JP2008246276A - Resin applying apparatus and laser beam machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin applying apparatus operated by rotating a spinner table to fix a frame to a claw part by the centrifugal force and applying a protective film on the surface of a wafer supported by the frame through a tape, wherein the wafer is removed from the spinner table even when a resin enters into a gap between the claw part and the frame. <P>SOLUTION: In a frame holding means 41 having a structure that a pendulum shaft 415 of a pendulum body 410 having the claw part 414 for holding the frame F is rotatably supported by a shaft hole 416 of a shaft supporting body 411, the shaft hole 416 is formed into a long hole inclined to the outer peripheral side of the spinner table with the direction from the lower side to the upper side and supporting the pendulum shaft 415 to slide and the pendulum body 410 is moved downward along the shaft hole 416 to release the connection of the claw part 414 to the frame in the stopping of the rotation of the spinner table. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a resin coating apparatus for coating a wafer with resin and a laser processing apparatus having a resin coating function.

  A wafer formed by dividing devices such as ICs and LSIs by processing planned lines is divided into individual devices by cutting the processing scheduled lines. As a method for cutting the processing scheduled line, a method using laser light irradiation is also employed for the reason that chipping or the like hardly occurs.

  However, when processing is performed by irradiating a processing line on the surface of the wafer with laser light, there is a problem that debris scatters and adheres to the surface of the device, resulting in deterioration of quality. Therefore, a technique has been proposed in which a protective film made of a resin is previously coated on the surface of a wafer before processing with a laser beam (see, for example, Patent Document 1).

  When coating the resin on the surface of the wafer, a resin coating apparatus or a laser processing apparatus having a resin coating function is used, and the protective film made of resin is coated on the surface by, for example, spin coating. At that time, as shown in FIG. 13, the wafer W is supported by the frame F in a state of being integrated with the frame F via the tape T. On the surface of the wafer W, a device D is formed by being partitioned by a processing scheduled line S.

  As shown in FIG. 14, the resin coating apparatus or the laser processing apparatus includes a spinner table 100 that can hold and rotate the wafer W, and the wafer W supported by the frame F is placed on the spinner table 100. Placed and adsorbed. At this time, the surface of the wafer W is exposed.

  The outer periphery of the spinner table 100 is provided with a pendulum body 104 that is pivotally supported by the pivotal support portion 101 and is connected to the weight portion 102 and the claw portion 103. Centrifugal force causes the weight portion 102 to rotate outward (clockwise in FIG. 14) about the shaft support portion 101, whereby the claw portion 103 presses the frame F against the surface of the spinner table 100 to fix the frame F. The wafer W is fixed (see, for example, Patent Document 2).

JP 2004-322168 A JP 2006-128359 A

  However, when the spinner table 100 holding the wafer W supported by the frame F is rotated via the tape T, and a liquid resin such as PVA (polyvinyl alcohol) is dropped on the rotating wafer W to cover the protective film. The liquid resin scatters to the outer peripheral side of the wafer and adheres to the frame F and is solidified. The claw 103 is bonded to the frame F by the resin, and the wafer W cannot be removed from the spinner table 100 together with the frame F. There is a problem.

  Therefore, the problem to be solved by the present invention is that when a spinner table is rotated and the frame is fixed by a claw portion by the centrifugal force, and a protective film is coated on the surface of a wafer supported by the frame via a tape. Even when resin enters between the claw portion and the frame, the wafer can be removed from the spinner table.

  A first invention includes a spinner table that rotates while holding a wafer supported by a frame, a frame pressing unit that is disposed on an outer peripheral portion of the spinner table and presses the frame by centrifugal force when the spinner table rotates, and a spinner table A resin coating apparatus having at least a liquid resin supply nozzle for dropping liquid resin onto a wafer held on a frame, wherein a frame pressing means is connected to a weight part, an arm part connected to the weight part, and a frame connected to the arm part. A pendulum body composed of a pendulum shaft formed on the arm portion so that the claw portion and the weight portion are positioned on the lower side and the claw portion is positioned on the upper side, and the pendulum shaft disposed on the outer peripheral portion of the spinner table And a shaft support that has a shaft hole that rotatably supports the shaft hole. Characterized in that it is formed in a long hole which is inclined to the outer peripheral side of the pin donor table slidably supporting the pendulum shaft.

