JP2007067101A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which cleans a substrate favorably without contaminating it when the substrate is cleaned by being rotated. <P>SOLUTION: A height position of an abutment 102 of a retaining pin is positioned to a second height position P2, a surface Wf of an unprocessed substrate W is retained with a face-down attitude directing downward by the retaining pin, while the back surface Wb of the substrate W is cleaned by an upper face cleaning brush 31 with rotation of the substrate W. Subsequently, a height position of the abutment 102 of the retaining pin is positioned to a third height position P3, the substrate W is supported at a first height position P1 by a support pin 6, also a cutoff plate 5 is positioned to a process position PL, and nitrogen gas is supplied to a space SP formed between an opposing face 5a of the cutoff plate 5 and the substrate W, thereby pressing and retaining the substrate W to the support pin 6. As described above, in a state of retaining the substrate W, the substrate W is rotated and the end face of the substrate W is cleaned by an end face cleaning brush 41. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for performing a predetermined process such as a cleaning process on a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal, a substrate for an optical disk, and the like.

  The manufacturing process of an electronic component such as a semiconductor device or a liquid crystal display device includes a step of repeatedly forming a fine pattern by repeatedly performing processes such as film formation and etching on the surface of a substrate. Here, for the fine processing, it is necessary to keep the substrate surface clean, and the substrate is subjected to a cleaning process as necessary. For example, by rotating a substrate and bringing a physical cleaning means such as a cleaning brush into contact with the substrate, that is, by applying a physical force to the substrate and performing a cleaning process, it can be sufficiently removed only by chemical treatment with a chemical solution or the like. An apparatus for removing unnecessary materials such as particles that cannot be used has been proposed (see Patent Document 1).

  In the invention described in Patent Document 1, in order to remove unnecessary substances such as dust and slurry remaining on the substrate surface after a CMP (Chemical Mechanical Polishing) process for polishing a thin film formed on the substrate surface, And a plurality of holding rollers for rotating the substrate and a cleaning brush for cleaning the upper and lower surfaces of the substrate held by these holding rollers. When cleaning the substrate, the upper and lower surfaces and the end surfaces of the substrate are cleaned by bringing the cleaning brush into contact with the substrate while rotating the substrate by rotating the holding roller. As a result, the contact position between the holding roller and the substrate end surface is constantly changed, and the entire periphery of the substrate end surface is cleaned.

JP 2002-79190 A (FIG. 2)

  By the way, as described above, unnecessary objects attached from the entire circumference of the upper and lower surfaces of the substrate and the end surface of the substrate can be removed by rubbing the upper and lower surfaces and the end surface of the substrate with a cleaning brush while rotating the substrate without gripping the end surface of the substrate. Although it can be removed, there are the following problems. That is, in the above-described prior art, the substrate is rotated while holding the substrate end surface by the holding roller, so that the holding roller and the substrate slide with each other and particles are generated from the sliding portion. For this reason, the substrate cleaned by the cleaning brush is contaminated again, and the substrate is substantially cleaned while contaminating the substrate.

  In particular, when a notch such as a notch or an orientation flat is formed at the periphery of the substrate to be cleaned, the notch and the holding roller collide with the rotation of the substrate, and particles are more likely to be generated. As a result, the above-mentioned problem appears remarkably.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus capable of performing a good cleaning process without contaminating the substrate when the substrate is cleaned while rotating the substrate. And

  A substrate processing apparatus according to the present invention is a substrate processing apparatus that performs a predetermined process on a substrate while rotating the substrate, and in order to achieve the above object, a rotating member provided to be rotatable about a vertical axis, and a rotating member Rotating means for rotating the member, supporting means having at least three or more supporting members that are provided upward on the rotating member, abut against the lower surface of the substrate and support the substrate separated from the rotating member, and the substrate A pressing means for pressing the substrate against the support member by supplying gas to the upper surface of the substrate and holding the substrate on the rotating member, and an end face physical cleaning means for cleaning the end surface of the substrate held on the rotating member by the pressing means with physical force And.

  In the invention configured as described above, the substrate is supported by at least three or more support members that are in contact with the lower surface of the substrate, and is pressed by the support member by the gas supplied from the pressing means to the upper surface of the substrate to be the rotating member. Retained. The rotating member rotates the rotating member, so that the substrate pressed by the supporting member rotates with the rotating member while being supported by the supporting member by the frictional force generated between the supporting member and the substrate. As a result, the substrate rotates while being held by the rotating member in a state where there is no contact member (holding member) that contacts the end surface. Since the substrate is rotated and held in this manner, the physical cleaning is performed by applying physical force to the end surface of the substrate using the end surface physical cleaning means, so that it can be sufficiently removed only by chemical treatment with a chemical solution or the like. Unnecessary items that were not present can be effectively removed. Therefore, it is possible to perform a good cleaning process without contaminating the substrate.

  Further, the pressing means is formed between the opposing surface and the upper surface of the substrate by ejecting gas from the gas ejection port, and a plate-like member having an opposing surface provided with a gas ejection port facing the upper surface of the substrate. And a gas supply unit that supplies gas to the space. According to this structure, gas is supplied to the space formed between the opposing surface and the upper surface of the substrate by ejecting gas from the gas outlet provided on the opposing surface. As a result, it becomes possible to press the support member that contacts and supports the lower surface of the substrate by the pressing force of the gas supplied to the space.

  Further, as a holding mode of the substrate, gas may be supplied to the rotating substrate while the plate member is fixed to hold the substrate on the rotating member, or the plate member is rotated together with the substrate. You may make it hold | maintain a board | substrate to a rotation member in the state. When the plate-like member is rotated together with the substrate, it is possible to prevent an excessive air flow accompanying the rotation between the substrate and the plate-like member, and to perform better substrate processing.

  In addition, when the substrate and the plate-like member are substantially circular, the plate-like member is preferably configured to have a smaller diameter than the substrate. According to this configuration, when the end face physical cleaning means cleans the edge of the substrate, it is possible to prevent the end face physical cleaning means and the plate-like member from contacting and interfering with each other. Thereby, generation | occurrence | production of the particle from a plate-shaped member can be prevented, and contamination of a board | substrate can be prevented.

  Further, pure water supply means for supplying pure water toward the lower surface of the substrate that is pressed by the supporting member and rotating the substrate and covering the lower surface of the substrate with pure water may be further provided. According to this configuration, the entire lower surface of the substrate is covered with pure water, and it is possible to prevent unnecessary substances such as particles removed from the substrate from reattaching to the lower surface of the substrate when cleaning the substrate end surface or the upper surface of the substrate. it can.

  A substrate processing apparatus according to the present invention is a substrate processing apparatus that performs a predetermined process on a plurality of processing surfaces of a substrate while rotating the substrate, and is rotatable about a vertical axis in order to achieve the above object. A rotating member provided, a rotating means for rotating the rotating member, a first height provided above the rotating member and having a tip abutting against the lower surface of the substrate and spaced upward by a predetermined distance from the rotating member. Support means having at least three or more support members configured to support the substrate at a position, and pressing configured to press the substrate toward the support member by supplying gas to the upper surface of the substrate And holding means that can be brought into contact with the edge portion of the substrate and can be moved up and down in the vertical direction on the upper side of the rotating member, and by raising the holding means, 1st height position or 1st The substrate is held by being positioned at the second height position higher than the height position, and the abutting portion is positioned at the third height position lower than the first height position by lowering the holding means. Elevating means that enables the substrate to be supported by the support member in a state where the portion is spaced apart from the lower position of the substrate, and abuts the substrate by positioning the contact portion at the first height position or the second height position. The first substrate holding held by the portion, the contact portion is positioned at the third height position, the substrate is supported by the supporting means at the first height position, and the substrate is pressed toward the supporting member by the pressing means. The holding of the second substrate is selectively switched according to the surface to be processed on which a predetermined process is performed.

