JP2005064329A - Irradiated object holding mechanism - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an irradiated object holding mechanism which can improve the flatness of a plate-like irradiated object. <P>SOLUTION: Pin holders are attached to three places on a plate 70 set in a concave portion 2 of a holder body 1, and pins 110, 120, and 130 are held by the respective pin holders so that they may not be brought into contact with the plate 70. The plate 70 is lowered, and a glass plate 15 is inserted between top plate regulation plates 4, 5, and 6 formed on projected portions 3a and 3b of the holder body 1 and the pin holders 110, 120, and 130 located face to face with the respective top place regulation plates, and then the plate 70 is lifted to hold the glass plate 15 between the top face regulation plates and the pins. Each pin holder has screws 24A and 24B for position control screwed therein to move each pin in parallel with the bottom of the concave portion 2 of the holder body. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a mechanism for holding an object to be irradiated such as an IC pattern drawn or a wafer on which an IC pattern is drawn or a mask plate such as a glass substrate.

  In a semiconductor device manufacturing apparatus, a charged particle beam such as an electron beam or a beam such as a laser beam is irradiated to a predetermined position on an irradiated object such as a silicon wafer or a glass substrate coated with a resist, and an IC pattern is formed on the irradiated object. Is drawn.

  On the other hand, in a semiconductor device inspection apparatus, an irradiated object such as a silicon wafer or a glass substrate on which an IC pattern has already been drawn is scanned with a beam such as a charged particle beam or a laser beam. The pattern is inspected and inspected based on the reflected light or secondary electrons.

  In any of these semiconductor element manufacturing apparatuses and semiconductor element inspection apparatuses, charged particles are set in a state where an object to be irradiated is set in a holder and the holder is set on a stage provided in a chamber such as a drawing room. A beam such as a beam or a laser beam is irradiated.

  Nowadays, the density of semiconductor elements is rapidly increasing, and it is increasingly desired to improve the accuracy of pattern drawing and pattern inspection.

  Accordingly, it is required that the holder for holding the material on which the pattern is drawn and the sample to be inspected for pattern holding with very little distortion (that is, with extremely high flatness).

  FIG. 1 shows an outline of a holder for holding, for example, a glass dry plate on which a pattern is drawn (FIG. 1 (b) is a cross-sectional view taken along line AA in FIG. 1 (a)).

  In the figure, reference numeral 1 denotes a rectangular parallelepiped holder body, in which a rectangular parallelepiped concave portion 2 for accommodating a glass dry plate is formed at the center. The upper surface restriction plates 4 and 5 are attached to one peak portion 3a extending in one direction along the recess, and the upper surface restriction plate 6 is attached to the other peak portion 3b.

  In the recess 2, a plate 7 having an area slightly smaller than the bottom area of the recess is disposed so as to be movable in the vertical direction. In other words, a hole is provided in the center of the plate 7, and a circular plate 9 in which a cylindrical bar 8 extending perpendicularly to the center is integrated is left on the upper surface of the plate 7. Through. Then, a spring 10 is inserted between the lower surface of the disk 9 and the upper surface of the holder bottom wall so as to surround the cylindrical rod 8, and the cylindrical rod 8 is moved up and down by a drive mechanism (not shown) outside the holder. The plate 7 is moved up and down by the disc 9.

  Pins 11, 12, and 13 (pins 11 that face the upper surface regulating plate 4 are not shown) are attached to the periphery of the plate 7 at portions that face the upper surface regulating plates 4, 5, and 6. Yes. These pins are hollow, and a spring 14 is inserted between the hollow portion and the bottom wall of the holder body.

Incidentally, the upper end regulating plates 4, 5, 6 and the pins 11, 12, 13 are formed in a spherical shape at the tips.
When the glass dry plate 15 is set in the holder having such a configuration, the cylindrical rod 8 is moved downward against the extension of the spring 10 by a drive mechanism (not shown), and the plate 9 is moved downward by the circular plate 9. Move to. As the plate 7 moves, the pins 11, 12, and 13 attached to the plate also move downward against the extension of the spring 14.

