JP2006128359A - Spinner cleaning device and dicing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate troublesome exchange work of a spinner table for holding a plurality of types of frames whose outer diameters differ in a spinner cleaning device where cleaning water is supplied while a wafer integrated with the annular frame is rotated through a tape and the wafer is cleaned. <P>SOLUTION: A pressing means 28 having a frame support 26 and a wafer region support 27 and sandwiching the frame with the frame support 26 is constituted of a first pressing means 280 corresponding to the frame of a large diameter, and a second pressing means 285 corresponding to the frame of a small diameter. The frame different in the outer diameter can be held without exchanging the spinner table 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a spinner cleaning apparatus that cleans a wafer by supplying cleaning water while rotating the wafer, and a dicing apparatus equipped with the spinner cleaning apparatus.

  A wafer partitioned by streets and having a plurality of devices formed on the surface is divided into individual devices by separating the streets by a dicing apparatus. A general dicing apparatus includes a chuck table for holding a wafer, a cutting means having a cutting blade for cutting a street of the wafer held on the chuck table, and cleaning the wafer diced by the cutting with cleaning water while rotating the wafer. A spinner cleaning device is provided, and a wafer to be diced is held on a chuck table in a state of being integrated with a dicing frame via a dicing tape. Then, while the chuck table moves, the street of the wafer is cut vertically and horizontally by the action of the cutting means, and is divided into individual devices. The device after the division is attached to a dicing tape and conveyed to the cleaning device while maintaining the outer shape of the wafer as a whole, and cutting waste and the like are removed by the cleaning water (see, for example, Patent Document 1).

  As a cleaning apparatus mounted on the dicing apparatus, a so-called spinner cleaning apparatus having a configuration in which a rotating table holding a wafer rotates and jets cleaning water to the rotating wafer is generally used. In this spinner cleaning apparatus, as a rotary table for holding a wafer, a presser pendulum in which a rotatable weight part and a presser part are integrally provided on the outer periphery of the table is pivotally supported, and the rotary table is rotated while the rotary table rotates. There is known a structure in which a frame integrated with a wafer is sandwiched between a pressing portion and a rotary table by utilizing the fact that the weight portion rotates to the outer peripheral side by force (see, for example, Patent Document 2).

JP 2003-86543 A Japanese Utility Model Publication No. 61-86931

  However, if the frame is held on the rotary table (spinner table) disclosed in Patent Document 2, the frame is held by the pressing portion of the pressing pendulum provided on the outer peripheral portion thereof. There is a problem that the diameter is determined in advance, and it is not possible to cope with a plurality of types of frames having different outer diameters.

  On the other hand, with the chuck table that holds the wafer during cutting, it is possible to suck and fix the holding table on the base, so if you just release the suction, you can also replace the table according to the outer diameter of the frame However, unlike the chuck table, the spinner table needs to be rotated at a high speed of about 100 rpm to 3000 rpm when cleaning the wafer. Therefore, the table cannot be held by suction, and the table base is bolted. It is necessary to fix firmly by such as. Therefore, if you prepare multiple spinner tables that match the outer diameter of the frame and try to replace the spinner table each time when cleaning a wafer that is integrated with a frame with a different outer diameter, it is equivalent to the replacement work. There is a problem that it takes time and productivity is remarkably lowered.

  Therefore, the problem to be solved by the present invention is to eliminate the troublesome work of replacing the spinner table when holding a plurality of types of frames having different outer diameters in the spinner cleaning apparatus.

  The present invention provides a spinner cleaning comprising at least a spinner table capable of holding and rotating a wafer integrated with a frame via a tape, and a cleaning water supply nozzle for supplying cleaning water to the wafer held on the spinner table. The spinner table has a frame support part for supporting the frame and a wafer area support part for supporting the wafer area, and the frame support part has a frame by centrifugal force generated by rotation of the spinner table. A pressing means having a pressing pendulum that sandwiches the frame with the support portion is disposed, and the pressing means includes at least a first pressing means having a first pressing pendulum that presses a large-diameter frame, and a small diameter. And a second pressing means having a second pressing pendulum for pressing the frame of It is characterized in. Here, the large diameter and the small diameter with respect to the frame mean a relative size relationship between the outer diameters when there are two types of frames having different outer diameters. The wafer area means a portion of the tape where the wafer is attached.

  The first pressing means is arranged at four equal intervals on the outer periphery of the frame support portion, and the second pressing means is arranged at equal intervals at a position where the second pressing pendulum does not contact the first pressing pendulum. It is desirable to be installed. As an example, there is a configuration in which, for example, a notch portion that is notched toward the inner periphery is formed on the outer periphery of the frame support portion, and the second pressing means is disposed in the notch portion. In addition, it is desirable that the second pressing means includes a stopper that regulates the swing of the second pressing pendulum.

