CN109065493A - A kind of device for assisting hard vias masks version and sample to be precisely aligned - Google Patents
A kind of device for assisting hard vias masks version and sample to be precisely aligned Download PDFInfo
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- CN109065493A CN109065493A CN201811047890.6A CN201811047890A CN109065493A CN 109065493 A CN109065493 A CN 109065493A CN 201811047890 A CN201811047890 A CN 201811047890A CN 109065493 A CN109065493 A CN 109065493A
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- mask plate
- sample
- hole
- hard mask
- fixed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sampling And Sample Adjustment (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to thin-film material technical field, specially a kind of device for assisting hard vias masks version and sample to be precisely aligned.Apparatus of the present invention include: sample tray, loading disk, mask plate adsorption head, displacement adjustment device, microscope etc.；Wherein, loading disk has rotation adjustment freedom degree, and loading disc rotary drives sample tray rotation, to accurately control sample rotates angle；Displacement adjustment device has the rotation and horizontal adjustment freedom degree of tri- axis of X, Y, Z；The position of the hard mask plate of through-hole can be accurately adjusted by displacement adjustment device；This whole device structure is simple, easy to operate, and alignment precision is high, has very strong practicability.It to a certain extent instead of the function of photoetching, avoids photoresist in photoetching process and sample is had an impact, be very suitable to the device fabrication of the thin-film materials such as organic material or two-dimensional material (graphene etc.).
Description
Technical field
The invention belongs to thin-film material technical fields, and in particular to a kind of that hard vias masks version and sample is assisted to carry out accurately
The device of alignment.
Background technique
In the device fabrication processes of organic semiconductor or two-dimensional material, defining electrode pattern mainly has photolithographic exposure figure
Shape (use photomask blank) and two methods of figure are defined using the hard mask plate of through-hole.Wherein, lithographic definition figure needs are serving as a contrast
Spin coating photoresist on bottom, inevitable that photoetching glue residua, leads to the performance degradation of device, be for example difficult to shape after development
At good metal-semiconductor contact, carrier mobility etc. is influenced.In contrast, using the hard mask plate of through-hole, Ke Yizhi
It connects and device technology processing (for example metal evaporation, dry etching etc.) is carried out to through-hole naked position, do not need to connect in the process
Any chemical substance is touched, therefore thin-film material will not be caused to damage.
However, in common experiment or process, the alignment of none good through-hole hard mask plate and sample
Method is difficult to realize essence often using relatively rough methods such as manual alignments, and when the hard mask plate precision of through-hole is higher
Really alignment.Existing means generally use small-sized alignment device (with reference to utility model CN104064505A) that sample is hard with through-hole
After mask plate alignment and fixation, following process (vapor deposition or etching, etc.) is carried out together, the device is than cumbersome and operating process
It is easily damaged alignment.Also there is the installation remote control alignment dress directly inside process equipment (evaporator or etching machine, etc.)
It sets, but cost is very expensive.
Summary of the invention
The purpose of the present invention is to provide a kind of alignment precision height, the equipment cost low hard vias masks versions of auxiliary and sample
The device precisely aligned.
The device provided by the invention for assisting hard vias masks version and sample to be precisely aligned, possesses multiple freedom degrees
(rotation and horizontal adjustment freedom degree including tri- axis of X, Y, Z), it is flat with being aligned after realizing that sample is aligned with the hard mask plate of through-hole
Platform is detached from.The processing for the carry out next step that thus can be convenient.The accurate of sample and hard mask plate may be implemented in this device
Alignment, to a certain extent instead of the function of photoetching, avoids the problem of photoresist has an impact sample in photoetching process.
The device that the hard vias masks version of auxiliary provided by the invention and sample are precisely aligned, structure as shown in Figure 1,
It include: sample tray 1, loading disk 3, loading disk clamp 2, mask plate adsorption head 5, displacement adjustment device 6, microscope 7；Its
In, sample tray 1 is for loading sample；Sample tray 1 is coaxially fixed on loading disk 3 by loading disk clamp 2；Sample
It is fixed on sample tray 1；Loading disk 3 has rotation adjustment freedom degree, and the rotation of loading disk 3 drives sample tray 1 to rotate,
To accurately control sample rotates angle；Displacement adjustment device 6 has the rotation and horizontal adjustment freedom degree of tri- axis of X, Y, Z；Position
Displacement regulating device 6 has a cantilever arm, and mask plate adsorption head 5 is fixed on cantilever arm, and the hard mask plate 4 of through-hole is placed in mask plate suction
Attached 5 bottom of head, 5 bottom of mask plate adsorption head are equipped with aperture, can adsorb through-hole under the action of external pump machine draft and cover firmly
Film version 4；By displacement adjustment device 6, the position of the hard mask plate 4 of through-hole can be accurately adjusted；Loading disk 3 and displacement adjust dress
6 are set to be fixed on same level plate.
