JP2006165506A - 実装基板及び電子機器 - Google Patents
実装基板及び電子機器 Download PDFInfo
- Publication number
- JP2006165506A JP2006165506A JP2005204230A JP2005204230A JP2006165506A JP 2006165506 A JP2006165506 A JP 2006165506A JP 2005204230 A JP2005204230 A JP 2005204230A JP 2005204230 A JP2005204230 A JP 2005204230A JP 2006165506 A JP2006165506 A JP 2006165506A
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- electronic device
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Abstract
【解決手段】 本発明の回路基板10FDは、一面側がパッド7を具備した端子形成面2aとされた半導体チップ2をフレキシブル基板1上に実装してなる実装基板であって、前記パッド7が、前記フレキシブル基板1上に形成された金属配線4に対して電気的に接続されており、前記半導体チップ2の端子形成面2aが、当該実装基板10FDの厚さ方向における中立面npに略一致して配置されている。
【選択図】 図1
Description
このような背景のもとに、従来、弾力性を有する導電部材を用いて端子間の電気的な接続を行い、接続構造の信頼性を向上させる実装方法が提案されている(例えば、特許文献1参照)。
厚さ50μm程度にまでICチップを薄層化すると、チップ自体の薄さのほか、加工による微小欠陥が半導体チップの破損に繋がることもあるため、特にチップ近傍の曲げ耐性を向上させることが望まれる。
本発明は前記事情に鑑みてなされたもので、その目的とするところは、電子機器や電子部品に搭載される電子デバイスを実装した実装基板であって、薄厚化を実現するとともにフレキシブル性を有して曲げに対する耐性も強い実装基板を提供することにある。
この実装基板は、フレキシブル基板を基体として用いていることで可撓性を有し、比較的自由に撓曲させることが可能なものである。そして、前記電子デバイスの端子形成面と、実装基板の中立面とが略一致するように電子デバイスが実装されているので、実装基板を曲げる際に生じるひずみが、中立面に配置された電子デバイスの端子形成面でほぼゼロになる。したがって電子デバイスの接続端子と実装基板上の配線パターンとが電気的に接続された部位に曲げ応力が作用することがない。これにより、曲げに対する耐性に優れ、信頼性に優れた実装基板を実現することができる。
この実装基板は、フレキシブル基板を基体として用いていることで可撓性を有し、比較的自由に撓曲させることが可能なものである。そして、前記電子デバイスの端子形成面と反対側の載置面と、実装基板の中立面とが略一致するように電子デバイスが実装されているので、実装基板を曲げる際に生じるひずみが、中立面に配置された電子デバイスの載置面でほぼゼロになる。したがって、電子デバイスを薄層化する際の研削面となる端子形成面と反対側の載置面に曲げ応力が作用することがない。これにより、研削時に微小な割れ(研削割れ)が導入されている可能性のある載置面において、研削割れの伸展等に起因する破損が生じるのを防止でき、曲げに対する耐性に優れ、信頼性に優れた実装基板を実現することができる。
以下、本発明の実施の形態を図面を参照して詳しく説明する。
図1は、本発明における実装基板の一実施形態を示す部分断面構成図である。図1に示すように、実装基板10FDは、フレキシブル基板1上に半導体チップ(一面側に接続端子を備えた電子デバイス)2を実装した構造を備えている。フレキシブル基板1は、ポリイミド等の樹脂からなるもので、テープ状またはシート状など、各種の形状に形成されたものが用いられている。
また、フレキシブル基板1上には、熱硬化性の絶縁性樹脂からなる接着層6が形成されている。この接着層6は、後述するように前記導体ポスト5の上面を露出させた状態で金属配線4を覆い、これによってフレキシブル基板1と半導体チップ2との間を接着しているものである。この接着層6を形成する熱硬化性樹脂としては、例えばエポキシ系樹脂材料等が用いられる。