  In the invention configured as described above, the substrate can be rotated while being held by the two types of holding modes of the first substrate holding and the second substrate holding, and the substrate can be cleaned. Among these holding modes, the first substrate holding means that the contact portion of the holding means is at the first height position, that is, the height position of the substrate supported by the support member or the second height position higher than the first height position. As a result of the positioning, the contact portion comes into contact with the edge portion of the substrate and the substrate is held by the rotating member. On the other hand, in the second substrate holding, the contact portion of the holding means is positioned at the third height position lower than the first height position, so that the substrate is supported only by each support member. In such a state, the substrate is pressed against each supporting member by supplying gas from the pressing means to the upper surface of the substrate, and the substrate is held by the rotating member. As described above, since the substrate can be held by the two types of holding modes of the first substrate holding and the second substrate holding, the substrate holding mode can be selectively switched according to the surface of the substrate to be processed. Can be washed well.

  Here, an upper surface physical cleaning means for cleaning the substrate held by the first substrate holding by applying a physical force to the upper surface of the substrate, and an end surface of the substrate with respect to the substrate held by the second substrate holding If an end face physical cleaning means for cleaning by applying a physical force is further provided, the substrate can be cleaned well without being contaminated as follows. That is, the contact portion of the holding means is positioned at the first height position or the second height position, so that the contact portion contacts the edge portion of the substrate and the substrate is held by the rotating member. This eliminates the need for gas supply from the pressing means to the upper surface of the substrate, and allows the upper surface physical cleaning means to perform cleaning by applying a physical force to the upper surface of the substrate. On the other hand, the substrate is supported by each support member by positioning the contact portion of the holding means at the third height position, and the substrate is pressed against each support member by supplying gas to the upper surface of the substrate. Held by the rotating member. Accordingly, the rotating substrate can be held without any contact member (holding member) in contact with the substrate end surface, and the end surface physical cleaning means causes a physical force to act on the end surface of the substrate to contaminate the substrate end surface. The cleaning process can be performed satisfactorily without any problems. As described above, when cleaning the substrate end surface or the substrate upper surface, cleaning is performed by applying physical force to the surface to be processed while avoiding contact with the surface to be processed. The surface to be processed can be effectively cleaned without being attached.

  Further, the pressing means is formed between the opposing surface and the upper surface of the substrate by ejecting gas from the gas ejection port, and a plate-like member having an opposing surface provided with a gas ejection port facing the upper surface of the substrate. A gas supply unit that supplies gas to the space to be formed, and a plate member that is moved up and down to face and oppose the plate member close to the top surface of the substrate, and a separation position that separates the plate member from the top surface of the substrate Further, a plate-like member lifting / lowering means for positioning may be provided. According to this configuration, it is possible to reliably press the substrate against the support member by supplying the gas to the space formed between the plate-like member positioned at the opposing position and the upper surface of the substrate. Thus, the substrate end surface can be cleaned without contaminating the substrate by cleaning the end surface of the substrate by the end surface physical cleaning means while holding the rotating substrate. On the other hand, since the plate-like member is positioned at the separation position, the upper surface of the substrate can be effectively cleaned while rotating the substrate by disposing the upper surface physical cleaning means in a space above the upper surface of the substrate.

  Further, in the holding means, the abutting portion has a supporting part that abuts the lower surface of the substrate and supports the substrate, and a regulating part that regulates the horizontal movement of the substrate by contacting the end surface of the substrate. The height of the part is configured to be lower than the height position of the upper surface of the substrate. According to this configuration, the rotating member can be held by the rotating member by restricting the horizontal movement of the substrate by the restricting portion while supporting the substrate by the supporting portion. In addition, since the height of the restriction portion is configured to be lower than the height position of the upper surface of the substrate, the upper surface physical cleaning means contacts the restriction portion when the upper surface of the substrate is cleaned by the upper surface physical cleaning means. Thus, the upper surface of the substrate can be satisfactorily cleaned.

  The “end surface physical cleaning means” and the “upper surface physical cleaning means” of the present invention refer to physical force by bringing a brush, a sponge or the like into direct contact with each of the end surface and the upper surface of the rotating substrate. This means means for cleaning the substrate by acting.

  According to the present invention, the substrate is pressed against the support member by the gas supplied to the upper surface of the substrate while the substrate is supported by the support member in contact with the lower surface of the substrate, and is held by the rotating member. In this way, cleaning is performed by applying physical force to the end surface of the substrate using the end surface physical cleaning means while rotating the substrate held by the rotating member without the contact member (holding member) in contact with the end surface of the substrate. As a result, the substrate can be cleaned well without contaminating the substrate.

  According to the present invention, the contact portion of the holding means is positioned at the first height position, which is the substrate height position supported by the support member, or at the second height position higher than the first height position. As a result, the contact portion comes into contact with the edge portion of the substrate, and the substrate is held by the rotating member (first substrate holding). On the other hand, since the contact portion of the holding means is positioned at the third height position lower than the first height position, the substrate is supported only by each support member, and in such a state, the substrate is pressed from the pressing means. By supplying gas to the upper surface, the substrate is pressed against each support member, and the substrate is held by the rotating member (second substrate holding). Therefore, the substrate can be satisfactorily cleaned by selectively switching the substrate holding mode between the first substrate holding and the second substrate holding corresponding to the surface to be processed of the substrate.

  FIG. 1 is a diagram showing an embodiment of a substrate processing apparatus according to the present invention. FIG. 2 is a plan view of the substrate processing apparatus of FIG. This substrate processing apparatus is an apparatus capable of cleaning the end surface and the back surface Wb of the substrate W in a face-down posture with the front surface Wf (device forming surface) of the substrate W facing downward, and is configured as follows. ing. This substrate processing apparatus includes a spin chuck 1 that horizontally rotates a substrate W with its back surface Wb facing upward, and pure water or the like on the upper surface (back surface Wb) of the substrate W held by the spin chuck 1. The cleaning liquid supply means 2 for supplying the cleaning liquid, the upper surface brush cleaning mechanism 3 for cleaning the upper surface of the substrate W, the end surface brush cleaning mechanism 4 for cleaning the end surface of the substrate W, and the spin chuck 1 are held. And a blocking plate 5 disposed opposite to the upper surface of the substrate W.

  The spin chuck 1 has a hollow rotating column 11 connected to a rotating shaft of a motor 12, and can rotate around a rotating shaft J extending in the vertical direction by driving the motor 12. A spin base 13 is integrally connected to an upper end portion of the rotary support 11 by a fastening component such as a screw. Therefore, the spin base 13 rotates around the rotation axis J by driving the motor 12 in accordance with an operation command from the control unit 8 that controls the entire apparatus. Thus, in this embodiment, the motor 12 corresponds to the “rotating means” of the present invention, and the spin base 13 corresponds to the “rotating member” of the present invention.

  A liquid supply pipe 14 is inserted into the hollow rotating column 11, and a lower surface side nozzle 15 functioning as “pure water supply means” of the present invention is coupled to the upper end of the liquid supply pipe 14. The liquid supply pipe 14 is connected to the pure water supply unit 16, and when pure water is supplied from the pure water supply unit 16 to the liquid supply pipe 14 in accordance with an operation command from the control unit 8, the lower surface side nozzle 15. From the bottom to the center of the lower surface (front surface Wf) of the substrate W. Further, a gap between the inner wall surface of the rotary support 11 and the outer wall surface of the liquid supply pipe 14 forms a cylindrical gas supply path 17. The gas supply path 17 is connected to a gas supply unit 18 and can supply nitrogen gas to a space formed between the lower surface of the substrate W and the opposing surface of the spin base 13. In this embodiment, nitrogen gas is supplied from the gas supply unit 18, but air or other inert gas may be discharged.

