JP2006156662A - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP2006156662A
JP2006156662A JP2004344432A JP2004344432A JP2006156662A JP 2006156662 A JP2006156662 A JP 2006156662A JP 2004344432 A JP2004344432 A JP 2004344432A JP 2004344432 A JP2004344432 A JP 2004344432A JP 2006156662 A JP2006156662 A JP 2006156662A
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting device
sealing portion
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004344432A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006156662A5 (enExample
Inventor
Hideo Nagai
秀男 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2004344432A priority Critical patent/JP2006156662A/ja
Publication of JP2006156662A publication Critical patent/JP2006156662A/ja
Publication of JP2006156662A5 publication Critical patent/JP2006156662A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2004344432A 2004-11-29 2004-11-29 発光装置 Pending JP2006156662A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004344432A JP2006156662A (ja) 2004-11-29 2004-11-29 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004344432A JP2006156662A (ja) 2004-11-29 2004-11-29 発光装置

Publications (2)

Publication Number Publication Date
JP2006156662A true JP2006156662A (ja) 2006-06-15
JP2006156662A5 JP2006156662A5 (enExample) 2007-12-13

Family

ID=36634566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004344432A Pending JP2006156662A (ja) 2004-11-29 2004-11-29 発光装置

Country Status (1)

Country Link
JP (1) JP2006156662A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008085172A (ja) * 2006-09-28 2008-04-10 Shinetsu Astec Kk 発光装置
JP2009009926A (ja) * 2007-03-23 2009-01-15 Toshiba Lighting & Technology Corp 発光ダイオード照明装置
EP2221891A1 (en) * 2009-02-18 2010-08-25 Everlight Electronics Co., Ltd. Light emitting device
USD646015S1 (en) 2009-11-20 2011-09-27 Everlight Electronics Co., Ltd. Light emitting diode lamp
JP2012028666A (ja) * 2010-07-27 2012-02-09 Nitto Denko Corp 発光装置用部品、発光装置およびその製造方法
JP2012113306A (ja) * 2010-11-24 2012-06-14 Raytheon Co 光学的な表面を保護すること
US8203164B2 (en) 2007-03-14 2012-06-19 Samsung Led Co., Ltd. Light emitting diode package
US8378358B2 (en) 2009-02-18 2013-02-19 Everlight Electronics Co., Ltd. Light emitting device
US8405105B2 (en) 2009-02-18 2013-03-26 Everlight Electronics Co., Ltd. Light emitting device
WO2013168802A1 (ja) * 2012-05-11 2013-11-14 シチズンホールディングス株式会社 Ｌｅｄモジュール
JP2013239712A (ja) * 2013-06-03 2013-11-28 Nichia Chem Ind Ltd 発光装置
US8960932B2 (en) 2011-05-27 2015-02-24 Samsung Electronics Co., Ltd. Light emitting device
JP2018006477A (ja) * 2016-06-29 2018-01-11 セイコーエプソン株式会社 光源装置およびプロジェクター

