JP2006128457A5 - - Google Patents

Download PDF

Info

Publication number
JP2006128457A5
JP2006128457A5 JP2004316007A JP2004316007A JP2006128457A5 JP 2006128457 A5 JP2006128457 A5 JP 2006128457A5 JP 2004316007 A JP2004316007 A JP 2004316007A JP 2004316007 A JP2004316007 A JP 2004316007A JP 2006128457 A5 JP2006128457 A5 JP 2006128457A5
Authority
JP
Japan
Prior art keywords
light
fusion
light emitting
contact electrode
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004316007A
Other languages
English (en)
Japanese (ja)
Other versions
JP4630629B2 (ja
JP2006128457A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004316007A priority Critical patent/JP4630629B2/ja
Priority claimed from JP2004316007A external-priority patent/JP4630629B2/ja
Priority to US11/220,405 priority patent/US7417220B2/en
Publication of JP2006128457A publication Critical patent/JP2006128457A/ja
Publication of JP2006128457A5 publication Critical patent/JP2006128457A5/ja
Priority to US12/155,820 priority patent/US8017967B2/en
Application granted granted Critical
Publication of JP4630629B2 publication Critical patent/JP4630629B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004316007A 2004-09-09 2004-10-29 発光装置の製造方法 Expired - Fee Related JP4630629B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004316007A JP4630629B2 (ja) 2004-10-29 2004-10-29 発光装置の製造方法
US11/220,405 US7417220B2 (en) 2004-09-09 2005-09-07 Solid state device and light-emitting element
US12/155,820 US8017967B2 (en) 2004-09-09 2008-06-10 Light-emitting element including a fusion-bonding portion on contact electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004316007A JP4630629B2 (ja) 2004-10-29 2004-10-29 発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006128457A JP2006128457A (ja) 2006-05-18
JP2006128457A5 true JP2006128457A5 (enExample) 2007-07-26
JP4630629B2 JP4630629B2 (ja) 2011-02-09

Family

ID=36722829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004316007A Expired - Fee Related JP4630629B2 (ja) 2004-09-09 2004-10-29 発光装置の製造方法

Country Status (1)

Country Link
JP (1) JP4630629B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129739B2 (en) 2005-07-15 2012-03-06 Panasonic Corporation Semiconductor light emitting device and semiconductor light emitting device mounted board
JP5250856B2 (ja) 2006-06-13 2013-07-31 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子の製造方法
JP4979299B2 (ja) * 2006-08-03 2012-07-18 豊田合成株式会社 光学装置及びその製造方法
JP5329787B2 (ja) * 2007-09-28 2013-10-30 パナソニック株式会社 実装基板およびledモジュール
JP5549190B2 (ja) * 2009-02-27 2014-07-16 豊田合成株式会社 半導体発光素子の実装体の製造方法、発光装置の製造方法及び半導体発光素子
DE102010054898A1 (de) * 2010-12-17 2012-06-21 Osram Opto Semiconductors Gmbh Träger für einen optoelektronischen Halbleiterchip und Halbleiterchip
WO2013161208A1 (ja) * 2012-04-27 2013-10-31 パナソニック株式会社 発光素子
JP6754921B1 (ja) 2018-12-14 2020-09-16 パナソニックセミコンダクターソリューションズ株式会社 半導体装置
JPWO2022004393A1 (enExample) * 2020-07-02 2022-01-06
US12408493B2 (en) 2021-05-26 2025-09-02 Nichia Corporation Light-emitting element including first semiconductor layer having exposed portion with first region and second regions
WO2023210082A1 (ja) * 2022-04-26 2023-11-02 日亜化学工業株式会社 発光素子及び発光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730153A (ja) * 1993-07-14 1995-01-31 Hitachi Cable Ltd 発光ダイオードチップ、その台座、及び発光ダイオード
JP3811248B2 (ja) * 1997-03-10 2006-08-16 松下電器産業株式会社 半導体素子の基板への接合方法及び実装方法
US6514782B1 (en) * 1999-12-22 2003-02-04 Lumileds Lighting, U.S., Llc Method of making a III-nitride light-emitting device with increased light generating capability
JP4139634B2 (ja) * 2002-06-28 2008-08-27 松下電器産業株式会社 Led照明装置およびその製造方法
JP2004082036A (ja) * 2002-08-28 2004-03-18 Ishigaki Co Ltd 加温式フイルタープレス
JP3703455B2 (ja) * 2002-12-13 2005-10-05 Necエレクトロニクス株式会社 二層バンプの形成方法
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法

Similar Documents

Publication Publication Date Title
TW200505043A (en) LED device, flip-chip led package and light reflecting structure
JP2006066868A5 (enExample)
WO2006138465A3 (en) Light emitting diodes with reflective electrode and side electrode
JP2006128457A5 (enExample)
JP2017028287A5 (enExample)
JP2013535393A (ja) オプトエレクトロニクス半導体素子及びガラスろうを用いない超短波パルスレーザーを用いたガラスハウジング部材の直接融着によるその製造方法
JP2005109282A5 (enExample)
JP2007103917A5 (enExample)
JP2017199933A5 (enExample)
JP2005123477A5 (enExample)
JP7570863B2 (ja) 半導体発光装置及び半導体発光モジュール
JP4956274B2 (ja) Ledパッケージ構造
JP2008166272A (ja) 光を発する装置
RU2009118965A (ru) Органическое светоизлучающее диодное устройство
JP2016004913A (ja) 発光装置および発光装置の製造方法
WO2003010860A3 (en) Vertical-cavity surface emitting laser utilizing a reversed-biased diode
TW200608607A (en) Semiconductor light-emitting device and manufacturing method thereof
US10325889B1 (en) Display device including LED devices with selective activation function
JP2003209293A (ja) 発光ダイオード
TWI497770B (zh) 發光二極體燈源裝置
US20080173890A1 (en) Multidirectional light-emitting diode
JP2007027585A5 (enExample)
KR970705838A (ko) 발광 다이오드칩 및 이를 사용한 발광 다이오드
KR102701975B1 (ko) 유기 발광 패널 및 무기 발광 다이오드를 포함하는 조명장치
JP6257203B2 (ja) 発光素子