In the present invention, the hard mask plate suction type of through-hole can there are two types of:
Mode one: the aperture that can be connected with external pumping pump machine is arranged at hard 5 bottom of mask plate adsorption head of through-hole, and external pump machine is taken out
Through-hole hard mask plate 4 can be adsorbed when gas, closes air pump, and the hard mask plate 4 of through-hole can be separated with adsorption head 5；
Mode two: it using electromagnet absorption (the corresponding position of mask plate need to add iron plate), can be controlled by the switch of electric current
Whether system absorption.
In addition, being additionally provided with spring chuck 8 on sample tray 1, a magnetic flakes 9 in addition can be set up, for after fixed alignment
Sample and the hard mask plate 4 of through-hole.
Alignment function carries out with the help of microscope 7, observes sample carrier through the hollowed out area of the hard mask plate 4 of through-hole
The pattern (or the alignment mark patterned in advance on sample) of sample on disk 1, it is corresponding by adjusting displacement adjustment device 6
Threaded rod drive the mask plate adsorption head 5 being attached thereto.First with the adjustment of horizontal freedom degree make the hard mask plate of through-hole 4 with
Sample surfaces keeping parallelism then carries out the alignment function of relative displacement in the x, y direction to the hard mask plate of through-hole 4, finally leads to
The hard mask plate of through-hole is adjacent to by the adjustment for crossing Z-direction with sample.To complete alignment function.
After the completion of alignment, sample and the hard mask plate of through-hole are fixed, there are two types of fixed forms:
Mode one, using the spring chuck 8 being fixed on sample tray 1 come the hard mask plate 4 of fixed hole；
Mode two passes through the hard mask plate 4 of the magnetic attraction fixed hole generated with irony sample tray using magnetic flakes 9.
Concrete operations are as follows: the spring chuck 8 that will be connect with pallet, or using magnetic flakes 9 slowly close to
Hard 4 surface of mask plate of through-hole of alignment is completed, and it is slowly declined to and is fixed on hard 4 surface of mask plate of through-hole, so that logical
The hard mask plate 4 in hole is adjacent to state with sample holding.Pump machine is then shut off to release the hard mask plate adsorption head 5 of through-hole with through-hole and cover firmly
Absorption between diaphragm plate 4, and mask plate adsorption head 5 is slowly risen by the Z axis threaded rod of displacement adjustment device 6.Unclamp fixture 2
Sample tray 1 and loading disk 3 are detached from.It is just completed on sample tray 1 between the hard mask plate 4 of through-hole and sample at this time
Alignment function and fixation, and separated they and alignment device under the premise of not destroying aligned relationship.
In the present invention, the hard mask plate of through-hole usually (refers to patent of invention using stainless steel or silicon wafer as making material
CN105261588A), by patterning and etching obtains required figure.With certain flatness and mechanical strength, meet this
The operation requirement of system.
The hard mask plate of high-precision through-hole is used to define figure, figure can be defined in any position of thin-film material, to thin
Membrane material fanout free region；Alignment can be repeated several times, the hard mask plate of through-hole also may be reused.
Whole device structure of the present invention is simple, easy to operate, and alignment precision is high, has very strong practicability.This device can
To realize precisely aligning for sample and hard mask plate, to a certain extent instead of the function of photoetching, avoid in photoetching process
Photoresist has an impact sample, and the device for being very suitable to the thin-film materials such as organic material or two-dimensional material (graphene etc.) adds
Work.
Detailed description of the invention
Fig. 1 is the overall structure figure of the accurate overlay alignment platform of the hard mask plate of the auxiliary.
