JP2006135016A - ロードポート - Google Patents
ロードポート Download PDFInfo
- Publication number
- JP2006135016A JP2006135016A JP2004320809A JP2004320809A JP2006135016A JP 2006135016 A JP2006135016 A JP 2006135016A JP 2004320809 A JP2004320809 A JP 2004320809A JP 2004320809 A JP2004320809 A JP 2004320809A JP 2006135016 A JP2006135016 A JP 2006135016A
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- JP
- Japan
- Prior art keywords
- load port
- sample
- plate
- exhaust duct
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ventilation (AREA)
Abstract
【解決手段】 大気搬送ユニット5の前面側に設置され、前面側に被処理対象の試料が収納された容器15が載置されるテーブル部24と、大気搬送ユニットの5の搬送室12の内部を外部から仕切るボルツプレート16を備え、ボルツプレート16に設けられている開口部により容器15内から試料を取出したり、容器15に試料を収納するようにしたロードポート9において、ボルツプレート16の背面側に沿って前記の開口部の下方に配置された排気ダクト20を設け、ファン21により排気室12内の雰囲気を大気中に排出させるようにしたもの。
【選択図】 図2
Description
このとき腐食性ガスによる腐食を防ぐため、排気ダクト20の表面、ファン21の表面、それにロードポート9のドア19を保持するキャリア(保持体)の表面には、それぞれ所定の厚さの防食用コーティングが施されている。
2:処理室
3:バッファ室
4:ロードロック室
5:大気搬送ユニット
6:Y軸ユニット
7:ロボットアーム
8:アライメントユニット
9:ロードポート
10:排気経路
11:排気経路
12:搬送室
13:ファンユニット
14:大気搬送ロボット駆動部
15:容器(FOUP等の容器)
16:ボルツプレート
17:駆動部
18:マッピングユニット
19:ドア
20:排気ダクト
21:ファン
22:開口部
23:収納室
24:テーブル部
25:抑制板
Claims (5)
- 処理対象の試料を搬送するための大気搬送ユニットの前面側に設置され、前記試料を収納した容器が載置されるテーブルと、前記大気搬送ユニットの内部を外部から仕切るプレートとを備えたロードポートにおいて、
前記プレートの背面側に配置した排気ダクトと、
前記排気ダクトの下端に配置したファンとを設け、
前記排気ダクトと前記ファンにより、前記大気搬送ユニット内の雰囲気が大気中に排出されるように構成したことを特徴とするロードポート。 - 処理対象の試料を搬送するための大気搬送ユニットの前面側に設置され、前記試料を収納した容器が載置されるテーブルと、前記大気搬送ユニットの内部を外部から仕切るプレートと、このプレートに設けられ前記容器内から取出し又は収納される前記試料がやり取りされる開口部と、前記プレートの前記大気搬送ユニットの前面側に配置され前記開口部を開閉するドアを駆動する駆動手段を収納する収納室とを備えたロードポートにおいて、
前記プレートの背面側に配置した排気ダクトと、
前記排気ダクトの下端に配置したファンとを設け、
前記排気ダクトと前記ファンにより、前記収納室の雰囲気が前記大気搬送ユニット外に排出されるように構成したことを特徴とするロードポート。 - 請求項1又は請求項2に記載のロードポートにおいて、
前記排気ダクトと前記ファンにより、前記容器の雰囲気が大気搬送ユニット外に排出されるように構成されていることを特徴とするロードポート。 - 請求項2に記載のロードポートにおいて、
前記排気ダクトの表面と前記ファンの表面、それに前記ドアを保持したドア保持体の何れかに防食コーティングが施されていることを特徴とするロードポート。 - 請求項2に記載のロードポートにおいて、
前記開口部を開放するため移動した前記ドアと前記大気搬送ユニットの内側と外側とを仕切る前記プレートとの間に、前記大気搬送ユニット内の雰囲気が前記収納室内に流入するのを抑制する抑制板が設けられていることを特徴とするロードポート。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004320809A JP4891538B2 (ja) | 2004-11-04 | 2004-11-04 | ロードポート |
US11/405,421 US20070066204A1 (en) | 2004-11-04 | 2006-04-18 | Load port |
US14/622,973 US9620399B2 (en) | 2004-11-04 | 2015-02-16 | Load port |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004320809A JP4891538B2 (ja) | 2004-11-04 | 2004-11-04 | ロードポート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006135016A true JP2006135016A (ja) | 2006-05-25 |
JP4891538B2 JP4891538B2 (ja) | 2012-03-07 |
Family
ID=36728304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004320809A Active JP4891538B2 (ja) | 2004-11-04 | 2004-11-04 | ロードポート |
Country Status (2)