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054179U (ja) * 1983-09-19 1985-04-16 三洋電機株式会社 微小発光ダイオ−ド表示器
JPS6113958U (ja) * 1984-06-28 1986-01-27 スタンレー電気株式会社 発光ダイオ−ドランプ
JPH0311771A (ja) * 1989-05-31 1991-01-21 Siemens Ag 表面実装可能なオプトデバイス
JPH05251747A (ja) * 1992-03-06 1993-09-28 Takiron Co Ltd 発光表示体及びその製造方法
JPH1187778A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
JP2001036149A (ja) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd 光源装置
JP2003124528A (ja) * 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源
JP2003330109A (ja) * 2002-05-09 2003-11-19 Seiko Epson Corp 照明装置および投射型表示装置
JP2004111906A (ja) * 2002-07-25 2004-04-08 Matsushita Electric Works Ltd 光電素子部品
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054179U (ja) * 1983-09-19 1985-04-16 三洋電機株式会社 微小発光ダイオ−ド表示器
JPS6113958U (ja) * 1984-06-28 1986-01-27 スタンレー電気株式会社 発光ダイオ−ドランプ
JPH0311771A (ja) * 1989-05-31 1991-01-21 Siemens Ag 表面実装可能なオプトデバイス
JPH05251747A (ja) * 1992-03-06 1993-09-28 Takiron Co Ltd 発光表示体及びその製造方法
JPH1187778A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
JP2001036149A (ja) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd 光源装置
JP2003124528A (ja) * 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源
JP2003330109A (ja) * 2002-05-09 2003-11-19 Seiko Epson Corp 照明装置および投射型表示装置
JP2004111906A (ja) * 2002-07-25 2004-04-08 Matsushita Electric Works Ltd 光電素子部品
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008085172A (ja) * 2006-09-28 2008-04-10 Shinetsu Astec Kk 発光装置
US8203164B2 (en) 2007-03-14 2012-06-19 Samsung Led Co., Ltd. Light emitting diode package
JP2009009926A (ja) * 2007-03-23 2009-01-15 Toshiba Lighting & Technology Corp 発光ダイオード照明装置
US8378358B2 (en) 2009-02-18 2013-02-19 Everlight Electronics Co., Ltd. Light emitting device
EP2221891A1 (en) * 2009-02-18 2010-08-25 Everlight Electronics Co., Ltd. Light emitting device
US8772802B2 (en) 2009-02-18 2014-07-08 Everlight Electronics Co., Ltd. Light emitting device with transparent plate
US8405105B2 (en) 2009-02-18 2013-03-26 Everlight Electronics Co., Ltd. Light emitting device
USD646015S1 (en) 2009-11-20 2011-09-27 Everlight Electronics Co., Ltd. Light emitting diode lamp
JP2012028666A (ja) * 2010-07-27 2012-02-09 Nitto Denko Corp 発光装置用部品、発光装置およびその製造方法
JP2012113306A (ja) * 2010-11-24 2012-06-14 Raytheon Co 光学的な表面を保護すること
US8960932B2 (en) 2011-05-27 2015-02-24 Samsung Electronics Co., Ltd. Light emitting device
WO2013168802A1 (ja) * 2012-05-11 2013-11-14 シチズンホールディングス株式会社 Ｌｅｄモジュール
US9512968B2 (en) 2012-05-11 2016-12-06 Citizen Holdings Co., Ltd. LED module
JP2013239712A (ja) * 2013-06-03 2013-11-28 Nichia Chem Ind Ltd 発光装置
JP2018006477A (ja) * 2016-06-29 2018-01-11 セイコーエプソン株式会社 光源装置およびプロジェクター

Similar Documents

Publication Publication Date Title
EP1953825B1 (en) Power surface mount light emitting die package
US8608349B2 (en) Power surface mount light emitting die package
TWI484665B (zh) 具有小型光學之高功率發光器包裝
JP5750040B2 (ja) オプトエレクトロニクス半導体コンポーネント
JP4192742B2 (ja) 発光装置
US20140284643A1 (en) Power surface mount light emitting die package
JP3872490B2 (ja) 発光素子収納パッケージ、発光装置および照明装置
WO2005043637A1 (ja) 発光装置
JP2007311445A (ja) 半導体発光装置及びその製造方法
WO2013168802A1 (ja) Ｌｅｄモジュール
JP2009290180A (ja) Ｌｅｄパッケージ及びその製造方法
JP5936885B2 (ja) 半導体発光装置
JP4857709B2 (ja) 発光装置
JP2006049715A (ja) 発光光源、照明装置及び表示装置
JP2007184656A (ja) 発光装置
CN100438093C (zh) 发光器件
JP2007335734A (ja) 半導体装置
KR20200134463A (ko) 발광소자 패키지, 광원장치 및 발광소자 패키지 제조방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071031

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071031

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100622

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100820

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101221

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110412