  It is desirable that the tip of the nail portion is formed in a sharp shape. Moreover, it is desirable that the lower surface of the tip portion of the claw portion is formed in a curved shape. The resin coating apparatus may be provided with a cleaning water supply nozzle that ejects cleaning water onto the wafer held on the spinner table.

  The second invention comprises a chuck table for holding a wafer supported by a frame, and a laser beam irradiation means for irradiating the wafer held by the chuck table with a laser beam to process the chuck table and the laser beam irradiation. The present invention relates to a laser processing apparatus having a structure in which processing means is relatively processed and indexed, and relates to a laser processing apparatus provided with the above resin coating apparatus.

  In the present invention, the shaft hole that is formed in the shaft support body and supports the pendulum body is formed into a long hole that tilts toward the outer peripheral side of the spinner table from the lower side toward the upper side and supports the pendulum shaft in a slidable manner. When the table is rotated, the weight part is raised by the centrifugal force, so that the pendulum shaft moves to the upper side of the shaft hole and the claw part can hold down the frame and be fixed, and when the rotation of the spinner table is stopped, the weight part is As the pendulum shaft moves down to the lower side of the shaft hole, it adheres when the pendulum shaft moves to the lower side of the shaft hole even when resin is interposed between the frame and the claw. The state can be released, and the pendulum body can be easily returned to the open state.

  In addition, when the tip of the nail part is formed in a sharp shape, the contact area between the nail part and the frame is reduced, so that the resin interposed between the nail part and the frame is reduced, and the adhesive state can be easily released. it can.

  Furthermore, when the lower surface of the tip of the claw portion is formed in a curved surface shape, the contact point of the claw portion with respect to the frame moves when the weight portion descends, so that the adhesive force is easily released.

  A laser processing apparatus 1 shown in FIG. 1 is an apparatus that performs processing by irradiating a wafer with laser light. The chuck table 2 that holds the wafer and the wafer that is held by the chuck table 2 irradiates the laser light to perform processing. And a resin coating apparatus 4 that coats the surface of the wafer with a protective film.

  The wafer W to be processed is accommodated in the wafer cassette 5a in a state of being supported integrally with the frame F via the tape T. Hereinafter, the wafer W supported by the frame F via the tape T is simply referred to as a wafer W.

  The wafer cassette 5a is placed in the cassette placement area 5. In the vicinity of the wafer cassette 5a, a loading / unloading means 6 for unloading the wafer W from the wafer cassette 5a and loading the processed wafer W into the wafer cassette 5a is disposed. The carry-in / out means 6 is movable in the Y-axis direction (carrying-in / out direction) with the frame F held between the holding portions 6a.

  Between the carry-in / out means 6 and the wafer cassette 5a, a temporary placement region 7 is provided, which is a region in which the wafer W to be carried in / out is temporarily placed.

  On the front side of the laser processing apparatus 1, a chuck table 2 that holds the wafer W and is movable in the X-axis direction and is rotatable is disposed. Between the temporary placement region 7 and the chuck table 2, first transport means 8 for transporting the wafer W between the temporary placement region 7 and the chuck table 2 is disposed.

  Above the movement path of the chuck table 2 in the X-axis direction, an alignment means 9 for detecting a planned processing line formed on the wafer is disposed. The alignment unit 9 has an imaging unit 9a that images the wafer W, and detects a processing line by pattern matching between an image acquired by the imaging unit 9a and an image stored in advance.

  Above the movement path of the chuck table 2 in the X-axis direction, laser light irradiation means 3 for irradiating laser light for processing the wafer is disposed. The laser light irradiation means 3 includes a processing head 30 that is movable in the Y-axis direction and the Z-axis direction and has a function of irradiating laser light downward, an output adjusting means 31 that adjusts the output of the laser light, and a laser light. Oscillation means 32 that oscillates to generate pulsed laser light, and frequency setting means 33 that sets the repetition frequency of the pulsed laser light.

  In the vicinity of the chuck table 2, a resin coating device 4 that covers the surface of the wafer W with a resin protective film is disposed. The resin coating device 4 can also function as a cleaning device for cleaning the processed wafer. Above the resin coating apparatus 4, a second transport unit 11 is disposed that transports the wafer W between the chuck table 2 and the resin coating apparatus 4.