図示のように、半導体チップ2の外側の領域は、フレキシブル基板1上に金属配線4と絶縁層8とが積層されており、端子形成面2aと面一の中立面npは絶縁層8中に位置する。したがって、中立面の位置を調整するための曲げ弾性率の調整は、主に絶縁層8の厚さ調整により行うことができる。
次に、本発明の第2の実施形態に係る実装基板の構成につき、図2を参照して説明する。図2は、本実施形態の実装基板の部分断面構成図である。
なお、本実施形態の実装基板10FUは、電子デバイスである半導体チップ2の実装構造が異なっている以外は、先の第1実施形態に係る実装基板10FDと同様の構造であるから、図2において図1と共通の符号が付された構成要素は、同一の構成要素として説明を省略する。
次に、図1に示した第1実施形態に係る実装基板10FDの製造方法につき、図3を参照して説明する。
まず、図3(a)に示すようにフレキシブル基板1を用意し、フレキシブル基板1上の所定位置に、液滴吐出法によって金属微粒子を分散液に分散させてなる液状体を吐出し配置する。液滴吐出法としては、インクジェット法やディスペンサ法などが採用可能であるが、特にインクジェット法が、所望位置に所望量の液状材料を配することができるため好ましく、本実施形態ではインクジェット法を用いるものとする。
また、分散液の蒸気圧は、0.001mmHg以上、50mmHg以下(約0.133Pa以上、6650Pa以下)であることがより好ましい。蒸気圧が50mmHgより高い場合には、インクジェット法(液滴吐出法)で液滴を吐出する際に乾燥によるノズル詰まりが起こり易く、安定な吐出が困難となるからである。一方、室温での蒸気圧が0.001mmHgより低い分散液の場合、乾燥が遅くなって膜中に分散液が残留しやすくなり、後工程の加熱処理後に良質の導電膜(配線)が得られにくくなるからである。
なお、前述したように金属配線4の中間構造体4bについて、本硬化処理でなく仮硬化処理にとどめておいた場合には、ここでの導体ポスト5の中間構造体5aの焼成処理により、中間構造体4aの金属微粒子も焼結される。
よって、この実装基板10FDにあっては、全体の曲げ性を確保することができるとともにその接続信頼性をも確保することができる。
また、導体ポスト5についてはこれを金属微粒子を含む液状体を用いた液相法により形成することなく、メッキ等による金属導電体で形成してもよく、その場合には、やはりこの導体ポスト上に金属微粒子を分散させた液状体を配し、係る液状体を介してパッド7を接続するようにすればよい。
次に、本発明の第3の実施形態に係る実装基板の構成につき、図5を参照して説明する。図5は、本実施形態の実装基板の部分断面構成図である。
なお、本実施形態においては、先の実施形態に係る実装基板と共通の符号が付された構成要素は、同一の構成要素として説明を省略する。
なお、本実施形態の場合、金属配線4は液滴吐出法を用いて形成されたものであることから極めて薄い厚さに形成されており、上記曲げ弾性率にはほとんど影響しない。
図示のように、半導体チップ2の外側の領域は、フレキシブル基板1上に金属配線4と絶縁層8aとが積層されており、端子形成面2aと面一の中立面npは絶縁層8a中に位置する。したがって、中立面の位置を調整するための曲げ弾性率の調整は、主に絶縁層8aの厚さ調整により行うことができる。
次に、図5に示した第3実施形態に係る実装基板110の製造方法につき、図6を参照して説明する。
まず、図6(a)に示すようにフレキシブル基板1を用意し、このフレキシブル基板1上の所定位置に、図6(a)に示すように液滴吐出法によって金属微粒子を分散液に分散させてなる液状体を吐出し配置する。液滴吐出法としては、インクジェット法やディスペンサ法などが採用可能であるが、特にインクジェット法が、所望位置に所望量の液状材料を配することができるため好ましい。本実施形態では先の実施形態と同様のインクジェット法を用いるものとする。
スロープ材9は、図示のように、半導体チップ2の側面から外側に向かって薄くなるように形成し、半導体チップ2の端子形成面2aから金属配線4に至る傾斜面を有したものとする。またスロープ材9は、パッド7を覆わない限度でその一部が端子形成面2aに乗り上げていてもよい。
なお、前述したように金属配線4の中間構造体4bについて、本硬化処理でなく仮硬化処理にとどめておいた場合には、接続配線4cの焼成処理により、中間構造体4aの金属微粒子も焼結される。