Figure label: 1 is sample tray, and 2 be loading disk clamp, and 3 be loading disk, and 4 be the hard mask plate of through-hole, and 5 are
Mask plate adsorption head, 6 be displacement adjustment device, and 7 be microscope, and 8 be the fixed spring chuck of mask plate, and 9 be magnetic flakes.
Specific embodiment
A specific embodiment is given below, the invention will be further described.
Sample tray 1 is the iron disk of diameter 100mm；Loading disk clamp 2 is a pair being screwed in pedestal
Copper elastic sheet；Loading disk 3 is diameter 150mm, thickness 3mm, has rotation function, material is aluminum；Silicon substrate high-precision is logical
The hard mask plate 4(in hole refers to patent of invention CN105261588A)；Mask plate suction sheet 5 is that bottom leads to foraminate plastics square,
The connection of the small hole at bottom part other end and external pump machine；Displacement adjustment device 6 is that can be adjusted by tri- threaded rods of X, Y, Z and three are horizontal
Whole knob composition, can be with intense adjustment so that the mechanical device that the mask plate adsorption head being attached thereto is subjected to displacement；Microscope 7 is
Common long-focus microscope；Spring chuck 8, rectangular tab made of magnetic flakes 9, can be designed to frame shape, close
One end center of mask plate 4 is hollow out, to expose the alignment area of mask plate again while fixed mask plate.
Claims (5)
1. a kind of device for assisting hard vias masks version and sample to be precisely aligned characterized by comprising sample tray
(1), loading disk (3), loading disk clamp (2), mask plate adsorption head (5), displacement adjustment device (6), microscope (7)；Its
In, sample tray (1) is for loading sample；Sample tray (1) is coaxially fixed on loading disk by loading disk clamp (2)
(3) on；Sample is fixed on sample tray (1)；Loading disk (3) has rotation adjustment freedom degree, and loading disk (3) rotates band
Dynamic sample tray (1) rotation, to accurately control sample rotates angle；Displacement adjustment device (6) has the rotation of tri- axis of X, Y, Z
With horizontal adjustment freedom degree；Displacement adjustment device (6) has a cantilever arm, and mask plate adsorption head (5) is fixed on cantilever arm, through-hole
Hard mask plate (4) is placed in mask plate adsorption head (5) bottom, and mask plate adsorption head (5) bottom is equipped with aperture, can be in external pump
The hard mask plate of through-hole (4) is adsorbed under the action of machine draft；By displacement adjustment device (6), it can accurately adjust through-hole and cover firmly
The position of film version (4)；Loading disk (3) and displacement adjustment device (6) are fixed on same level plate.
2. the apparatus according to claim 1, which is characterized in that there are two types of the hard mask plate suction types of through-hole:
Mode one: the aperture that can be connected with external pumping pump machine, external pump machine are arranged at hard mask plate adsorption head (5) bottom of through-hole
The hard mask plate of through-hole (4) can be adsorbed when pumping, closes air pump, and the hard mask plate of through-hole (4) can be separated with adsorption head (5)；
Mode two: being adsorbed using electromagnet, need to be added iron plate in the corresponding position of the hard mask plate of through-hole (4), be passed through opening for electric current
Whether closing to control absorption.
3. the apparatus according to claim 1, which is characterized in that be additionally provided with spring chuck (8) on sample tray (1), in addition
A magnetic flakes (9) are set up, for sample after fixed alignment and the hard mask plate of through-hole (4).
4. device according to claim 3, which is characterized in that alignment function carries out with the help of microscope (7), penetrates
The pattern of sample on sample tray (1) is observed in the hollowed out area of the hard mask plate of through-hole (4), by adjusting displacement adjustment device
(6) corresponding threaded rod drives the mask plate adsorption head (5) being attached thereto；Keep through-hole hard first with the adjustment of horizontal freedom degree
Mask plate (4) and sample surfaces keeping parallelism, then carry out pair of relative displacement in the x, y direction to the hard mask plate of through-hole (4)
The hard mask plate of through-hole, is adjacent to, to complete alignment function by quasi- operation finally by the adjustment of Z-direction with sample.