  As shown in FIG. 2, the resin coating apparatus 4 holds the wafer W and holds the frame F by the spinner table 40 that rotates while holding the wafer W and the centrifugal force that is disposed on the outer periphery of the spinner table 40 and rotates the spinner table 40. A frame pressing means 41 and a liquid resin supply nozzle 42 for dropping the liquid resin on the wafer W held on the spinner table 40 are provided. The resin coating device 4 in the example of FIG. 2 also functions as a cleaning device that cleans the wafer W after the laser processing, and thus sprays cleaning water onto the wafer held on the spinner table 40. A cleaning water supply nozzle 43 and an air nozzle 44 for ejecting high-pressure air are also provided.

  The spinner table 40 is connected to a drive unit 46 via a shaft 45 and is configured to rotate by being driven by a motor inside the drive unit 46. The drive unit 46 can be moved up and down by an air piston 47, and the spinner table 40 is also moved up and down as the drive unit 46 is moved up and down.

  The spinner table 40 includes a frame support portion 40a that supports the frame F, and a wafer region support portion 40b that supports a wafer region, that is, a portion of the tape T to which the wafer W is attached. The wafer region support portion 40b is formed of a porous member, and can communicate with a suction source (not shown) to suck and hold the wafer region. On the other hand, the frame support portion 40a is configured by a plate-like member formed in a ring shape. Below the outer peripheral side of the spinner table 40, a receiving part 48 for receiving the dropped liquid resin and a discharging part 49 for discharging the liquid resin staying in the receiving part 48 are arranged.

  As shown in FIG. 3, the frame pressing means 41 includes a pendulum body 410 and a shaft support body 411 that supports the pendulum body 410 so as to be rotatable.

  The pendulum body 410 includes a weight part 412, an arm part 413 connected to the weight part 412, and a claw part having a function of holding the frame F between the arm part 413 and the frame support part 40 a to hold the frame F. 414 and a pendulum shaft 415 formed on the arm portion 413 so that the weight portion 412 is located on the lower side and the claw portion 414 is located on the upper side.

  As shown in FIG. 2, the shaft support 411 is disposed on the outer periphery of the spinner table 40, and as shown in FIG. 3, the pendulum shaft 415 is rotatably supported by the shaft support 411. A shaft hole 416 is formed. The shaft hole 416 is formed as a long hole that is inclined toward the outer peripheral side of the spinner table 40 from the lower side toward the upper side, and the pendulum shaft 415 can be slid thereon. When the spinner table 40 is not rotating, the pendulum shaft 415 is lowered to the lower portion of the shaft hole 416 as shown in FIG.

  The weight portion 412 is heavier than the claw portion 414 and the arm portion 413, and when the spinner table 40 is stationary without rotating, the weight portion 412 is located on the lower side and the claw portion 414 is located on the upper side. The part 414 is in a position where it is removed from the upper side of the frame support part 40a to the outer peripheral side, and the wafer W can be attached and detached together with the frame F (open state).

  In the example shown in FIG. 3, the tip portion lower surface 414 a of the claw portion 414 is formed in a curved surface shape. In the example shown in FIG. 4, the tip 414b of the claw 414 is formed in a sharp shape. The claw portion 414 may have a tip end lower surface 414a having a curved surface and a tip end 414b formed in a sharp shape. In addition, when the tip portion lower surface 414a is curved and the tip portion 414b is not sharp, the tip portion lower surface 414a may not be curved but the tip portion 414b may be formed sharp.

  The wafers W accommodated in the wafer cassette 5a shown in FIG. 1 are carried out to the temporary placement region 7 by the carry-in / out means 6 and carried to the resin coating apparatus 4 by the first carrying means 8, as shown in FIG. And placed on the spinner table 40. When the wafer W is placed on the spinner table 40, the frame F is supported by the frame support 40a, and the portion of the tape T to which the wafer W is adhered is sucked and held by the wafer region support 40b. At this time, the spinner table 40 is in the raised position, and the frame pressing means 41 has the claw portion 414 in an open state as shown in FIG.