  The cleaning liquid supply means 2 includes a cleaning liquid supply nozzle 21 that supplies pure water as a cleaning liquid toward the upper surface (back surface Wb) of the substrate W, a swing arm 22 that holds the cleaning liquid supply nozzle 21 at one end, and a swing. A swing drive source 24 such as a motor that rotates (swings) the arm 22 around the arm shaft 23 within a predetermined angle range is provided. The cleaning liquid supply nozzle 21 is connected to the pure water supply unit 16, and when pure water is pumped from the pure water supply unit 16 to the cleaning liquid supply nozzle 21 in accordance with an operation command from the control unit 8, the upper surface ( Pure water is jetted toward the back surface Wb).

  The upper surface brush cleaning mechanism 3 includes an upper surface cleaning brush 31, a swinging arm 32 that rotatably holds the upper surface cleaning brush 31 at one end, and a swinging arm 32 that rotates around a arm shaft 33 within a predetermined angle range. A swing drive source 34 such as a motor that moves (swings) and a lift drive source 35 such as a cylinder that lifts and lowers the upper surface cleaning brush 31 and the swing arm 32 in the vertical direction are provided. The upper surface cleaning brush 31 is configured to be rotated by a rotation driving source (not shown) such as a motor provided in the swing arm 32. With these configurations, the upper surface brush cleaning mechanism 3 can move the upper surface cleaning brush 31 horizontally along the substrate back surface Wb by the swing drive source 34 and also move it up and down by the lift drive source 35. . The range in which the upper surface cleaning brush 31 reciprocates is, for example, a range from a substantially central position of the substrate W to a position slightly outside the outer periphery of the substrate W. Thereby, the upper surface cleaning brush 31 contacts the entire upper surface of the substrate W to apply a physical force, whereby the entire upper surface of the substrate W can be cleaned. Thus, in this embodiment, the upper surface cleaning brush 31 functions as the “upper surface physical cleaning means” of the present invention.

  The upper surface cleaning brush 31 is made of, for example, a hair-like brush material. The material of such a brush material is, for example, polypropylene (PP), polyethylene (PE), polyamide (PA) and acrylic resin, nylon brush, mohair brush, and the like. The upper surface cleaning brush 31 may be a sponge-like one made of polyvinyl alcohol (PVA). The same applies to the end face cleaning brush 41 described later.

  The end surface brush cleaning mechanism 4 includes a non-rotating edge cleaning brush 41 and a support shaft 42 that supports the edge cleaning brush 41. The edge cleaning brush 41 has a substantially cylindrical shape, and a support shaft 42 is fixed so as to coincide with the center axis of the cylinder. The support shaft 42 is connected to the edge cleaning brush moving mechanism 43, and a standby position where the edge cleaning brush 41 supported by the support shaft 42 is separated from the end surface of the substrate W in accordance with an operation command from the control unit 8. The edge cleaning brush 41 can be moved between a cleaning position for cleaning the substrate end surface by contacting the end surface of the substrate W held on the spin base 13. When the edge cleaning brush 41 is positioned at the cleaning position, the edge cleaning brush 41 is brought into contact with the end surface of the substrate W to be rotationally driven to apply physical force, thereby cleaning the entire periphery of the end surface of the substrate W. can do. The edge cleaning brush 41 is supported so as to be rotatable about an axis substantially parallel to the rotary support column 11, and when contacting the end surface of the rotating substrate W, the substrate W rotating the edge cleaning brush 41. You may comprise so that it may be accompanied to the end surface of. Thus, in this embodiment, the end face cleaning brush 41 functions as the “end face physical cleaning means” of the present invention.

  As shown in FIG. 2, a plurality of support pins 6 (support members) (12 in this embodiment) are provided near the peripheral edge of the upper surface of the spin base 13, and the rotation shaft J is used as the "support means" of the present invention. Projecting upward from the spin base 13 at equiangular intervals radially as the center. Each of these support pins 6 is in contact with the peripheral portion (non-device formation region) of the lower surface (front surface Wf) of the substrate W, so that the substrate W is horizontally spaced apart from the spin base 13 by a predetermined distance. Support is possible. For this reason, damage and contamination of the lower surface of the substrate W that occur when the substrate W is supported by being in contact with the spin base 13 are prevented. Here, in order to horizontally support the substrate W, the number of support pins 6 may be at least three.

  A plurality (12 in this embodiment) of holding pins F1 to F6 and S1 to S6 are provided in the vicinity of the peripheral edge of the upper surface of the spin base 13 as “holding means” of the present invention so as to be vertically movable. It has been. The holding pins F1 to F6 and S1 to S6 are provided between the support pins 6 projecting from the peripheral edge of the upper surface of the spin base 3 on a circumference having substantially the same diameter as the circumference where the support pins 6 are disposed. , And projecting upward from the spin base 13 at equiangular intervals radially about the rotation axis J. Each of the holding pins F <b> 1 to F <b> 6 and S <b> 1 to S <b> 6 can hold the substrate W horizontally while being spaced apart from the spin base 13 by a predetermined distance by contacting the edge of the substrate W. . Among these, the six holding pins F1 to F6 arranged alternately every other along the circumferential direction constitute a first holding pin group, and these hold the substrate W in conjunction with each other or hold the substrate W. Works to release. On the other hand, the remaining six holding pins S1 to S6 constitute a second holding pin group, and these operate in conjunction with each other to hold the substrate W or release the holding. Note that the number of holding pins is not limited to the number described above, and may be at least three in order to hold the substrate W horizontally.

  Above the spin chuck 1, a disc-shaped blocking plate 5 facing the spin base 13 is disposed horizontally as the “plate member” of the present invention. The blocking plate 5 is attached to a lower end portion of a rotary column 51 arranged coaxially with the rotary column 11 of the spin chuck 1 so as to be integrally rotatable. A shield plate rotation drive mechanism 52 is connected to the rotary column 51, and the shield plate 5 is driven to rotate on the rotation axis (vertical) by driving the motor of the shield plate rotation drive mechanism 52 in accordance with an operation command from the control unit 8. Axis) Rotate around J. The control unit 8 can rotationally drive the shielding plate 5 at the same rotational direction and the same rotational speed as the spin chuck 1 by controlling the motor of the shielding plate rotation drive mechanism 52 to synchronize with the motor 12. Thus, in this embodiment, the blocking plate rotation drive mechanism 52 functions as the “plate member rotating means” of the present invention.

  Further, the shield plate 5 is connected to the shield plate lifting / lowering drive mechanism 53, and operates the lift drive actuator (for example, an air cylinder) of the shield plate lift / lower drive mechanism 53 to bring the shield plate 5 close to the spin base 13. Can be opposed to each other, or conversely separated. Specifically, the control unit 8 operates the blocking plate lifting / lowering drive mechanism 53 to carry the substrate W into and out of the substrate processing apparatus or to clean the upper surface of the substrate W with the upper surface cleaning brush 31. Then, the blocking plate 5 is raised to the retracted position PH (position shown in FIG. 1) above the spin chuck 1. On the other hand, when the end surface of the substrate W is cleaned with the end surface cleaning brush 41, a predetermined processing position PL (opposite position; FIG. 5) set very close to the surface Wf of the substrate W held by the spin chuck 1 11 (c), the blocking plate 5 is lowered. Thus, in this embodiment, the blocking plate lifting / lowering drive mechanism 53 functions as the “plate member lifting / lowering means” of the present invention.