Country | Link |
---|---|
US (2) | US20070066204A1 (ja) |
JP (1) | JP4891538B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007333300A (ja) * | 2006-06-15 | 2007-12-27 | Ricoh Co Ltd | 微細部品の製造装置と製造方法及びそれにより製造された液吐出ヘッド |
JP2011066260A (ja) * | 2009-09-18 | 2011-03-31 | Tdk Corp | ロードポート装置及び該ロードポート装置の排塵方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8021513B2 (en) * | 2006-08-23 | 2011-09-20 | Tokyo Electron Limited | Substrate carrying apparatus and substrate carrying method |
KR20140061691A (ko) * | 2012-11-14 | 2014-05-22 | 삼성전자주식회사 | 웨이퍼 홀더 클리닝 장치 및 이를 구비하는 성막 시스템 |
US9550219B2 (en) * | 2014-12-29 | 2017-01-24 | Daifuku Co., Ltd. | Apparatus of inhalation type for stocking wafer at ceiling and inhaling type wafer stocking system having the same |
US10262884B2 (en) | 2016-11-10 | 2019-04-16 | Applied Materials, Inc. | Systems, apparatus, and methods for an improved load port |
US10741432B2 (en) * | 2017-02-06 | 2020-08-11 | Applied Materials, Inc. | Systems, apparatus, and methods for a load port door opener |
US10649507B2 (en) | 2017-08-22 | 2020-05-12 | Dell Products, L.P. | Power over Ethernet cooling system |
US10403514B1 (en) * | 2018-04-12 | 2019-09-03 | Asm Ip Holding B.V. | Substrate transporting system, storage medium and substrate transporting method |
US11031265B2 (en) | 2018-11-28 | 2021-06-08 | Brooks Automation, Inc. | Load port module |
US10923375B2 (en) | 2018-11-28 | 2021-02-16 | Brooks Automation, Inc. | Load port module |
JP6856692B2 (ja) * | 2019-03-28 | 2021-04-07 | 平田機工株式会社 | ロードポート |
Citations (4)
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---|---|---|---|---|
JPH11145245A (ja) * | 1997-11-13 | 1999-05-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2000357641A (ja) * | 1999-06-14 | 2000-12-26 | Hitachi Plant Eng & Constr Co Ltd | クリーンルーム設備 |
JP2003007799A (ja) * | 2001-06-21 | 2003-01-10 | Tokyo Electron Ltd | 処理システム |
JP2004200669A (ja) * | 2002-12-02 | 2004-07-15 | Rorze Corp | ミニエンバイロメント装置、薄板状物製造システム及び清浄容器の雰囲気置換方法 |
Family Cites Families (21)
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DD160756A3 (de) * | 1981-04-24 | 1984-02-29 | Gudrun Dietz | Anordnung zur verbesserung fotochemischer umsetzungsprozesse in fotoresistschichten |
JPS61160934A (ja) * | 1985-01-10 | 1986-07-21 | Canon Inc | 投影光学装置 |
US6799932B2 (en) * | 1994-04-28 | 2004-10-05 | Semitool, Inc. | Semiconductor wafer processing apparatus |
US6013920A (en) * | 1997-11-28 | 2000-01-11 | Fortrend Engineering Coirporation | Wafer-mapping load post interface having an effector position sensing device |
JP3939062B2 (ja) * | 2000-01-25 | 2007-06-27 | 松下電器産業株式会社 | 基板検出装置 |