  Next, as shown in FIG. 6, when the spinner table 40 is lowered and rotated, as shown in FIG. 7, the weight portion 412 is swung to the outer peripheral side by the centrifugal force at the time of rotation, and the tip of the claw portion 414 is moved. Hold frame F. At this time, since the shaft hole 416 is inclined toward the outer peripheral side of the spinner table 40 from the lower side to the upper side, the pendulum shaft 415 slides along the shaft hole 416 by centrifugal force and moves upward and on the outer peripheral side. Move to.

  As shown in FIG. 7, in a state where the frame F is pressed and fixed by the claw portion 414 as the spinner table 40 is rotated, the wafer W is rotated at the tip of the liquid resin supply nozzle 42 as shown in FIG. Positioned above the center, the liquid resin 42 a is dropped from the liquid resin supply nozzle 42. Then, the dropped liquid resin spreads over the entire surface of the wafer W by the rotation of the spinner table 40, and the entire surface is covered with the liquid resin. Further, the liquid resin scatters further from the surface of the wafer W to the outer peripheral side, and enters between the surface of the frame F and the claw portion 414 like the liquid resin 42b in FIG. Since the liquid resin 42b that has entered in this manner is solidified over time, the claw portion 414 and the frame F are bonded to each other by the resin 42b.

  As shown in FIG. 10, when the surface of the wafer W is coated with the resin 42c, the rotation of the spinner table 40 is stopped. Then, the centrifugal force acting on the weight portion 412 disappears, and the claw portion 414 attempts to return to the open state. At this time, as shown in FIG. 11, the pendulum shaft 415 moves downward along the shaft hole 416 and the spinner table. It moves to the inner circumference side of 40. Therefore, in addition to the force that the weight portion 412 returns to the original position due to gravity, a force due to the downward movement of the pendulum shaft 415 also acts on the pendulum body 410, so that the claw portion 414 can be easily separated from the frame F. Become.

  In addition, when the tip of the claw portion is formed in a sharp shape, the contact area between the claw portion 414 and the frame F becomes small, and therefore, there is less resin interposed between the claw portion 414 and the frame F, which is easy. The adhesive state can be released. Furthermore, when the tip portion lower surface 414a of the claw portion 414 is formed in a curved surface shape, the contact point of the claw portion 414 with respect to the frame F moves when the weight portion 412 descends, so that the adhesive force is easily released.

  Thus, when the adhesion state between the claw portion 414 and the frame F is released, the claw portion 414 is separated from the frame F, and the pendulum body 410 returns to the open state shown in FIG. Thus, when the pendulum body 410 returns to the open state, the wafer W whose surface is coated with the resin 42c can be removed from the spinner table 40.

  Next, after the liquid resin supply nozzle 42 is retracted from above the wafer W, the frame F supporting the wafer W covered with the resin 42c is adsorbed by the second transfer means 11 shown in FIG. 2, and the wafer W is sucked and held on the chuck table 2.

  Next, when the chuck table 2 moves in the + X direction, the wafer W is moved directly below the alignment means 9, the surface of the wafer W is imaged by the imaging unit 9 a, and a processing scheduled line to be processed is detected. Alignment with the head 30 in the Y-axis direction is performed. Further, the chuck table 2 is further processed and fed in the same direction, and when the detected processing planned line is irradiated with laser light from the processing head 30, the processing planned line is ablated.

  In addition, when the chuck table 2 is processed and fed in the X-axis direction, and the laser beam irradiation is performed while the laser beam irradiation means 3 is indexed and fed in the Y-axis direction by the interval between adjacent machining lines, machining in the same direction is performed. All planned lines are ablated. It should be noted that the chuck table 2 and the laser beam irradiation means 3 may be in a relationship of being relatively processed and indexed. Therefore, the chuck table 2 may be moved in the Y-axis direction and the laser light irradiation means 3 may be moved in the X-axis direction.

  Further, when the chuck table 2 is rotated 90 degrees and then irradiated with laser light in the same manner as described above, all the planned processing lines are ablated in the vertical and horizontal directions and divided into individual devices D as shown in FIG. .

  After the wafer W is divided into devices, the chuck table 2 returns to the original position. Then, the wafer W is transferred to the resin coating apparatus 4 by the second transfer means 11 and placed on the spinner table 40.