  The rotary support column 51 has a hollow shaft, and a cylindrical gas supply path 54 is formed coaxially therein. The gas supply path 54 communicates with the space above the substrate W at the lower end portion, and from the gas supply unit 18 connected to the gas supply path 54 when the blocking plate 5 is positioned at the processing position PL. Nitrogen gas can be supplied to the space SP (FIG. 11C) sandwiched between the shielding plate 5 and the substrate W. The shielding plate 5 has a lower surface (bottom surface) that faces the upper surface (back surface Wb) of the substrate W substantially in parallel with the opposing surface 5a. When nitrogen gas is supplied from the gas supply path 54, It is possible to increase the internal pressure of the space SP formed between the upper surface of the substrate W and press the substrate W against the support pins 6 that contact the lower surface. As a result, the substrate W pressed against the support pins 6 is spun while being supported on the support pins 6 by the frictional force generated between the lower surface of the substrate W and the support pins 6 when the motor 12 rotates the spin base 13. It rotates with the base 13. The supplied nitrogen gas flows from the vicinity of the center of the substrate W to the outside in the radial direction.

  FIG. 3 is a bottom view of the blocking plate 5. The blocking plate 5 is formed such that the planar size D1 is smaller than the substrate diameter D2. With this configuration, when the edge cleaning brush 41 cleans the edge of the substrate W, it is possible to prevent the edge cleaning brush 41 and the blocking plate 5 from contacting and interfering with each other. A plurality of gas jets 5b are provided at the peripheral edge of the blocking plate 5 and open to the facing surface 5a. The plurality of gas ejection ports 5b are arranged at equal intervals along the circumference around the rotation axis (vertical axis) J on the opposing surface 5a, and when the blocking plate 5 is positioned at the processing position PL, the substrate Oppositely arranged close to the back surface Wb. The gas outlet 5b communicates with the gas circulation space 5c inside the blocking plate 5 and directs nitrogen gas from the gas supply unit 18 (gas supply unit) connected to the gas circulation space 5c toward the substrate rear surface Wb. Discharge in a substantially vertical direction. Then, the nitrogen gas is uniformly discharged from each of the plurality of gas ejection ports 5b, so that the substrate W is pressed evenly by the support pins 6. Thus, in this embodiment, the opposing surface 5a of the blocking plate 5, the gas outlet 5b, the gas supply path 54, and the gas supply unit 18 function as the “pressing means” of the present invention.

  4 and 5 are cross-sectional views (a cross section taken along the line A-A 'in FIG. 9) for explaining a configuration related to the spin chuck 1. FIG. FIG. 4 shows a state where the holding pin is raised, and FIG. 5 shows a state where the holding pin is lowered. FIG. 6 is a plan view for explaining the configuration of the motion transmission mechanism provided in the spin base 13. The spin chuck 1 includes a first motion transmission mechanism FT1 for moving up and down the holding pins F1 to F6 and a second operation transmission mechanism FT2 for moving up and down the holding pins S1 to S6. Is provided. As shown in FIG. 6A, the first motion transmission mechanism FT1 includes six upper and lower arms 71 for operating the holding pins F1 to F6, and a first for moving the upper and lower arms 71 up and down. 1 upper and lower rings 72 are provided. Each of the upper and lower arms 71 is connected to the first upper and lower rings 72 by fastening parts such as screws so as to extend radially in the radial direction at equal angular (60 °) intervals around the rotation axis J. Holding pins F <b> 1 to F <b> 6 are erected at the tip of the upper and lower arms 71. Similarly, as shown in FIG. 6B, the second motion transmission mechanism FT2 moves up and down the six vertical arms 73 for operating the holding pins S1 to S6 and the upper and lower arms 73 in conjunction with each other. And a second upper and lower ring 74 for the purpose. Each of the upper and lower arms 73 is connected to the second upper and lower rings 74 by fastening parts such as screws so as to extend radially in the radial direction at equal angular (60 °) intervals around the rotation axis J. Holding pins S <b> 1 to S <b> 6 are erected at the tip of the upper and lower arms 73.

  The first vertical ring 72 and the second vertical ring 74 are substantially annular members arranged concentrically with the rotation axis J of the spin base 13, and the second vertical ring 74 is an opening provided at the center thereof. By enlarging the part 74a, the opening 74a surrounds a part of the first upper and lower ring 72 and is disposed above the first upper and lower ring 72 (FIGS. 4 and 5). These first and second upper and lower rings 72 and 74 can be moved up and down along the rotation axis J of the spin base 13, and the holding pins F <b> 1 to F <b> 6 are integrated with each other by raising and lowering the first upper and lower rings 72. The holding pins S <b> 1 to S <b> 6 can be integrally raised and lowered by raising and lowering the second upper and lower rings 74.

  The spin base 13 is configured by fixing an upper plate 131 and a lower plate 132 with bolts, and holding pins F1 to F6 and S1 to S6 are arranged on the periphery of the upper plate 131 so as to be movable up and down. A through-hole 131a is formed in the upper surface. An accommodation space for accommodating the first and second motion transmission mechanisms FT1, FT2 is formed between the upper plate 131 and the lower plate 132. A through-hole 133 that penetrates the spin base 13 is formed at the center of the upper plate 131 and the lower plate 132. The liquid supply pipe 14 is disposed so as to pass through the through-hole 133 and further through the rotary support 11 of the spin chuck 1. At the upper end of the liquid supply pipe 14, a lower surface side nozzle 15 that is opposed to the center of the lower surface of the substrate W held by the spin chuck 1 is fixed.

  FIG. 7 is a plan view of the spin base 13 as viewed from the back. The first and second upper and lower rings 72 and 74 are engaged with first and second interlocking rings 75 and 76 for raising and lowering the first and second upper and lower rings 72 and 74, respectively. The first and second interlocking rings 75 and 76 are annular members disposed concentrically with the rotation axis J, and the second interlocking ring 76 is disposed outside the first interlocking ring 75. . The first and second interlocking rings 75 and 76 are formed to extend in the vertical direction with respect to the lower plate 132 through through holes 134 and 135 formed in the lower plate 132 of the spin base 13, respectively. Ends are engaged with the first and second interlocking rings 75, 76. The first and second interlocking rings 75 and 76 can be moved up and down along the rotation axis J of the spin base 13, and the first interlocking ring 75 is lifted and lowered through the first upper and lower rings 72. The holding pins F <b> 1 to F <b> 6 can be raised and lowered, and the holding pins S <b> 1 to S <b> 6 can be raised and lowered via the second upper and lower rings 74 by raising and lowering the second interlocking ring 76.

  FIG. 8 is a cross-sectional view showing the configuration of the holding pin. Note that since the holding pins F1 to F6 and S1 to S6 all have the same configuration, the configuration of one holding pin F1 will be described here. The holding pin F <b> 1 includes a movable main body member 101 erected on the upper and lower arms 71, a contact portion 102 provided on the movable main body member 101 and capable of abutting with an edge portion of the substrate W, and the movable main body member 101. And a bellows 103 fitted on the upper plate 131 of the spin base 13. The contact portion 102 is configured to be able to contact a support portion 102a that supports the lower surface of the substrate W and an end surface of the substrate W, and regulates the horizontal movement of the substrate W by contacting the end surface of the substrate W. And a restriction portion 102b.

  A screw hole 101a in which a support part 102a can be mounted is formed at the top of the movable body member 101, and the support part 102a is erected on the movable body member 101 by fitting the support part 102a into the screw hole 101a. . The support portion 102 a is a screw-shaped member, and an upper screw head (thread) can be brought into contact with the lower surface of the substrate W, and a lower screw portion is screwed into the screw hole 101 a of the movable main body member 101. Is possible. The upper end portion 103a of the bellows 103 protects the movable main body member 101 by engaging with the movable main body member 101 so as to cover the top of the movable main body member 101 (peripheral portion of the screw hole 101a), and also has a through hole 131a. Prevents the liquid from entering the inside of the spin base 13. The bellows 103 is made of, for example, PTFE (polytetrafluoroethylene), and protects the movable main body member 101 made of stainless steel (SUS), aluminum, or the like when the substrate W is processed with a chemical solution or the like. In addition, a seal member 201 is disposed between the upper plate 131 of the spin base 13 and the end member of the bellows 103 to block the internal space of the spin base 13 from the external atmosphere.

