行負荷及び前記空気流のマッピングに応じて前記データセンタの換気をマッピングすること、を行うようにさらに構成される、請求項1又は2に記載の空気分配装置又は換気システム。 - 空気流分配装置又は換気システムであって、
前記データセンタ内の少なくとも1つの位置にある少なくとも1つの温度計に結合するようになっている温度計インタフェースと、
前記データセンタ内の複数のサーバに結合するようになっているサーバインタフェースとをさらに備え、
前記コントローラは、前記温度計インタフェース及び前記サーバインタフェースに結合され、前記データセンタ内の前記複数のサーバにおけるソフトウェア実行負荷を監視するとともに、検知された空気流、ファンの場所、前記少なくとも1つの位置の周囲温度測定値、サーバの消費電力、及びサーバのソフトウェア実行負荷に応じて多次元で空気流をマッピングするようにさらに構成されることを特徴とする、請求項1又は2に記載の空気分配装置又は換気システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/046,476 | 2005-01-28 | ||
US11/046,476 US20060168975A1 (en) | 2005-01-28 | 2005-01-28 | Thermal and power management apparatus |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006208000A true JP2006208000A (ja) | 2006-08-10 |
JP2006208000A5 JP2006208000A5 (ja) | 2009-03-12 |
JP5001557B2 JP5001557B2 (ja) | 2012-08-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006017621A Expired - Fee Related JP5001557B2 (ja) | 2005-01-28 | 2006-01-26 | 熱/電力管理装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060168975A1 (ja) |
JP (1) | JP5001557B2 (ja) |
GB (1) | GB2423573B (ja) |
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JP2009104307A (ja) * | 2007-10-22 | 2009-05-14 | Sanyo Electric Co Ltd | 電子機器冷却システム |
JP2009134522A (ja) * | 2007-11-30 | 2009-06-18 | Sanyo Electric Co Ltd | 電子機器冷却システム |
JP2009176304A (ja) * | 2008-01-23 | 2009-08-06 | Palo Alto Research Center Inc | 電力制御システム |
JP2009258837A (ja) * | 2008-04-14 | 2009-11-05 | Hitachi Appliances Inc | 空調機 |
JP2009294957A (ja) * | 2008-06-05 | 2009-12-17 | Fujitsu Ltd | 格納装置および情報処理装置並びに冷却方法 |
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GB2423573B (en) | 2010-06-30 |
JP5001557B2 (ja) | 2012-08-15 |
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