図7(a)は、本発明に係る電子機器の一例を示す斜視図である。この図に示す携帯電話1300は、筐体の内部或いは表示部1301に、前述の方法を用いて得られる実装基板を備えている。図中、符号1302は操作ボタン1302、符号1303は受話口、符号1304は送話口を示している。
図7(b)は、(a)に示す表示部1301の斜視構成図である。表示部1301は、液晶表示装置や有機EL表示装置からなる表示パネル1311の一辺端に、電子デバイス1312を実装した実装基板1313を接続してなる構成を備えている。そして、この実装基板1313には、本発明の実装方法を用いて電子デバイスを実装された実装基板が好適に用いられており、実装基板上に薄型に電子デバイスが実装されているので、携帯電話1300の薄型化、小型化を実現することができる。
Claims (16)
- 接続端子を具備した端子形成面を有する電子デバイスをフレキシブル基板上に実装してなる実装基板であって、
前記接続端子が、前記フレキシブル基板上に形成された配線パターンに対し直接又は導電部材を介して電気的に接続されており、
前記端子形成面が、当該実装基板の厚さ方向における中立面に略一致して配置されていることを特徴とする実装基板。 - 当該実装基板の厚さ方向において、前記電子デバイスの端子形成面を挟み両側にそれぞれ配された構成部材が、略等しい曲げ弾性率を有していることを特徴とする請求項1に記載の実装基板。
- 前記電子デバイスが、前記端子形成面を前記フレキシブル基板側に向けた状態で実装されており、
前記電子デバイスが、前記フレキシブル基板と、該フレキシブル基板と前記端子形成面との間に形成された構成部材とを合わせた曲げ弾性率と略等しい曲げ弾性率を有していることを特徴とする請求項2に記載の実装基板。 - 前記配線パターン上に、前記電子デバイス側へ突出する導体ポストが形成されており、
前記電子デバイスが、前記導体ポストを取り囲むように設けられた接着層を介して前記フレキシブル基板上に実装され、
前記電子デバイスの接続端子が、前記導体ポストに電気的に接続されていることを特徴とする請求項3に記載の実装基板。 - 前記フレキシブル基板上であって、前記電子デバイスの外側の領域に、前記配線パターンを覆う絶縁層が形成されていることを特徴とする請求項1から4のいずれか1項に記載の実装基板。
- 前記絶縁層が、前記電子デバイス上にも形成されていることを特徴とする請求項5に記載の実装基板。
- 前記電子デバイスが、前記端子形成面を前記フレキシブル基板と反対側に向けて実装されるとともに、該電子デバイスを覆う絶縁層が形成されており、
前記電子デバイス上に形成された絶縁層が、前記電子デバイスと、前記フレキシブル基板と、該電子デバイスとフレキシブル基板との間に設けられた構成部材とを合わせた曲げ弾性率と略等しい曲げ弾性率を有していることを特徴とする請求項2に記載の実装基板。 - 前記電子デバイスの側面部に、当該側面部から外側に延びる斜面部を有するスロープ材が形成されており、
前記接続端子と配線パターンとが、前記スロープ材の斜面部と当接して設けられた接続配線を介して電気的に接続されていることを特徴とする請求項7に記載の実装基板。 - 前記電子デバイスの外側の領域において、該電子デバイスの端子形成面の延長面を挟んで両側にそれぞれ配された当該実装基板の構成部材が、互いに略等しい曲げ弾性率を有していることを特徴とする請求項2から8のいずれか1項に記載の実装基板。
- 接続端子を具備した端子形成面を有する電子デバイスをフレキシブル基板上に実装してなる実装基板であって、
前記電子デバイスが、前記端子形成面を前記フレキシブル基板に対し反対側に向けて配置されており、
前記電子デバイスの端子形成面と反対側の載置面が、当該実装基板の厚さ方向における中立面に略一致して配置されていることを特徴とする実装基板。 - 当該実装基板の厚さ方向において、前記電子デバイスの載置面を挟み両側にそれぞれ配された構成部材が、略等しい曲げ弾性率を有していることを特徴とする請求項10に記載の実装基板。
- 前記フレキシブル基板上であって、前記電子デバイスの外側の領域に、前記配線パターンを覆う絶縁層が形成されていることを特徴とする請求項10又は11に記載の実装基板。
- 前記電子デバイスの実装領域の外側の領域において、
前記載置面を延長してなる面を挟んで両側にそれぞれ配された構成部材が、略等しい曲げ弾性率を有していることを特徴とする請求項12に記載の実装基板。 - 前記絶縁層が、前記電子デバイス上にも形成されていることを特徴とする請求項12又は13に記載の実装基板。
- 前記電子デバイスの側面部に、当該側面部から外側に延びる斜面部を有するスロープ材が形成されており、
