JPH08141479A - Rotary type substrate treating device - Google Patents

Abstract

PURPOSE: To avert the generation of stains on the rear surface and end faces of a substrate occurring in constitution to lift the substrate for the purpose of carrying in and out of the substrate while this device obviates the formation of chuck traces on the rear surface of the substrate. CONSTITUTION: This treating device is so constituted that the substrate W is made rotatable around the axial center in the perpendicular direction while the outer peripheral edge of the substrate is held by a hinge-shaped supporting member and a regulating member. The device is so constituted that a hermetic space is formed between a base plate 9 provided with the pin-shaped supporting member and the regulating member and the substrate W. A through-hole 16 is formed at the bottom plate 9 and a substrate lifting pin 17 is lifted through this through-hole 16. In addition, the through-hole 16 is provided with a cap member 18. This cap member 18 is so displaced as to open the through-hole 16 at the time of lifting the substrate lifting pin 17 and to close the through-hole 16 in the state of lowering and retreating the substrate lifting pin 17. The cap member is so constituted as to prevent the inflow of the air from the through- hole 16 at the time of rotating the substrate W.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device,
Hold the outer peripheral edge of the substrate for applying a coating liquid such as a resist liquid to a substrate such as an optical disk substrate, or supplying a solvent to the outer peripheral edge of the substrate to wash it, that is, to perform edge rinse. A substrate holding member, a substrate rotating means for rotating the substrate holding member around an axis in the vertical direction, a holding position for holding the substrate on the substrate holding member in contact with the back surface of the substrate, and a transfer position above it. The present invention relates to a rotary substrate processing apparatus having a substrate elevating pin that moves up and down.

[0002]

2. Description of the Related Art As a rotary substrate processing apparatus of this type,
Conventionally, the substrate is generally held by vacuum suction. However, due to the strong suction force, chuck marks are left on the back surface of the substrate, and the chuck marks add to the contamination from the previous process, causing a deviation in the height of the substrate surface, which causes focus abnormality during exposure. was there. Further, when particles adhering to the back surface of the substrate are detached and housed in a cassette, the surface of the substrate housed in the lower side is contaminated, or transferred to a substrate transfer device to contaminate other substrates. There was such a problem.

Therefore, in order to avoid the above-mentioned problems, a support pin for supporting the back surface of the substrate and a restriction pin for contacting the end surface of the substrate and restricting the horizontal position are provided on the outer peripheral edge side of the substrate. Alternatively, it is proposed that the substrate is supported only on the outer peripheral edge side, such as by providing an annular member that supports the outer peripheral edge of the substrate while covering the entire outer periphery thereof.

Further, in the case of the proposed example, an air flow is generated on the back surface side of the substrate as the substrate rotates, the air flow interferes with a member supporting the outer peripheral edge of the substrate, and a turbulent flow reaches the outer peripheral portion of the substrate. There is a problem that causes, usually, a plate etc. is provided so as to face the back surface of the substrate, and the plate etc.
A support pin, a regulation pin, or an annular member is provided so that a sealed space is formed between the support pin and the regulation pin or the annular member.

[0005]

However, in the case of the structure in which the substrate is supported only on the outer peripheral side thereof, the substrate cannot be carried in or loaded.
Substrate lift pins are needed to lift the substrate to carry it out. Therefore, through holes are formed through the plate and the like for retracting the substrate elevating pins, and the substrate elevating pins are raised and lowered through the through holes in a state of being stopped at a predetermined position so that the substrate can be elevated. However, as the substrate rotates and the air in the sealed space flows to the outer peripheral edge side of the substrate, a negative pressure is generated in the sealed space, and external air flows in through the through hole, and this inflowing air However, there is a drawback in that mist adheres to the back surface of the substrate and stains the back surface or the end surface of the substrate when it is not clean.

The present invention has been made in view of the above circumstances, and originates from a structure in which a chuck mark is not formed on the back surface of a substrate, but the substrate is moved up and down for loading and unloading the substrate. It is an object of the present invention to prevent the back surface and the end surface of a substrate from being contaminated.

[0007]

The invention according to claim 1 is
In order to achieve the above-mentioned object, a substrate holding member that holds the outer peripheral edge of the substrate, a substrate rotating unit that rotates the substrate holding member around an axis in the vertical direction, and a substrate that contacts the back surface of the substrate In a rotary substrate processing apparatus equipped with a substrate holding member for holding a substrate holding member and a substrate lifting pin for raising and lowering to a transfer position above the substrate holding member, the substrate holding member is hermetically sealed between the substrate holding member and the substrate. The substrate holding member is formed with a through hole for raising and lowering the substrate elevating pin, and when the substrate elevating pin is raised, the through hole is opened and in the state of being lowered and retracted. It is configured by providing a lid member that closes the through hole.