  The restriction part 102 b is an annular member that opens in accordance with the diameter of the screw part of the support part 102 a and is placed on the upper end part 103 a of the bellows 103, and the support part 102 a is a screw hole 101 a of the movable body member 101. It is fixed by being screwed in. A seal member 104 is disposed between the screw portion of the support part 102a and the restriction part 102b, and prevents liquid from entering the screw hole 101a of the movable main body member 101 from between the support part 102a and the restriction part 102b. ing. The support part 102a and the restriction part 102b are preferably formed of PCTFE (polychlorotrifluoroethylene) in consideration of chemical resistance. On the other hand, when it is not necessary to consider chemical resistance, it may be formed of a rubber material.

  In addition, the height of the restriction portion 102b is formed so as to be lower than the height position PT of the upper surface of the substrate W supported by the support portion 102a while being able to contact the end surface of the substrate W. With this configuration, the upper surface cleaning brush 31 is regulated when the upper surface cleaning brush 31 cleans the upper surface (back surface Wb) of the substrate W while preventing the rotating substrate W from protruding radially outward. It is possible to avoid the contact with the portion 102b and to clean the entire periphery of the upper surface of the substrate W.

  Below the holding pin F1, a spring case 203 is disposed on the lower plate 132 of the spin base 13 and accommodates the compression coil spring 202 with its expansion / contraction direction arranged along the vertical direction. As a result, the holding pin F1 is urged upward via the upper and lower arms 71. As a result, as shown in FIG. Is positioned at a position (second height position) P2 higher than the position (first height position) P1 that contacts the lower surface of the substrate W and supports the substrate W. The height of the holding pin F1 is defined by the upper limit position of the holding pin F1 when the stopper 204 fixedly disposed inside the spin base 13 is engaged with the flange portion 101b at the lower end of the movable body member 101. Is done. On the other hand, as shown in FIG. 5, when the holding pin F <b> 1 is lowered as described later, the upper end surface 203 a of the spring case 203 serves as a stopper, and the lower end of the upper and lower arms 71 is the lower end of the spring case 203. By engaging the upper end surface 203a, the lower limit position of the holding pin F1 is defined.

  Returning to FIG. 4 and FIG. The rotary support 11 is integrated with the drive shaft of the motor 12 and is provided through the motor 12. A casing 27 is disposed so as to surround the motor 12, and the casing 27 is further surrounded by a cylindrical cover member 28. The upper end of the cover member 28 extends to the vicinity of the lower surface of the spin base 13, and a seal mechanism 29 is disposed on the inner surface near the upper end. The seal mechanism 29 is in sliding contact with a seal member 30 fixed to the lower surface of the spin base 13, so that a mechanism portion that is shielded from the external atmosphere is provided between the seal mechanism 29 and the rotary column 11. A storage space MS is formed.

  FIG. 9 is a plan view for explaining the configuration of a drive mechanism for driving the holding pins. In the mechanism housing space MS, a substantially annular gear case 61 surrounding the rotating column 11 is mounted on the upper lid portion 27a of the casing 27. On the gear case 61, as shown in the plan view of FIG. 9, the first motor M <b> 1 and the second motor M <b> 2 are fixed at symmetrical positions with respect to the rotating column 11 as “elevating means” of the present invention. As shown in FIGS. 4 and 5, bearings 62 and 63 are press-fitted inside the gear case 61 on the inner peripheral side and the outer peripheral side of the inner wall surface, respectively. The bearings 62 and 63 are arranged coaxially with respect to the rotary column 11. A ring-shaped first gear 64 that surrounds the rotating column 11 is fixed to the rotating side ring of the inner bearing 62, and a ring-shaped first gear 64 that surrounds the rotating column 11 is fixed to the rotating side ring of the outer bearing 63. Two gears 65 are fixed. Therefore, in the gear case 61, the first gear 64 and the second gear 65 can be rotated coaxially with respect to the rotary column 11, and the second gear 65 is located outside the first gear 64. The first gear 64 has gear teeth on the outer peripheral side, and the second gear 65 has gear teeth on the inner peripheral side.

  The pinion 66 fixed to the drive shaft of the first motor M1 enters between the first gear 64 and the second gear 65 and meshes with the first gear 64 disposed inside. Similarly, as shown in FIG. 9, the pinion 67 fixed to the drive shaft of the second motor M2 is located between the first gear 64 and the second gear 65, and is disposed outside. The gear 65 is engaged. On the gear case 61, a pair of first ball screw mechanisms 81 are further arranged at positions where the motors M <b> 1 and M <b> 2 are avoided at positions facing the rotation column 11 (that is, the sides of the rotation column 11). . Further, on the gear case 61, a position where the motors M <b> 1 and M <b> 2 and the first ball screw mechanism 81 are avoided is positioned so that the other pair of second ball screw mechanisms 82 face each other with the rotating column 11 interposed therebetween (that is, , On the side of the rotating column 11).

  As shown in FIGS. 4 and 5, the first ball screw mechanism 81 includes a screw shaft 83 disposed in parallel with the rotary column 11 and a ball nut 84 that is screwed onto the screw shaft 83. Yes. The screw shaft 83 is attached to the upper lid portion of the gear case 61 via a bearing portion 85, and the lower end thereof extends into the gear case 61. A gear 86 is fixed to the lower end of the screw shaft 83. The gear 86 enters between the first gear 64 and the second gear 65 and meshes with the first gear 64 disposed on the inner side. .

  On the other hand, a first non-rotating side movable member 88 is attached to the ball nut 84. The first non-rotating side movable member 88 is an annular member that surrounds the rotating column 11, and the non-rotating side ring 77 f of the first bearing 77 provided on the inner peripheral surface of the first non-rotating side movable member 88 so as to surround the rotating column 11. Is fixed. The rotation side ring 77r of the first bearing 77 is disposed on the inner side with respect to the rotation column 11 than the non-rotation side ring 77f. The rotation-side ring 77r is fixed to the outer peripheral surface side of the annular first rotation-side movable member 89 that surrounds the rotation column 11. The first rotation-side movable member 89 is engaged with a guide rail 90 provided so as to protrude from the outer peripheral surface of the rotary column 11. The guide rail 90 is formed along a direction parallel to the rotating column 11, whereby the first rotation side movable member 89 is guided and moved in the direction along the rotating column 11, and rotates. It is coupled to the column 11.

  When the first motor M <b> 1 is driven to rotate the pinion 66, this rotation is transmitted to the first gear 64. As a result, the gear 86 meshing with the first gear 64 rotates, and the screw shaft 83 of the first ball screw mechanism 81 rotates. As a result, the ball nut 84 and the first non-rotating side movable member 88 coupled thereto are moved up and down along the rotating column 11. Since the first rotation-side movable member 89 that rotates together with the rotary column 11 is coupled to the first non-rotation-side movable member 88 via the first bearing 77, Even when the rotary column 11 is rotating, the elevator column is moved up and down along the guide rail 90.

  Another ring-shaped second non-rotating side movable member 91 is disposed outside the ring-shaped first non-rotating side movable member 88 that is moved up and down by the first ball screw mechanism 81. The second ball screw mechanism 82 has the same configuration as the first ball screw mechanism 81, but the gear provided at the lower end of the screw shaft is the first gear 64 and the second gear in the gear case 61. The second gear 65 meshes with the second gear 65 from the inside. Accordingly, when the pinion 67 that is also meshed with the second gear 65 is driven by the second motor M2, the ball nut (not shown) of the second ball screw mechanism 82 is moved up and down. This ball nut is coupled to the second non-rotating side movable member 91.