5. device according to claim 4, which is characterized in that after the completion of alignment, sample and the hard mask plate of through-hole are fixed
There are two types of modes:
Mode one, using the spring chuck (8) being fixed on sample tray (1) come the hard mask plate of fixed hole (4)；
Mode two passes through the hard mask plate of magnetic attraction fixed hole that generates with irony sample tray using magnetic flakes (9)
(4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811047890.6A CN109065493B (en) | 2018-09-10 | 2018-09-10 | Device for assisting hard through hole mask plate and sample to accurately align |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811047890.6A CN109065493B (en) | 2018-09-10 | 2018-09-10 | Device for assisting hard through hole mask plate and sample to accurately align |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109065493A true CN109065493A (en) | 2018-12-21 |
| CN109065493B CN109065493B (en) | 2023-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811047890.6A Active CN109065493B (en) | 2018-09-10 | 2018-09-10 | Device for assisting hard through hole mask plate and sample to accurately align |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109065493B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109491201A (en) * | 2018-12-26 | 2019-03-19 | 仪晟科学仪器(嘉兴)有限公司 | A kind of mask plate high-precision two-dimensional movement mechanism |
| CN109968206A (en) * | 2019-03-28 | 2019-07-05 | 杭州电子科技大学 | A kind of mask plate assisted jet processing method |
| CN113716520A (en) * | 2021-08-31 | 2021-11-30 | 电子科技大学 | Multifunctional system and method for preparing two-dimensional material micro-nano device |
| CN114879452A (en) * | 2022-04-26 | 2022-08-09 | 中国科学院光电技术研究所 | High-uniform contact type alignment exposure device for flexible film |
| CN116121697A (en) * | 2022-11-04 | 2023-05-16 | 南方科技大学 | Electrode alignment and growth system and method for ultra-high vacuum film samples |
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| JPH1154901A (en) * | 1997-08-01 | 1999-02-26 | Sumitomo Wiring Syst Ltd | Soldering method and soldering jig |
| JP2007042858A (en) * | 2005-08-03 | 2007-02-15 | Mejiro Precision:Kk | Projection aligner |
| CN203932033U (en) * | 2014-07-07 | 2014-11-05 | 南通威倍量子科技有限公司 | A kind of micro device of aiming at for precision mask plate |
| CN108193169A (en) * | 2018-03-06 | 2018-06-22 | 华东师范大学 | A kind of mask plate for preparing two-dimensional material metal electrode |
| CN108205237A (en) * | 2016-12-19 | 2018-06-26 | 航天科工惯性技术有限公司 | The device and method that a kind of wafer profile is precisely aligned with mask plate patterns |
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Patent Citations (5)
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| JPH1154901A (en) * | 1997-08-01 | 1999-02-26 | Sumitomo Wiring Syst Ltd | Soldering method and soldering jig |
| JP2007042858A (en) * | 2005-08-03 | 2007-02-15 | Mejiro Precision:Kk | Projection aligner |
| CN203932033U (en) * | 2014-07-07 | 2014-11-05 | 南通威倍量子科技有限公司 | A kind of micro device of aiming at for precision mask plate |
| CN108205237A (en) * | 2016-12-19 | 2018-06-26 | 航天科工惯性技术有限公司 | The device and method that a kind of wafer profile is precisely aligned with mask plate patterns |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109491201A (en) * | 2018-12-26 | 2019-03-19 | 仪晟科学仪器(嘉兴)有限公司 | A kind of mask plate high-precision two-dimensional movement mechanism |
| CN109491201B (en) * | 2018-12-26 | 2024-01-19 | 仪晟科学仪器(嘉兴)有限公司 | High-precision two-dimensional movement mechanism for mask |
| CN109968206A (en) * | 2019-03-28 | 2019-07-05 | 杭州电子科技大学 | A kind of mask plate assisted jet processing method |
| CN113716520A (en) * | 2021-08-31 | 2021-11-30 | 电子科技大学 | Multifunctional system and method for preparing two-dimensional material micro-nano device |
| CN114879452A (en) * | 2022-04-26 | 2022-08-09 | 中国科学院光电技术研究所 | High-uniform contact type alignment exposure device for flexible film |
| CN116121697A (en) * | 2022-11-04 | 2023-05-16 | 南方科技大学 | Electrode alignment and growth system and method for ultra-high vacuum film samples |
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| Publication number | Publication date |
|---|---|
| CN109065493B (en) | 2023-09-05 |
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