  In this state (a state where each pin 11, 12, 13 and each upper surface regulating plate 4, 5, 6 are largely spaced), the position is accurately aligned on the arm (not shown) of the transport mechanism (not shown). The dried glass plate is carried by a transport mechanism (not shown) along the inner walls of both mountain portions 3a, 3b by a predetermined distance, and the pins 11, 12, 13 and the upper surface regulating plates 4, Three edge portions of the glass substrate are located between 5 and 6.

  In this state, the cylindrical rod 8 is moved upward by a drive mechanism (not shown), and the plate 7 is moved upward by the spring 10. By the movement of the plate 7, the pins 11, 12, 13 attached to the plate are also moved upward by the spring 14, and the upper surface regulating plate 4 and the pin 11, the upper surface regulating plate 5 and the pin 12, and the upper surface regulating plate 6 and the pin. 13 are in contact with different edge portions of the glass substrate 15 in opposition to each other. As a result, the glass dry plate 15 is supported at three points by the holder, and the flatness thereof is maintained with high accuracy.

JP-A-10-294263

  Now, with respect to the upper surface regulating plate 4 and the pin 11, the upper surface regulating plate 5 and the pin 12, and the upper surface regulating plate 6 and the pin 13, the spherical surface vertex of the upper surface regulating plate and the spherical surface vertex of the pin are not aligned and shifted. If so, the glass dry plate set due to the deviation is distorted and the flatness is impaired.

  The decrease in the flatness of the glass dry plate can be confirmed by actually drawing a pattern on the glass dry plate set in the holder as described above and shifting the drawing position of the drawn pattern.

  However, even if the flatness of the glass dry plate can be confirmed in this way, it is difficult to correct. For example, a method of adjusting the position of the upper surface restricting plate or the pin can be considered, but the upper surface restricting plate is fixed to the peak portion of the holder body, and the pin is fixed to the plate. Position adjustment is extremely difficult.

  The present invention has been made to solve such problems, and an object thereof is to provide a novel object holding mechanism.

    The irradiated object holding mechanism according to the present invention includes a holder main body provided with a recess capable of taking in and out a plate-shaped irradiated object from one side of the side, a state parallel to the bottom surface of the recessed part and perpendicular to the bottom surface. A plate provided on the bottom surface so as to be movable in the direction, push-up bodies provided at three positions on the plate to push up the irradiated object from the lower surface, and the irradiated object on both the upper and lower sides Three upper surface restricting plates attached to the holder main body so as to be sandwiched between and supported by the holder body, and the object is irradiated between the push-up bodies and the opposing upper surface restricting plates by moving the plates closer to the bottom surface In the irradiated object holding mechanism configured to move the plate in a direction away from the bottom surface so that the irradiated object is sandwiched between each of the pushed-up bodies and the opposing upper surface regulating plate, the pushed-up body Characterized in that form as held in the plate to be moved in parallel to the bottom surface.

  The flatness of the irradiated object can be easily corrected.

    Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

    FIG. 2 shows a schematic example of the irradiated object holding mechanism of the present invention ((b) of FIG. 2 is a cross-sectional view taken along the line BB of (a) of FIG. 2). Components with the same symbols as used indicate the same components.

  The configuration in which the irradiated object holding mechanism shown in FIG. 2 is different from the irradiated object holding mechanism shown in FIG. 1 is as follows.

  Holes 21, 22, 23 (21 is not shown) are opened on the plate 70 facing the upper surface regulating plates 4, 5, 6, and the cross-section is so as to sandwich the extension lines of the holes 21, 22, 23. L-shaped pin holders 21a, 21b, 22a, 22b, 23a, 23b (21a, 21b not shown) are fixed on the plate 70.

  Then, pins 110, 120, and 130 (110 not shown) that are hollow and have flanges are disposed on the holes 21, 22, and 23, respectively. In this arrangement, as shown in a partially enlarged view of FIG. 3, a spring 14 is inserted between the hollow portion of each pin and the bottom surface of the holder main body through each of the holes 21, 22, and 23. A collar portion is formed so as to be caught on a lateral portion H of each of the pin holders 21a, 21b, 22a, 22b, 23a, 23b.