  A non-rotating side ring 78f of a second bearing 78 provided so as to surround the rotating column 11 is fixed to the outer peripheral surface of the second non-rotating side movable member 91. The rotation-side ring 78r of the second bearing 78 is fixed to the inner peripheral surface of a ring-shaped second rotation-side movable member 92 that surrounds the rotation column 11. On the upper surface of the second rotation side movable member 92, two rotation transmission pins 93 are inserted in the vertical direction along the rotation column 11, and are inserted at substantially symmetric positions around the rotation column 11 with the rotation column 11 interposed therebetween ( FIG. 7). The rotation transmission pin 93 is fixed to the spin base 13 so as to penetrate the upper plate 131 and the lower plate 132 of the spin base 13, and the lower end of the rotation transmission pin 93 allows the second rotation side movable member 92 to move up and down for the second rotation. The side movable member 92 is engaged. When the second non-rotating side movable member 91 moves up and down together with the ball nut of the second ball screw mechanism 82, the second rotating side movable member 92 coupled via the second bearing 78 also moves up and down at the same time. Since the second rotation side movable member 92 is coupled to the spin base 13 through the rotation transmission pin 93 in a state where it can be moved up and down, the second rotation side movable member 92 is rotated together with the spin base 13 (that is, together with the rotating support column 11). However, the driving force from the second ball screw mechanism 82 can be obtained and the elevator can be moved up and down.

  The first rotation-side movable member 89 is provided with four vertical drive pins 891 extending upward in the vertical direction and engaging with the first interlocking ring 75. Specifically, as shown in FIG. 7, the first interlocking ring 75 is formed with notches 751 that can be engaged with the upper and lower drive pins 891 corresponding to the upper and lower drive pins 891. Vertical drive pins 891 are inserted into the portion 751. Then, as shown in FIG. 5, when the first rotation side movable member 89 is lowered, the shoulder 891a of the vertical drive pin 891 is engaged with the first interlocking ring 75, that is, four vertical drive pins. 891 lowers the first interlocking ring 75 so as to lower the first interlocking ring 75 downward. Thus, the first upper and lower rings 72 engaged with the first interlocking ring 75 and the upper and lower arms connected to the first upper and lower rings 72 against the urging force of the compression coil spring 202 arranged below the upper and lower arms 71. The holding pins F <b> 1 to F <b> 6 erected on each of the upper and lower arms 71 can be lowered by lowering 71 integrally.

  Further, the lowering operation of the holding pins S1 to S6 is substantially the same as the lowering operation of the holding pins F1 to F6. That is, the second interlocking ring 76 has insertion holes 761 that can be engaged with the vertical drive pins corresponding to the vertical drive pins (not shown) of the second rotation side movable member 92, respectively. Vertical drive pins are inserted into the respective insertion holes 761. And when the 2nd rotation side movable member 92 descends, an up-and-down drive pin engages with the 2nd interlocking ring 76, and the 2nd interlocking ring 76 is lowered. Thereby, the upper and lower arms connected to the second upper and lower rings 74 and 74 engaged with the second interlocking ring 76 against the urging force of the compression coil spring 202 disposed below the upper and lower arms 73. The holding pins S <b> 1 to S <b> 6 erected on each of the upper and lower arms 73 can be lowered by integrally lowering 73.

  In this way, by lowering the holding pins F1 to F6 and S1 to S6, the support pins 6 come into contact with the lower surface of the substrate W to support the substrate W (first position). It can be positioned at a position (third height position) P3 lower than (height position) P1. Therefore, by rotating the first and second motors M1 and M2 in accordance with the operation command of the control unit 8, the first holding pin group including the holding pins F1 to F6 and the second holding pin including the holding pins S1 to S6. At the same time or independently of the holding pin group, a position (second height position) P2 higher than the first height position P1 and a position (third height position) lower than the first height position P1. ) Can be positioned at P3. As a result, when the contact portion 102 of the holding pins F1 to F6 and S1 to S6 is positioned at the second height position P2, the substrate W is held by each holding pin, while the holding pins F1 to F6, When the contact portions 102 of S1 to S6 are positioned at the third height position P3, the substrate W is supported by the support pins 6.

  Next, the operation of the substrate processing apparatus configured as described above will be described with reference to FIGS. In this apparatus, when an unprocessed substrate W is loaded into a substrate processing apparatus by a transfer means such as a transfer robot in a face-down posture with its surface Wf facing downward, the control unit 8 controls each part of the apparatus as follows. Then, the back surface cleaning process and the end surface cleaning process are performed on the substrate W in this order. More specifically, a series of processing shown in the flowchart of FIG. 10 is executed. When the substrate W is transported, the blocking plate 5 is in the retracted position PH above the spin chuck 1 to prevent interference with the substrate W.

  FIG. 10 is a flowchart showing the operation of the substrate processing apparatus of FIG. Moreover, FIG. 11 is a figure for demonstrating operation | movement of the substrate processing apparatus of FIG. Note that the contact portions 102 of the holding pins F1 to F6 and S1 to S6 are positioned at the second height position P2. That is, the contact portions 102 of the holding pins F1 to F6 and S1 to S6 are positioned at a position higher than the position (first height position) P1 at which the support pin 6 contacts the lower surface of the substrate W and supports the substrate W. Has been. First, in step S1, the substrate W is transported in a face-down posture and dropped onto the holding pins F1 to F6 and S1 to S6, and as shown in FIG. 11A, the substrate W is held to the holding pins F1 to F6 and S1 to S6. Is held (first substrate holding). Specifically, the substrate W is supported by the support portion 102a of each holding pin coming into contact with the peripheral edge of the lower surface of the substrate W, and the movement in the horizontal direction is restricted by the restriction portion 102b.

  When the substrate W is held by the holding pins F1 to F6 and S1 to S6, the control unit 8 disposes the cleaning liquid supply nozzle 21 above the substrate W and moves the upper surface cleaning brush 31 to a position above the substrate W. The substrate W is lowered and brought into contact with the upper surface (back surface Wb) of the substrate W. Then, by driving the motor 12 and rotating the spin base 13, the cleaning liquid is ejected and supplied from the cleaning liquid supply nozzle 21 to the substrate W while rotating the substrate W at a low speed at a constant speed. As described above, since the substrate W is rotated while the upper surface cleaning brush 31 is in contact with the upper surface of the substrate W, the jumping out of the substrate W is further effectively prevented.

  Then, as shown in FIG. 11B, the upper surface cleaning brush 31 is driven on the upper surface of the substrate W by driving the swing drive source 34 while rotating (rotating) the upper surface cleaning brush 31 around the vertical axis as necessary. Is moved horizontally at a predetermined speed along the line (step S2). At this time, since the height position of the restricting portion 102b of each holding pin is lower than the height position PT of the upper surface of the substrate W, the peripheral portion of the upper surface (back surface Wb) of the substrate W should be cleaned well. Can do. As a result, physical force can be applied to the entire substrate back surface Wb, and unnecessary materials that could not be sufficiently removed only by chemical treatment can be effectively removed from the entire substrate back surface Wb. When cleaning the back surface Wb, the lower surface side nozzle 15 causes the substrate W to avoid unnecessary substances such as particles removed during cleaning from flowing around and adhering to the lower surface (front surface Wf) of the substrate W. It is preferable to supply pure water to the lower surface. As a result, the lower surface of the substrate is covered with pure water, and unnecessary substances are prevented from adhering to the lower surface of the substrate.

  Thus, when the back surface cleaning process for the substrate W is completed, the control unit 8 stops the rotation of the substrate W. Subsequently, the control unit 8 drives the first and second motors M1 and M2 to lower the holding pins F1 to F6 and S1 to S6, thereby positioning the contact portion 102 at the third height position P3. That is, the contact portions 102 of the holding pins F1 to F6 and S1 to S6 are positioned at a position lower than the position (first height position) P1 at which the support pin 6 contacts the lower surface of the substrate W and supports the substrate W. To do. As a result, the abutting portions 102 of the respective holding pins are separated to the lower position of the substrate W, the lower surface of the substrate W abuts on the tip portion of the support pin 6, and the substrate W is supported by the support pin 6 (step S3). ).

