JP4871096B2 - Resin coating apparatus and laser processing apparatus - Google Patents

Description

  The present invention relates to a resin coating apparatus for coating a wafer with resin and a laser processing apparatus having a resin coating function.

  A wafer formed by dividing devices such as ICs and LSIs by processing planned lines is divided into individual devices by cutting the processing scheduled lines. As a method for cutting the processing scheduled line, a method using laser light irradiation is also employed for the reason that chipping or the like hardly occurs.

  However, when processing is performed by irradiating a processing line on the surface of the wafer with laser light, there is a problem that debris scatters and adheres to the surface of the device, resulting in deterioration of quality. Therefore, a technique has been proposed in which a protective film made of a resin is previously coated on the surface of a wafer before processing with a laser beam (see, for example, Patent Document 1).

  When coating the resin on the surface of the wafer, a resin coating apparatus or a laser processing apparatus having a resin coating function is used, and the protective film made of resin is coated on the surface by, for example, spin coating. At that time, as shown in FIG. 10, the wafer W is supported by the frame F in a state of being integrated with the frame F via the tape T. On the surface of the wafer W, a device D is formed by being partitioned by a processing scheduled line S.

  As shown in FIG. 11, the resin coating apparatus or the laser processing apparatus includes a spinner table 100 that can hold and rotate the wafer W, and the wafer W supported by the frame F is placed on the spinner table 100. Placed and adsorbed. At this time, the surface of the wafer W is exposed.

  The outer periphery of the spinner table 100 is provided with a pendulum part 104 that is pivotally supported by a pivotal support part 101 and is connected to a weight part 102 and a claw part 103. Centrifugal force causes the weight portion 102 to rotate to the outer periphery side (clockwise in FIG. 11) around the shaft support portion 101, whereby the claw portion 103 presses the frame F against the surface of the spinner table 100 to fix the frame F. The wafer W is fixed (see, for example, Patent Document 2).

JP 2004-322168 A JP 2006-128359 A

  However, when the spinner table 100 holding the wafer W supported by the frame F is rotated via the tape T, and a liquid resin such as PVA (polyvinyl alcohol) is dropped on the rotating wafer W to cover the protective film. The liquid resin scatters to the outer peripheral side of the wafer and adheres to the frame F and is solidified. The claw 103 is bonded to the frame F by the resin, and the wafer W cannot be removed from the spinner table 100 together with the frame F. There is a problem.

  Therefore, the problem to be solved by the present invention is that when a protective film is coated on the surface of a wafer supported by a frame via a tape, the spinner table is rotated and the frame is fixed by the claw portion by the centrifugal force. It is also possible to remove the wafer from the spinner table.

  A first invention includes a spinner table that rotates while holding a wafer supported by a frame, a frame pressing unit that is disposed on an outer peripheral portion of the spinner table and presses the frame by centrifugal force when the spinner table rotates, and a spinner table A liquid resin coating apparatus comprising at least a liquid resin supply nozzle for dropping liquid resin on a wafer held in a frame, wherein the frame pressing means is connected to the arm part and the arm part connected to the weight part and the weight part. The claw part is composed of a pendulum part composed of a claw part that holds the frame, and a shaft support part that pivotally supports the arm part so that the weight part is located on the lower side and the claw part is located on the upper side. And the arm portion are connected by an elastic body.

  The elastic body is preferably a leaf spring. In addition, it is desirable that the resin coating apparatus includes a cleaning water supply nozzle.

  The second invention comprises a chuck table for holding a wafer supported by a frame, and a laser beam irradiation means for irradiating the wafer held by the chuck table with a laser beam to process the chuck table and the laser beam irradiation. A laser processing apparatus having a structure in which the means is relatively fed and indexed, and includes the above resin coating apparatus.

  In the resin coating apparatus according to the present invention, since the claw part and the arm part constituting the pendulum part are connected by the elastic member, the weight part is swung to the outer peripheral side by the centrifugal force when the spinner table rotates, so that the claw part is framed. Even if the scattered liquid resin enters the space between the frame and the claw part and solidifies while holding down, if the spinner table stops rotating, the connecting part made of an elastic body moves the claw part immediately after that. The adhesive state is released. Therefore, the claw portion thereafter returns to the open state, and the wafer can be removed from the spinner table together with the frame.

