JP2007232486A - Configuration measuring apparatus and configuration measuring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a configuration measuring apparatus which can be set on a set stage without damaging any thin plate nor allowing any warpage to occur, and can be instantly fixed to and unfixed from the set stage. <P>SOLUTION: The configuration measuring apparatus 1, which measures a configuration of a thin film formed on an electrostatically chargeable thin plate W or a configuration of a surface of the electrostatically chargeable thin plate by using a noncontact way, comprises: the set stage 4 for setting the thin plate W; and a measuring device 6 which is out of contact with the thin plate W being set on the set stage 4 and measures the configuration of the thin film or the configuration of the surface of the thin plate. Furthermore, an electrostatic sucking mechanism 5 for sucking the thin plate W electrostatically is incorporated in the set stage 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a morphometric measuring apparatus and a morphometric measuring method for measuring either the form of a thin film formed on a thin plate or the form of the surface of the thin plate in a non-contact manner.

Conventionally, as a method for fixing a thin plate to a set stage, a method of vacuum-sucking a thin plate placed on the set stage is known (see Patent Document 1). In this method, after the thin plate is placed on the set stage, the thin plate is sucked and fixed by suction driving with a vacuum pump, so that the thin plate can be fixed without causing warpage. Because it is not necessary to fix the thin plate, etc., the thin plate is not damaged.
JP 2000-312989 A

  However, in the configuration as described above, when processing a thin plate after suction fixing, the time from the time when the thin plate is placed to the time of suction fixing becomes a time loss in processing work. That is, since the vacuum pump is driven by suction after the thin plate is placed, it takes time until the thin plate is sucked and fixed. Similarly, after a desired process is performed on the thin plate that has been suction-fixed, a time loss occurs in the time from when the thin plate after the process is suction-fixed to when the suction is released. As a result, there is a problem that the work efficiency of the processing work is deteriorated. In addition, when a thin plate is subjected to three-dimensional processing such as a through hole and a groove on the back surface, or a porous material such as paper, desired vacuum suction cannot be expected. However, simply placing it on the set stage does not allow reproducible and accurate measurements on thin plates that tend to warp or float.

  The present invention can be placed on a set stage without damaging the thin plate and without causing warp even on a thin plate that is likely to be warped or floated, and the position of the surface of the thin plate in the height direction is measured. To provide a morphometric measuring device and a morphometric measuring method that can easily and unnecessaryly perform alignment and focusing, can be fixed to and released from the set stage instantaneously, and can perform reproducible and accurate measurement. Is an issue.

  The form measuring apparatus of the present invention sets a thin plate in a form measuring apparatus that measures either the form of a thin film formed on a thin sheet having chargeability or the form of the surface of a thin sheet having chargeability in a non-contact manner. An electrostatic adsorption mechanism that electrostatically attracts the thin plate to the set stage, comprising a set stage and a measuring instrument that faces the thin plate set on the set stage in a non-contact manner and measures the form of the thin film or the surface of the thin plate Is incorporated.

  Further, the form measuring method of the present invention is a form measuring method in which any of the form of a thin film formed on a thin sheet having chargeability and the form of the surface of a thin sheet having chargeability is measured by a measuring instrument in a non-contact manner. The thin plate is set on a set stage incorporating an electrostatic adsorption mechanism for electrostatically adsorbing the thin plate, and in this state, measurement is performed by a measuring instrument.

  According to this configuration, since the thin plate can be electrostatically attracted to the set stage at the same time as the thin plate is set, the setting operation of the thin plate can be speeded up without causing the thin plate to be warped and scratched. Can be done. Further, in the measurement, it becomes easy or unnecessary to align or focus the surface of the thin plate in the height direction. Thereby, the tact time in the measurement work can be shortened, so that the work efficiency can be improved.

  In this case, the form of the thin film includes at least one of the film thickness, the film structure, the optical constant, the surface shape, and the surface roughness of the thin film, and the surface form of the thin plate includes the optical constant, the surface shape, and the surface roughness. It is preferable that at least one of them is included.

  According to this configuration, the thin film is measured by measuring the film thickness, film structure (infrared absorption spectrum), optical constants (refractive index, extinction coefficient), surface shape and surface roughness of the thin film or thin plate. Is formed with a uniform thickness on the thin plate, what optical constants the surface of the thin film and the thin plate have, what surface shape / roughness, and what functional group the substance has Can be measured by a reproducible and accurate method.

  In this case, it is preferable that the measuring device is either an optical measuring device or a spectroscopic measuring device.