  The present invention also provides a chuck table for holding a wafer integrated with a frame via a tape, a cutting means for cutting the wafer held on the chuck table, the above spinner cleaning device, and a wafer after cutting. There is also provided a dicing apparatus provided with at least conveying means for conveying from the means to the spinner cleaning apparatus.

  The spinner cleaning apparatus according to the present invention includes a first pressing unit having a first pressing pendulum that presses a large-diameter frame and a second pressing unit having a second pressing pendulum that presses a small-diameter frame. Thus, since the first pressing means can hold the large-diameter frame and the second pressing means can hold the small-diameter frame, two kinds of frames having different outer diameters are held on one spinner table. Can be washed. Therefore, it is not necessary to replace the spinner table according to the outer diameter of the frame, and productivity can be improved.

  In addition, the first pressing means is arranged at four equal intervals on the outer periphery of the frame support portion, and the second pressing means is arranged at equal intervals so that the second pressing pendulum does not contact the first pressing pendulum. When provided, the large-diameter frame and the small-diameter frame can be stably held.

  Furthermore, when the second pressing means is provided with a stopper that restricts the swinging of the second pressing pendulum, the second pressing pendulum is prevented from contacting the large diameter frame when supporting the large diameter frame. can do.

  In the dicing apparatus equipped with the spinner cleaning apparatus according to the present invention, the wafer after cutting can be cleaned, and therefore, the wafer after dicing integrated with two or more types of frames is cleaned by one dicing apparatus. Can be efficient.

A dicing apparatus 1 shown in FIG. 1 is an apparatus for dicing a wafer, dividing it into individual devices, and cleaning it, and is equipped with a spinner cleaning apparatus 2. Dicing targets are at least two types of wafers W1 and W2 having different outer diameters, each of which is a frame F1.
, Are attached to the adhesive surfaces of the tapes T1 and T2 that block the opening of F2, and are accommodated in the cassette 3 in a state of being integrated with the frames F1 and F2 via the tapes T1 and T2.

  The wafer W1 (W2) accommodated in the cassette 3 is placed in the temporary placement region 5 by the frame F1 (F2) being sandwiched by the loading / unloading means 4 and the loading / unloading means 4 moving in the −Y direction. And it is attracted | sucked by the 1st conveying means 6, is conveyed to the chuck table 7 by the turning movement, and is sucked and held.

  The chuck table 7 is movable in the X-axis direction. Above the movement path of the chuck table 7, an alignment unit 8 for detecting a street to be cut and a cutting unit 9 having a cutting blade 9a are disposed. . When the chuck table 7 holding the wafer W1 (W2) moves in the + X direction, it is positioned directly below the alignment means 8. After the street to be cut is detected by the image pickup means 8a constituting the alignment means 8, and the street and the cutting blade 9a are aligned in the Y-axis direction, the chuck table 7 further moves in the + X direction. At the same time, the cutting means 9 descends while the cutting blade 9a rotates at a high speed, whereby the cutting blade 9a rotating at a high speed is cut into the detected street and the street is cut.

  In addition, the wafer W1 (W2) held on the chuck table 7 reciprocates in the X-axis direction and cuts the streets one by one while indexing and feeding the cutting means 9 in the Y-axis direction by the street interval. All streets in the same direction are cut. Furthermore, if the chuck table 7 is rotated 90 degrees and the wafer W1 (W2) is rotated 90 degrees and then the same cutting is performed, all streets are cut vertically and horizontally and diced to be divided into individual devices. Is done. At this time, since the individual devices remain adhered to the tape T1 (T2), the outer shape of the wafer W1 (W2) is maintained as a whole.

  The device that maintains the outer shape of the wafer W1 (W2) as a whole after dicing is transferred to the spinner cleaning device 2 by the second transfer means 10 in a state of being integrated with the frame F1 (F2) via the tape T1 (T2). Is done.

  As shown in FIG. 2, the spinner cleaning device 2 holds the wafer W1 (W2) integrated with the frame F1 (F2) via the tape T1 (T2), and the spinner table 20 holds the spinner table 20. A cleaning water supply nozzle 21 for supplying cleaning water to the wafer W1 (W2) and an air nozzle 22 for ejecting air for removing the cleaning water are provided.

  The spinner table 20 is connected to a motor 24 via a shaft portion 23 and is driven to rotate by the motor 24. The motor 24 can be moved up and down by an air piston 25, and the spinner table 20 is also moved up and down as the motor 24 moves up and down.