  Also, in the laser processing apparatus equipped with the resin coating apparatus according to the present invention, the resin can be coated on the wafer surface, and laser processing can be performed after removing the wafer from the spinner table. Can be done.

  A laser processing apparatus 1 shown in FIG. 1 is an apparatus that performs processing by irradiating a wafer with laser light. The chuck table 2 that holds the wafer and the wafer that is held by the chuck table 2 irradiates the laser light to perform processing. And a resin coating apparatus 4 that coats the surface of the wafer with a protective film.

  The wafer W to be processed is accommodated in the wafer cassette 5a in a state of being supported integrally with the frame F via the tape T. Hereinafter, the wafer W supported by the frame F via the tape T is simply referred to as a wafer W.

  The wafer cassette 5a is placed in the cassette placement area 5. In the vicinity of the wafer cassette 5a, a loading / unloading means 6 for unloading the wafer W from the wafer cassette 5a and loading the processed wafer W into the wafer cassette 5a is disposed. The carry-in / out means 6 is movable in the Y-axis direction (carrying-in / out direction) with the frame F held between the holding portions 6a.

  Between the carry-in / out means 6 and the wafer cassette 5a, a temporary placement region 7 is provided, which is a region in which the wafer W to be carried in / out is temporarily placed.

  On the front side of the laser processing apparatus 1, a chuck table 2 that holds the wafer W and is movable in the X-axis direction and is rotatable is disposed. Between the temporary placement region 7 and the chuck table 2, first transport means 8 for transporting the wafer W between the temporary placement region 7 and the chuck table 2 is disposed.

  Above the movement path of the chuck table 2 in the X-axis direction, an alignment means 9 for detecting a planned processing line formed on the wafer is disposed. The alignment unit 9 has an imaging unit 9a that images the wafer W, and detects a processing line by pattern matching between an image acquired by the imaging unit 9a and an image stored in advance.

  Above the movement path of the chuck table 2 in the X-axis direction, laser light irradiation means 3 for irradiating laser light for processing the wafer is disposed. The laser light irradiation means 3 includes a processing head 30 that is movable in the Y-axis direction and the Z-axis direction and has a function of irradiating laser light downward, an output adjusting means 31 that adjusts the output of the laser light, and a laser light. Is provided with an oscillation means 32 that oscillates the pulse laser light and a frequency setting means 33 that sets the frequency of the pulse laser light.

  In the vicinity of the chuck table 2, a resin coating device 4 that covers the surface of the wafer W with a resin protective film is disposed. The resin coating device 4 can also function as a cleaning device for cleaning the processed wafer. Above the resin coating apparatus 4, a second transport unit 11 is disposed that transports the wafer W between the chuck table 2 and the resin coating apparatus 4.

  As shown in FIG. 2, the resin coating apparatus 4 holds the wafer W and holds the frame F by the spinner table 40 that rotates while holding the wafer W and the centrifugal force that is disposed on the outer periphery of the spinner table 40 and rotates the spinner table 40. A frame pressing means 41 and a liquid resin supply nozzle 42 for dropping the liquid resin on the wafer W held on the spinner table 40 are provided. The resin coating apparatus 4 in the example of FIG. 2 also functions as a cleaning apparatus that performs cleaning after laser processing of the wafer W, so that the cleaning water supply nozzle 43 that jets cleaning water and the high-pressure air are jetted. An air nozzle 44 is also provided.

  The spinner table 40 is connected to a drive unit 46 via a shaft 45 and is configured to rotate by being driven by a motor inside the drive unit 46. The drive unit 46 can be moved up and down by an air piston 47, and the spinner table 40 is also moved up and down as the drive unit 46 is moved up and down.

  The spinner table 40 includes a frame support portion 40a that supports the frame F, and a wafer region support portion 40b that supports a wafer region, that is, a portion of the tape T to which the wafer W is attached. The wafer region support portion 40b is formed of a porous member, and can communicate with a suction source (not shown) to suck and hold the wafer region. On the other hand, the frame support portion 40a is configured by a plate-like member formed in a ring shape. Below the outer peripheral side of the spinner table 40, a receiving part 48 for receiving the dropped liquid resin and a discharging part 49 for discharging the liquid resin staying in the receiving part 48 are arranged.