In order to achieve the above-mentioned object, the invention according to claim 2 rotates a substrate holding member for holding the outer peripheral edge of the substrate and the substrate holding member around a vertical axis. In a rotary substrate processing apparatus provided with a substrate rotating means, a substrate raising / lowering pin that moves up and down to a holding position for contacting the back surface of the substrate and holding the substrate on the substrate holding member, and a transfer position above the holding position, , The substrate holding member is configured to form a hermetically sealed space with the substrate, and the substrate holding member is provided with a substrate elevating pin capable of ascending and descending in a hermetically sealed state connected to the hermetically sealed space. A pressing member that abuts and raises the substrate is provided, and an urging mechanism that lowers the substrate elevating pin in a non-abutting state of the pressing member is provided.

[0009]

According to the structure of the rotary substrate processing apparatus of the first aspect of the present invention, when the substrate is held and rotated, the through hole is closed by the lid member, and air is introduced into the sealed space through the through hole. There is no inflow. On the other hand, when loading or unloading the substrate with the rotation stopped, open the through hole,
The substrate can be raised and lowered by raising and lowering the substrate raising and lowering pins through the through holes.

Further, according to the structure of the rotary substrate processing apparatus of the invention of claim 2, when the substrate is held and rotated, the substrate elevating pin is lowered by the urging mechanism regardless of the pressing member. The airtight space is maintained and air does not flow into the airtight space. On the other hand, when the substrate is loaded or unloaded while the rotation is stopped, the pressing member is moved up and down to bring the pressing member into contact with the substrate lifting pin,
The substrate can be raised and lowered by raising and lowering the substrate raising and lowering pins in cooperation with the urging mechanism.

[0011]

Embodiments of the present invention will now be described in detail with reference to the drawings. 1 is an overall schematic vertical cross-sectional view showing a first embodiment of a rotary substrate processing apparatus of the present invention, FIG. 2 is a plan view of a main part, and FIG. 3 is a perspective view of the main part. The substrate rotating means 3 is configured to connect the shaft 2 and rotate the rotary shaft 2 around the axis in the vertical direction by driving the electric servomotor 1. The outer peripheral edge of the substrate W is provided on the upper end side of the rotary shaft 2. A substrate holding member 4 which is placed and held is integrally rotatably attached.

Around the substrate holding means 4 and the substrate W held in a horizontal posture by the substrate holding means 4, a lower first cup 5 which can be raised and lowered by a raising and lowering drive mechanism (not shown) and a second cup 5 above it. It is covered with the cup 6 and.

On the outside of the second cup 6, there is provided a resist solution supply nozzle 7 that is movable between a supply position corresponding to the center of rotation on the substrate W and a standby position off the substrate W. The resist solution is supplied to the surface of the substrate W at the position, and the resist solution can be applied to the surface of the substrate W by the rotation of the substrate W. Further, on the outer side of the second cup 6, a solvent supply nozzle 8 configured to be movable between a supply position corresponding to the outer peripheral edge of the substrate W and a standby position separated from the substrate W is provided. A solvent is supplied to the outer peripheral edge of the surface of the substrate W so that the resist liquid on the outer peripheral edge of the substrate can be removed.

An annular support member 10 is formed so that a drainage gap (for example, about 0.2 mm) is formed through a spacer (not shown) in a bottom plate 9 which is integrally rotatably connected to the rotary shaft 2.
Is attached. In addition, on the upper surface of the support material 10,
Three pin-shaped supporting members 1 spaced apart by a predetermined distance in the circumferential direction
1 are provided and are configured to support the substrate W by making point contact with the back surface of the substrate W (see FIG. 5), and a sealed space S is formed between the substrate W and the substrate W while holding the substrate W. The substrate holding member 4 is configured as described above.