前記接続端子と配線パターンとが、前記スロープ材の斜面部と当接して設けられた接続配線を介して電気的に接続されていることを特徴とする請求項10から14のいずれか1項に記載の実装基板。 - 請求項1から15のいずれか1項に記載の実装基板を具備したことを特徴とする電子機器。
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JP2009038331A (ja) * | 2007-07-11 | 2009-02-19 | Sony Corp | 配線への素子の電気的接続方法及び発光素子組立体の製造方法、並びに、発光素子組立体 |
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- 2005-10-21 US US11/256,594 patent/US7385280B2/en active Active
- 2005-11-08 CN CNA2005101200326A patent/CN1790696A/zh active Pending
- 2005-11-08 KR KR1020050106507A patent/KR100749983B1/ko active IP Right Grant
- 2005-11-09 TW TW094139279A patent/TWI272747B/zh not_active IP Right Cessation
Cited By (8)
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JP2009038331A (ja) * | 2007-07-11 | 2009-02-19 | Sony Corp | 配線への素子の電気的接続方法及び発光素子組立体の製造方法、並びに、発光素子組立体 |
US7838410B2 (en) | 2007-07-11 | 2010-11-23 | Sony Corporation | Method of electrically connecting element to wiring, method of producing light-emitting element assembly, and light-emitting element assembly |
JP2009054835A (ja) * | 2007-08-28 | 2009-03-12 | Toshiba Corp | 半導体装置およびその製造方法 |
JP6079624B2 (ja) * | 2011-04-12 | 2017-02-15 | 凸版印刷株式会社 | Icモジュールおよびicカード |
JP2013098184A (ja) * | 2011-10-27 | 2013-05-20 | Kyocera Corp | 実装基板および電子装置 |
JP2017038046A (ja) * | 2015-08-13 | 2017-02-16 | パロ アルト リサーチ センター インコーポレイテッド | 可撓性基板の上にある印刷された構成要素とのベアダイの集積化 |
WO2018142577A1 (ja) * | 2017-02-03 | 2018-08-09 | 株式会社Fuji | 回路形成方法、および回路形成装置 |
JPWO2018142577A1 (ja) * | 2017-02-03 | 2019-11-07 | 株式会社Fuji | 回路形成方法、および回路形成装置 |
Also Published As
Publication number | Publication date |
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US7385280B2 (en) | 2008-06-10 |
CN1790696A (zh) | 2006-06-21 |
JP4386008B2 (ja) | 2009-12-16 |
TWI272747B (en) | 2007-02-01 |
US20060097373A1 (en) | 2006-05-11 |
TW200629662A (en) | 2006-08-16 |
KR100749983B1 (ko) | 2007-08-16 |
KR20060052533A (ko) | 2006-05-19 |
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