  As shown in FIG. 3, the frame pressing means 41 is configured by pivotally supporting the arm portion 501 of the pendulum portion 50 by a pivotal support portion 51. The pendulum part 50 includes a weight part 500 positioned below, an arm part 501 connected to the weight part 500, a claw part 502 located above the weight part 500 and holding the frame F, a claw part 502, and an arm part. It is comprised from the connection part 503 which connects 501. FIG. The connecting portion 503 is formed of an elastic body such as a leaf spring.

  The arm portion 501 is pivotally supported by the shaft support portion 51 and can swing. The weight portion 500 is heavier than the claw portion 502 and the arm portion 501, and when the spinner table 40 is stationary without rotating, the weight portion 500 is positioned on the lower side and the claw portion 502 as shown in FIG. Is located on the upper side, and the claw portion 502 is at a position disengaged from the upper side of the frame support portion 40a to the outer peripheral side, so that the wafer W can be attached and detached together with the frame F (open state).

  The wafer W accommodated in the wafer cassette 5a shown in FIG. 1 is carried out to the temporary placement region 7 by the carry-in / out means 6, and is carried to the resin coating apparatus 4 by the first carrying means 8, as shown in FIG. And placed on the spinner table 40. At this time, the spinner table 40 is in the raised position, and the claw portion 502 of the frame pressing means 41 is open as shown in FIG.

  When the wafer W is placed on the spinner table 40, the frame F is supported by the frame support 40a, and the portion of the tape T to which the wafer W is adhered is sucked and held by the wafer region support 40b.

  Then, as shown in FIG. 5, when the spinner table 40 is lowered and the spinner table 40 is rotated, as shown in FIG. 6, the weight portion 500 is swung to the outer peripheral side by the centrifugal force at the time of rotation, and rotated. As a result, the claw portion 502 rotates, and the tip of the claw portion 502 presses the frame F. At this time, as shown in FIG. 6, the frame F is fixed in a state where the connecting portion 503 is bent and the claw portion 502 is slightly opened upward.

  As shown in FIG. 6, in a state where the frame F is pressed and fixed by the claw portion 502 as the spinner table 40 rotates, the wafer W is rotated around the tip of the liquid resin supply nozzle 42 as shown in FIG. Positioned above the center, the liquid resin 42 a is dropped from the liquid resin supply nozzle 42. Then, the dropped liquid resin spreads over the entire surface of the wafer W by the rotation of the spinner table 40, and the entire surface is covered with the liquid resin. Further, the liquid resin is further scattered from the surface of the wafer W to the outer peripheral side, and enters between the surface of the frame F and the claw portion 502 like the liquid resin 42b in FIG. The liquid resin 42b that has entered in this manner is solidified over time, and the claw portion 502 and the frame F are bonded.

  As shown in FIG. 9, when the resin is coated on the surface of the wafer W, the rotation of the spinner table 40 is stopped. Then, immediately after the stop, the claw portion 502 tries to return to the open state, but before that, as shown in FIG. 8, the connecting portion 503 is bent from the state of being bent by the restoring force of the spring (the state of FIG. 6). Accordingly, the claw portion 502 slides sideways in the horizontal direction. Therefore, this movement of the claw portion 502 releases the state where the claw portion 502 and the frame F are bonded by the resin 42b.

  When the adhesive state between the claw portion 502 and the frame F through the resin 42b is released in this way, the weight portion 500 is lowered, so that the claw portion 502 is separated from the frame F, and the pendulum portion 50 is in the open state shown in FIG. Return to. In this manner, the wafer W whose surface is coated with the resin 42c can be removed from the spinner table 40.

  Next, after the liquid resin supply nozzle 42 is retracted from above the wafer W, the frame F supporting the wafer W covered with the resin 42c is adsorbed by the second transfer means 11 shown in FIG. 2, and the wafer W is sucked and held on the chuck table 2.

  Next, the chuck table 2 moves in the + X direction and is positioned immediately below the alignment means 9, the surface of the wafer W is imaged by the imaging unit 9 a, a processing scheduled line to be processed is detected, and the Y with the processing head 30 is detected. Axial alignment is performed. Further, the chuck table 2 is further processed and fed in the same direction, and the detected processing planned line is irradiated with laser light from the processing head 30, and the processing planned line is ablated.