Further, outside the pin-shaped support members 11 on the upper surface of the support member 10, six pin-shaped restriction members 12 are provided at predetermined intervals in the circumferential direction, and the pin-shaped support members 11 are provided. It is configured to make point contact with the outer peripheral edge of the substrate W supported by 11 to regulate the horizontal position of the substrate W. The predetermined two of the regulating members 12 ...
It is provided so that the rotational force can be effectively transmitted to the substrate W by making point contact with the outer peripheral edge of the orientation flat. The regulation member 12 is not limited to the pin shape, and may be any member configured to be in point contact with the outer peripheral edge of the substrate W, and may be a rod shape or a plate shape (see FIG. 5).

An annular member 13 is provided so as to cover the outer peripheral edge of the substrate W over the entire outer periphery of the restricting members 12 in the horizontal direction, and the outer peripheral edge of the substrate W and the restricting members 12 ... A drain flow path 14 is formed between the inner peripheral surface and between the outer peripheral surface of the support member 10 and the inner peripheral surface of the annular member 13 so as to vertically direct the drain flown by the centrifugal force from the substrate W. (See FIG. 5).

The upper surface of the annular member 13 is formed into a flat horizontal surface, and the lower portion of the annular member 13 is attached to the bottom plate 9 through a spacer (not shown) so that a drain discharge gap is formed. The resist liquid and the solvent flowing through the drain passage 14 can be discharged to the outside. In addition, the drain flow path 14 receives an air flow directed toward the side between the outer peripheral edge of the substrate W and the inner peripheral surface of the annular member 13 by the inner peripheral surface of the annular member 13 by the centrifugal force, and gives a resistance to the flow. Ring member 1 with almost no disturbance
It is made to flow along the flat upper surface of 3 and to prevent turbulent flow from being generated by the pin-shaped support members 11 ...

The rotary shaft 2 is formed in a cylindrical shape, and the rotary shaft 2
A cleaning liquid supply nozzle 15 is provided in a state of penetrating the bottom plate 8 from the inside, supplies the cleaning liquid to the back surface of the substrate W, and discharges it through the drain discharge gap to the outside to wash the back surface of the substrate W. Is configured.

Through holes 16 are formed at three predetermined positions on the bottom plate 9, and three substrate elevating pins 17 are provided below the bottom plate 9.
Is provided so as to be able to move up and down, counts pulses by a rotary encoder, and stops the substrate holding member 4 at a predetermined position by fine movement of the electric servomotor 1.
In this state, the substrate elevating pins 17 are moved up and down through the through holes 16 to move up and down to a holding position where the substrate W is supported by the pin-shaped support members 11 and a transfer position above the holding position.

As shown in the enlarged cross-sectional view of the main part of FIG. 4, a lid member 18 formed of a pair of leaf springs 18a, 18a is provided in the through hole 16, and in the natural state, the leaf springs 18a, 18a.
The respective elastic restoring forces press the end faces into contact with each other to close the through holes 16, and the through holes 16 are opened by pressing against the elastic restoring forces so as to separate from each other.

The lower ends of the leaf springs 18a, 18a are fitted and locked in a locking groove 19 formed in the through hole 16, and the inner peripheral surfaces of the leaf springs 18a, 18a facing each other are raised and lowered. A cam portion 18b is formed so as to project so as to contact only the shoulder portion 17a on the tip side of the pin 17, while the tip portion 17b of the board elevating pin 17 is connected to the shoulder portion 1a.
7a is in contact with the cam portion 18b, the leaf springs 18a, 1
It is projected so as not to contact the inner peripheral surface of 8a.

With the above structure, the substrate elevating pin 17 is used for applying the resist solution, edge rinsing, and back surface cleaning.
When the substrate W is held by the substrate holding member 4 and rotated by lowering and retracting the substrate, as shown in FIG.
It is possible to close the through hole 16 by 8 and prevent air from flowing into the sealed space S from the through hole 16. on the other hand,
When the substrate elevating pins 17 are moved up and down for loading and unloading the substrate W, the rotation of the substrate holding member 4 is stopped at a predetermined position and the substrate elevating pins 17 are lifted, so that the shoulder portion 17a is moved to the cam portion 18b. The leaf spring 1 is brought into contact with the leaf spring 1 without contacting the tip portion 17b with the inner peripheral surfaces of the leaf springs 18a, 18a.
The through holes 16 ... Can be opened by separating 8a and 18a. Thus, the tip portion 17 that contacts the back surface of the substrate W
Since b is not brought into contact with the inner peripheral surfaces of the leaf springs 18a, 18a, it is advantageous in preventing the back surface of the substrate W from being contaminated.