  Subsequently, the control unit 8 controls the shield plate lifting / lowering drive mechanism 53 to lower the shield plate 5 to the processing position PL facing the substrate W so as to face and oppose the substrate W (step S4). And as shown in FIG.11 (c), while discharging nitrogen gas from the gas jet nozzle 5b, nitrogen gas is supplied toward the center part of the substrate back surface Wb from the gas supply path 54 (step S5). As a result, the internal pressure of the space SP formed between the opposing surface 5a of the blocking plate 5 and the substrate back surface Wb is increased, and the substrate W is pressed by the support pins 6 that are in contact with the lower surface thereof and held by the spin base 13. (Second substrate holding). Further, the cleaned substrate back surface Wb is covered in a state of being in close proximity to the opposing surface 5a of the blocking plate 5, so that it is reliably blocked from the external atmosphere around the substrate W.

  Next, the control unit 8 drives the end surface cleaning brush moving mechanism 43 to position the end surface cleaning brush 41 from the standby position to the cleaning position where it can be cleaned by contacting the end surface of the substrate W. Subsequently, the substrate 12 is rotated by driving the motor 12 and rotating the spin base 13. At this time, the substrate W pressed by the support pins 6 rotates together with the spin base 13 while being held by the spin base 13 by the frictional force generated between the support pins 6 and the lower surface of the substrate W. Accordingly, the entire circumference of the end surface of the substrate W comes into contact with the end surface cleaning brush 41, and the entire circumference of the end surface of the substrate W is cleaned (step S6). Here, since the physical force is applied to the entire circumference of the end surface of the substrate W in the state where there is no abutting member such as a holding pin that contacts the end surface of the substrate W, chemical treatment is performed without contaminating the substrate W. Unnecessary materials that could not be sufficiently removed only by this can be effectively removed from the entire periphery of the substrate end face. Even in the end face cleaning process, it is preferable to continuously protect the substrate surface Wf with pure water in order to prevent unnecessary substances from adhering to the substrate surface Wf. Also, pure water is supplied from the lower surface side nozzle 15 in order to supply pure water between the end surface cleaning brush 41 and the end surface of the substrate W. The pure water supply for this purpose is not limited to the lower surface side nozzle 15, and a nozzle may be arranged separately.

  At the same time as or before or after the rotation of the substrate W, the control unit 8 controls the blocking plate rotation drive mechanism 52 to rotate the blocking plate 5 in the same direction at substantially the same rotation speed as the rotation speed of the spin base 13. Thereby, it is possible to prevent an excessive air flow from being generated between the substrate W and the blocking plate 5 and to suppress the entrainment of the liquid into the cleaned substrate back surface Wb.

  Thus, when the end surface cleaning process is completed, the supply of pure water from the lower surface side nozzle 15 is stopped. Thereafter, the control unit 8 increases the rotational speed of the motor 12 and the motor of the shield plate rotation drive mechanism 52 to rotate the substrate W and the shield plate 5 at a high speed, thereby drying the substrate W (step S7). At this time, nitrogen gas is supplied to the front and back surfaces of the substrate W by supplying nitrogen gas from the gas supply path 17 together with the nitrogen gas supply to the substrate back surface Wb. Thereby, the drying process of the front and back of the board | substrate W is accelerated | stimulated.

  When the drying process of the substrate W is completed, the control unit 8 controls the blocking plate rotation drive mechanism 52 to stop the rotation of the blocking plate 5 and also controls the motor 12 to stop the rotation of the substrate W. Then, by stopping the supply of nitrogen gas from the gas supply path 54 and the gas outlet 5b, the pressing and holding of the substrate W to the support pins 6 is released. Thereafter, the blocking plate 5 is raised, and the processed substrate W is unloaded from the apparatus (step S8).

  As described above, according to this embodiment, the cleaning process is performed by rotating the substrate W while holding the substrate W by the two types of holding modes of the first substrate holding and the second substrate holding. Among these, the first substrate holding is a second height higher than the first height position P1, which is the substrate height position where the contact portions 102 of the holding pins F1 to F6 and S1 to S6 are supported by the support pins 6. By positioning at the position P2, the contact portion 102 is brought into contact with the edge portion of the substrate W, and the substrate W is held on the spin base 13. Then, the upper surface (back surface Wb) of the substrate W is cleaned with the substrate W held in this manner. On the other hand, in the second substrate holding, the contact pins 102 of the holding pins F1 to F6 and S1 to S6 are positioned at the third height position P3 lower than the first height position P1, so that the substrate is supported by the support pins 6. While supporting W, by supplying gas to the upper surface of the substrate W, the substrate W is pressed against the support pins 6 to hold the substrate W on the spin base 13. Then, the end surface of the substrate W is cleaned while the substrate W is held in this manner. As described above, since the substrate can be held by the two types of holding modes of the first substrate holding and the second substrate holding, the substrate holding mode can be selectively switched according to the surface of the substrate to be processed. Can be washed well. Therefore, the substrate W can be satisfactorily cleaned by selectively switching the holding mode of the substrate W between the first substrate holding and the second substrate holding corresponding to the surface to be processed of the substrate W.

  Furthermore, according to this embodiment, after the back surface Wb of the substrate W is cleaned by the first substrate holding, the end surface of the substrate W is cleaned by the second substrate holding without contacting the substrate back surface Wb at all. As a result, it is possible to reliably prevent re-adhesion of unnecessary substances such as particles on the substrate back surface Wb. Further, the end surface cleaning process for the end surface of the substrate W is completed without contacting the end surface of the substrate at all. Therefore, the back surface Wb and the end surface of the substrate W can be reliably prevented from being contaminated and cleaned without any unprocessed regions.

  Further, according to this embodiment, when the end surface of the substrate W is cleaned, the opposing surface 5a of the blocking plate 5 is supported while the substrate W is supported by the support pins 6 that are in contact with the peripheral edge of the lower surface (surface Wf) of the substrate W. The substrate W is pressed against the support pins 6 and held on the spin base 13 by supplying a gas to a space SP formed between the substrate W and the upper surface (back surface Wb) of the substrate W. Then, the end surface of the substrate W is used by using physical cleaning means such as the end surface cleaning brush 41 while rotating the substrate W held on the spin base 13 without a contact member such as a holding pin contacting the end surface of the substrate. Since the cleaning is performed by applying a physical force, it is possible to effectively remove unnecessary substances that could not be sufficiently removed only by chemical treatment with a chemical solution or the like. Therefore, it is possible to perform a good cleaning process without contaminating the substrate W.

  Further, according to this embodiment, since the blocking plate 5 is configured such that the diameter D1 of the blocking plate 5 is smaller than the diameter D2 of the substrate W, the substrate is cleaned using physical cleaning means such as the end surface cleaning brush 41. When cleaning the end face of W, it is possible to prevent the end face cleaning brush 41 and the blocking plate 5 from contacting and interfering with each other. Thereby, generation | occurrence | production of the particle | grains from the shielding board 5 can be prevented, and the contamination of the board | substrate W can be prevented.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, when the back surface Wb of the substrate W is cleaned, the contact portions 102 of the holding pins F1 to F6 and S1 to S6 are the first height that is the substrate height position supported by the support pins 6. The substrate W is held at the second height position P2 higher than the height position P1, but the contact portions 102 of the holding pins F1 to F6 and S1 to S6 are positioned at the first height position P1. Then, the substrate W may be held. In short, when the back surface Wb of the substrate W is subjected to the cleaning process, it may be held by at least the holding pins F1 to F6 and S1 to S6.