  As shown in FIG. 2, the objects that can be held in the spinner table 20 are the wafer W1 integrated with the frame F1 through at least the tape T1 and the wafer W2 integrated with the frame F2 through the tape T2. The wafer W1 is formed with a larger outer diameter than the wafer W2, and accordingly, the frame F1 is also formed with a larger outer diameter than the frame F2.

  The spinner table 20 supports a frame F1 and a frame F2 of the wafer W1 integrated with the frame F1 via the tape T1 and the wafer W2 integrated with the frame F2 via the tape T2. 26, a wafer region, that is, a wafer region support portion 27 that supports a portion of the tape T1 to which the wafer W1 is attached and a portion of the tape T2 to which the wafer W2 is attached to the outer periphery of the frame support portion 26. The presser means 28 is composed of a first presser means 280 and a second presser means 285. A cleaning water cover 29a is disposed around the shaft portion 23. Below the cleaning water cover 29a, a cleaning water receiving portion 29b that receives the cleaning water and a discharge portion 29c that discharges the used cleaning water staying in the cleaning water receiving portion 29b. And.

  The wafer region support unit 27 is formed of a porous member, and can suck and hold the wafer region in communication with a suction source (not shown). On the other hand, the frame support portion 26 is formed with a notch 26a by notching a part of the outer periphery of the ring-shaped plate-shaped member toward the inner peripheral side, and the first end is formed at the outer peripheral end. A pressing means 280 is provided, and a second pressing means 285 is provided in the notch 26a. A plurality of first pressing means 280 and second pressing means 285 are provided. In the illustrated example, each of the first pressing means 280 and the second pressing means 285 is arranged alternately at equal intervals (equal angles). Thereby, the large-diameter frame F1 and the small-diameter frame F2 can be stably held.

  The first pressing means 280 corresponds to the frame F1 having a larger outer diameter (large diameter), and the second pressing means 285 corresponds to the frame F2 having a smaller outer diameter (small diameter). The table 20 can hold two types of frames having different outer diameters. The first pressing means 280 includes a first pressing pendulum 281, and the second pressing means 285 includes a second pressing pendulum 286 at a position that does not contact the first pressing pendulum 281.

  As shown in FIG. 3, the first pressing means 280 includes a first pressing pendulum 281 that is pivotally supported by a shaft support portion 282. The first pressing pendulum 281 includes a pressing portion 281a that holds and holds the frame F1 with the frame support portion 26, and a weight portion 281b that is formed integrally with the pressing portion 281a and is heavier than the pressing portion 281a. The shaft support 282 can be turned around. Since the weight part 281b is heavier than the pressing part 281a, the weight part 281b is positioned below and the pressing part 281a is positioned upward when the spinner table 20 is stationary as shown in FIG.

  When cleaning the wafer W1, as shown in FIG. 4, the wafer W1 integrated with the frame F1 is placed on the spinner table 20 via the tape T1, and the spinner table 20 is lowered. When the spinner table 20 rotates at a high speed (100 rpm to 3000 rpm), as shown in FIG. 4, the weight portion 281b rotates to the outer peripheral side with the shaft support portion 282 as a fulcrum by the centrifugal force at the time of rotation. 281a rotates to the inner peripheral side, and the frame F1 is sandwiched between the frame support 26. At this time, the wafer W1 is sucked and held by the wafer region support portion 27 via the tape T1.

  With the spinner table 20 rotating at a high speed, the cleaning water supply nozzle 21 swings in the horizontal direction so that its tip 210 faces the surface of the wafer W as shown in FIG. Is ejected, the cutting waste adhering to the wafer W is removed. Further, after the ejection of the cleaning water is finished, although not shown, the air nozzle 22 rotates in the horizontal direction so that its front end portion faces the surface of the wafer W, and the high-pressure air is ejected, thereby cleaning water. Is removed and dried.

  As shown in FIG. 4, when the wafer W1 integrated with the large-diameter frame F1 is supported and cleaned, the frame F is fixed by the first pressing means 280. The shown second pressing means 285 needs to be out of the way to support the large-diameter frame F1. Therefore, as shown in FIG. 5, the second pressing means 285 is provided with a stopper 288 that restricts the swing of the second pressing pendulum 286. The stopper 288 has a loose fitting hole 288a for loosely fitting the bolt 289, and can slide in the horizontal direction by the width of the loose fitting hole 288a. As shown in FIG. 5, when the stopper 288 is slid to the outer peripheral side of the frame support portion 26 (in the direction of the arrow in FIG. 5), the second pressing pendulum 286 can be fixed so as not to swing. In the state shown in FIG. 5, since the pressing portion 286a is fixed below the frame support portion 26, even if the large-diameter frame F1 is supported in this state, the frame F1 does not contact the pressing portion 286a. . Therefore, the second pressing means 285 does not get in the way of supporting the large-diameter frame F1.