  Screws 24A and 24B are screwed into the vertical portions V of the pin holders 21a, 21b, 22a, 22b, 23a, and 23b, which are opposed to the front end surfaces of the flanges of the pins 110, 120, and 130, for position adjustment. The position of the pin along the plane parallel to the glass substrate 15 can be finely adjusted by adjusting the screwing condition of the position adjusting screws 24A and 24B.

  When the glass dry plate 15 is set in the holder having such a configuration, the cylindrical rod 8 is moved downward against the extension of the spring 10 by a drive mechanism (not shown), and the plate 70 is moved downward by the circular plate 9. Move to. As the plate 70 moves, the pins 110, 120, and 130 attached to the plate also move downward against the extension of the spring 14 through the pin holders 21a, 21b, 22a, 22b, 23a, and 23b.

  In this state (a state where each pin 110, 120, 130 and each upper surface regulating plate 4, 5, 6 are largely open), alignment is accurately performed on an arm (not shown) of a transport mechanism (not shown). The glass plate thus placed is carried by a transport mechanism (not shown) along the inner walls of both mountain portions 3a, 3b by a predetermined distance, and each pin 110, 120, 130 and each upper surface regulating plate 4, Three edge portions of the glass dry plate are located between 5 and 6.

  In this state, the cylindrical bar 8 is moved upward by a drive mechanism (not shown), and the plate 70 is moved upward by the spring 10. By the movement of the plate 70, the pins 110, 120, and 130 attached to the plate are also moved upward by the spring 14, and the upper surface restriction plate 4 and the pin 110, the upper surface restriction plate 5 and the pin 120, and the upper surface restriction plate 6 and the pin. 130 respectively contact different edge portions of the glass plate 15 in opposition to each other. As a result, the glass dry plate 15 is supported at three points by the holder, and the flatness thereof is maintained with high accuracy.

  The glass dry plate 15 set in the holder in this way is set on, for example, the stage of the drawing chamber of the electron beam drawing apparatus, and the electron beam is irradiated to a plurality of predetermined positions on the glass dry plate 15 to As shown in FIG. 4, a cross mark is formed.

  The glass dry plate 15 on which the cross mark is formed is removed from the holder, and the position at which the mark is formed is a reference position (when the spherical portion vertex of each opposing upper surface regulating plate and the spherical portion vertex of the pin are in a straight line, that is, The position of the mark formed when the flatness of the glass substrate set in the holder is in an ideal state is compared.

First, for example, a mark drawn on the right side on the glass dry plate 15, in (a) of FIG. 5, as shown in M _1, when in the right of the mark M ₀ depicted in standard position, in FIG. 5 as shown in (b), with respect to the tip U ₁ of the upper surface regulating plate, a state in which the leading end P ₁ of the pin is shifted to the right side (i.e., upper surface state distortion occurs extending the glass dry plate 15) glass substrate 15 in the This corresponds to the case where it is set in the holder.

  In this case, the position adjusting screws 34A and 24B screwed into the pin holders 23a and 23b of the pin 130 are adjusted to move the pin 130 a small amount to the left. The movement at this time is performed based on the adjustment amount of the position adjustment screw with respect to the difference between the mark drawing position and the standard position, which has been confirmed in advance by experiments or the like.

Meanwhile, the mark drawn on the right side on the glass dry plate 15, in (a) of FIG. 5, as shown in M _2, if the left side from the mark M ₀ depicted in standard position, in FIG. 5 (c as shown in), with respect to the tip U ₂ of the upper surface regulating plate, a state in which the leading end P ₂ of the pin is shifted to the left, (i.e., the glass dry plate 15 in a state), the upper surface of the strain shrink occurs in the glass dry plate 15 is Horu It corresponds to the case where it is set.

  In this case, the position adjusting screws 34A and 24B screwed into the pin holders 23a and 23b of the pin 130 are adjusted, and the pin 130 is moved to the right by a small amount.