Next, a description will be given of the results of comparative experiments between the apparatus of the above embodiment and the apparatus for comparison. As a comparative device, a device in which the bottom plate 9 is not provided with the lid member 18 was used.
The size of the through hole 16 was 3 mm in diameter. When a positive resist solution was applied to a substrate W having a diameter of 6 inches to a thickness of 1.2 μm in each of the two devices, the air flow turbulence at the outer peripheral edge of the substrate W increased in the comparative device, and Disturbance of the film thickness profile at the outer peripheral edge extends to the range of 2 to 5 mm from the outer peripheral edge of the substrate W, and when mist of the resist solution is mixed under the bottom plate 9, the mist enters from the through hole 16. Then, about 100 mist particles having a size of 0.2 μm or more adhered to the back surface of the substrate W. On the other hand, in the case of the apparatus of the above embodiment, the disturbance of the film thickness profile at the outer peripheral edge of the substrate W is within 2 mm from the outer peripheral edge of the substrate W, and there is no mist adhered to the back surface of the substrate W. It was apparent that the processing quality can be significantly improved by providing the lid member 18.

FIG. 5 is a partially omitted overall schematic vertical sectional view showing a second embodiment of the rotary substrate processing apparatus of the present invention.
The difference from the embodiment is as follows. That is, the air cylinder 20 is attached to the lower surface of the bottom plate 9, the lid member 21 is provided so as to be displaced in the horizontal direction and capable of opening and closing the through hole 16, the air cylinder 20 and the lid member 21 are connected, and The first air pipe 22 is connected to the air cylinder 20, and the first air pipe 2
2 and a second air pipe 23 connected to a pressurized air source (not shown) are connected to the rotary shaft 2 of the bottom plate 9 by a cylindrical portion 9a.
Of the first air passage 24a formed within the thickness of the rotary shaft 2, the second air passage 24b formed within the thickness of the rotary shaft 2, and the annular air flow formed in the cylindrical body 26 attached to the fixing member 25. It is connected via the path 24c. The other structure is the same as that of the first embodiment, and the same reference numerals are given and the description thereof is omitted.

In this second embodiment, the air cylinder 2
0 and a vacuum suction source may be connected, and the lid member 21 may be opened and closed by using vacuum suction pressure.

FIG. 6 is an overall schematic vertical sectional view with a part omitted showing a third embodiment of the rotary substrate processing apparatus of the present invention.
The difference from the embodiment is as follows. That is, a cylindrical body 27 that extends downward is attached to the downward surface of the bottom plate 9, and a substrate elevating pin 28 that makes a point contact with the back surface of the substrate W in the cylindrical body 27 so as to be able to ascend and descend in a sealed state connected to the sealed space S. And a compression coil spring 29 that urges the substrate elevating pin 28 to be displaced downward. An opening 30 is formed in the lower portion of the cylindrical body 27, and the board raising / lowering pin 2 is provided so as to correspond to the lower side of the opening 30.
A pressing member 31 that abuts and raises 8 is provided so as to be able to move up and down. The other structure is the same as that of the first embodiment, and the same reference numerals are given and the description thereof is omitted.

With the above structure, when the substrate W is loaded, the pressing member 3 is pressed against the substrate holding member 4 stopped at a predetermined position.
1 is raised and brought into contact with the substrate elevating pin 28 to raise it to the delivery position of the substrate W. Then, after the substrate W is delivered, the pressing member 31 is lowered to the outside of the cylindrical body 27 to be in a non-contact state with the substrate elevating pin 28, and the elastic restoring force of the compression coil spring 29 causes the substrate elevating pin 2 to move.
8 is lowered, and the substrate W is lowered to the holding position and supported on the pin-shaped support member 11. In this state, the substrate W is rotated to apply the resist solution, perform edge rinse and back surface cleaning processing. At this time, the airtight state is maintained between the substrate elevating pin 28 and the cylindrical body 27, air is not introduced from the lower part due to the elevating structure of the substrate elevating pin 28, and the back surface of the substrate W is contaminated. do not do. Next, when the substrate W is carried out, the rotation of the substrate holding member 4 is stopped at a predetermined position, the pressing member 31 is raised with respect to the substrate holding member 4, and the substrate W supported by being brought into contact with the substrate elevating pin 28 is supported. Raise it to the delivery position and carry it out.