  The second pressing pendulum 286 is pivotally supported by the shaft support portion 287 and can be rotated. The second pressing pendulum 286 holds the frame F between the frame support portion 26 and presses the frame F. The first pressing means 280 is the same as the first pressing means 280 in that the weight portion 286b is formed integrally with the pressing portion 286a and is heavier than the pressing portion 286a.

  On the other hand, when supporting the small-diameter frame F2, as shown in FIG. 6, when the stopper 288 is slid to the inner peripheral side of the frame support portion 26 (in the direction of the arrow in FIG. 6), the second pressing pendulum 286 The second pressing pendulum 286 is rotated by the weight of the weight portion 286b after the fixed state is released, and the pressing portion 286a is positioned above the frame support portion 26. When the spinner table 20 rotates at a high speed, the second pressing pendulum 286 further rotates in the same direction due to the centrifugal force and rotates to the position indicated by the two-dot chain line in FIG. A small-diameter frame F2 can be sandwiched between the two.

  Thus, since the first pressing means 280 can hold the large-diameter frame F1 and the second pressing means 285 can hold the small-diameter frame F2, two types of frames having different outer diameters can be combined into one spinner table. The wafer can be cleaned by holding at 20. Therefore, it is not necessary to replace the spinner table 20 according to the outer diameter of the frame, and productivity can be improved.

  In the above example, the case where the spinner cleaning apparatus is mounted on the dicing apparatus has been described. However, the spinner cleaning apparatus can be used alone or mounted on another apparatus. In addition to the first pressing means and the second pressing means, a third pressing means for holding a frame having another outer diameter, a fourth frame means,... Can be arranged. It is.

It is a perspective view which shows an example of a dicing apparatus. It is a perspective view which shows an example of a spinner washing | cleaning apparatus. It is sectional drawing which shows the state in which the 1st pressing means does not hold | maintain a large diameter flame | frame. It is sectional drawing which shows the state holding a large diameter flame | frame by the 1st pressing means. It is sectional drawing which shows the state which fixed the 2nd pressing pendulum. It is sectional drawing which shows the state which hold | maintains a small diameter flame | frame by the 2nd pressing means.

Explanation of symbols

1: Dicing device 2: Spinner cleaning device 20: Spinner table 21: Cleaning water supply nozzle 22: Air nozzle 23: Shaft portion 24: Motor 25: Air piston 26: Frame support portion 26a: Notch portion 27: Wafer region support portion 28: Pressing means 280: First pressing means
281: First presser pendulum
281a: holding part 281b: weight part
282: Shaft support 285: Second pressing means
286: Second press pendulum
286a: holding part 286b: weight part
287: Shaft support
288: Stopper
288a: loose fitting hole
289: Bolt 29a: Washing water cover 29b: Washing water receiving part 29c: Discharge part 3: Cassette 4: Carry-in / out means 5: Temporary placing area 6: First transport means 7: Chuck table 8: Alignment means 8a: Imaging means 9: Cutting means 9a: Cutting blade 10: Second conveying means W1, W2: Wafer T1, T2: Tape F1, F2: Frame D: Device

Claims (5)

A spinner cleaning apparatus comprising at least a spinner table capable of rotating while holding a wafer integrated with a frame via a tape, and a cleaning water supply nozzle for supplying cleaning water to the wafer held on the spinner table. And
The spinner table has a frame support portion for supporting the frame and a wafer region support portion for supporting a wafer region, and the frame support portion has an outer periphery on the outer periphery of the frame support portion by centrifugal force generated by the rotation of the spinner table. A pressing means having a pressing pendulum that sandwiches the frame with the support portion is disposed,
The pressing means includes at least a first pressing means having a first pressing pendulum for pressing a large-diameter frame and a second pressing means having a second pressing pendulum for pressing a small-diameter frame. Cleaning device. The first pressing means are arranged at four equal intervals on the outer periphery of the frame support portion,
2. The spinner cleaning device according to claim 1, wherein the second pressing unit is disposed at equal intervals at a position where the second pressing pendulum does not contact the first pressing pendulum. The spinner cleaning device according to claim 2, wherein a cutout portion cut out toward an inner periphery is formed on an outer periphery of the frame support portion, and the second pressing means is disposed in the cutout portion. . The spinner cleaning apparatus according to claim 1, 2 or 3, wherein the second pressing means includes a stopper for restricting the swing of the second pressing pendulum. A chuck table for holding a wafer integrated with the frame via a tape;
Cutting means for cutting the wafer held on the chuck table;
A spinner cleaning device according to claim 1, 2, 3 or 4,
A dicing apparatus comprising at least conveying means for conveying a cut wafer from the cutting means to the spinner cleaning apparatus.

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