  According to this configuration, in measuring the form of the thin film, the thin film can be measured at room temperature and normal pressure without damaging the thin film. When measuring the film thickness of the thin film, it is preferable to use an optical interference type film thickness meter as the optical measuring instrument and a measuring instrument that measures by ellipsometry as the spectroscopic measuring instrument. Constants (refractive index, extinction coefficient) are preferably measured using an ellipsometric method as a spectroscopic measuring instrument, and the surface shape / roughness of a thin film is measured using an optical measuring instrument. Preferably, when measuring the film structure (infrared absorption spectrum), it is preferable to use a measuring instrument that measures by infrared spectroscopy.

  Another form measuring apparatus of the present invention sets a thin plate in a form measuring apparatus that measures either the form of a thin film formed on a magnetic thin plate or the form of the surface of a magnetic thin plate in a non-contact manner. A set stage and a measuring instrument that faces the thin plate set on the set stage in a non-contact manner and measures the form of the thin film or the surface of the thin plate, and the set stage incorporates a magnetic adsorption mechanism for magnetically attaching the thin plate It is characterized by being.

  Further, another form measuring method of the present invention is a form measuring method in which either a form of a thin film formed on a magnetic thin plate or a form of a surface of a magnetic thin plate is measured in a non-contact manner by a measuring instrument. The thin plate is set on a set stage incorporating a magnetic adsorption mechanism for magnetically attaching the thin plate, and in this state, measurement is performed by a measuring instrument.

  According to this configuration, since the thin plate can be magnetically attached to the set stage simultaneously with setting the thin plate on the set stage, the setting operation of the thin plate can be performed speedily.

  Hereinafter, a configuration measuring apparatus according to this embodiment will be described with reference to the accompanying drawings. This form measuring apparatus measures the film thickness of a thin film formed on a thin plate-shaped workpiece made of a metal material.

  As shown in FIG. 1, the form measuring apparatus 1 includes a bed 2, an XYθ table 3 provided at the center of the bed 2, a set stage 4 movably mounted on the XYθ table 3, and a set stage 4. An electrostatic adsorption mechanism 5, an optical measurement system 6 (measuring instrument) facing the workpiece W set on the set stage 4 from above, an inverted “U” -shaped support member 8 that supports the optical measurement system 6, The entire apparatus is centrally controlled by a control apparatus 7 such as a personal computer.

  The XYθ table 3 is mounted on the motor-driven X-axis table 10 fixed on the bed 2, the motor-driven Y-axis table 11 mounted on the X-axis table 10, and the Y-axis table 11. And a motor-driven θ table 12 that rotates the workpiece W at an angle. When the workpiece W is set on the set stage 4, the XYθ table 3 rotates the θ table 12 so that the workpiece W set on the set stage 4 faces the optical measurement system 6 based on the control of the control device 7. And the X-axis table 10 and the Y-axis table 11 are appropriately driven.

  The set stage 4 is formed in a rectangular thick plate shape, and has a pair of position restricting members 15 for positioning the workpiece W set on the upper surface thereof. The pair of position restricting members 15 are each formed in an “L” shape, and are arranged so as to position the two rear corners of the workpiece W to be set (see FIG. 2). In addition, it is preferable that the pair of position regulating members 15 is configured to be capable of adjusting the position in the left-right direction (X-axis direction) so that the workpiece W having a different size can be positioned and set. Further, the position restricting member 15 may have only one configuration as necessary. In FIG. 1, the set stage 4 is formed for a rectangular work, but it may be a circular stage for a circular work. Further, if the stage is formed in accordance with the workpiece shape, the stage may have a step within a range that does not hinder measurement.

  The optical measurement system 6 uses, for example, an optical measurement device such as an ellipsometer, and is disposed on the front surface of the support member 8 and faces the workpiece W to be set in a non-contact state. The optical measurement system 6 includes a light source unit 21 that irradiates incident light toward the workpiece W, and a light receiving unit 22 that receives reflected light reflected from the workpiece W and inputs a light reception result to the control device 7. ing. When incident light is irradiated from the light source unit 21 toward the workpiece W, the incident light is reflected by the workpiece W, and the reflected light that is reflected enters the light receiving unit 22. Thereafter, the light receiving unit 22 inputs the light reception result to the control device 7, and the control device 7 measures the thickness of the thin film based on the irradiated incident light and the reflected light reflected. In the measurement work, the workpiece W may be moved by the XYθ table 3 while irradiating incident light, and each part of the workpiece W may be measured at any time, or only a specific point on the workpiece W may be measured. May be.