In this third embodiment, the substrate lifting pins 2
In order to bias 8 to be displaced to the descending side, for example, a tension spring is used instead of the compression coil spring 29 as described above, or the substrate elevating pin 28 itself is composed of a heavy object, or , Gravity may be used such as attaching a heavy object to the board lifting pin 28,
In short, a constitution using a compression coil spring 29, a tension spring, gravity, etc. for urging the substrate elevating pin 28 to be displaced to the holding position side is collectively referred to as an urging mechanism.

FIG. 7 is a cross-sectional view of the essential parts showing a fourth embodiment of the rotary substrate processing apparatus of the present invention, and FIG. 8 is a bottom view. The difference from the first embodiment is as follows. That is,
A lid member 18 for opening and closing the through hole 16 is made of scissors-shaped member made of a flexible material, and one end side in the longitudinal direction of the lid member 18 apart from the through hole 16 is attached to the downward surface of the bottom plate 9 with a screw 32. . A long notch 33 is formed in the lid member 18 from one end side in the longitudinal direction opposite to the screw 32 side, and the divided pieces 34, 34 on both sides of the notch 33 come into contact with each other to close the through hole 16 and flexural deformation. Thus, a state in which the through holes 16 are opened apart from each other is obtained. Further, inclined cam surfaces F, F continuous from the notch 33 are formed in a portion which overlaps the through hole 16 in the closed state of each of the divided pieces 34, 34. The other structure is the same as that of the first embodiment.

With the above structure, in the natural state, as shown in FIG. 7A, the through hole 16 can be closed to prevent the inflow of air into the above-mentioned sealed space S, while the substrate W As shown in FIG. 7 (b), when carrying in / out the substrate, the shoulder portion 1
Only the 7a is brought into contact with the inclined cam surfaces F, F, and the two divided pieces 3
4, 34 are separated from each other to open the through hole 16, and the substrate elevating pin 17 can be moved up and down to displace the substrate W between the holding position and the transfer position without bringing the tip end portion 17b into contact with the lid member 18. Has become.

FIG. 9A is a sectional view of the essential parts showing a fifth embodiment of the rotary substrate processing apparatus of the present invention, and FIG. 9B is a bottom view, which is different from the fourth embodiment. However, it is as follows. That is, the lid member 18 is attached to the downward surface of the bottom plate 9 so as to be rotatable about the vertical axis, and the winding spring 35 that urges the lid member 18 to displace the through hole 16 is closed. Attached and the lid member 18
There is provided a stopper 36 that abuts against and keeps the through hole 16 in a closed position. Further, an inclined cam surface F1 is formed at a portion overlapping the through hole 16 in the closed state of the lid member 18, and only the shoulder portion 17a of the substrate elevating pin 17 is in contact with the inclined cam surface F1.
The lid member 18 is opened and closed by raising and lowering the board raising and lowering pins 17,
The substrate W can be displaced between the holding position and the transfer position.

FIG. 10A is a bottom view of an essential part showing a sixth embodiment of the rotary substrate processing apparatus of the present invention, and FIGS. 10B and 10C are sectional views, respectively. The difference from the embodiment is as follows. That is, the lid member 18 is provided on the lower surface of the bottom plate 9 so as to be slidable in the radial direction of the bottom plate 9 by the pair of guides 37, 37, and is attached to the rotation shaft core side of the guides 37, 37. The member 38 and the lid member 18 are connected via a tension spring 39. As the tension spring 39, its elastic restoring force is sufficient to displace the lid member 18 to the position where the through hole 16 is opened in a natural state where the rotation of the substrate holding member 4 is stopped and the centrifugal force does not work. When the holding member 4 is rotated at a rotational speed of 800 rpm or more, the centrifugal force of the holding member 4 can set the lid member 18 to a position where the through hole 16 is closed against the elastic restoring force. . In the figure, reference numeral 40 denotes a stopper that stops the displacement of the lid member 18 at the closed position.

According to the sixth embodiment, the substrate holding member 4
The lid member 18 can be displaced from the open position to the closed position by utilizing the centrifugal force associated with the rotation of the above, while the elastic restoring force of the tension spring 39 can displace the lid member 18 from the closed position to the open position when the rotation is stopped. Therefore, the air cylinder 20 and the drive source therefor as in the second embodiment are not required, and there is an advantage that the structure can be configured easily and inexpensively.

The present invention is not limited to the circular substrate having the orientation flat as in the above-mentioned embodiments, but can be applied to a rotary substrate processing apparatus for a circular substrate having a notch or a rectangular substrate for liquid crystal.