  In addition, when the chuck table 2 is processed and fed in the X-axis direction, and the laser beam irradiation is performed while the laser beam irradiation means 3 is indexed and fed in the Y-axis direction by the interval between adjacent machining lines, machining in the same direction is performed. All planned lines are ablated. It should be noted that the chuck table 2 and the laser beam irradiation means 3 may be in a relationship of being relatively processed and indexed. Therefore, the chuck table 2 may be moved in the Y-axis direction and the laser light irradiation means 3 may be moved in the X-axis direction.

  Further, when the chuck table 2 is rotated by 90 degrees and then irradiated with laser light in the same manner as described above, all the planned processing lines are ablated vertically and horizontally and divided into individual devices.

  After the wafer W is divided into devices, the chuck table 2 returns to the original position. Then, the wafer W is transferred to the resin coating apparatus 4 by the second transfer means 11 and placed on the spinner table 40.

  When the tape T affixed to the wafer W is sucked and held by the wafer region support portion 40b of the spinner table 40 shown in FIG. 2, the spinner table 40 rotates, and as shown in FIG. The frame F is fixed by the claw portion 502 of the means 41. Then, the cleaning water supply nozzle 43 shown in FIG. 2 moves above the wafer W, jets high-pressure water toward the wafer W, and the surface side of the wafer W coated with the resin is cleaned. In addition, after cleaning, the cleaning water supply nozzle 43 is retracted, and the air nozzle 44 is moved above the wafer W, and high-pressure air is ejected toward the rotating wafer W to remove the cleaning water.

  The cleaned and dried wafer W is transferred to the temporary placement region 7 by the first transfer means 8 shown in FIG. And it is accommodated in the wafer cassette 5a by the loading / unloading means 6.

It is a perspective view which shows an example of the laser processing apparatus carrying a resin coating apparatus. It is a perspective view which shows an example of a resin coating apparatus. It is a front view showing a frame pressing means. It is sectional drawing which shows schematically the state of the resin coating apparatus before hold | maintaining a wafer. It is sectional drawing which shows schematically the resin coating apparatus of the state holding the wafer. It is a front view which shows the state which the nail | claw part pressed the flame | frame. It is a perspective view which shows the state which dripping liquid resin on the surface of a wafer. It is a front view which shows the state immediately after the rotation stop of a spinner table. It is a front view which shows the wafer by which resin was coat | covered on the surface. It is a perspective view which shows the wafer supported by the flame | frame via the tape. It is sectional drawing which shows the conventional frame pressing means.

Explanation of symbols

1: Laser processing apparatus 2: Chuck table 3: Laser light irradiation means 30: Processing head 31: Output adjustment means 32: Oscillation means 33: Frequency setting means 4: Resin coating apparatus 40: Spinner table 40a: Frame support section 40b: Wafer Area support part 41: Frame pressing means 42: Liquid resin supply nozzle 42a: Liquid resin 42b: Resin 42c: Resin 43: Washing water supply nozzle 44: Air nozzle 45: Shaft part 46: Drive part 47: Air piston 48: Receiving part 49: Ejection part 50: Pendulum part 500: Weight part 501: Arm part 502: Claw part 503: Connection part 51: Shaft support part 5: Cassette placement area 5a: Wafer cassette 6: Loading / unloading means 7: Temporary placing means 8: 1st conveyance means 9: Alignment means 9a: Imaging part 11: 2nd conveyance means

Claims (4)

A spinner table that rotates while holding a wafer supported by a frame, a frame pressing unit that is disposed on the outer periphery of the spinner table and that holds the frame by centrifugal force when the spinner table rotates, and is held by the spinner table A liquid resin coating apparatus comprising at least a liquid resin supply nozzle for dropping the liquid resin on the wafer,
The frame holding means is
A pendulum part composed of a weight part, an arm part connected to the weight part, and a claw part connected to the arm part and holding the frame;
The arm portion is configured to swingably support so that the weight portion is located on the lower side and the claw portion is located on the upper side,
A resin coating apparatus in which the claw portion and the arm portion are connected by an elastic body.   The resin coating apparatus according to claim 1, wherein the elastic body is a leaf spring.   The resin coating apparatus of Claim 1 or 2 provided with the washing water supply nozzle. A chuck table for holding a wafer supported by a frame; and a laser beam irradiation means for irradiating the wafer held by the chuck table with a laser beam for processing. The chuck table and the laser beam irradiation means A laser processing apparatus configured to be relatively fed and indexed,
A laser processing apparatus comprising the resin coating apparatus according to claim 1, 2 or 3.

Images