    Next, for example, for the mark drawn on the upper left side of the glass dry plate 15, the drawing position is compared with the standard position, and the position adjusting screw screwed into the pin holders 21 a and 21 b of the pin 110 is similarly used. 24A and 24B are adjusted to move the pin 110 to the left or right by a small amount.

  Next, for example, for the mark drawn on the lower left side on the glass dry plate 15, the drawing position is compared with the standard position, and the position adjusting screw screwed into the pin holders 22 a and 22 b of the pin 120 is similarly used. 24A and 24B are adjusted to move the pin 120 to the left or right by a small amount.

  By adjusting the positions of the pins 110, 120, and 130 at the above three locations, the glass flat plate to be set is maintained at an ideal flatness after the next time.

  In the above description, the irradiation object holding mechanism of the present invention has been described by taking the holder used in the electron beam drawing apparatus as an example, but it is used in a light beam drawing apparatus, a charged particle beam inspection apparatus, and the like. It goes without saying that the present invention can also be applied to the irradiation object holding mechanism.

  Also, a mechanism for moving the plate 70 up and down, a structure of the push-up body itself such as a pin, a mechanism for pushing the push-up body such as a pin toward the upper surface regulating plate, a mechanism for holding the push-up body such as a pin, and a pin Such a mechanism for moving the push-up body in the horizontal direction is not limited to the above-described configuration example.

1 shows a schematic example of a conventional holder. 1 shows a schematic example of the holder of the present invention. FIG. 3 is a partially enlarged view of FIG. 2. It is a glass dry plate on which a cross is used to confirm the flatness of the glass dry plate set in the holder. It is the figure used for description of position adjustment of the pin currently used for the holder of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Holder main body 2 ... Recessed part 3a, 3b ... Mountain part 4, 5, 6 ... Upper surface control board 7,70 ... Plate 8 ... Cylindrical bar 9 ... Disc 10 ... Spring 11, 12, 13 ... Pin 14 ... Spring 15 ... glass dry plate 110, 120, 130 ... pin 21a, 21b, 22a, 22b, 23a, 23b ... pin holder 24A, 24B ... position adjusting screw _{M 0, M 1, M 2} ... marks _{U 1,} U 2 _... upper surface regulating plate tip part _{P 1, P} 2 _... pin tip

Claims (6)

  A holder main body provided with a recess capable of taking in and out a plate-like irradiated object from one side of the side, and provided on the bottom so as to be movable in a direction perpendicular to the bottom while maintaining a state parallel to the bottom of the recess In order to push up the plate and the object to be irradiated from the lower surface, the holder body is supported by sandwiching the object to be irradiated from above and below by the push-up bodies provided at three locations on the plate and the above-mentioned push-up bodies. It is provided with three attached upper surface regulating plates, and the plate is moved so as to be close to the bottom surface so that an irradiated object can be taken in and out between each push-up body and each opposing upper surface regulating plate. In the irradiated object holding mechanism configured to move the object in the direction away from each other and sandwich the irradiated object between each of the push-up bodies and the opposing upper surface regulating plate, the push-up body can be moved in parallel with the bottom surface. Irradiated object holding mechanism forms as held in the rate. The irradiated object holding mechanism according to claim 1, wherein a portion of the push-up body that contacts the irradiated object of the upper surface regulating plate is formed in a spherical shape. The push-up body is held by a push-up body holder attached to the plate so that the push-up body can move in parallel to the bottom surface of the recess independently of the plate, and the push-up body is parallel to the bottom surface of the recess. The irradiated object holding mechanism according to claim 1, wherein a position adjusting mechanism for moving the irradiated object is provided. 4. The irradiated object holding mechanism according to claim 3, wherein the position adjusting mechanism is a screw screwed into the push-up body holder. 4. The irradiated object holding mechanism according to claim 3, wherein the push-up body has a hollow portion, a hole is formed in a portion of the plate facing the hollow portion, and a spring is inserted between the hollow portion and the bottom surface of the recess through the hole. The push-up body has a hook part, and the push-up body holder holds the push-up body by contacting the upper surface regulating plate side of the hook part, and the tip surface of the hook part is held by the press body provided on the holder. The irradiated object holding mechanism according to claim 3, wherein the object can be pressed.

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