[0035]

As is apparent from the above description, according to the rotary substrate processing apparatus of the first aspect of the present invention, the substrate elevating pin is moved up and down through the through hole in the state where the rotation of the substrate holding member is stopped. When the substrate is held and rotated while the substrate is lifted up and down and the substrate can be loaded and unloaded, the through hole is closed by the lid member and air is not allowed to flow into the sealed space through the through hole. As the board rotates,
It is possible to avoid that mist flows in through the through-hole and adheres to the back surface of the substrate, and does not cause a chuck mark on the back surface of the substrate, but the substrate is moved up and down for loading and unloading the substrate. It is now possible to avoid the occurrence of dirt on the back and end faces.

According to the rotary type substrate processing apparatus of the second aspect of the present invention, in the state where the rotation of the substrate holding member is stopped, the pressing member is brought into contact with the substrate elevating pin and the substrate elevating pin is moved up and down. When the board is lifted up and down and the board can be loaded and unloaded while the board is held and rotated, the energizing mechanism keeps the board elevating pin lowered to maintain the airtight space, and the air in the airtight space is maintained. Therefore, it is possible to prevent the mist from flowing into the hermetically sealed space and adhering to the back surface of the substrate as the substrate rotates, and to prevent chuck marks on the back surface of the substrate. It has become possible to prevent the back surface and the end surface of the substrate from being contaminated due to the structure of raising and lowering the substrate for loading and unloading.

[Brief description of drawings]

FIG. 1 is an overall schematic vertical sectional view showing a first embodiment of a rotary substrate processing apparatus of the present invention.

FIG. 2 is a plan view of a main part.

FIG. 3 is a perspective view of a main part.

FIG. 4 is an enlarged cross-sectional view of a main part.

FIG. 5 is a partially omitted general schematic vertical sectional view showing a second embodiment of the rotary substrate processing apparatus of the present invention.

FIG. 6 is a partially omitted general schematic vertical sectional view showing a third embodiment of the rotary substrate processing apparatus of the present invention.

FIG. 7 is a cross-sectional view of essential parts showing a fourth embodiment of the rotary substrate processing apparatus of the present invention.

FIG. 8 is a bottom view of the main part.

FIG. 9A is a fifth view of the rotary substrate processing apparatus of the present invention.
FIG. 4B is a sectional view of the main part showing the embodiment, and FIG.

FIG. 10 (a) is a bottom view of essential parts showing a sixth embodiment of the rotary substrate processing apparatus of the present invention, and (b) and (c) are
It is a sectional view of an important section.

[Explanation of symbols]

 3 ... Substrate rotating means 4 ... Substrate holding member 16 ... Through hole 17 ... Substrate elevation pin 18 ... Lid member 21 ... Lid member 28 ... Substrate elevation pin 29 ... Compression coil spring 31 ... Pressing member S ... Sealed space W ... Substrate

Claims (2)

[Claims] 1. A substrate holding member for holding an outer peripheral edge of a substrate, a substrate rotating means for rotating the substrate holding member around a vertical axis, and a substrate holding member for holding the substrate in contact with a back surface of the substrate. What is claimed is: 1. A rotary substrate processing apparatus comprising: a substrate holding pin that holds a substrate; and a substrate lifting pin that moves up and down to a transfer position above the substrate, wherein the substrate holding member is provided between the substrate and the substrate while holding the substrate. While forming a sealed space in the, the substrate holding member is formed with a through hole for raising and lowering the substrate elevating pin, and when raising the substrate elevating pin, the through hole is opened, and A rotary substrate processing apparatus comprising a lid member for closing the through hole in a state of being lowered and retracted. 2. A substrate holding member for holding the outer peripheral edge of the substrate, a substrate rotating means for rotating the substrate holding member around an axis in the vertical direction, and a substrate holding member for holding the substrate in contact with the back surface of the substrate. What is claimed is: 1. A rotary substrate processing apparatus comprising: a substrate holding pin that holds a substrate; and a substrate lifting pin that moves up and down to a transfer position above the substrate, wherein the substrate holding member is provided between the substrate and the substrate while holding the substrate. The substrate holding member is provided with the substrate elevating pin so as to be able to move up and down in a sealed state connected to the hermetically sealed space, and the substrate elevating pin is pressed against the substrate elevating pin to raise the substrate elevating pin. A rotary substrate processing apparatus, characterized in that a member is provided and an urging mechanism that lowers the substrate elevating pin in a non-contact state of the pressing member is provided.