  As shown in FIG. 2, the electrostatic attraction mechanism 5 uses a bipolar system. For example, an anode 26 and a cathode 27 are arranged in a comb shape inside the set stage 4. , Plus and minus static electricity (charging) are alternately generated. For this reason, adsorption | suction of a small workpiece | work is also attained. A switch (switching element: not shown) is provided between the electrodes 26 and 27 and the power supply device, and the ON / OFF operation of the switch is controlled by the control device 7. That is, when the workpiece W is set in a state of being positioned on the set stage 4, the control device 7 turns on the switch to instantaneously attract and fix the workpiece W to the set stage 4 by the electrostatic adsorption mechanism 5. . While maintaining this state, the measurement work by the optical measurement system 6 is performed, and thereafter, when the measurement work is completed, the switch is turned off to instantaneously release the suction fixation. The electrostatic attraction mechanism 5 may be configured such that one half of the set stage 4 is charged positively, for example, and the other half is negatively charged.

  According to such a configuration, it is possible to instantaneously fix and release the workpiece W by suction, and it becomes easy or unnecessary to position and focus the workpiece surface in the height direction during measurement. Therefore, the tact time in the measurement work can be shortened, and the work efficiency can be improved. In addition, since the handling can be performed without contacting the surface of the workpiece W when being fixed to the set stage 4, the workpiece W is not damaged, and further, no warping occurs, so that reproducible accuracy is achieved. High measurement is possible. In this embodiment, the film thickness is measured by using an ellipsometer, but the film structure (infrared absorption spectrum) of a thin film may be measured by using an infrared spectrophotometer. Moreover, the form measuring apparatus of this embodiment is applicable also to the apparatus which measures the form of the surface of a thin plate. In this case, the surface shape and surface roughness of the thin plate can be measured.

  Next, the form measuring apparatus 1 according to the second embodiment will be described. In order to avoid duplicate descriptions, only different parts will be described. Although not shown in the figure, this configuration measuring apparatus 1 has a magnetic adsorption mechanism instead of the electrostatic adsorption mechanism 5. In this case, the workpiece W used in the form measuring device 1 has a magnetic configuration. The magnetic adsorption mechanism uses, for example, an electromagnet or the like, and the electromagnet is connected to the power supply device via a switch in the same manner as described above. When the workpiece W is set on the set stage 4, the switch is turned on by the control device 7, and the workpiece W is sucked and fixed instantaneously. Thereafter, a measurement operation is performed, and when the measurement operation is completed, the switch is turned off to instantaneously release the suction fixation. Even in such a configuration, the work W can be adsorbed and fixed and released immediately, so that the work efficiency can be improved.

It is a perspective view of the form measuring apparatus which concerns on this embodiment. It is a top view of a set stage.

Explanation of symbols

  W ... Work 1 ... Form measuring device 4 ... Set stage 5 ... Electrostatic adsorption mechanism 6 ... Optical measurement system

Claims (6)

In a form measuring apparatus for measuring, in a non-contact manner, either the form of a thin film formed on a thin plate having charging property or the form of the surface of a thin plate having charging property,
A set stage for setting the thin plate;
A measuring instrument that faces the thin plate set on the set stage in a non-contact manner and measures the form of the thin film or the surface of the thin plate;
The form measuring apparatus, wherein the set stage includes an electrostatic adsorption mechanism for electrostatically adsorbing the thin plate.   The form of the thin film includes at least one of the film thickness, film structure, optical constant, surface shape and surface roughness of the thin film, and the surface form of the thin plate includes the optical constant, surface shape and surface roughness. The shape measuring apparatus according to claim 1, wherein at least one of them is included.   The form measuring apparatus according to claim 1, wherein the measuring instrument is one of an optical measuring instrument and a spectroscopic measuring instrument. In the form measuring device for measuring either the form of the thin film formed on the thin plate having magnetism or the form of the surface of the thin plate having magnetism in a non-contact manner,
A set stage for setting the thin plate;
A measuring instrument that faces the thin plate set on the set stage in a non-contact manner and measures the form of the thin film or the surface of the thin plate;
The form measuring device, wherein a magnetic adsorption mechanism for magnetically attaching the thin plate is incorporated in the set stage. In a form measuring method for measuring either the form of a thin film formed on a thin plate having charging property or the form of the surface of a thin plate having charging property in a non-contact manner by a measuring instrument,
Set the thin plate on a set stage incorporating an electrostatic adsorption mechanism for electrostatically adsorbing the thin plate,
In this state, the form measurement method is characterized in that measurement is performed by the measuring device. In the form measuring method for measuring either the form of the thin film formed on the thin plate having magnetism or the form of the surface of the thin plate having magnetism in a non-contact manner by a measuring instrument,
Set the thin plate on a set stage incorporating a magnetic adsorption mechanism for magnetizing the thin plate,
In this state, the form measurement method is characterized in that measurement is performed by the measuring device.

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