  When the tape T adhered to the portion of the wafer W is sucked and held by the wafer region support portion 40b of the spinner table 40 shown in FIG. 2, the spinner table 40 rotates and, as shown in FIG. The frame F is fixed by the claw portion 414 of the means 41. Then, the cleaning water supply nozzle 43 shown in FIG. 2 moves above the wafer W, jets high-pressure water toward the wafer W, and the surface side of the wafer W coated with the resin is cleaned. In addition, after cleaning, the cleaning water supply nozzle 43 is retracted, and the air nozzle 44 is moved above the wafer W, and high-pressure air is ejected toward the rotating wafer W to remove the cleaning water.

  The cleaned and dried wafer W is transferred to the temporary placement region 7 by the first transfer means 8 shown in FIG. And it is accommodated in the wafer cassette 5a by the loading / unloading means 6.

It is a perspective view which shows an example of a laser processing apparatus. It is a perspective view which shows an example of a resin coating apparatus. It is a front view which shows the open state of a frame pressing means. It is a perspective view which shows the example by which the front-end | tip of the nail | claw part is formed in the sharp shape. It is sectional drawing which shows schematically the state which mounts the wafer united with the flame | frame on a spinner table. It is sectional drawing which shows schematically the state with which the wafer united with the flame | frame was hold | maintained at the spinner table. It is a front view which shows the state which the flame | frame holding means pressed the flame | frame. It is a perspective view which shows the state which dripping liquid resin on the surface of a wafer. It is sectional drawing which shows schematically the state in which resin entered between the nail | claw part and the flame | frame. It is a front view which shows the wafer by which resin was coat | covered on the surface. It is a front view which shows the state of the frame pressing means immediately after the rotation stop of a spinner table. It is a perspective view which shows the divided | segmented wafer. It is a perspective view which shows the wafer united with the flame | frame via the tape. It is sectional drawing shown schematically which shows the conventional flame | frame holding | suppressing means.

Explanation of symbols

1: Laser processing apparatus 2: Chuck table 3: Laser light irradiation means 30: Processing head 31: Output adjustment means 32: Oscillation means 33: Frequency setting means 4: Resin coating apparatus 40: Spinner table 40a: Frame support section 40b: Wafer Area support portion 41: Frame pressing means 410: Pendulum body 411: Shaft support body 412: Weight portion 413: Arm portion 414: Claw portion 414a: Tip portion lower surface 414b: Tip portion 415: Pendulum shaft 416: Shaft hole 42: Liquid resin Supply nozzle 43: Cleaning water supply nozzle 44: Air nozzle 45: Shaft part 46: Drive part 47: Air piston 48: Receiving part 49: Discharge part 5: Cassette placement area 5a: Wafer cassette 6: Loading / unloading means 7: Temporary Place area 8: First transport unit 9: Alignment unit 9a: Imaging unit 11: Second transport unit

Claims (5)

A spinner table that rotates while holding a wafer supported by a frame, a frame pressing unit that is disposed on the outer periphery of the spinner table and that holds the frame by centrifugal force when the spinner table rotates, and is held by the spinner table A liquid resin coating apparatus comprising at least a liquid resin supply nozzle for dropping the liquid resin on the wafer,
The frame holding means is
A weight part, an arm part connected to the weight part, a claw part connected to the arm part and holding the frame, and the arm so that the weight part is located on the lower side and the claw part is located on the upper side A pendulum body composed of a pendulum shaft formed in the section;
A shaft support that is disposed on the outer periphery of the spinner table and has a shaft hole that rotatably supports the pendulum shaft;
The resin coating apparatus, wherein the shaft hole of the shaft support body is formed into a long hole that inclines toward the outer peripheral side of the spinner table from the lower side toward the upper side and supports the pendulum shaft so as to be slidable. The resin coating apparatus according to claim 1, wherein a tip of the claw portion is formed in a sharp shape. The resin coating apparatus according to claim 1, wherein a bottom surface of the tip of the claw is formed in a curved shape. The resin coating apparatus according to claim 1, wherein a cleaning water supply nozzle that ejects cleaning water to the wafer held on the spinner table is disposed. A chuck table for holding a wafer supported by a frame; and a laser beam irradiation means for irradiating the wafer held by the chuck table with a laser beam for processing. The chuck table and the laser beam irradiation means A laser processing apparatus configured to be relatively fed and indexed,
The laser processing apparatus provided with the resin coating apparatus of Claim 1, 2, 3 or 4.

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