TW460035U (en) * | 2000-09-08 | 2001-10-11 | Ind Tech Res Inst | Automatic front-opening load-in device for wafer box |
JP2002184831A (ja) * | 2000-12-11 | 2002-06-28 | Hirata Corp | Foupオープナ |
US6543981B1 (en) * | 2001-03-30 | 2003-04-08 | Lam Research Corp. | Apparatus and method for creating an ultra-clean mini-environment through localized air flow augmentation |
US6769424B2 (en) * | 2001-06-21 | 2004-08-03 | Charles James Perrault | Heater with heat resistant anti-oxidant coating on interior surfaces |
JP3880343B2 (ja) * | 2001-08-01 | 2007-02-14 | 株式会社ルネサステクノロジ | ロードポート、基板処理装置および雰囲気置換方法 |
US7371467B2 (en) * | 2002-01-08 | 2008-05-13 | Applied Materials, Inc. | Process chamber component having electroplated yttrium containing coating |
US6895981B2 (en) * | 2002-07-19 | 2005-05-24 | Semitool, Inc. | Cross flow processor |
JP4175560B2 (ja) | 2002-11-13 | 2008-11-05 | 平田機工株式会社 | 容器開閉装置 |
US6984839B2 (en) * | 2002-11-22 | 2006-01-10 | Tdk Corporation | Wafer processing apparatus capable of mapping wafers |
JP4027837B2 (ja) * | 2003-04-28 | 2007-12-26 | Tdk株式会社 | パージ装置およびパージ方法 |
US9010384B2 (en) * | 2004-06-21 | 2015-04-21 | Right Mfg. Co. Ltd. | Load port |
JP4440070B2 (ja) * | 2004-10-20 | 2010-03-24 | キヤノン株式会社 | 画像形成装置 |
US7467916B2 (en) * | 2005-03-08 | 2008-12-23 | Asm Japan K.K. | Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same |
US9105673B2 (en) * | 2007-05-09 | 2015-08-11 | Brooks Automation, Inc. | Side opening unified pod |
JP5494734B2 (ja) * | 2011-08-15 | 2014-05-21 | Tdk株式会社 | パージ装置及び該パージ装置を有するロードポート装置 |
JP6198043B2 (ja) * | 2013-06-06 | 2017-09-20 | Tdk株式会社 | ロードポートユニット及びefemシステム |
-
2004
- 2004-11-04 JP JP2004320809A patent/JP4891538B2/ja active Active
-
2006
- 2006-04-18 US US11/405,421 patent/US20070066204A1/en not_active Abandoned
-
2015
- 2015-02-16 US US14/622,973 patent/US9620399B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11145245A (ja) * | 1997-11-13 | 1999-05-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2000357641A (ja) * | 1999-06-14 | 2000-12-26 | Hitachi Plant Eng & Constr Co Ltd | クリーンルーム設備 |
JP2003007799A (ja) * | 2001-06-21 | 2003-01-10 | Tokyo Electron Ltd | 処理システム |
JP2004200669A (ja) * | 2002-12-02 | 2004-07-15 | Rorze Corp | ミニエンバイロメント装置、薄板状物製造システム及び清浄容器の雰囲気置換方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007333300A (ja) * | 2006-06-15 | 2007-12-27 | Ricoh Co Ltd | 微細部品の製造装置と製造方法及びそれにより製造された液吐出ヘッド |
JP2011066260A (ja) * | 2009-09-18 | 2011-03-31 | Tdk Corp | ロードポート装置及び該ロードポート装置の排塵方法 |
Also Published As
Publication number | Publication date |
---|---|
US9620399B2 (en) | 2017-04-11 |
JP4891538B2 (ja) | 2012-03-07 |
US20150162229A1 (en) | 2015-06-11 |
US20070066204A1 (en) | 2007-03-22 |
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