  In the above embodiment, when the substrate W is held by the holding pins F1 to F6 and S1 to S6, the movement of the substrate W in the horizontal direction is restricted by the restriction portion 102b. It is not limited. For example, in the holding pin, a contact portion that can contact the edge of the substrate W is configured to be rotatable, and the substrate W is sandwiched so that the contact portion of each holding pin is in contact with the substrate end surface. You may do it.

  In the above embodiment, when the substrate back surface Wb is cleaned, all the holding pins, that is, the first holding pin group including the holding pins F1 to F6 and the second holding pin group including the holding pins S1 to S6 are provided. However, as long as the substrate W is stably held, the substrate W is held only by the first holding pin group, or the substrate W is held only by the second holding pin group. May be. Further, during the cleaning process, the first and second motors M1 and M2 are independently controlled to hold the substrate W by the first and second holding pin groups from the state in which the substrate W is held only by the first holding pin group. It is also possible to switch to the state in which the substrate W is held, and then switch to the state in which the substrate W is held only by the second holding pin group. By switching the holding state in this way, the cleaning process can be performed by causing the cleaning liquid to wrap around all the contact portions between the substrate W and the holding pins.

  In the above embodiment, the substrate back surface Wb and the substrate end surface are cleaned while holding the substrate W in a face-down posture with the substrate surface Wf facing downward, but only the end surface of the substrate W or the substrate The present invention is applicable to a substrate processing apparatus that performs a cleaning process on the front surface Wf and the substrate end surface, and further on both surfaces of the substrate W and the substrate end surface.

  The present invention provides a predetermined process such as a cleaning process while rotating the substrate with respect to the entire surface of the substrate including a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for an optical disk, etc. It can be applied to a substrate processing apparatus that applies

It is a figure showing one embodiment of a substrate processing device concerning this invention. It is a top view of the substrate processing apparatus of FIG. It is a bottom view of a blocking plate. It is sectional drawing for demonstrating the structure relevant to a spin chuck, Comprising: It is a figure which shows the state which the holding pin raised. It is sectional drawing for demonstrating the structure relevant to a spin chuck, Comprising: It is a figure which shows the state which the holding pin fell. It is a top view for demonstrating the structure of the motion transmission mechanism with which the spin base was equipped. It is a top view when a spin base is seen from the back. It is sectional drawing which shows the structure of a holding pin. It is a top view for demonstrating the structure of the drive mechanism for driving a holding | maintenance pin. It is a flowchart which shows operation | movement of the substrate processing apparatus of FIG. It is a figure for demonstrating operation | movement of the substrate processing apparatus of FIG.

Explanation of symbols

5 ... Shut-off plate (plate-like member, pressing means)
5a: Opposing surface (pressing means)
5b ... Gas outlet (pressing means)
6. Support pin (support member)
12 ... Motor (rotating means)
13 ... Spin base (rotating member)
15 ... Nozzle on the lower surface side (pure water supply means)
18 ... Gas supply unit (gas supply unit, pressing means)
31 ... Upper surface cleaning brush (upper surface physical cleaning means)
41 ... End face cleaning brush (end face physical cleaning means)
52 .. Shutting plate rotation drive mechanism (plate member rotating means)
53 .. Shutting plate lifting / lowering drive mechanism (plate-like member lifting / lowering means)
54 ... Gas supply path (pressing means)
DESCRIPTION OF SYMBOLS 102 ... Contact part (of holding pin) 102a ... Supporting part 102b ... Restriction part D1 ... Diameter of shielding board D2 ... Substrate diameter M1 ... First motor (lifting means)
M2 ... Second motor (lifting means)
P1: First height position P2: Second height position P3: Third height position PH: Retraction position PL: Processing position (opposite position)
PT: Height position of the upper surface of the substrate SP: Space (formed between the opposing surface and the upper surface of the substrate) W: Substrate

Claims (9)

In a substrate processing apparatus for performing a predetermined process on the substrate while rotating the substrate,
A rotating member provided rotatably around a vertical axis;
Rotating means for rotating the rotating member;
A support means having at least three or more support members which are provided upward on the rotating member and abut against the lower surface of the substrate to support the substrate apart from the rotating member;
Pressing means for pressing the substrate against the support member by supplying gas to the upper surface of the substrate and holding the substrate on the rotating member;
A substrate processing apparatus comprising: an end face physical cleaning means for cleaning the end face of the substrate held on the rotating member by the pressing means by applying a physical force.   The pressing means is opposed to the upper surface of the substrate and has a plate-like member having an opposing surface provided with a gas outlet, and between the opposing surface and the upper surface of the substrate by ejecting gas from the gas outlet. The substrate processing apparatus according to claim 1, further comprising a gas supply unit configured to supply a gas to a space formed in the substrate. A plate-like member rotating means for rotating the plate-like member around a vertical axis;
The substrate processing apparatus according to claim 2, wherein the plate member rotating unit rotates the plate member together with the substrate in a state where the substrate is held by the rotating member by the pressing unit. The substrate and the plate-like member are substantially circular,
The substrate processing apparatus according to claim 2, wherein the plate member has a smaller diameter than the substrate.   The substrate according to any one of claims 1 to 4, further comprising pure water supply means for supplying pure water toward a lower surface of the substrate rotating while being pressed by the support member and covering the lower surface of the substrate with pure water. Processing equipment. In a substrate processing apparatus for performing predetermined processing on a plurality of processing surfaces of the substrate while rotating the substrate,
A rotating member provided rotatably around a vertical axis;
Rotating means for rotating the rotating member;
The substrate is configured to be able to support the substrate at a first height position which is provided toward the upper side of the rotating member and whose front end is in contact with the lower surface of the substrate and is spaced apart from the rotating member by a predetermined distance. A support means having at least three or more support members;
Pressing means configured to be able to press the substrate toward the support member by supplying gas to the upper surface of the substrate;
A holding means having an abutting portion capable of abutting on an edge portion of the substrate, and being vertically movable up and down on the rotating member;
By raising the holding means, the contact portion is positioned at the first height position or a second height position higher than the first height position to hold the substrate, while lowering the holding means. As a result, the substrate is supported by the support member in a state where the contact portion is positioned at a third height position lower than the first height position and the contact portion is spaced apart from the lower position of the substrate. Elevating means for enabling,
A first substrate holding for positioning the contact portion at the first height position or the second height position and holding the substrate by the contact portion; and the contact portion at the third height position. The second substrate holding that positions and supports the substrate at the first height position by the support means and presses the substrate toward the support member by the pressing means and holds the predetermined processing. A substrate processing apparatus, wherein the switching is selectively performed according to the surface to be processed.   Upper surface physical cleaning means for cleaning the substrate held by the first substrate holding by applying a physical force to the upper surface of the substrate; and the substrate held by the second substrate holding The substrate processing apparatus according to claim 6, further comprising an end face physical cleaning unit that applies a physical force to the end face to perform cleaning. The pressing means is opposed to the upper surface of the substrate and has a plate-like member having an opposing surface provided with a gas outlet, and between the opposing surface and the upper surface of the substrate by ejecting gas from the gas outlet. A gas supply unit for supplying gas to the space formed in
8. The plate-like member raising / lowering means for raising and lowering the plate-like member and positioning the plate-like member at a facing position where the plate-like member is closely opposed to the upper surface of the substrate and a separation position where the plate-like member is separated from the upper surface of the substrate. Substrate processing equipment. In the holding means, a support portion where the contact portion contacts the lower surface of the substrate to support the substrate, and a restriction portion which restricts movement of the substrate in the horizontal direction by contacting the end surface of the substrate. Have
The substrate processing apparatus according to claim 7, wherein a height of the restriction portion is lower than a height position of the upper surface of the substrate.

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